Philips TDA8925 User manual

DATA SHEET
Product specification
Supersedes data of 2004 Jan 05 2004 May 06
INTEGRATED CIRCUITS
TDA8925
Power stage2x15to25Wclass-D
audio amplifier

2004 May 06 2
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
CONTENTS
1 FEATURES
2 APPLICATIONS
3 GENERAL DESCRIPTION
4 QUICK REFERENCE DATA
5 ORDERING INFORMATION
6 BLOCK DIAGRAM
7 PINNING
8 FUNCTIONAL DESCRIPTION
8.1 Power stage
8.2 Protection
8.2.1 Overtemperature
8.2.2 Short-circuit across the loudspeaker terminals
9 LIMITING VALUES
10 THERMAL CHARACTERISTICS
11 QUALITY SPECIFICATION
12 DC CHARACTERISTICS
13 AC CHARACTERISTICS
14 SWITCHING CHARACTERISTICS
15 TEST AND APPLICATION INFORMATION
15.1 SE application
15.2 Package ground connection
15.3 Output power
15.4 Reference design
15.5 Reference design bill of material
15.5.1 Version 2; revision 5
15.5.2 Printed-circuit board
15.6 Curves measured in reference design
16 PACKAGE OUTLINES
17 SOLDERING
17.1 Introduction to soldering through-hole mount
packages
17.2 Soldering by dipping or by solder wave
17.3 Manual soldering
17.4 Suitability of through-hole mount IC packages
for dipping and wave soldering methods
18 DATA SHEET STATUS
19 DEFINITIONS
20 DISCLAIMERS

2004 May 06 3
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
1 FEATURES
•High efficiency (> 94 %)
•Operating voltage from ±7.5 V to ±30 V
•Very low quiescent current
•High output power
•Diagnostic output
•Usable as a stereo Single-Ended (SE) amplifier
•Electrostatic discharge protection (pin to pin)
•No heatsink required.
2 APPLICATIONS
•Television sets
•Home-sound sets
•Multimedia systems
•All mains fed audio systems.
3 GENERAL DESCRIPTION
The TDA8925 is a switching power stage for a high
efficiency class-D audio power amplifier system.
With this power stage a compact 2 ×15 W self oscillating
digital amplifier system can be built, operating with high
efficiency and very low dissipation. No heatsink is
required. The system operates over a wide supply voltage
range from ±7.5 V up to ±30 V and consumes a very low
quiescent current.
4 QUICK REFERENCE DATA
5 ORDERING INFORMATION
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
General
VPsupply voltage ±7.5 ±15 ±30 V
Iq(tot) total quiescent current no load connected; VP=±15 V −25 45 mA
ηefficiency endstage Po= 15 W; RL=8Ω; VP=±15 V −94 −%
Stereo single-ended configuration
Pooutput power RL=8Ω; THD = 10 %; VP=±15 V 14 15 −W
RL=6Ω; THD = 10 %; VP=±15 V −20 −W
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
TDA8925ST RDBS17P plastic rectangular-DIL-bent-SIL power package; 17 leads (row
spacing 2.54 mm) SOT577-2
TDA8925J DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length
7.7 mm) SOT243-3

2004 May 06 4
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
6 BLOCK DIAGRAM
MDB610
handbook, full pagewidth
CONTROL
AND
HANDSHAKE
DRIVER
HIGH
TDA8925
TEMPERATURE SENSOR
AND
CURRENT PROTECTION
DRIVER
LOW
temp
current
4
7
VSS1
VSS1 VSS2
VDD2
6
1
2
9
810
VDD2 VDD1
13 5
CONTROL
AND
HANDSHAKE
DRIVER
HIGH
DRIVER
LOW
14
11
12
17
16
3
15
EN1
DIAG
REL1
SW1
SW2
REL2
POWERUP
EN2
BOOT1
OUT1
STAB
OUT2
BOOT2
Fig.1 Block diagram.

2004 May 06 5
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
7 PINNING
SYMBOL PIN DESCRIPTION
SW1 1 digital switch input; channel 1
REL1 2 digital control output; channel 1
DIAG 3 digital open-drain output for
overtemperature and overcurrent
report
EN1 4 digital enable input; channel 1
VDD1 5 positive power supply; channel 1
BOOT1 6 bootstrap capacitor; channel 1
OUT1 7 PWM output; channel 1
VSS1 8 negative power supply; channel 1
STAB 9 decoupling internal stabilizer for
logic supply
VSS2 10 negative power supply; channel 2
OUT2 11 PWM output; channel 2
BOOT2 12 bootstrap capacitor; channel 2
VDD2 13 positive power supply; channel 2
EN2 14 digital enable input; channel 2
POWERUP 15 enable input for switching on
internal reference sources
REL2 16 digital control output; channel 2
SW2 17 digital switch input; channel 2
handbook, halfpage
TDA8925ST/J
MDB611
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
VSS1
VSS2
VDD2
VDD1
EN1
DIAG
REL1
SW1
SW2
REL2
POWERUP
EN2
BOOT1
OUT1
STAB
OUT2
BOOT2
Fig.2 Pin configuration.

2004 May 06 6
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
8 FUNCTIONAL DESCRIPTION
The TDA8925 is a two-channel audio power amplifier
system using the class-D technology (see Fig.1).
The power stage TDA8925S is used for driving the
loudspeaker load. It performs a level shift from the
low-power digital PWM signal, at logic levels, to a
high-power PWM signal that switches between the main
supplylines.A2nd-orderlow-passfilterconvertsthePWM
signal into an analog audio signal across the loudspeaker.
8.1 Power stage
The power stage contains the high-power DMOS
switches,thedrivers,timingand handshakingbetweenthe
power switches and some control logic (see Fig.1). For
protection, a temperature sensor and a maximum current
detector are built-in on the chip.
The following functions are available:
•Switch (pins SW1 and SW2): digital inputs; switching
from VSS to VSS + 12 V and driving the power DMOS
switches
•Release (pins REL1 and REL2): digital outputs;
switching from VSS to VSS + 12 V; follow SW1 and SW2
with a small delay. Note: for self oscillating applications
this pin is not used.
•Power-up (pin POWERUP): must be connected to a
continuous supply voltage of at least VSS + 5 V with
respect to VSS
•Enable (pins EN1 and EN2): digital inputs; at a level
of VSS the power DMOS switches are open and the
PWM outputs are floating; at a level of VSS + 12 V the
power stage is operational
•Diagnostics(pin DIAG):digitalopen-drainoutput; pulled
to VSS if the temperature or maximum current is
exceeded.
8.2 Protection
Temperature and short-circuit protection sensors are
included in the TDA8925. In the event that the maximum
current or maximum temperature is exceeded the
diagnostic output is pulled down to VSS. Since the
diagnostic is connected to the enable pins in the
application the system shuts down itself.
8.2.1 OVERTEMPERATURE
If the junction temperature (Tj) exceeds 150 °C, then
pin DIAG becomes LOW. The diagnostic pin is released if
the temperature is dropped to approximately 130 °C, so
there is a hysteresis of approximately 20 °C.
8.2.2 SHORT-CIRCUIT ACROSS THE LOUDSPEAKER
TERMINALS
When the loudspeaker terminals are short-circuited this
will be detected by the current protection. If the output
current exceeds the maximum output current of 3 A, then
pin DIAG becomes LOW. Using pin DIAG in combination
with the enable pins the system will shut down
immediately,and restartagain.The resultisthat theoutput
current is limited at the overcurrent detection level.

2004 May 06 7
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
9 LIMITING VALUES
In accordance with the Absolute Maximum Rate System (IEC 60134).
Notes
1. Human Body Model (HBM); Rs= 1500 Ω; C = 100 pF.
2. Machine Model (MM); Rs=10Ω; C = 200 pF; L = 0.75 µH.
10 THERMAL CHARACTERISTICS
11 QUALITY SPECIFICATION
In accordance with “SNW-FQ611” if this device is used as an audio amplifier.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VPsupply voltage −±30 V
VP(sc) supply voltage for
short-circuits across the load −±30 V
IORM repetitive peak current in
output pins −3.5 A
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −40 +85 °C
Tvj virtual junction temperature −150 °C
Vesd(HBM) electrostaticdischarge voltage
(HBM) note 1
all pins with respect to VDD (class 1a) −500 +500 V
all pins with respect to VSS (class 1a) −1500 +1500 V
all pins with respect to each other
(class 1a) −1500 +1500 V
Vesd(MM) electrostaticdischarge voltage
(MM) note 2
all pins with respect to VDD (class B) −250 +250 V
all pins with respect to VSS (class B) −250 +250 V
all pins with respect to each other
(class B) −250 +250 V
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient in free air 40 K/W
Rth(j-c) thermal resistance from junction to case in free air 1.5 K/W

2004 May 06 8
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
12 DC CHARACTERISTICS
VP=±15 V; Tamb =25°C; measured in test diagram of Fig.4; unless otherwise specified.
Note
1. Temperature sensor or maximum current sensor activated.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
VPsupply voltage ±7.5 ±15 ±30 V
Iq(tot) total quiescent current no load connected −25 45 mA
outputs floating −510mA
Internal stabilizer logic supply (pin STAB)
VO(STAB) stabilizer output voltage referenced to VSS 11.7 13 14.3 V
Switch inputs (pins SW1 and SW2)
VIH HIGH-level input voltage referenced to VSS 10 −15 V
VIL LOW-level input voltage referenced to VSS 0−2V
Control outputs (pins REL1 and REL2)
VOH HIGH-level output voltage referenced to VSS 10 −15 V
VOL LOW-level output voltage referenced to VSS 0−2V
Diagnostic output (pin DIAG, open-drain)
VOL LOW-level output voltage IDIAG = 1 mA; note 1 0 −1.0 V
ILO output leakage current no error condition −−50 µA
Enable inputs (pins EN1 and EN2)
VIH HIGH-level input voltage referenced to VSS 9−15 V
VIL LOW-level input voltage referenced to VSS 05−V
VEN(hys) hysteresis voltage −4−V
II(EN) input current −−300 µA
Switching-on input (pin POWERUP)
VPOWERUP operating voltage referenced to VSS 5−12 V
II(POWERUP) input current VPOWERUP =12V −100 170 µA
Temperature protection
Tdiag temperature activating diagnostic VDIAG =V
DIAG(LOW) 150 −−°C
Thys hysteresis on temperature
diagnostic VDIAG =V
DIAG(LOW) −20 −°C
Current protection
IO(ocpl) overcurrent protection level −3.5 −A

2004 May 06 9
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
13 AC CHARACTERISTICS
VP=±15 V; Tamb =25°C; unless otherwise specified.
Notes
1. VP=±15 V; RL=8Ω;f
i= 1 kHz; fosc = 310 kHz; Rs= 0.1 Ω(series resistance of filter coil); Tamb =25°C; measured
in reference design (SE application) shown in Fig.5; unless otherwise specified.
2. Indirectly measured; based on Rds(on) measurement.
3. Total Harmonic Distortion (THD) is measured in a bandwidth of 22 Hz to 20 kHz (AES 17 brickwall filter). When
distortion is measured using a low-order low-pass filter a significantly higher value will be found, due to the switching
frequency outside the audio band. Measured using the typical application circuit, given in Fig.5.
4. Efficiency for power stage.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Single-ended application; note 1
Pooutput power RL=8Ω
THD = 0.5 % 10(2) 12 −W
THD = 10 % 14(2) 15 −W
RL=6Ω
THD = 0.5 % −16 −W
THD = 10 % −20 −W
THD total harmonic distortion Po= 1 W; note 3
fi= 1 kHz −0.05 0.1 %
fi= 10 kHz −0.2 −%
ηefficiency endstage Po=2×15 W; fi= 1 kHz; note 4 −94 −%

2004 May 06 10
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
14 SWITCHING CHARACTERISTICS
VP=±15 V; Tamb =25°C; measured in Fig.4; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
PWM outputs (pins OUT1 and OUT2); see Fig.3
trrise time −30 −ns
tffall time −30 −ns
tblank blanking time −70 −ns
tPD propagation delay from pin SW1 (SW2) to
pin OUT1 (OUT2) −200 −ns
tW(min) minimum pulse width −220 270 ns
Rds(on) on-resistance of the output
transistors −0.2 0.4 Ω
handbook, full pagewidth
MGW145
PWM
output
(V)
VDD
VSS
0 V
tblank tf tr
1/fosc
100 ns
VSTAB
VSS
VSW
(V)
tPD
VSTAB
VSS
VREL
(V)
Fig.3 Timing diagram PWM output, switch and release signals.

2004 May 06 11 Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D audio amplifier TDA8925
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15 TEST AND APPLICATION INFORMATION
d
book, full pagewidth
12 kΩ15 nF
MDB613
15 nF
100
nF
CONTROL
AND
HANDSHAKE
DRIVER
HIGH
TDA8925
TEMPERATURE SENSOR
AND
CURRENT PROTECTION
DRIVER
LOW
temp
current
4
7
VSS1
VSS1
VREL2 VSS2
VDD2
6
1
2
9
810
VDD2 VDD1
13 5
CONTROL
AND
HANDSHAKE
DRIVER
HIGH
DRIVER
LOW
14
11
12
17
16
3
15
EN1
DIAG
REL1
SW1
SW2
REL2
POWERUP
EN2
BOOT1
2VP
OUT1
STAB
OUT2
VOUT2
VOUT1
BOOT2
12 V
V
V
V
VSW2
VREL1
V
VSW1 VEN VDIAG
V
VSTAB
V
12 V
0
12 V
0
Fig.4 Test diagram.

2004 May 06 12
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
15.1 SE application
For SE application the application diagram as shown in Fig.5 can be used.
15.2 Package ground connection
The heatsink of the TDA8925 is connected internally to VSS.
15.3 Output power
The output power in SE self oscillating class-D applications can be estimated using the formula
The maximum current should not exceed 3 A.
Where:
RL= load impedance
Rs= series resistance of filter coil
Po(1%) = output power just at clipping.
The output power at THD = 10 %: Po(10%) = 1.25 ×Po(1%).
15.4 Reference design
The reference design for a self oscillating class-D system for the TDA8925 is shown in Fig.5. The Printed-Circuit
Board (PCB) layout is shown in Figs 6, 7 and 8. The bill of materials is given in Section 15.5.1.
Po(1%)
RL
RLRds(on) Rs ++
------------------------------------------- VP
×2
2R
L
×
-----------------------------------------------------------------
=
IO(max) VP
RLRds(on) Rs ++
-------------------------------------------
=

2004 May 06 13 Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D audio amplifier TDA8925
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mdb614
C24
1µF
C25
1µF
C10
220 nF
C8 C9
220 nF
22 µF
(100 V)
R26
0 Ω
220 nF
C34
220 nF
C32
470 nF
C12
15 nF LS1
8 Ω
LS2
8 Ω
R22
22 Ω
C28
100 nF C27
22 µF (100 V)
R19
5.6 Ω
C28
560 pF
C29
560 pF
C30
560 pF
C31
560 pF
VSSP
R30
39 kΩ
L3
33 µH
L4
33 µH
U1
TDA8925ST/J
R31
39 kΩ
17
6
9
12
11
513
810
2
15
3
4
14
16
17
VSSP
VDDP
VDDP
VDDP
VDDP
C35
220 nF
C33
470 nF
C13
15 nF
R23
22 Ω
R21
5.6 Ω
C11
220 nF
C38
100 nF
S1
power-ON
C37
220 pF
STAB (U1,9)
STAB (U1,9)
DZ2
3.3 V
DZ1
36 V
R24
R16
1 kΩ
R10
0 Ω
C17
C15
100 nF
22 µF
(100 V)
C14
22 µF (100 V)
C16
100 nF
R28
0 Ω
R29
0 Ω
R4
1 kΩ
R35 R34
3.9 kΩ
R2
10 kΩ
150 Ω
R8
3.9 kΩ
R6
220 kΩ
C22
2.2 nF
C42
2.2 nF
R32
100 Ω
C39
2.2 nF
C41
47 nF
R7
3.9 kΩ
C40
47 nFIn1
In2
C21
2.2 nF
R13
15 kΩ
R9
1 kΩ
R33
3.9
kΩ
R1
10 kΩ
R14
15 kΩ
R25
2 kΩ
R15
10 kΩ
R17
5.6 kΩ
R12
2 kΩ
R11
2 kΩ
Q2
BC856
Q1
BC848
0 Ω
C6
470 µF
(35 V)
VSSP
VSSP
C7
470 µF
(35 V)
C5
VDD1 VDD2
VSS1 VSS2
VSSP
VSSP
VDDP
VDDP
VDDP
U2A
LM393
1
28
4
3
U2B
LM393
7
5
6
VSSP
VSSP
VSSP
J1
21
J32
1
J2
21
SW1 OUT1
BOOT1
STAB
BOOT2
OUT2
REL1
POWERUP
DIAG
EN1
EN2
REL2
SW2
R5
220 kΩ
R3
1 kΩ
C20
2.2 nF
C19
2.2 nF
C1
100 nF
+14.5 V
−14.5 V
CON1
supply
1
2
3C2
100 nF
C3
470 µF
(35 V)
L1
bead
bead
L2
VDDP
VSSP
C4
470 µF
(35 V)
Fig.5 SE self oscillating class-D system application diagram for TDA8925.

2004 May 06 14
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
handbook, full pagewidth
MDB615
Bottom silk
C37R15
C45
C36
R33
R34
R3
C19
C50
C17
C40
C41
R8
R16
IN2 IN1
Q1
C38
R25
Q2
C2
C12 C13 VDD
R28
R14
R13
R29
C11
C10 R26
R24 pin 1 R30 C28 R11
R12
R2
R31
C25
C24
C8
C9
C26 C31
C26
C31
C26
C30
R9
R35
R32
R1
GND
22 V
OUT1
R23
C35
R22
C34
OUT2 C1
C16
R4
C22
C21
R6
R10 R17 R7 R5
U2
++−−
C37R15
R19
R21
R19
R21
Fig.6 Printed-circuit board (bottom silk) layout for TDA8925ST.
handbook, full pagewidth
MDB617
Bottom copper
Fig.7 Printed-circuit board (bottom copper) layout for TDA8925ST.

2004 May 06 15
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
handbook, full pagewidth
MDB616
Top silk
TDA8925ST
In1 In2
Con3
C32 C33L2
L1
L4
L3
C4 C3 DZ1 C14 C15
J3
C6
C7 C27
C5 U1
J2
J1
Con2 Con1 CO2 CO1
S1DZ2
power_on
GND
Out1 Out2
VDD VSS
state of D art
VPtyp +/- 15 V
2 x 15 W in 8 Ω
single layer
demo PCB v2r4
RL 1 2003
Fig.8 Printed-circuit board (top silk) layout for TDA8925ST.
15.5 Reference design bill of material
15.5.1 Version 2; revision 5
COMPONENT DESCRIPTION TYPE COMMENTS
U1 TDA8925ST Philips Semiconductors,
SOT577-2
U2 LM393AD National, SO8 alternatives: TI
semiconductors and On
semiconductors
DZ1 36 V Zener diode BZX-79C36V, DO-35 used as jumper
DZ2 3.3 V Zener diode BZX-79C3V3, DO-35 used as jumper, optional
Q1 BC848 transistor NPN, SOT23
Q2 BC856 transistor PNP, SOT23
L1, L2 bead Murata BL01RN1-A62 used as jumper
L3, L4 33 µH coil Toko 11RHBP-330M ws totally shielded
S1 power-on switch PCB switch, SACME
09-03290-01 optional
CON1 VSS, GND, VDD connector Augat 5KEV-03 optional
CON2, CON3 Out2, Out1 connector Augat 5KEV-02 optional
CO1, CO2 In1, In2 connector Cinch Farnell 152-396 optional
J1, J2, J3 wire Jumpers, D = 0.5 mm
Capacitors
C37 220 pF/50 V SMD0805

2004 May 06 16
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
15.5.2 PRINTED-CIRCUIT BOARD
The printed-circuit board dimensions are 8.636 ×5.842 cm; single-sided copper of 35 µm; silk screen on both sides;
79 holes; 94 components (32 resistors and 41 capacitors).
C28, C29, C30,
C31 560 pF/100 V SMD0805 50 V is OK
C19, C20, C21,
C22, C39, C42 2.2 nF/50 V SMD0805
C12, C13 15 nF/50 V SMD0805
C40, C41 47 nF/50 V SMD1206
C1, C2, C16, C17,
C26, C38 100 nF/50 V SMD0805
C8, C9, C10, C11,
C34, C35 220 nF/50 V SMD1206 C8 to C11 used as jumper
C32, C33 470 nF/63 V MKT
C24, C25 1 µF/16 V SMD1206 1206 due to supply range
C7, C14, C15,
C27 22 µF/100 V Panasonic NHG Series ECA1JHG220 63 V is OK
C3, C4, C5, C6 470 µF/35 V Panasonic M Series
ECA1VM471
C18, C23, C36 these capacitors have been
removed
Resistors
R10, R26, R28,
R29 0ΩSMD1206 used as jumpers
R24 0 ΩSMD0805 short-circuited in a new
printed-circuit board layout
R19, R21 5.6 Ω/0.25 W SMD1206 1206 due to dissipation
R22, R23 22 Ω/1 W SMD2512 2512 due to dissipation
R35 150 ΩSMD1206 used as jumper
R32 100 ΩSMD1206 used as jumper
R9 1 kΩSMD1206 used as jumper
R3, R4, R16 1 kΩSMD0805
R11, R12 2 kΩSMD1206 used as jumpers
R25 2 kΩSMD0805
R7, R8, R33, R34 3.9 kΩSMD0805
R17 5.6 kΩSMD0805
R1, R2, R15 10 kΩSMD0805
R13, R14 15 kΩSMD0805
R30, R31 39 kΩSMD0805
R5, R6 220 kΩSMD0805
R18, R20, R27 these resistors have been
removed
COMPONENT DESCRIPTION TYPE COMMENTS

2004 May 06 17
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
15.6 Curves measured in reference design
handbook, halfpage
MDB618
10−210−111010
2
THD +N
(%)
102
10
1
10−1
10−2
10−3
Po(W)
(1)
(2)
(3)
Fig.9 THD + N as function of output power.
2×8ΩSE; VP=±15 V.
(1) 6 kHz.
(2) 1 kHz.
(3) 100 Hz.
handbook, halfpage
MDB620
10 102103104105
102
10
1
10−1
10−3
10−2
fi(Hz)
THD + N
(%)
(1)
(2)
Fig.10 THD + N as function of frequency.
2×8ΩSE; VP=±15 V.
(1) Po=10W.
(2) Po=1W.
handbook, halfpage
020
100
0
20
40
60
80
4 8 12 16
η
(%)
Po(W)
MDB622
Fig.11 Efficiency as function of output power.
2×8ΩSE; VP=±15 V;
fi= 1 kHz.
handbook, halfpage
(1)
(3)
(4)
MDB619
SVRR
(dB)
−80
−60
−40
−20
0
fi(Hz)
10 102103104105
(2)
Fig.12 SVRR as function of frequency.
VP=±15 V; Vripple(p-p) =2V.
(1) Both supply lines in phase.
(2) One supply line (VSS) rippled.
(3) One supply line (VDD) rippled.
(4) Both supply lines in antiphase.

2004 May 06 18
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
handbook, halfpage
0
100
20
40
60
80
MDB621
10−1 10−2Po(W)
S/N
(dB)
11010
2
Fig.13 S/N as function of output power.
2×8ΩSE; VP=±15 V.
handbook, halfpage
−100
0
−80
−60
−40
−20
MDB623
102 10 fi(Hz)
αcs
(dB)
103104105
(2)
(1)
Fig.14 Channel separation as function of
frequency.
2×8ΩSE; VP=±15 V.
(1) Po=1W.
(2) Po=10W.
handbook, halfpage
10
35
15
20
25
30
MDB624
102 10 fi(Hz)
G
(dB)
103104105
Fig.15 Gain as function of frequency.
2×8ΩSE; VP=±15 V;
Vi= 100 mV.
handbook, halfpage
10
(2)
(1)
20
25
5
9
13
17
21
12
Po
(W)
VP (V)
14 16 18
MDB625
Fig.16 Output power as function of supply voltage.
2×8ΩSE; fi= 1 kHz.
(1) THD + N = 10 %.
(2) THD + N = 1 %.

2004 May 06 19
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
16 PACKAGE OUTLINES
UNIT A e
1
e
2
A
2
b
p
cE
(1)
D
(1)
Z
(1)
de LL
1
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 13.5 4.6
4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54
12.2
11.8 1.27 2.54 3.75 3.15
E
h
D
h
62.00
1.45
2.1
1.8
3.4
3.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
3.75
3.15
SOT577-2
0 5 10 mm
scale
Qj
0.4
w
0.6
v
0.03
x
D
E
A
L
1
QL
c
A
2
w M
b
p
1
d
Ze
2
e
e
117
j
01-01-05
03-03-12
RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads
(row spacing 2.54 mm) SOT577-2
v
M
D
xh
Eh
non-concave
view B: mounting base side
B

2004 May 06 20
Philips Semiconductors Product specification
Power stage 2 x 15 to 25 W class-D
audio amplifier TDA8925
REFERENCES
OUTLINE
VERSION EUROPEAN PROJECTION ISSUE DATE
IEC JEDEC JEITA
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT243-3
0 5 10 mm
scale
D
L
E
A
c
A
2
L
3
Q
w M
b
p
1
d
D
Ze
e
xh
117
j
Eh
non-concave
99-12-17
03-03-12
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) SOT243-3
view B: mounting base side
m
2
e
v M
B
UNIT A e
1
A
2
b
p
cD
(1)
E
(1)
Z
(1)
deD
h
LL
3
m
mm 17.0
15.5 4.6 4.4 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54
v
0.6
12.2
11.8 1.27
e
2
5.08 2.4
1.6
E
h
62.00
1.45
2.1
1.8
3.4
3.1 4.3
8.4
7.0
Qj
0.25
w
0.03
x