Qiyang IAC-IMX8MM-Kit User manual

IAC-IMX8MM-Kit Embedded Development Kit
Hardware Manual
Version: V 2.0
2020.04
ZHEJIANG QIYANG INTELLIGENT TECHNOLOGY Co., Ltd
Copyright Reserved

IAC-IMX8MM-Kit Embedded Development Kit Hardware Manual
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Version Update
Version
Hardware
Description
Date
Reviser
1.0
IAC-IMX8MM-MB V1.00
Internal version
2020-02
wangwx
1.2
IAC-IMX8MM-MB V1.10
Update wireframe pictures
2020-04
wwx
2.0
IAC-IMX8MM-MB V1.20
Update pictures
2020-06
wwx

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Catalogue
Note: This manual mainly introduces the hardware interfaces of the development board.........................................4
I. Preface.....................................................................................................................................................................4
1.1 Company Profile:..........................................................................................................................................4
1.2、IAC-IMX8MM-KIT Development board..................................................................................................5
II.System Composition ...............................................................................................................................................6
2.1 Chip Summary..............................................................................................................................................6
2.2、Mainboard resource：...............................................................................................................................9
2.3、SOM Resource：.....................................................................................................................................10
Ⅲ.Functions on Board..............................................................................................................................................11
3.1. Basic Function Description :......................................................................................................................12
3.2. DIP Switch Setting.....................................................................................................................................13
3.3. Pin Definition: ...........................................................................................................................................14
Ⅳ.Structure & Size: .................................................................................................................................................25
4.1.SOM Dimension .........................................................................................................................................26
4.2.Carrier Board Dimension:...........................................................................................................................27
Ⅴ.Connection Picture ..............................................................................................................................................29
Ⅵ.Electrical Property ...............................................................................................................................................30
Ⅶ.Software Description:..........................................................................................................................................31
Ⅷ.Remark.................................................................................................................................................................31

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Note: This manual mainly introduces the hardware interfaces of the
development board.
I. Preface
1.1 Company Profile:
Zhejiang Qiyang Intelligent Technology Co., Ltd. Was estimated in Hangzhou in
2007. It is a National High-tech Enterprise focusing on the development, production
and sales of ARM embedded products. More than 10 years of accumulation and
precipitation have successfully constructed a service chain from product development
to mass production.
As the core of the company, Qiyang R&D team is composed of more than 30
embedded engineers, who committed to providing users with easy-to-use embedded
hardware, software tools and customized product solutions. Our products and solutions
have been widely used in industrial control, Internet of Things, new retail, medical,
electricity, environmental monitoring, charging piles and other fields.
The production base established in Zhuji provides a strong guarantee for Qiyang.
It covers a over 5,000 square meters area also has 2 SMT production lines, and has
passed and strictly followed the ISO9001 quality management system certification to
guide production. With the strong production strength, the annual output can reach 1
million sets, ensuring the delivery time and solving the worries of users.
Qiyang has a complete sales market network, professional sales and after-sales

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team providing users with a full range of technical support and services. The business
has spread to more than 120 countries and regions, and has successfully helped more
than 2,000 users to quickly and efficiently bring products to the market.
The combination and extension of R&D, production capacity and market has laid
a solid foundation for Qiyang to become a professional and global supplier of
embedded software and hardware.
We offer:
⚫Multi-platform software/hardware products
NXP, Rockchip, MTK, Renesas, TI, Atmel, Cirrus Logic and other multi-platform
ARM development boards/core boards/industrial control boards and peripheral
hardware products, as well as supporting tools and software resources to support
users' rapid secondary development.
⚫Customized service
Give full play to the accumulation of technology on the ARM platform, Linux,
Android, and Ubuntu operating systems to provide users with customized
embedded product services (OEM/ODM).
Thank you for using Qiyang Intelligent products. We will spare no effort on
providing you with technical assistance! Wish you success in your work!
1.2、IAC-IMX8MM-KIT Development board
1. Please read the instructions first before using the development board;

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2. Please check the packing list and see whether there is a missing file in the CD
before using the development board;
3. Please understand the basic structure and composition of IAC-IMX8MM-KIT,
including the allocation of hardware resource, the definition of each pin of the core and
bottom board, and the definition of extended pins, etc..
4. If you need to design and develop under the Linux system and burn program into
the development board. Besides the document, we also suggest reading another
document, IAC-IMX8MM-KIT Linux User Manual;
5. If you need to design and develop under the Android system and burn program
into the development board. Besides the document, we also suggest reading another
document, IAC-IMX8MM-KIT Linux User Manual;
6.IAC-IMX8MM-KIT embedded development board accept batch order.
II. System Composition
2.1 Chip Summary
The IAC-IMX8MM-KIT embedded development board adopts the i.MX8M Mini
series application processor. The i.MX 8M Mini application processor is an NXP
product that can bring the latest video and audio experience, with the most advanced
specific media functions, using high-performance processing technology, while
optimizing power consumption. The i.MX8MMini series processors use an

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advanced quad-core Arm®Cortex®-A53 core, which runs at speeds up to 1.8 GHz.
And a general-purpose Cortex®-M4 400 MHz core processor is used for low-power
processing. The DRAM controller supports 32-bit/16-bit LPDDR4, DDR4 and
DDR3L memories. Besides, a variety of audio interfaces are available, including
I2S, AC97, TDM and S/PDIF.
The functional block diagram of the processor is as follows:
Chart 1

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◆Multi-core Processing：
4 Cortex-A53, running up to 1.8GHz per core, support 32KB L1-I cache/ 32 kB L1-D cache /512 kB L2 cache,
MPE with NEON, support advanced single instruction multiple data (SIMP) architecture, support 64 bits ARM8-A
architecture, support VFPv4-d16 FPU.
1 Cortex-M4, running up to 400MHz, with 16 kB L1-I cache/ 16 kB L2-D cache/256kB TCM
◆GPU：
3D GPU (1* mental ray, OpenGL® ES 2.0 )
2D GPU
◆Display interface: 1-ch MIPI DSI (4 channel) with PHY
◆Video Display: support 1080p60 VP9 Profile 0, 2 (10bits)decoding, HEVC/H.265 decoding, AVC/H.264,
Main,advanced decoding, VP8 decoding, 1080p60 AVC/H.264 encoding, VP8 encoding.
◆Audio: support 5-chSAI, 8*PDM input
◆Camera interface: 1-ch MIPI CSI (4 channel) with PHY
◆USB:2-ch USB 2.0 with PHY
◆PCIe: 1-ch PCIe 2.0 (1-ch ), with L1 low power consumption sub-state
◆Ethernet: 1-ch Gigabit Ethernet (MAC) with AVB and IEEE 1588 (EEE stands for Energy Efficient Ethernet
which applies to low-power consumption equipment.)
◆Three uSDHC interface:
MMC 5.1 accord to HS400 DDR, supporting up to 400 MB/sec speed rate.
SD/SDIO 3.0 accord to 200 MHz SDR, supporting up up 100 MB/sec speed rate
Support SDXC (expandable)
◆In-chip Storage:lead:boot ROM( 256kB), in-chip RAM (256kB+32kB)
◆EMIFA:
32/16 bit DRAM interface supports LPDDR4 ( up to 2.5GHz)/ DRR4-2400/DDR3L-1600
Support 8 bits NAND Flas, including Raw MLC/SLC, more than 62 bits BCHECC according to ONFi 3.2
(Clock rate reaches 100MHz, Data transmission rate achieves 200MB/sec)
Support eMMc5.1 Flash
Support LPDDR4, DDR4, DDR3L; Quad SPI with XIP
◆Temperature: consumer electronics (0°C to 95°C Tj); Industrial Controls(-40°C to 105°C Tj)
◆Operating system: support Linux, Android

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2.2、Mainboard Resource：
Hardware Resources
CPU
NXP i.MX8M Mini processor,Quad ARM® Cortex™-A53+Cortex-M4, 1.8
GHz of i.MX8M, 400MHz of Cortex®-M4
RAM
2GB LPDDR4
Flash
8GB EMMC, ( 16GB EMMC、32GB EMMC Optional)
Network
1-ch AR8035 Internet chip adopts RGMII supporting adaptability
l10M/100M/1000M
1-ch LAN 7430 port chip, supporting 10M/ 100M/1000M
Onboard WIFI (AP6236)
Communi
cation
4-ch RS232, 2-ch debug UART
4-ch USB 2.0, 1-ch USB-OTG
2-ch CAN 2.0
Display
4-ch MIPI each Display channel’ s resolution up to 1920 * 1200
Audio
McASP audio interface; binaural output; MIC audio input
Input
Standrad I2C Capacitive panel
1-ch CSI camera interface (4-ch)
Expansion
Interface
MINI-PCIE interface with SIM socket for 4g module
Memory
Interface
1-ch SD card
Expansion
Interface
GPIO interface
Other
Reset circuit, Watch dog, RTC, Buzzer, JTAG interface
Power
Input
+12V power supply
Software Resource
Developm
ent
Tools
Development environment: Virtual Machine VM9.0.2+ubuntu14.04 or
Ubuntu 14.04
Application layer development debug tool
Cross-compiler
Common terminal development debugging tool
Image File
ISO of matched operating system
Test
Program
Interface using demo test program and test program source code
Source
Code
Bootloader, kernel, system source code
Manual
Mainboard User manual,Hardware Manual, Device Manual

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Mechanic
al Chart
Carrier Boardd’s Structure & Size
Electrical Property
Size
Core Board:55mm*60mm, 8-layer high precision immersion gold process
Back Board: 200mm*130mm ，4-layer high precision immersion gold
process
Power
Consumpt
ion
≤5W (Non-loaded consumption)
Operation
Temperatu
re
-40℃ ~ +85℃ ( industrial level )，0℃ ~ +85℃ （Consumer Level,
According to customers’ requirements）
Operation
Humidity
5% ~ 95%, Non-Condensing
2.3、SOM Resource：
IAC-IMX8MM adopts 8-layer high precision immersion gold process PC board and high glass transition
temperature material with reliable electrical specification and disturbance rejection behaviour. SOM integrates CPU,
LPDDR4, eMMc, power management circuits and so on. More than 150 pin from board to board connector apply
to IAC-IMX8MM to expand its hardware resource. According to Pin status and multiplex combination of different
interface functions, back panel would be designed.
Chart 2