Polar Electro LED 32 User manual

SERVICE MANUAL
CHASSIS : AS-TSUMV59XUS-LE1
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
LCD/LED TV
MODEL:LED 32

CONTENTS
C
ontents .............................................................................................. 2
P
roduct safety ..................................................................................3
S
pecification ........................................................................................7
Software
upgrade........................................................................................10
S
vc.sheet ...............................................................................................17

SAFETY PRECAUTIONS
IMPORTANT SAFETY NOTICE
Many
electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by
in
the Schematic Diagram and Replacement Parts List.
It
is essential that these special safety parts should be replaced with the same components as recommended in this manual to
prevent
Shock, Fire, or other Hazards.
Do
not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the
AC
power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal
injury
from electrical shocks.
It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be
inadvertently
introduced during the service operation.
If
any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before
returning the receiver to the customer, always perform an AC leakage current check on the exposed metallic parts of the
cabinet,
such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock.
Leakage Current Cold Check(Antenna Cold Check
With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the
AC
switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead
in
turn to each exposed metallic parts such as antenna terminals, phone jacks, etc.
If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩand 5.2MΩ.
When the exposed metal has no return path to the chassis the reading must be infinite.
An other abnormality exists that must be corrected before the receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF
capacitor
between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any
voltage
measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA.
In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.

Leakage Current Hot Check circuit
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow
SAFETY
PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety
precautions
on page 3 of this publication, always follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power source before;
a. Removing or reinstalling any component, circuit board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its assemblies.
4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90%
(by volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be
equipped.
6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks ar
correctly installed.
7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this service manual.
CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect
transistors
and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of
component
damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any
electrostatic
charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available
discharging
wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit
under
test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum
foil, to prevent electrostatic charge buildup or exposure of the assembly
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can
generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it.
(Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable
conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective
material
to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient
to
damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within
the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do
not use freon-propelled spray-on cleaners.
5.
Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature. (500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
6.
Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature (500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only
until
the solder flows onto and around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit board printed foil.
d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.
IC
Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the
circuit
foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working
with
boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.
Removal
1.
Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder
melts.
2.
Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the
IC.

Replacement
1.
Carefully insert the replacement IC in the circuit board.
2.
Carefully bend each IC lead against the circuit foil pad and solder it.
3.
Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).
"Small-Signal"
Discrete Transistor
Removal/Replacement
1.
Remove the defective transistor by clipping its leads as close as possible to the component body.
2.
Bend into a "U" shape the end of each of three leads remaining on the circuit board.
3.
Bend into a "U" shape the replacement transistor leads.
4.
Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with
long
nose pliers to insure metal to metal contact then solder each connection.
Power
Output, Transistor Device
Removal/Replacement
1.
Heat and remove all solder from around the transistor leads.
2.
Remove the heat sink mounting screw (if so equipped).
3.
Carefully remove the transistor from the heat sink of the circuit board.
4.
Insert new transistor in the circuit board.
5.
Solder each transistor lead, and clip off excess lead.
6.
Replace heat sink.
Diode
Removal/Replacement
1.
Remove defective diode by clipping its leads as close as possible to diode body.
2.
Bend the two remaining leads perpendicular y to the circuit board.
3.
Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.
4.
Securely crimp each connection and solder it.
5.
Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if
necessary,
apply additional solder.
Fuse
and Conventional Resistor
Removal/Replacement
1.
Clip each fuse or resistor lead at top of the circuit board hollow stake.
2.
Securely crimp the leads of replacement component around notch at stake top.
3.
Solder the connections.
CAUTION:
Maintain original spacing between the replaced component and adjacent components and the circuit board to
prevent
excessive component temperatures.
Circuit
Board Foil Repair
Excessive
heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit
board
causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed
whenever
this condition is encountered.
At
IC Connections
To
repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern
side
of the circuit board. (Use this technique only on IC connections).
1.
Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).
2.
carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.
3.
Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.
4.
Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good

copper
pattern. Solder the overlapped area and clip off any excess jumper wire.
At
Other Connections
Use
the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves the
nstallation
of a jumper wire on the component side of the circuit board.
1.
Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous
condition
will not exist if the jumper wire opens.
2.
Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly
connected
to the affected copper pattern.
3.
Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead
of
the nearest component on the other side. Carefully crimp and solder the connections.
CAUTION
: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges.
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
1.
Application range
This
specification is applied to the LCD TV used AS-TSUMV59XUS-LE1 chassis.
2.
Requirement for Test
Each
part is tested as below without special appointment.
1)
Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC
2)
Relative Humidity : 65±10%
3)
Power Voltage : Standard input voltage(100-240V~, 50/60Hz)
* Standard Voltage of each products is marked by models.
4)
Specification and performance of each parts are followed each drawing and specification by part number in accordance with
BOM.
5)
The receiver must be operated for about 20 minutes prior to the adjustment.
3.
Test method
1)
Performance: Asano TV test method followed
2)
Demanded other specification
-
Safety: CB specification
-
EMC: CISPR 13 specification
4.
General specification
Item Specification Remark
Broadcasting
system PAL-BG
Available
Channel
1) VHF : 00 ~ 12
2) UHF : 20 ~ 75
3) CATV : 02 ~ 44
Tuner
IF 1) PAL : 38.90MHz(Picture)
34.40MHz(Sound)
Input
Voltage 100 - 240V~, 50/60Hz Mark : 240V, 50Hz
Screen
Size 32 inch Wide (1366 x 768) HV320WX2-201
Aspect
Ratio 16:9
Module
HV320WX2-201 HV320WX2-201
Operating
Environment 1) Temp : 0 ~ 40 deg
2) Humidity : ~ 80 %
Storage
Environment 1) Temp : -20 ~ 60 deg
2) Humidity : ~ 85 %

5.
Chrominance & Luminance Specification
No Item Min Typ Max Unit Remark
1White peak brightness 300 350 cd/m2 HV320WX2-201
2 Contrast ratio 1000:1 N/A
3 Brightness uniformity 72 % Full white
4 Color coordinate
RED X
Typ..
-0.03
0.630
Typ..
+0.03 HV320WX2-201
Y 0.340
GREEN X 0.300
Y 0.630
BLUE X 0.148
Y 0.068
WHITE X 0.280
Y 0.290
RED X 0.630
Y 0.340
GREEN X 0.300
Y 0.630
BLUE X 0.148
Y 0.068
WHITE X 0.280
Y 0.290
5 Color coordinate uniformity N/A
6 Contrast ratio 1000 HV320WX2-201
7 Color Temperature
Cool 9500 <Test Condition>
HDMI input,
85% Full white
pattern
Medium 8700
Warm 6200
8 Color Distortion, DG 10.0 %
9 Color Distortion, DP 10.0 deg
10 Color S/N, AM/FM 43 dB
11 Color Killer Sensitivity -80 dBm
6.
Component Video Input (Y, PB, PR)
No Specification Remark
Resolution H-freq(kHz) V-freq(Hz)
1 720x480 15.73 59.94 SDTV,DVD 480i
2 720x480 15.75 60 SDTV, DVD 480i
3 720x480 31.47 59.94 SDTV 480p
4 720X480 31.5 60 SDTV 480p
5 720x576 15.625 50 SDTV, DVD 576i
6 720x576 31.25 50 SDTV 576p
7 1280x720 44.96 59.94 HDTV 720p
8 1280x720 45 60.36 HDTV 720p
9 1280x720 37.5 50 HDTV 720p
10 1920x1080 28.125 50 HDTV 1080i
11 1920x1080 33.75 60 HDTV 1080i
12 1920x1080 33.72 59.94 HDTV 1080i

13 1920x1080 56.25 50 HDTV 1080p
14 1920x1080 67.433 59.94 HDTV 1080p
15 1920x1080 67.5 60 HDTV 1080p
7.
RGB PC INPUT Mode
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 720*400 31.468 70.08 28.321
2640*480 31.469 59.94 25.17 VESA Input 848*480 60Hz,
852*480 37.684 75.00 31.50 --> 640*480 60Hz Display
3800*600 37.879 60.31 40.00 VESA
46.875 75.00 49.50
4 1024*768
48.363 60.00 65.00 VESA(XGA)
56.470 70.00 75.00
60.123 75.029 78.75
5 1280*768 47.78 59.87 79.5 WXGA
6 1360*768 47.72 59.8 84.75 WXGA
7 1366*768 47.56 59.6 84.75 WXGA
8 1280*1024 63.595 60.0 108.875 SXGA
9 1920*1080 66.647 59.988 138.625 WUXGA
8.
HDMI Input (PC/DTV)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
PC
1 720*400 31.468 70.08 28.321 HDCP
2 640*480 31.469 59.94 25.17 VESA HDCP
3 800*600 37.879 60.31 40.00 VESA HDCP
4 1024*768 48.363 60.00 65.00 VESA(XGA) HDCP
56.470 70.00 75.00
5 1280*768 47.78 59.87 79.5 WXGA HDCP
6 1360*768 47.72 59.8 84.75 WXGA HDCP
7 1366*768 47.56 59.6 84.75 WXGA HDCP
DTV
10 720*480 31.47 59.94 27.00 SDTV 480P(4:3)
11 720*480 31.50 60 27.027 SDTV 480P(4:3)
12 720*480 31.47 59.94 27.000 SDTV 480P(16:9)
13 720*480 31.50 60.00 27.027 SDTV 480P(16:9)
14 720*576 31.25 50.00 27.000 SDTV 576P
15 1280*720 37.50 50.00 74.176 HDTV 720P HDCP
16 1280*720 44.96 59.94 74.176 HDTV 720P HDCP
17 1280*720 45.00 60.00 74.250 HDTV 720P
18 1920*1080 33.72 59.94 74.176 HDTV 1080I HDCP
19 1920*1080 33.75 60.00 74.250 HDTV 1080I HDCP
20 1920*1080 28.125 50.00 74.250 HDTV 1080I 50Hz HDCP
21 1920*1080 27.000 24.00 74.250 HDTV 1080P 24Hz HDCP
22 1920*1080 56.250 50 148.500 HDTV 1080P 50Hz HDCP
23 1920*1080 67.433 59.94 148.352 HDTV 1080P HDCP
24 1920*1080 67.500 60 148.500 HDTV 1080P HDCP

Software upgrade
1.
Application Range
This
specification sheet is applied to all of the LCD TV with AS-TSUMV59XUS-LE1 chassis.
2.
Designation
1)
The adjustment is according to the order which is designated and which must be followed, according to the plan which can be
changed
only on agreeing.
2)
Power Adjustment: Free Voltage
3)
Magnetic Field Condition: Nil.
4)
Input signal Unit: Product Specification Standard
5)
Reserve after operation: Above 5 Minutes (Heat Run)
Temperature
: at 25±5ºC
Relative
humidity : 65±10%
Input
voltage : 220V, 60Hz
*
Download
1)
Execute ISP program “Mstar ISP Utility”and then click“Config”tab.
2)
Set as below, and then click “Auto Detect”and check “OK”message. If display “Error”, Check connect computer, jig,
and
set.
3)
Click “Connect”tab. If display “Can’t”, Check connect computer, jig, and set.
4)
Click “Read” tab, and then load download file(MST_V59.bin) by clicking “Read”.