Power integrations LinkSwitch-4 LNK4*15D Series Installation and operating instructions

Application Note AN-69
LinkSwitch-4 Family
www.power.com October 2017
Design Guide and Considerations
Introduction
The LinkSwitch™-4 family of ICs dramatically simplies low power
CV/CC charger/adapter design by eliminating an optocoupler and
secondary control circuitry. The LinkSwitch-4 family adaptive BJT drive
technology uses combined base and emitter switching to boost switching
performance and deliver higher efciency, wider Reverse Bias Safe
Operating Area (RBSOA) margin and the exibility to accommodate a
wide range of low cost BJT. The device incorporates a multimode PWM
/ PFM controller with quasi-resonant switching to maximize the efciency,
meets <30 mW no-load and at same time maintains fast transient
response greater than 4.3 V with a load change from 0% to 100%.
Advanced Performance Features
•Dynamic base drive technology provides exibility in choice of BJT
transistor by dynamically optimizing BJT switching characteristics
•Extends RBSOA of BJT
•Dramatically reduces sensitivity to BJT gain
•Compensates for transformer inductance tolerances
•Compensates for input line voltage variations
•Compensates for cable voltage drop
•Compensates for external component temperature variations
•Very accurate IC parameter tolerances using proprietary trimming
technology
•Frequency up to 65 kHz to reduce transformer size
•The minimum peak current is xed to improve transient load
response
Advanced Protection/Safety Features
•Single fault output overvoltage and short-circuit
•Over-temperature protection
EcoSmart™ – Energy Efcient
•Meets DoE 6 and CoC V5 2016 via an optimized quasi-resonant
switching PWM / PFM control
•No-load consumption of <30 mW at 230 VAC input
Green Package
•Halogen free and RoHS compliant package
Applications
•Chargers for cell/cordless phones, PDAs, MP3/portable audio
devices, adapters, etc.
LinkSwitch-4 Family
There are four main family groups covering a power range of nominally
2 W to 18 W and they come in either a SOT23-6 or SO-8 package.
Groups are further subdivided by cable drop compensation levels of
0%, 3% and 6%.
LNK43xxx and LNK4x15D devices have an enhanced base drive
optimization for reduced BJT losses. For example, the LNK4322S can
output 5 W using a TO92 13003 BJT instead of a TO251 13005 and
remain thermally safe. The LNK43x3 devices also include a debounce
delay after a low output voltage is detected to prevent false UVP
foldback being triggered in noisy environments.
Figure 1. LinkSwitch-4 Packages.
Note that the LNK4xx3D and LNK4xx4D SO-8 packages have the
SUPPLEMENTARY BASE DRIVE (SBD) pin and BASE DRIVE (BD) pins
swapped. This is to avoid problems with charger/adapter reliability.
The 10 W rated LNK40X3D would otherwise work in a 15 W LNK40X4D
design and may pass production nal test, but it would be over-
stressed and probably result in eld failures.
Output Power Table
Product3,4
85 - 265 VAC
Features5Adapter1
Open Frame2
LNK43x2S 13003 Drive 5 W
LNK40x2S STD 6.5 W
LNK40x3S STD 8 W
LNK4323S STD 8 W
LNK40x3D STD 10 W
LNK4323D STD 10 W
LNK40x4D STD 15 W
LNK4114D Easy Start 15 W
LNK4214D Easy Start + Constant Power 15 W
LNK4115D Easy Start 18 W
LNK4215D Easy Start + Constant Power 18 W
Table 1. LinkSwtich-4 Selection Table Based on Output Power.
PI-7673-061516
D Package (SO-8)
(LNK40x4D, LNK4114D, LNK4214D,
LNK4115D, LNK4215D)
S Package (SOT-23-6)
CS
VCC
BD
SBD
8
7
6
5
1
2
3
4
FB
FB
GND
ED
CS
VCC
BD
61
52
43
GND
GND
ED
D Package (SO-8)
(LNK40x3D, LNK4323D)
CS
VCC
SBD
BD
8
7
6
5
1
2
3
4
FB
GND
GND
ED

Rev. B 10/17
2
Application Note AN-69
www.power.com
Scope
This application note is intended for engineers designing an isolated
AC-DC yback power supply using the LinkSwitch-4 family of devices.
It provides guidelines to enable an engineer to quickly select key
components and to complete a suitable transformer design. To
simplify the task this application note refers directly to the PIXls
design spreadsheet, part of the PI Expert design software suite.
Basic Circuit Topology
The circuit in Figure 2 shows the basic topology of a yback power
supply designed using LinkSwitch-4. Because of the high-level
integration of LinkSwitch-4, far fewer design issues are left to be
addressed externally, resulting in one common circuit conguration
for all applications. For example, different output power levels may
require different values for some circuit components, but the circuit
topology stays unchanged. The exception to this is the optional SBD
resistor used with the SO-8 package parts. This increases the
available base drive current for higher power designs without
increasing the package power dissipation.
Schematic Features
• R IN provides inrush current limiting at turn-on and under transient
surge conditions.
• CIN1, CIN2 and LFILT provide ltering to reduce switching noise impressed
upon the AC supply, the capacitors also provide energy storage to
power the convertor during the valleys of the rectied AC.
• R HT provides start-up current, which is amplied by the BJT to
charge CVCC via the EMITTER DRIVER (ED) and VOLTAGE SUPPLY
(VCC) pins.
• R CS converts the positive ramping primary current into a negative
ramping voltage, which is monitored by the PRIMARY CURRENT
SENSE (CS) pin. It allows cycle-by-cycle peak primary current and
hence output power control, primary current limiting and, with the
transformer turns ratio, sets the maximum output current limit.
• R CS2 reduces ESD susceptibility on all devices. Though highly
recommended, it is not strictly necessary on LNK40x2S parts.
On the remaining parts, it sets one of four minimum primary
current levels to control no-load behavior.
• R SBD is only used on SO-8 packaged parts. It allows for extra base
drive in higher power designs without increasing package dissipation
signicantly.
• T1 is the yback transformer. It stores energy in the primary wind-
ing and transfers it to the secondary and bias windings. There are
usually additional screen windings, not shown, to reduce EMI.
• The bias diode and CVCC provide operational power to the controller IC.
• The bias winding is also used to measure the output voltage level
on the secondary winding.
• For FEEDBACK (FB) pin positive voltage excursions, RFB1, RFB2 and
the turns ratio between the secondary and bias windings set the
output voltage.
• For negative voltage excursions, the FEEDBACK pin is a virtual
earth amplier and is held at zero volts by sourcing current into
RFB1. This is translated internally into a voltage that represents the
HT voltage across CIN2. This is used to provide input undervoltage
detection, brown-out detection and BJT desaturation detection.
• R OUT is a dummy load for controlling no-load behavior.
In addition to this application note, you may also nd the LinkSwitch-4
Design Examples Reports (DER). Further details on downloading PI
Expert, Design Example Reports, and updates to this document can
be found at www.power.com.
Figure 2. Typical LinkSwitch-4 Circuit Topology.
PI-7962-052416
LNK40x3D
~
GND
BD
ED
CS
VCC
SBD
FB
+
2 × R
HT
Q1
L
FILT
D
BRIDGE
R
CS
R
CS2
R
SBD
SBD pin only available
on SOP-8 package parts
R
FB2
R
OUT
C
OUT
D
OUT
R
FB1
T1
C
VCC
R
IN
C
IN1
C
IN2

Rev. B 10/17
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Application NoteAN-69
www.power.com
Quick Start
To start immediately, use the following information to quickly design
the transformer and select the components for a rst prototype.
Only the information described below needs to be entered into the
PIXls spreadsheet gray cells in column [B]. Some gray cells have
entries in bold font, these contain drop down selections. If an invalid
selection is made, then Info or Warning text will appear in column [C]
and [D], a description of the error is displayed in column [H]. Other
parameters and component values will be automatically calculated.
References to spreadsheet cell locations are provided in square
brackets [cell reference].
The default design presented in a blank spreadsheet is for a 5 V, 2 A
adapter with 6% cable compensation and standard universal AC input
voltage range. All gray cells are blank except for those with bold text
drop down selections, which are set to the appropriate selections for
the default adapter. The default values are displayed in column [E]
and [F]. When an entry is made in a column [B] gray cell, its value is
transferred into the corresponding cell in columns [E] and [F] and
from there, used in the calculations.
It is only necessary to enter values into column [B] if they are
different to the default values in column [E].
• If a non-standard AC input voltage range is required, enter the
values for VACMIN, VACMAX and fL into cells [B3, B4, B5] as required.
• Enter the nominal output voltage (at the end of the cable if
applicable), VO[B6].
• Entre the output diode forward volt drop if different to the
standard Schottky value, VD[B8].
• Enter the minimum required output current value, IO[B9]. Notice
that cell [E10] is updated with a suggested minimum CC value for
ICC. See Figure 4.
• Enter the required CC limit, ICC [B10], if it is higher than the
suggested minimum I [E10]. See Figure 4.
• Enter an efciency estimate, η [B12]. Use the target gure from
the applicable efciency standard.
• Use the drop down selection menu in [B19] to select the desired
cable compensation. Output voltage at the PCB, VO_PCB, is now
given in [E7].
• The minimum recommended bulk capacitance value (CIN1 + CIN2) is
given in [E13]. If a larger value, or standard values are to be used,
enter their total value into [B13].
• Using the value for ‘rated output power’ in cell [E11], use table 1
on page 1, to choose the correct LinkSwitch-4 device. Use the
drop down selection menu in [B18] to select that device.
• BJT types TS13003 and TS13005 are auto selected based on
output power. To use a different BJT, enter PART_NUMBER, HFE_
STARTUP (low current gain), HFE (high current gain) and VSWMAX
(VCBO) into [B24,B25,B26,B27].
• Use the drop down selection menu in [B35] to select ‘AUTO’. A
suitable core, bobbin and parameters will automatically be entered
into cells [E35 – E43].
• To optimize for efciency enter an alternative value for the
reected output voltage, VOR in [B49], the default is 100 V. While
trying different values, observe the changes in KCRMV [E65] and
aim to get between 0.95 and 0.98. At the same time ensure
VCRMV-VMIN [E56-E57] is less than 15 V, but the higher VCRMV
the better. The spreadsheet will produce a reasonable solution if
VOR is left at the default 100 V.
• Fixing the number of secondary turns in [B50] while sweeping the
VOR value [B49] offers further optimization possibilities.
• The default primary inductance tolerance is 10%, an alternative
value can be entered in [B88]. Tighter tolerance allows better
average efciency across production.
• The default number of primary winding layers is 3 [E98], if the
primary current density [E103] is less than 3.8 Amps / mm2it can
be reduced to 2 by an entry into [B98]. If greater than 10 Amps /
mm2, increase to 4 etc. The fewer layers the better for leakage
inductance and hence efciency.
• The default calculated number of turns for the bias winding, NB
[E105] is based on providing a no-load bias voltage, VB_NOLOAD
[E107] that achieves the lowest no-load power. However, start-up
may be compromised so enter a value between 8 and 9 into
VB_NOLOAD [B107]. NB will be recalculated; check the value of
VB_NOLOAD_MEASURED [E109] is between 8 and 9 V. If not,
adjust the value in [B107] and recheck.
• One secondary layer is optimal for efciency, but if the output
voltage is high resulting in the secondary wire being impractically
thin, DIAS [E120], then it can be increased by entering a value in
LS [B116]. The spreadsheet calculates for a triple insulated wire
size that will ll the bobbin width in an integer number of layers
given in [E116].
• For low voltage designs, particularly at higher powers and larger
cores, the wire thickness becomes impracticably thick to wind. By
winding the secondary with a number of parallel conductors, the
wire thickness is reduced to a practical value, also leakage
inductance is decreased which improves efciency. To use more
than one conductor, enter a value into Filars [B117] and recheck
the new calculated wire size, DIAS [E120].
• Enter a BJT voltage derating factor into SWITCH_DERATING
[B126] if other than 0.10 (10%) is required.
• Use the drop down selection menu in VCS_MIN [B135] to set the
minimum value of peak primary current at no-load. It is repre-
sented by the peak mV across RCS. For the LNK40X2S devices, only
88 mV should be selected and a 1 kW value be used for RCS2 for
ltering. For other devices select the lowest value (56 mV) for the
rst iteration.
• If the application requires no-load to partial or full load transient
capability, where the output voltage must not fall below a minimum
value as in USB charger applications, check the value of CBIAS
[E138] if it is more than 2 mF, enter the value ‘2’ into [B138].
Check DELTA_BIAS [E139] is less than 1.6 V.
• Output capacitor calculation for starting up into a resistive load:
Use the drop down selection menu in LOAD_TYPE [B141] to select
‘Resistive Load’. The spreadsheet calculates the maximum value of
output capacitance the circuit will start up into i.e. before CBIAS
runs out of charge.
• For a CC load at start-up, use [B141] to select ‘CCLoad’. The
default start-up CC load current is 75% of IO, the rated output
current (not the CC limited value) if another value is specied,
enter it into ICC_STARTUP [B142].
• If the suggested output capacitance value needs to be rounded up
to a preferred value, enter this into COUT_FINAL [B145].

Rev. B 10/17
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Application Note AN-69
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If no-load to partial or full load transient step is required as in USB
chargers:
• Enter the load step value into I_LOADSTEP [B148] if it is different
to the rated output current.
• Enter the minimum load voltage allowed during no-load to partial
or full load transient testing into V_UNDERSHOOT [B149].
• Check that FSW_NOLOAD value in [E154] is greater than FSW_
UNDERSHOOT in [E150]. If not, select a lower value for VCS_MIN
[B135], if already at the lowest setting or a LNK40x2S device is
being used, enter a lower value for R_PRELOAD [B152] untill the
condition is met.
• Check that the no-load power specication is met, P_NOLOAD_TO-
TAL [E174], if not select a higher value of VCS_MIN [B135] (not
LNK40X2S) and recheck that the FSW_
NOLOAD>FSWUNDERSHOOT and no-load power requirements are
met. If using a LNK40X2S, R_PRELOAD [B152] can be increased,
but no more than 2x.
If no transient step requirement:
• Select a value of VCS_MIN [B135] and R_PRELOAD [B153] that
gives a FSW_NOLOAD of between 1 kHz and 2 kHz and still meets
the no-load specication.
• Enter the maximum allowed start-up time into STARTUP_TIME
[B156] if it is not to be 1 second. Or enter a preferred value into
R_STARTUP [B157], a new value of the resultant startup time is
given in STARTUP_TIME_FINAL [E158].
Supplementary Base Drive
Resistor RSBD is used on SO-8 packaged devices to provide extra base
drive in higher power applications (7.5 W to 18 W). It should have a
value of between 390 Wand 220 W for standard designs, or 120 Wfor
applications using the EasyStart feature. Refer to the ‘Design
Testing’ section to check that correct value has been selected.
Component values for the design are found in:
CIN1 + CIN2, CIN [E13]
Selected device – [E20]
Q1 BJT – [E24]
T1 Core - [E35]
T1 Bobbin – [C37]
T1 Primary turns – [E51]
T1 Primary layers – [E98]
T1 Primary wire diameter – [E101, E102]
T1 secondary turns – [E50]
T1 Secondary layers – [E116]
T1 Secondary lars – [E117]
T1 Secondary wire diameter – [E120, E121]
T1 Bias turns – [E106]
T1 Core gap – [E93]
CVCC, Bias capacitor value – [E138]
Total output capacitance COUT, [E145]
Output capacitance ripple – [E81]
ROUT Dummy load – [E152]
RHT Start-up resistor – [E157]
RFB1 Upper feedback resistor – [E161]
RFB2 Lower feedback resistor – [E162]
RCS Current sense resistor – [E74]
RCS2 VCSMIN setting resistor – [E136]
Bias diode VRRM – [E129] usually 1N4148
DOUT VRRM – [E128]
DOUT Peak current – [E79]
DOUT RMS current – [E780]
Explore the spreadsheet for more informative data.

Rev. B 10/17
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Application NoteAN-69
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IC and BJT
Selection
Transformer Core,
Bobbin, Turns
.
Bulk Capacitor
Election
Power Range, CDC
Core Type; Size ; Material
Calculations: Turns,
Primary Inductance,
Peak Current, etc
Secondary Waveform
Parameters
Bias Winding
Parameters
PCB Layout
Bias Turns for Required
Bias Voltage
Assess Switching
Frequency vs. Load
Collector Voltage at
100%, 50%, 0% Load
Testing and
Troubleshooting
Function Consideration
EMC Consideration
Thermal Consideration
AUX Voltage vs. Load
Startup / Load Pull-Up
Efficiency
No-Load Power
Ripple
Thermal
Determines Minimum HT
Voltage at Full Load
Specify Application
Parameters
Customer / Data Sheet
Defined; Assumptions
Resulting HT, Primary
and Secondary
Conditions
Minimum HT Voltage,
Brown-Out HT Voltage
Transformer
Construction Wire Gauge, Number of
Layers, Filars
Optimize Turns Ratio
for Efficiency VOR, NS, NP
Peak, RMS Secondary
Current and C
OUT
Ripple Current
Peak Primary Current
Current Sense
Resistor Value
Additional Parameters
Bias Capacitor
Output Capacitor
Loadstep Undershoot
Dummy Load
Start-Up
Feedback Resistors
No-Load Power Estimate
PI-7977-012417
Figure 3. Design Flow Chart.
Step-by-Step Design Procedure

Rev. B 10/17
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Application Note AN-69
www.power.com
General Guidance for Using the PIXls Design
Spreadsheet
Only the information described below needs to be entered into the
PIXls spreadsheet gray cells in column [B]. Some gray cells already
have entries in bold font, these contain drop down selections. If an
invalid selection is made, then Info or Warning text will appear in
column [C] and [D], a description of the error is displayed in column
[H]. Other parameters and component values will be automatically
calculated. References to spreadsheet cell locations are provided in
square brackets [cell reference].
The default design presented in a blank spreadsheet is for a 5 V, 2 A
adapter with 6% cable compensation and standard universal AC input
voltage range. All gray cells are blank except for those with bold text
drop down selections, which are set to the appropriate selections for
the default adapter. The default values are displayed in column [E]
and [F]. When an entry is made in a column [B] gray cell, its value is
transferred into the corresponding cell in columns [E] and [F] and
from there, used in the calculations.
Do not read off calculated component values etc, until all the data
has been entered.
It is only necessary to enter values into column [B] if they are
different to the default values in column [E].
Step 1 – Enter Application Variables VACMIN, VACMAX, ƒL,
VO, VD, IO, ICC, η
AC Input Voltage Range, VACMIN, VACMAX
Determine the input voltage from Table 2 for common choices, or
enter the application specication values into [B3, B4].
Note: For designs that have a DC rather than an AC input, enter the
values for minimum and maximum DC input voltages, VMIN [B57] and
VMAX [B58], directly into the grey override cell on the design spread-
sheet (see Figure 5).
Line Frequency, ƒL
Typical line frequencies are 50 Hz for universal or single 100 VAC,
60 Hz for single 115 VAC, and 50 Hz for single 230 VAC inputs. These
values represent typical, rather than minimum, frequencies. For most
applications this gives adequate overall design margin. To design for
the absolute worst case, or based on the product specications,
reduce these numbers by 6% (to 47 Hz or 56 Hz). For half-wave
rectication use F /2. For DC input enter the voltage directly into
cells, VMIN [B57] and VMAX [B58].
Nominal Output Voltage, VO(V)
For both CV/CC and CV only designs, V is the nominal output voltage
measured at the end of an attached cable carrying nominal output
current. The tolerance for the output voltage is ±5% (including initial
tolerance and over the data sheet junction temperature range).
Output Diode Forward Voltage Drop, VD(V)
Enter the average forward-voltage drop of the output diode. Use
0.4 V for a Schottky diode or 0.7 V for a PN-junction diode (if specic
diode data is not available). VDhas a default value of 0.4 V.
Minimum Required Output Current, IO(A)
This is the nameplate current and is the current that must be
supplied at the nameplate voltage, before the VI curve follows the
decreasing voltage CC characteristic. It is the output current level at
which efciency measurements are taken. See Figure 4.
CC Mode Current Output Level, ICC (A)
In CC mode, the output current is regulated to the ICC value. There is
a 7% overall tolerance on the regulated value, so the spreadsheet
automatically defaults to setting this level to IO+ 8%. It is possible
to set ICC to a higher level by entering a value into [B10], a higher
value will help start-up into CC and/or high capacitance loads. It is
recommended that ICC < IO+ 20% else efciency will be signicantly
reduced.
Power Supply Efciency, η
Enter the estimated efciency of the complete power supply, as
would be measured at the output cable end (if applicable). In
practice, use the applicable energy saving standard value. If the
completed power supply fails to meet this value of efciency, some
components may be over stressed, but as the design has failed the
efciency specication it will need modifying anyway, before being
accepted for production.
Total Input Capacitance, CIN
This is calculated from the maximum power drawn from the bulk
capacitors at VACMIN, the minimum allowable bulk capacitor voltage
(VMIN) at which the convertor will operate efciently, nominally 80 V,
and the line frequency (FL). The value calculated in [E13] - with [B13]
blank, is the minimum required capacitance. A higher value may be
entered into [B13] to round up to the nearest standard value, or
increase the operating efciency of the converter stage over the AC
input voltage range. The total value of CIN is then split into two
approximately equal values, CIN1 and CIN2, to provide the input pi lter.
It is advisable to make at least CIN2 a low ESR type.
The following equation may be used to calculate the minimum
capacitance required:
arccos
CC FVV
P
V
V
2
2
()
IN IN
LMIN ACMIN MIN
O
ACMIN
MIN
12
22
##
#
#
$
h
+-
-
^
c
^
h
m
h
Use higher values to allow for capacitor tolerance.
Table 2. Standard Worldwide Input Line Voltage Ranges.
Figure 4. VI Curve With Parameter Positions Identied.
Nominal Input Voltage (VAC) VACMIN VACMAX
100/115 85 132
230 195 265
Universal 85 265
VOUT
IOUT
100%
100%
0
PI-8108-092116
VO [B6]
IO [B9]
ICC [B10]

Rev. B 10/17
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Application NoteAN-69
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BJT Output Power
TS13005 Up to 15 W
TS13003 Up to 5 W
Table 4. Recommended BJTs.
Figure 5. Application Variables Section of the Design Spreadsheet.
Figure 6. LinkSwitch-4 and BJT Selection.
Step 2 – Enter LinkSwitch-4 Selection
Select the Cable Drop Compensation Option
Select the cable compensation option from the drop down selection
menu in [B19] to most closely match the percentage output voltage
drop in the output cable. For example, a 5 V, 2 A LNK40x4D design
with a cable impedance of 150 mWhas a cable voltage drop of
-0.3 V. With a desired nominal output voltage of 5 V (at the end of
the cable), this represents a voltage drop of 6%. In this case, select
the +6% compensation, to give the smallest error. 0%, 3% or 6%
can be selected.
Selecting the Correct LinkSwitch-4 Part
Using the value for rated output power’ in cell [E11], use Table 1 on
page 1, to choose the correct LinkSwitch-4 device. Use the drop
down selection menu in [B18] to select that device. The full part
number is given in [E20].
The full load switching frequency of standard LinkSwitch-4 devices is
65 kHz.
Enter BJT selection
BJT types TS13003 (up to 5 W) and TS13005 (up to 18 W) are auto
selected based on output power. There are 800 V and 900 V rated
TS13003 parts for special circumstances, such as snubberless design
or higher AC input voltage e.g. 420 VAC. To use a different BJT, enter
PART_NUMBER, HFE_STARTUP (low current gain), HFE (high current
gain) and VSWMAX (VCBO) into [B24, B25, B26, B27].
Output Power Table
Product3,4
85 - 265 VAC
Features5Adapter1
Open Frame2
LNK43x2S 13003 Drive 5 W
LNK40x2S STD 6.5 W
LNK40x3S STD 8 W
LNK4323S STD 8 W
LNK40x3D STD 10 W
LNK4323D STD 10 W
LNK40x4D STD 15 W
LNK4114D Easy Start 15 W
LNK4214D Easy Start + Constant Power 15 W
LNK4115D Easy Start 18 W
LNK4215D Easy Start + Constant Power 18 W
Table 3. Selection Table of LinkSwitch-4 Parts by Power and Maximum BJT
Emitter Current (Primary Current).
ENTER APPLICATION VARIABLES
Design title
VACMIN 90 Volts Minimum AC Input Voltage
VACMAX 265 Volts Maximum AC Input Voltage
fL 50 Hertz AC Mains Frequency
VO 5.00 Volts Output Voltage at the end of the cable
VO_PCB 5.30 Volts Output Voltage at PCB. Changes with cable compensation selection
VD 0.40 Volts Output Winding Diode Forward Voltage Drop
IO 2.00 Amps Full load rated current. Used for all waveshape related calculations.
ICC 2.16 Amps CC setpoint. Must be >= IO+7%. Affects Rcs.
PO 10.60 Watts Rated output power including cable drop compensation. Calculated from IO
n 0.80 %/100 Efficiency Estimate
CIN 20.0 uFarads Total input bulk Capacitance
ENTER LINKSWTCH-4 VARIABLES
LinkSwitch-4 LNK40X4D Select LNK-4
Cable drop compensation option 6% 6% Select level of cable drop compensation
DEVICE
LNK4024D
Complete reference of select part number with the selected cable drop
compensation option
FSW 65000 Hertz LinkSwitch-4 typical switching frequency
ILIM_MAX 1.10 A Maximum emitter pin sink current
Transistor
PART_NUMBER TS13005 Example transistor for the current application
HFE_STARTUP 12 Minimum DC current gain at no load and startup. Affects start-up delay
HFE 25 Minimum DC current gain for load transient
VSWMAX 700 Volts Switch Breakdown voltage
V_CGND_ON
3.0 Volts
BJT + LNK-4 on-state Collector to ground Voltage (3V if no better information
available)

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Application Note AN-69
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Step 3 – Core and Bobbin Selection Based on Output
Power and Enter AE, LE, AL, BW, M
These symbols represent core effective cross-sectional area AE(cm2),
core effective path length LE (cm), core ungapped effective inductance
AL(nH/Turn2), bobbin width BW (mm) and safety margin width M (mm).
Due to the small transformer size that results at these power levels,
triple insulated wire is generally used for the secondary, so Safety
Margin Width is not used and left set to the default ‘0’ setting. If the
Safety Margin method is preferred and standard wire used, enter the
safety margin width. The spreadsheet will double it and subtract it
from the bobbin width (BW) and give the effective bobbin width, or
winding width (BWE). Universal input designs typically require a total
margin of 6.2 mm, and a value of 3.1 mm entered into [B42]. The
spreadsheet uses the value of BWE to calculate the required wire diam-
eter to ll the available bobbin width to minimize leakage inductance.
For designs using triple-insulated wire it may still be necessary to
enter a small margin to meet required safety creepage distances.
Typically many bobbins exist for each core size, each with different
mechanical spacing. Refer to the bobbin data sheet or seek guidance
from your safety expert or transformer vendor, to determine the
requirement for your design. The margin reduces the available area
for windings, so margin construction may not be suitable for
transformers with smaller cores. If, after entering the margin, more
than three primary layers (L) are required, either select a larger core
or switch to a zero-margin design using triple-insulated wire.
If the drop down selection menu in [B35] is used and ‘AUTO’ selected,
the spreadsheet selects the smallest core size, by AE, that meets the
peak ux density limit. The user can select an alternative core from
drop down list of commonly available cores (shown in Table 6). Table 5
provides guidance on the power capability of specic core sizes.
If the user has a preferred core not in the list, then the appropriate
parameters can be entered into [B36 – B42].
Figure 7. Transformer Core Selection.
Transformer Core Size
EE10 EF32
EF12.6 EFD15
EE13 EFD25
E24/25 EFD30
EE16 EI16
EE19 EI19
EE22 EI22
EEL16 EI25
EE16W EI28
EEL19 EI30
EEL22 EI35
EE25 EI40
EEL25 EPC17
EEL28 EPC19
EER28 EPC25
EER28L EPC30
EER35 ETD29
EER40 ETD34
EES16 ETD39
EF16 EE42/21/15
EF20 EE55/28/21
EF25 EF32
EF30
Table 5. Output Power Capability of Commonly used Sizes in LinkSwitch-4
Designs.
Table 6. List of Cores Provided in LinkSwitch-4 PIXls Spreadsheet.
Core Size Output Power Capability
EF12.6 3.3 W
EE13 3.3 W
EE16 6.1 W
EF20 10 W
Core Type EPC17 EPC17 Core Type
Custom Core (Optional) If Custom core is used - Enter Part number here
Bobbin P/N: BEPC-17-1110CPH
AE 0.23 cm^2 Core Effective Cross Sectional Area
LE 4.02 cm Core Effective Path Length
AL 1150 nH/T^2 Ungapped Core Effective Inductance
BW 9.55 mm Bobbin Physical Winding Width
M0 mm Safety Margin Width (Half the Primary to Secondary Creepage Distance)
BWE 9.6 mm Effective Bobbin Width
ENTER TRANSFORMER CORE/CONSTRUCTION VARIABLES

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Step 4 – Select Reected Voltage and Secondary Turns
These are the main optimization inputs that effect efciency and the
minimum DC bulk capacitor voltage the converter will operate at,
under full load. The spreadsheet will produce a reasonably optimized
design, but further improvement may be possible. To optimize for
efciency enter an alternative value for the reected output voltage,
VOR in [B49], the default is 100 V. Whilst trying different values,
observe the changes in KCRMV [E65] and aim to get between 0.95
and 0.98, though 0.945 to 1.05 is acceptable. At the same time
ensure VCRMV-VMIN [E56-E57] is less than 15 V. The higher VCRMV
the better for efciency at the cost of some twice line frequency
ripple in the output at ICC and VO (maximum power point). Fixing
the number of secondary turns in [B50] while sweeping the VOR
value [B49] offers further optimization possibilities.
The default primary inductance tolerance is 10%, an alternative value
can be entered in [B88]. Tighter tolerance allows better average
efciency across production.
F_RES is the idle ring frequency of the transformer whilst in the
application, so includes the effects of BJT collector capacitance and
and snubber capacitance. Use the default 400 kHz if no other gure
is available. Once the application has been tested, the true gure can
be entered and further optimization performed as required. Usually a
lower F_RES in the application will have an adverse effect, but it would
have to be signicantly lower to have a measurable effect, say -25%.
Figure 8. VOR and Secondary Turns Selection - Main Optimization Values.
Figure 9. DC Input Parameter Entry and VCRMV Optimization Watch Value.
Figure 10. Figure 10: Primary Waveform Parameters and KCRMV Optimization Watch Value.
Figure 11. Secondary Waveform Design Parameters.
MAIN OPTIMIZATION INPUTS
Turns and ratio
VOR 100.00 Volts Reflected Output Voltage. Use Goal Seek to get VCRMV to desired value.
NS
6
Number of Secondary Turns. Adjusting up or down along with VOR may improve
efficiency.
NP 105 Primary Winding Number of Turns
DC INPUT VOLTAGE PARAMETERS
VCRMV 94 Volts Vbulk at CRMV, at max LP tolerance. Higher value typically more efficient.
VMIN
82.6 Volts
Bulk cap "trough" voltage at VACMIN. Leave blank to calculate from capacitance
and load.
VMAX 375 Volts Maximum DC Input Voltage
VBROWN 51 Volts Bulk voltage it loses regulation
PRIMARY WAVEFORM PARAMETERS
F_RES 400 kHz Anticipated resonant frequency on the primary side (180<Ftrf<1200)
KCRMV 0.95 Ratio of primary switch off time to secondary conduction plus first valley time
IRMS 0.25 Amps Primary RMS Current (calculated at load=IO, VMIN)
IP 0.60 Amps Peak Primary Current (calculated at load=IO, VMIN)
IOCP
0.79 Amps
Pulse by pulse current limit. Appears during large load transients and brownout
operation.
IAVG 0.16 Amps Average Primary Current (calculated at load=IO, VMIN)
IP_CRMV 0.56 Amps Ipeak when Vin=Vcrm
F_CRMV 65000 Hz Fsw when Vin=Vcrm
FVMIN 62410 Hz Fsw at VMIN. If < 65kHz, is in frequency reduction mode
VCS_VMIN 0.273 Volts Vcs_pk at VMIN and load = IO
RCS 0.453 Ohm Calculated RCS value. Changes with Icc and VOR
SECONDARY WAVEFORM PARAMETERS
ISP 10.53 Amps Peak Secondary Current @ VMIN
ISRMS 3.67 Amps Secondary RMS Current @ VMIN
IRIPPLE 3.08 Amps Output Capacitor RMS Ripple Current @ VMIN

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Step 5 – Transformer Core Parameters
The default peak core ux is set to 3900 Gauss. If the users selected
core material requires a different value, enter it into [B86].
The default tolerance on the primary inductance is ±10%. A tighter
tolerance allows better average efciency across production, an
alternative value may be entered into [B88].
Step 6 – Transformer Primary Winding Design
Parameters
The default number of primary winding layers is 3, however if [H103]
indicates that the current density is low, then 2, or even 1, can be
entered into [B98] and the wire diameter will be reduced accordingly.
The lower the number of primary layers, the lower leakage induc-
tance is likely to be. However it may be possible that sandwiching
the secondary between 2 primary layers would result in the lowest
leakage inductance at the cost of a more complicated transformer
construction.
If [H103] indicates that the current density is high, then a higher
value must be entered into [B98]. More than 3 primary layers will
result in high primary to secondary leakage inductance, resulting in
high-voltage stress on the BJT or increased clamp/snubber losses, so
it may be necessary to sandwich the secondary between layers of the
primary.
Figure 12. Transformer Core Operational Parameters.
Figure 13. Transformer Primary Design Parameters.
TRANSFORMER CORE PARAMETERS
BP
3900 Gauss
Peak Flux Density @ max IOCP & max LP. 3900 Gauss. Lower BP may reduce
efficiency
LP 1099 uHenries Nominal Primary Inductance
LP Tolerance
10
Tolerance of Primary Inductance. Tighter tolerance allows better average
efficiency across production.
ALG 100 nH/T^2 Gapped Core Effective Inductance
BM 2763 Gauss Maximum Flux Density at PO, VMIN, LP (BM<3000)
BAC 1381 Gauss AC Flux Density for Core Loss Curves (0.5 X Peak to Peak)
ur 1614 Relative Permeability of Ungapped Core
LG 0.26 mm Gap Length (Lg > 0.1 mm)
L 3.0 Number of Primary Layers
OD 0.25 mm Maximum Primary Wire Diameter including insulation to fill layers
INS 0.05 mm Estimated Total Insulation Thickness (= 2 * film thickness)
DIA 0.20 mm Bare conductor diameter
AWG 33 AWG Primary Wire Gauge (Rounded to next smaller standard AWG value)
Primary Current Density (J) 5.23 Amps/mm^2 Primary Winding Current density (3.8 < J < 10)
Bias/Feedback Winding
NB 9 Turns Suggested number of turns for the bias / feedback winding
VDB 0.70 Volts Bias Winding Diode Forward Voltage Drop
VB_NOLOAD 7.40 Volts Desired Minimum Bias voltage at no load
PB_NOLOAD 4.14 mW Bias winding power consumption estimate at no load
VB_NOLOAD_MEASURED 7.40 Volts Measured Bias voltage at no load
TRANSFORMER PRIMARY DESIGN PARAMETERS

Rev. B 10/17
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Table 7. Suggested Bias Supply Diodes.
Step 7 – Bias / Feedback Winding Design Parameters
The bias / feedback winding performs two functions, as its name
suggests. Firstly, it provides power to the controller after the start-up
period and secondly, it provides the feedback signal to monitor output
voltage and bulk capacitor voltage.
During the start-up period, the controller is powered by the charge
held on the VCC capacitor CVCC. Before the voltage on CVCC falls to
VVCC(SLEEP), 4.5 V, the output voltage from the bias winding must exceed
VVCC(SLEEP)+VDB. The voltage from the Bias winding during start-up is
related to the voltage on the secondary winding, which in turn, is
related to the voltage on the output capacitor, which is charging from
0 V to VOUT. Hence more turns on the bias winding results in easier
starting with high output capacitance or constant current loads, but
results in a higher no-load power. Conversely, a lower number of
turns results in a reduced output capacitance or constant current load
start-up capability, but lower no-load power. A good starting point is
to aim for a no-load VCC voltage of between 8 V and 9 V, 7 V is the
minimum. The no-load level of VCC is determined by the turns ratio of
the secondary and bias turns, whereas the VCC level with load applied
is increased by energy scavenged from leakage inductance and is not
practical to calculate. Check the VCC level on the completed design,
checking that at the maximum AC input voltage and at maximum load
or start-up, VCC does not exceed 16.5 V.
N
V
VV
V
N
BIAS
CC No Load
OUTDOUT
DBIAS
S
#=
+
+
-
^h
The bias supply diode should be a silicon junction device, a Schottky
has too much reverse leakage and may prevent start-up. The spread-
sheet has 0.7 V entered as the default forward volt drop of the bias
supply diode, suitable for a silicon junction diode. An alternative
value may be entered into [B106] if required.
The spreadsheet defaults to calculating the required number of bias
wind turns to give at least 7 V with an integer number of turns. The
number of turns calculated is given in [E105] and the resulting VCC
level, at no-load, is given in [E109]. As previously discussed, between
8 V and 9 V is recommended, so enter ‘8’ into [B107]. The spread-
sheet will recalculate the number of turns to achieve a level of at
least 8 V. The revised number of Bias wind turns are given in [E105]
and the actual VCC level, at no-load, is given in [E109].
For applications that have challenging start-up conditions, CC load
and/or high output capacitance, a higher value of target VCC may be
entered into [B107], 9 V for example. Note however, that the Bias
winding power, given in [E108], increases with Bias voltage. Check
the no-load power estimation in [E174] is within specication. Check
the VCC level on the completed design, conrm that at the maximum
AC input voltage and at maximum load or start-up, VCC does not
exceed 16.5 V.
Bias Supply Diode Selection
In most circumstances a 1N4148 is adequate. In situations where
more leakage energy scavenging is required, to assist start-up for
example, a higher current ultrafast silicon diode may be used.
The maximum reverse voltage across the Bias diode is calculated in
[E129], add margin to this value before selecting a suitable part.
Suggested parts are given in Table 7.
VV
N
N
V2
DBIASMAX ACMAX
P
A
CC MAX
#
=+
^^hh
Where VCC(MAX) = 16.5 V worst case.
Type TRR (ns) VRRM (V) VFD (V) @ IF(A)
1N4148 475 1.0 0.15
1N4933 50 50 1.0 1.0
SF11G 35 50 1.0 2.0
UF4001 50 50 1.0 2.0
BYV27-50 25 50 1.0 2.0
UG1A 25 50 1.0 3.0
ES1A 35 50 1.0 3.0
STTH1R02 15 200 1.0 3.0

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Step 8 – Secondary Winding Design Parameters
Generally only one winding layer is used for the secondary, but for
high output voltage designs or very narrow winding window bobbins,
more may be needed. However, be aware that more layers mean
more leakage inductance and probably a reduction in efciency.
The spreadsheet defaults to 1 layer and calculates the required wire
diameter that will ll the bobbin width in the calculated number of
secondary turns.
If more layers are required to increase wire diameter, enter the value
into [B116].
For low voltage designs with a wide bobbin width, the required wire
thickness to ll the bobbin width may result in a wire thickness that is
too large to easily wind on the bobbin. To alleviate this problem, the
secondary can be wound in a number of lars (strands) in parallel and
side by side with each other. The spreadsheet calculates a recom-
mended number of lars displayed in [E117] required to keep wire
diameter practical. Approximately 1 mm outside diameter is the
spreadsheet target limit, but by entering the number of required lars
in [B117] the wire diameter can be reduced or increased as required.
From the effective bobbin width, number of turns, layers and lars,
the maximum outside diameter of the secondary wire is calculated.
A custom value can be entered into [B118], but this does not
recalculate the number of layers or lars. It does recalculate the bare
conductor diameter in [E120] and is useful for investigating the effect
on secondary winding current density.
The default secondary wire insulation thickness is 0.1 mm, as would
be found on available triple insulated wire. This is doubled to give
the space required for the insulation on the bobbin in [E119]. A
custom value (2 x insulation thickness) can be entered into [B119].
[E120] gives the bare conductor diameter, this can be used to select
the nearest available diameter e.g. the 0.56 mm value in the example
can be rounded down to 0.55 mm standard diameter. [E121] gives
the closest rounded down AWG standard wire gauge. If using AWG
sized wire, check that the rounded down AWG size is not too big a
reduction on the optimum size and not ll the bobbin width. If the
reduction is signicant, add a turn to the value in [B50] and check if
the AWG size suggested is closer to the optimum diameter. Then
re-check the primary wind results. A small adjustment to the
reected voltage VOR in [B49] can be used to optimize the primary
winding to ll the bobbin winding width.
Secondary winding current density is given in [E122], a value below
10 should be the target to limit transformer temperature rise at full
load. If the value is below 3.8, a smaller transformer may be possible,
but this is also determined by the primary winding parameters.
Figure 14. Transformer Secondary Design Parameters.
LS 1.0 Number of Secondary Layers
FilarS 2 # of paralleled secondary wires
ODS 0.76 mm Maximum Secondary Wire Diameter including insulation to fill layers
INSS 0.20 mm Estimated Total Insulation Thickness (= 2 * film thickness)
DIAS 0.56 mm Bare conductor diameter
AWGS 24 AWG Secondary Wire Gauge (Rounded to next smaller standard AWG value)
Secondary Current Density (J) 7.56 Amps/mm^2 Winding Current density (3.8 < J < 10)
TRANSFORMER SECONDARY DESIGN PARAMETERS

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Table 8. List of Recommended Secondary Diodes That May be used with LinkSwitch-4 Designs.
Series Number Type VR Range (V) IF (A) Package Manufacturer
1N5817 to 1N5819 Schottky 20-40 1Leaded Vishay
SB120 to SB1100 Schottky 20-100 1Leaded Vishay
11DQ50 to 11DQ60 Schottky 50-60 1Leaded Vishay
1N5820 to 1N5822 Schottky 20-40 3Leaded Vishay
MBR320 to MBR360 Schottky 20-60 3Leaded Vishay
SB320 to SB360 Schottky 20-60 3Leaded Vishay
SB520 to SB560 Schottky 20-60 5Leaded Vishay
MBR1045 Schottky 35/45 10 Leaded Vishay
UF4002 to UF4006 Ultrafast 100-600 1Leaded Vishay
UF5401 to UF5408 Ultrafast 100-800 3Leaded Vishay
MUR820 to MUR860 Ultrafast 200-600 8Leaded Vishay
BYW29-50 to BYW29-300 Ultrafast 50-200 8Leaded/SMD Vishay
ESA1A to ES1D Ultrafast 50-200 1SMD Vishay
ES2A to ES2D Ultrafast 50-200 2SMD Vishay
SL12 to SL23 Schottky (low VF)20-30 1SMD Vishay
SL22 to SL23 Schottky (low VF)20-30 2SMD Vishay
SL42 to SL44 Schottky (low VF)20-30 4SMD Vishay
SBR1045SD1 Schottky (low VF)45 10 Leaded Diodes
SL42 to SL4 Schottky (low VF)20-30 4SMD Vishay
SBR1045SP5 Schottky (low VF)45 10 SMD Diodes
Figure 15. Voltage Stress Parameters.
Step 9 – Voltage Stress Parameters
The default BJT switch derating factor is given in [E126] as 10%,
enter a custom value in [B126] if required. [E127] gives an estimate
of the maximum collector voltage of the switching BJT based on the
maximum bulk capacitor voltage, VOR and an estimate of the leakage
inductance spike. If this exceeds the maximum allowed BJT collector
voltage, a warning is given in [C127]. If a warning is given, check the
BJT derating factor is correct, if it is, select a BJT with a higher VCBO.
The maximum reverse voltage across the secondary diode is
calculated in [E128], add margin to this value before selecting a
suitable part. For low output voltage designs i.e. 5 V, the forward
voltage drop of the output diode greatly affects efciency, so it is
usual to choose a higher current part to help achieve the target
efciency i.e. >10 times rated output current.
VOLTAGE STRESS PARAMETERS
SWITCH_DERATING 0.10 %/100 Desired derating factor for switch
VCOLLECTOR 605 Volts Maximum Collector Voltage Estimate (Includes Effect of Leakage Inductance)
PIVS 27 Volts Output Rectifier Maximum Peak Inverse Voltage
PIVB 49 Volts Bias Rectifier Maximum Peak Inverse Voltage

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Step 10 – Additional Parameters
Bias Capacitor - CVCC
The bias capacitor serves three purposes:
1. Energy storage during the start-up procedure. The bias capacitor
powers the controller until the bias winding generates enough
voltage, which is limited by the voltage on the output capacitor,
to power the controller.
2. Acts as an energy reserve between switching cycles to power the
controller, particularly at no-load where the switching frequency
is low.
3. Forms part of the timing mechanism for the switching frequency
oscillator at no-load.
For easy starting into large output capacitance the bias capacitor
value can be made large. However, it must be a ceramic type
capacitor, an electrolytic capacitor will leak and possibly prevent
start-up especially as it ages. Also the bias capacitor must not be so
large that the ripple voltage on the VCC pin will be less than 50 mV at
the zero load switching frequency. If the ripple is less than 50 mV at
zero load, the controller will cease switching and power cycle. It
must detect the step in VCC when the transformer discharges to
move to the next state in the switching cycle when at zero load.
If the design has a zero load to partial or full load transient require-
ment, as found for USB charger designs, where the output voltage
must not fall below a given limit, the bias capacitor value should not
exceed 2 mF. Larger values of bias capacitor result in a very shallow
discharge curve across the capacitor. A voltage shifted version of this
curve is used to intersect with the internal switching frequency
oscillator capacitor charge voltage to start the next switching cycle.
If the angle of intersection is too shallow, thermal noise will make the
trigger point less predictable and the zero load frequency will vary
erratically. The average frequency will be such as to keep the output
voltage under zero load to be within specication, but the resulting
minimum frequency will allow a transient load to pull the output
voltage below the minimum allowed, if the transient coincides with a
low frequency cycle.
The bias capacitor ripple should not be allowed to exceed 1.6 V. If
VCC falls by more than 1.6 V in a switching cycle, an extra minimum
primary current pulse is issued. This will recharge the bias capacitor
to prevent VCC falling inadvertently to the sleep level, which would
cause a power reset cycle. If this happens too often, the output
voltage will rise and may exceed the specication.
The spreadsheet calculates the bias capacitor size to give 100 mV of
ripple [E139]. Alternative values can be entered into [B138] and the
new ripple level (Delta_Vbias) will be given in [E139].
Zero-Load Collector Peak Current
VCS_MIN is the minimum peak voltage that the controller can set
across the RCS resistor. This sets the minimum primary current and
hence the minimum energy per switching cycle. On LNK4xx3x,
LNK4x14D and LNK4x15D devices there are four discrete levels that
can be set, 58 mV, 73 mV. 94 mV and 127 mV. These are set by the
resistor RCS2 which can be 100 W, 270 W, 470 Wor 1 kWrespectively.
No other values can be used, there are no intermediate values of
VCS_MIN. LNK40x2S devices only have one level for VCS_MIN, 88 mV.
VCS_MIN is used to control the zero load behavior of the circuit,
particularly the zero load switching frequency. The higher the VCS_
MIN level, the lower the zero load switching frequency and the lower
the zero load power. However, the lower the zero load switching
frequency, the larger the output capacitors must be if there is a zero
load transient requirement. Larger output capacitors require a larger
bias capacitor which cannot be greater than 2 mF in this situation.
A zero load switching frequency of between 1 kHz and 2 kHz should
be the target, calculated in [E154].Use the drop down selection table
in [B145] to select the required VCS_MIN. The required value of RCS2
is given in [E136]. The higher the frequency, the easier it is to
start-up and meet zero load transient requirements, but zero load
power will be greater.
Dummy Load Resistor ROUT
The value of R_PRELOAD (ROUT) can be used to trim the zero load
switching frequency [E154] by entering a value in [B152]. Aim to
have the dummy load power dissipation [E153] no lower than the bias
winding power at no-load [E108]. This aids consistent zero load
behavior across production.
Figure 16. Bias Capacitor Selection.
Figure 18. Dummy Load Resistor Selection.
Figure 17. Zero-Load Peak Collector Current Selection.
Bias Capacitor
CBIAS
5.38 uF Bias capacitor is greater than 2uF! Transient response could be unpredictable.
For improved and repeatable transient response keep capacitor value < 2 uF
DELTAV_BIAS
100 mV
Voltage ripple on VCC capacitor at zero-load (should be between 0.05 V and
1.6 V
Zero-load Collector peak current
VCS_MIN
73 73 mV
Drives peak current at zero load. Affects zero load frequency and consumption,
and 0-100% load step
RCS2 270 Ohm Resistance for setting VCS_MIN
Dummy load and no load
R_PRELOAD
5620 Ohm
Pre load resistor (1%). Affects FSW_NOLOAD, zero load consumption, and
0-100% load step dip
P_PRELOAD 4.4 mW Preload resistor power consumption at no load
FSW_NOLOAD
1116 Hz
Estimated switching frequency at no load. Adjust with VCS_MIN and
R_PRELOAD

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Output Capacitor COUT
The spreadsheet will calculate the maximum size of output capacitor
into which the circuit can start up. This is mainly governed by the
size of the bias capacitor [E138], which has to supply power to the
controller during start-up, and the ratio between secondary and bias
winding turns. It can be selected to calculate this for either a
constant current load at start-up or a resistive load via the drop down
selection menu in [B141]. The level of the constant current load at
start-up can be set in [B142], the default level is 75% of IO [E9]. The
resistive load is made equal to that required to draw IO [E9] and
includes any cable resistance implied by the selected cable compen-
sation [E19].
The calculations do not take into account the effects of primary to
secondary leakage inductance. The bias winding is quite effective in
harvesting some of this energy and allows for a larger output
capacitance than that given in [E144]. It would be reasonable to
enter a value into [B145] that is 25% higher than that given in [E144]
if the end design is thoroughly tested across a pre-production run.
Output capacitors must be rated to have sufcient current ripple
capability i.e. ≥[E81]. Do not simply increase the capacitor value to
meet the ripple requirement, else starting difculties may occur, the
capacitance must not exceed [E145]. Selecting a capacitor with a
higher rated voltage will also achieve a higher ripple current rating.
Select the capacitor voltage to be ≥1.2 × VO_PCB.
Load Step and Undershoot
In this section the zero load transient response is evaluated. It is
essential to have the zero load switching frequency in [E154] greater
than the minimum undershoot switching frequency given in [E150].
Adjust VCS_MIN [B135], COUT_FINAL [B145 via E144] and ROUT
[B152] to achieve this. Parameters for load step current can be
entered in [B148] and minimum undershoot voltage set in [B149].
The zero load switching frequency requirement comes from the
operation of a primary side sensing yback convertor. The controller
can only sample the output voltage at the end of the transformer
discharge period. If a load transient occurs just after the discharge
period, the output capacitor will be discharged until the next switching
cycle measures the drop in output voltage. Therefor, if the output is
not to fall too much, the output must be sampled often enough.
Start-Up
Enter the allowed start-up time into [B156], 1 second is the default.
The spreadsheet calculates the size of the start-up resistor from the
current required to charge up the bias capacitor CVCC from zero to the
‘run voltage’ VCC(RUN) and divides it by the BJT low current gain and
adds pin leakage currents.
Round down the value in [E157] to the nearest standard value and
enter that into [B157]. An estimate of the start-up time is given in
[E158].
Figure 19. Output Capacitor Selection.
Figure 20. Load Step and Undershoot Parameters.
Figure 21. Start-up Resistor Value.
Output Capacitor
LOAD_TYPE
Resistive Load Resistive Load Select load type for startup testing. This will help estimate the maximum output
capacitance that will allow proper startup under any normal operating conditions
ICC_STARTUP 1.50 A Not used for resistive startup calculation
R_LOAD
2.65 Ohm Equivalent resistive load placed at the end of PCB for simulating load and cable
COUT_ADVISED 2281 uF Maximum Cout to guarantee proper startup and stability
COUT_FINAL 2281 uF Total output capacitance on the secondary of the power supply
Load step and undershoot
RCABLE_EST 0.150 Ohm Estimated charger cable resistance
I_LOADSTEP 2.00 A Required maximum current load step from zero load
V_UNDERSHOOT 3.70 V Accepted undershoot during maximum load step
FSW_UNDERSHOOT 877 Hz Minimum frequency at no load in order to satisfy undershoot requirements
Startup
STARTUP_TIME 1.00 second Desired startup delay time
R_STARTUP
14.70 MOhm
Startup resistor (default calculation assumes a standard resistor for desired
startup)
STARTUP_TIME_FINAL 1.00 second Final startup time assuming resistor value Rstartup

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Feedback Resistors
RFB1 sets the minimum HT voltage at start-up that will allow the
controller to continue to run. 73% of root(2) × VACMIN is the default
and will generally be satisfactory for most designs but an alternative
value may be entered in [B160] for special circumstances. It also
sets the brown-out level which is 43% of this value.
RFB2, in conjunction with RFB1 sets the output voltage and is calculated
in [E162]. Two resistors in series can be used to make up RFB1, one
high value and one low value. The low value may be trimmed in
value to obtain an accurate output voltage. In fact the spreadsheet
will tend to result in a slightly high output voltage as the high current
value of output diode volt drop is used, but the chip measures the
output voltage when the secondary discharge current is close to zero.
Step 11 – No-Load Power Estimator
Here, all the no-load losses are calculated and summed to give a
no-load power estimate. Aiming for a 27 mW target should result in a
30 mW design with adequate margin.
Figure 22. Feedback Resistor Values.
Figure 23. No-Load Power Estimation.
Feedback Resistors
V_UV+ 92.9 V DC voltage at which power supply will start up
RFB1 7500 Ohm Initial estimate for top feedback resistor (std value, use 1% tolerance)
RFB2 2370 Ohm Initial estimate for bottom feedback resistor (std value, use 1% tolerance)
NO LOAD POWER ESTIMATOR
EFF_NOLOAD 0.60 %/100 Assumed efficiency at no load (0.6 if no better data available)
VAC_INPUT 230 Volts AC input voltage for no load power estimation
PB_NOLOAD 4.1 mW Bias winding power consumption estimate at no load
P_PRELOAD 4.4 mW Preload resistor power consumption at no load
P_STARTUPRES 7.2 mW Energy dissipated by the startup resistor
PSW 6.6 mW Power losses of the switch and clamp
P_NOLOAD_TOTAL 28 mW Estimated no load power consumption. Affected by Vcs_min

Rev. B 10/17
17
Application NoteAN-69
www.power.com
Step 12 – Results Check
Now that all the variables have been entered, the results can be
assessed.
1. Check entered values and options are correct.
2. Check core gap is manufacturable [E93], generally >0.1 mm. If
not, increase secondary turns [B50] which will increase the gap
for the same inductance, or reduce Flux Density [B86] which
lowers inductance, then re-optimize transformer.
3. Check primary current density [E103]. If low, try decreasing
layers [B98]. This will reduce leakage inductance and improve
efciency.
4. If primary current density too high, increase layers.
5. Check bias voltage at no-load [E107] is between 8 V and 9 V.
Lower voltage improves no-load power, higher voltage aids
start-up into difcult loads.
6. Check secondary wire diameter is practical to wind on bobbin
used i.e. not too large. If so, increase lars [B117], if this results
in the secondary current density being too high [E122] increase
layers [B116]. Alternatively, just reduce the single lar wire size
to an acceptable diameter. This will not fully ll the bobbin winding
window width and leakage inductance will increase, but it might
be acceptable. Spreading the secondary winding evenly across
the bobbin width will lessen the increase in leakage inductance.
7. Check peak collector voltage [E127] is lower than the derated
maximum level.
8. Check PIV applied to the output diode [E128] is below the
derated voltage rating of the selected output diode.
9. Check PIV applied to the bias diode [E129] is below the derated
voltage rating of the selected bias diode.
10. Check high frequency ripple current rating of the chosen output
capacitors against the secondary RMS current [E81].
11. Check bias voltage delta at no-load [E139] is between 50 mV and
1.6 V. It will tend to be a few hundred mV.
12. If there is a no-load transient test for the design, check that
[E150] < [E154]. As [E154] is an estimate, this relationship must
be tested and veried on the prototype circuit.
Component values for the design are found in:
CIN1 + CIN2, CIN ....................................................................... [E13]
Selected device ......................................................................[E20]
Q1 BJT ...................................................................................[E24]
T1 Core ..................................................................................[E35]
T1 Bobbin ...............................................................................[C37]
T1 Primary turns ..................................................................... [E51]
T1 Primary layers ....................................................................[E98]
T1 Primary wire diameter ............................................. [E101, E102]
T1 Secondary turns .................................................................[E50]
T1 Secondary layers .............................................................. [E116]
T1 Secondary lars ............................................................... [E117]
T1 Secondary wire diameter ......................................... [E120, E121]
T1 Bias turns ........................................................................ [E106]
T1 Core gap ............................................................................[E93]
CVCC, Bias capacitor value ....................................................... [E138]
Total output capacitance COUT ................................................ [E145]
Output capacitance ripple ........................................................ [E81]
ROUT Dummy load .................................................................. [E152]
RHT Start-up resistor .............................................................. [E157]
RFB1 Upper feedback resistor ...................................................[E161]
RFB2 Lower feedback resistor .................................................. [E162]
RCS Current sense resistor ........................................................ [E74]
RCS2 VCSMIN setting resistor ...................................................... [E136]
Bias diode VRRM .............................................. [E129] usually 1N4148
DOUT VRRM .............................................................................. [E128]
DOUT Peak current ....................................................................[E79]
DOUT RMS current .................................................................. [E780]
Explore the spreadsheet for more informative data.

Rev. B 10/17
18
Application Note AN-69
www.power.com
Step 13 - Further Component Selection Input Stage
The recommended input stage is shown in Figure 24. It consists of a
fusible element (RF1), input rectication (DIN1-4), and line lter network
(CIN1 CIN2 LIN1 and LIN2).
The fusible element can be either a fusible resistor or a fuse. If a
fusible resistor is selected to limit switch on inrush current, use a
ameproof type.
Depending on the differential line input surge requirements, a
wire-wound type may be required. Avoid using metal or carbon lm
types as these can fail due to the inrush current when VAC applied
repeatedly to the supply. A value of 10 W, 2 W is a typical value.
CIN1 and CIN2 are approximately equal values, to provide the input pi
lter. It is advisable to make at least CIN2 a low ESR type.
LIN1 should be between 220 mH to 2.2 mH, and have a current rating
of approximately:
ILC
V
P
40 10
IN IN HT(MIN)
OUT
1
3
2
##
=+
^h
Although inductors have a current rating for a given temperature rise,
that current is often the level at which the inductance has fallen to
90% of its low current value. So given that it is not desirable that the
inductor saturates and reduces in inductance, hence reducing its
ltering capability, it is a reasonable guide, though the inductor will
be operating at a much lower average current than its rating.
The best EMI results are not always achieved by putting in the
highest available inductor value. The inductor will have a self
resonant frequency (SRF) which tends to decrease with inductor
value. A high value inductor may well have a SRF that coincides with
one of the switching generated frequencies and it will have minimal
attenuating effect upon it. Decreasing the inductor value may move
the SRF out of a sensitive frequency band and give better EMI
results. Alternatively, a resistor can be placed in parallel with the
inductor to damp the SRF, about 4.7 kW would sufce.
LIN2 is optional and helps with higher frequency EMI emissions, >20
Mhz. It is usually a low value SMT ferrite bead inductor of the order
of 150 Wto 1000 W impedance at 100 MHz.
Primary Clamp Components
DC1: 1N4007 / FR107, 1 A, 1000 V
RC1: 100 W– 300 W
CC1: 220 pF – 1000 pF 500 V
RC1: 330 KW- 680 KW
The clamp arrangement, shown in Figure 25, is suitable for LinkSwitch-4
designs. Minimize the value of CC1 and maximize RC2 while maintain-
ing the peak Collector voltage to <(VCBO × derating factor). Larger
Figure 24. Input Stage.
values of CC1 may cause higher output ripple voltages due to the
longer settling time of the clamp voltage impacting the sampled
voltage on the feedback winding, particularly at low loads. A value of
470 KW for RC2 with 470 pF for CC1 and 100 W for RC1 is a recommend-
ed starting point for the RCD design. Verify that the peak collector
voltage is less than (VCBO × derating factor) under all line and load
conditions including start-up.
The clamp diode choice is governed by what weight is given to
various performance factors and cost. Customers usually favor
lowest cost at the power level and application type covered by
LinkSwitch-4 devices. This indicates the use of a low-cost 1N4007
slow recovery type diode. Note from Figure 25, that a slow recovery
diode has a lower frequency ring, and faster settling time, this can be
useful in reducing EMI.
The choice of snubber components affects no-load power, no-load
frequency, no-load output voltage stability, peak collector voltage,
efciency and EMI.
Reducing CC1 will reduce energy lost in the clamp, reduce the no-load
switching frequency and hence reduce the no-load power. The
compromise is that the peak collector voltage is increased and EMI
emissions may increase, but as long they are within the set limits it is
an option to control no-load power.
Figure 25. Primary Clamp Components and Effect of Diode Recovery Time of
FEEDBACK Pin Voltage.
PI-5118-042308
+
AC IN
RF1
LIN1
LIN2
D
IN1-4
C
IN2
CIN1
CC1
RC1
RC2
DC1
PI-5107-012615
Black Trace: DC1 is a FR107 (fast type, trr = 500 ns)
Gray Trace: DC1 is a 1N4007G (standard recovery, trr = 2 us)

Rev. B 10/17
19
Application NoteAN-69
www.power.com
Supplementary Base Drive
Resistor RSBD is used on SO-8 packaged devices to provide extra base
drive in higher power applications (7.5 W – 18 W) without increasing
package dissipation.
It should have a value of between 220 Wand 390 Wfor standard
designs, or 100 Wto 150 Wfor applications using the EasyStart
feature. Refer to ‘Step 15 – First Time Start-up and Troubleshooting’
to check that correct value has been selected.
Output Diode Snubber
It is advisable to allow for a output diode snubber in the application
design. It may not be required, but will aid EMC development if there
are places allocated on the PCB for these components. The snubber
consists of a resistor in series with a capacitor and are then placed in
parallel with the output diode. The snubber dissipates energy during
operation and reduces efciency, so it is advisable to only provide as
much snubbing as is required to pass EMC requirements. A 10 W
resistor in series with a 1 nF ceramic capacitor is a good starting
point. As a guide, the capacitor voltage rating should be equal or
greater than the output diode voltage rating.
Current Sense Resistor RCS
The value of RCS [E74] may need some adjustment to obtain the
desired maximum output current i.e. the position of the constant
current region of the VI curve. This is due to the effects of the bias
winding, primary clamp and core losses drawing energy that would
otherwise go to the secondary. There is a nominal correction factor
in the calculations, but the amount of correction required varies with
power level and transformer design. Once the value has been
adjusted to give the desired current level, it will not change much
across production of the particular design. Some effort will have to
be made in centralizing the design so it remains within specication
across production, due to component tolerances, if required.
VCS(MIN) Setting Resistor RCS2
LNK4xx2S parts do not need this resistor to set VCS(MIN), but a 1 kW
resistor should be included to enhance ESD immunity.
Voltage Feedback Resistor RFB1
If RFB1 is to be SMT then it should be at least 0805 size, preferably
two in series. During ESD events, a large voltage can be present
across this resistor and it can be damaged.
Step 14 - Transformer Topology
The starting point for transformer design is not always the same
because it depends on constraints such as operating frequency and
transformer size. The transformer interacts with nearly all other
design considerations so it is impossible to design the transformer in
isolation. These interactions need constant consideration and review,
and the transformer design needs to be iterated to accommodate an
acceptable compromise throughout the design of the power supply.
For best efciency, use a core with as high a cross section area as
affordable. Also ensure that the winding window width is enough to
accommodate the secondary winding. The aim is a single layer of
secondary that fully lls the winding width; a 12 V design will there-
fore need a wider width than a 5 V design at the same power level.
Common LinkSwitch-4 Transformer Topologies
A simple 3 winding transformer structure has been developed that is
suitable for all LinkSwitch-4 designs up to 18 W. It may be necessary
to use a more complicated sandwiched secondary type structure with
5 windings, including a foil screen, at 7.5 W or greater to minimize
primary to secondary leakage inductance to optimize converter
performance. However, in a specic application a 5 winding structure
is not guaranteed to be superior to a 3 winding design. For cost and
manufacturing simplicity, it is recommended that a 3 winding
transformer is tried rst.
EMI conducted emissions are optimized by altering the number of
turns on the compensation winding. The number of turns on the bias
winding remains unchanged as it is designed to power the LinkSwitch-4
controller. It is the imbalance of the bias and compensation winding
turns, which are wound in the opposite sense, which provides the
compensation effect. The best balance is usually found within ±2
turns. Fractional turns can be used on the compensation wind for
optimal balance.
BJTs have slower switching edges than power MOSFETs, hence a
screen winding between the primary and the core is not usually
required. It tends to add signicant capacitance to the collector node
which degrades efciency and no-load power.
Wire size should be chosen such that each layer completely lls the
bobbin winding width. This can be compromised a little when a turn
or two is added or subtracted from the compensation winding, to
obtain the best EMI emissions performance.
Z-winding the primary, where each layer end is bought back to the
start side before winding the next layer, reduces the effect of inter
layer capacitance and signicantly reduces the no-load power.
Do not use unnecessary layers of tape as this will increase leakage
inductance and reduce efciency.
Simple 3 Winding Transformer
The 3 winding transformer is wound as the primary rst, with the
collector node pin as the start so that it is screened by succeeding
primary layers from the secondary.
The second winding is a combined bias winding and compensation
winding wound as a trilar (3 strand) winding. It is arranged that the
bias and compensation wind senses are in the opposite direction. On
average this tends to make the trilar winding have no net electro-
static voltage change, so it acts like a foil screen, though an imper-
fect one. Two strands are used for the bias wind and a single strand
for the compensation wind. It is possible to swap this to help obtain
a better compensation balance, or reduce VCC at maximum load if it is
too high.
The third winding is the secondary, wound in triple insulated wire.
A contact to the core material is made with tinned copper wire and
taken to +HT.

Rev. B 10/17
20
Application Note AN-69
www.power.com
Figure 26. 3 Winding Transformer Construction.
Figure 27. 5 Winding Transformer Construction.
5 Winding Transformer
The 5 winding transformer is wound as the primary rst, with the
collector node pin as the start so that it is screened by succeeding
primary layers from the secondary.
The second wind is a complete turn of copper foil that has the same
width as the bobbin winding window width. Care must be taken to
ensure the ends of the foil are insulated with tape so as not to form a
shorted turn. This is connected to the Bias wind GROUND pin.
The third winding is the secondary, wound in triple insulated wire.
The fourth winding is a combined bias winding and compensation
winding wound as a trilar (3 strand) winding. It is arranged that the
bias and compensation wind senses are in the opposite direction.
On average this tends to make the trilar winding have no net
electrostatic voltage change, so it acts like a foil screen, though an
imperfect one. Two strands are used for the bias wind and a single
strand for the compensation wind. It is acceptable to swap this to
help obtain a better compensation balance, or reduce VCC at maxi-
mum load if it is too high.
The fth winding is the remaining turns of the primary.
A contact to the core material is made with tinned copper wire and
taken to +HT.
This manual suits for next models
15
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