Qiyang IAC-IMX8MM-Kit User manual

IAC-IMX8MM-Kit Embedded Development Kit
Hardware Manual
Version: V 2.0
2020.04
ZHEJIANG QIYANG INTELLIGENT TECHNOLOGY Co., Ltd
Copyright Reserved

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Version Update
Version
Hardware
Description
Date
Reviser
1.0
IAC-IMX8MM-MB V1.00
Internal version
2020-02
wangwx
1.2
IAC-IMX8MM-MB V1.10
Update wireframe pictures
2020-04
wwx
2.0
IAC-IMX8MM-MB V1.20
Update pictures
2020-06
wwx

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Catalogue
Note: This manual mainly introduces the hardware interfaces of the development board.........................................4
I. Preface.....................................................................................................................................................................4
1.1 Company Profile:..........................................................................................................................................4
1.2、IAC-IMX8MM-KIT Development board..................................................................................................5
II.System Composition ...............................................................................................................................................6
2.1 Chip Summary..............................................................................................................................................6
2.2、Mainboard resource：...............................................................................................................................9
2.3、SOM Resource：.....................................................................................................................................10
Ⅲ.Functions on Board..............................................................................................................................................11
3.1. Basic Function Description :......................................................................................................................12
3.2. DIP Switch Setting.....................................................................................................................................13
3.3. Pin Definition: ...........................................................................................................................................14
Ⅳ.Structure & Size: .................................................................................................................................................25
4.1.SOM Dimension .........................................................................................................................................26
4.2.Carrier Board Dimension:...........................................................................................................................27
Ⅴ.Connection Picture ..............................................................................................................................................29
Ⅵ.Electrical Property ...............................................................................................................................................30
Ⅶ.Software Description:..........................................................................................................................................31
Ⅷ.Remark.................................................................................................................................................................31

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Note: This manual mainly introduces the hardware interfaces of the
development board.
I. Preface
1.1 Company Profile:
Zhejiang Qiyang Intelligent Technology Co., Ltd. Was estimated in Hangzhou in
2007. It is a National High-tech Enterprise focusing on the development, production
and sales of ARM embedded products. More than 10 years of accumulation and
precipitation have successfully constructed a service chain from product development
to mass production.
As the core of the company, Qiyang R&D team is composed of more than 30
embedded engineers, who committed to providing users with easy-to-use embedded
hardware, software tools and customized product solutions. Our products and solutions
have been widely used in industrial control, Internet of Things, new retail, medical,
electricity, environmental monitoring, charging piles and other fields.
The production base established in Zhuji provides a strong guarantee for Qiyang.
It covers a over 5,000 square meters area also has 2 SMT production lines, and has
passed and strictly followed the ISO9001 quality management system certification to
guide production. With the strong production strength, the annual output can reach 1
million sets, ensuring the delivery time and solving the worries of users.
Qiyang has a complete sales market network, professional sales and after-sales

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team providing users with a full range of technical support and services. The business
has spread to more than 120 countries and regions, and has successfully helped more
than 2,000 users to quickly and efficiently bring products to the market.
The combination and extension of R&D, production capacity and market has laid
a solid foundation for Qiyang to become a professional and global supplier of
embedded software and hardware.
We offer:
⚫Multi-platform software/hardware products
NXP, Rockchip, MTK, Renesas, TI, Atmel, Cirrus Logic and other multi-platform
ARM development boards/core boards/industrial control boards and peripheral
hardware products, as well as supporting tools and software resources to support
users' rapid secondary development.
⚫Customized service
Give full play to the accumulation of technology on the ARM platform, Linux,
Android, and Ubuntu operating systems to provide users with customized
embedded product services (OEM/ODM).
Thank you for using Qiyang Intelligent products. We will spare no effort on
providing you with technical assistance! Wish you success in your work!
1.2、IAC-IMX8MM-KIT Development board
1. Please read the instructions first before using the development board;

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2. Please check the packing list and see whether there is a missing file in the CD
before using the development board;
3. Please understand the basic structure and composition of IAC-IMX8MM-KIT,
including the allocation of hardware resource, the definition of each pin of the core and
bottom board, and the definition of extended pins, etc..
4. If you need to design and develop under the Linux system and burn program into
the development board. Besides the document, we also suggest reading another
document, IAC-IMX8MM-KIT Linux User Manual;
5. If you need to design and develop under the Android system and burn program
into the development board. Besides the document, we also suggest reading another
document, IAC-IMX8MM-KIT Linux User Manual;
6.IAC-IMX8MM-KIT embedded development board accept batch order.
II. System Composition
2.1 Chip Summary
The IAC-IMX8MM-KIT embedded development board adopts the i.MX8M Mini
series application processor. The i.MX 8M Mini application processor is an NXP
product that can bring the latest video and audio experience, with the most advanced
specific media functions, using high-performance processing technology, while
optimizing power consumption. The i.MX8MMini series processors use an

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advanced quad-core Arm®Cortex®-A53 core, which runs at speeds up to 1.8 GHz.
And a general-purpose Cortex®-M4 400 MHz core processor is used for low-power
processing. The DRAM controller supports 32-bit/16-bit LPDDR4, DDR4 and
DDR3L memories. Besides, a variety of audio interfaces are available, including
I2S, AC97, TDM and S/PDIF.
The functional block diagram of the processor is as follows:
Chart 1

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◆Multi-core Processing：
4 Cortex-A53, running up to 1.8GHz per core, support 32KB L1-I cache/ 32 kB L1-D cache /512 kB L2 cache,
MPE with NEON, support advanced single instruction multiple data (SIMP) architecture, support 64 bits ARM8-A
architecture, support VFPv4-d16 FPU.
1 Cortex-M4, running up to 400MHz, with 16 kB L1-I cache/ 16 kB L2-D cache/256kB TCM
◆GPU：
3D GPU (1* mental ray, OpenGL® ES 2.0 )
2D GPU
◆Display interface: 1-ch MIPI DSI (4 channel) with PHY
◆Video Display: support 1080p60 VP9 Profile 0, 2 (10bits)decoding, HEVC/H.265 decoding, AVC/H.264,
Main,advanced decoding, VP8 decoding, 1080p60 AVC/H.264 encoding, VP8 encoding.
◆Audio: support 5-chSAI, 8*PDM input
◆Camera interface: 1-ch MIPI CSI (4 channel) with PHY
◆USB:2-ch USB 2.0 with PHY
◆PCIe: 1-ch PCIe 2.0 (1-ch ), with L1 low power consumption sub-state
◆Ethernet: 1-ch Gigabit Ethernet (MAC) with AVB and IEEE 1588 (EEE stands for Energy Efficient Ethernet
which applies to low-power consumption equipment.)
◆Three uSDHC interface:
MMC 5.1 accord to HS400 DDR, supporting up to 400 MB/sec speed rate.
SD/SDIO 3.0 accord to 200 MHz SDR, supporting up up 100 MB/sec speed rate
Support SDXC (expandable)
◆In-chip Storage:lead:boot ROM( 256kB), in-chip RAM (256kB+32kB)
◆EMIFA:
32/16 bit DRAM interface supports LPDDR4 ( up to 2.5GHz)/ DRR4-2400/DDR3L-1600
Support 8 bits NAND Flas, including Raw MLC/SLC, more than 62 bits BCHECC according to ONFi 3.2
(Clock rate reaches 100MHz, Data transmission rate achieves 200MB/sec)
Support eMMc5.1 Flash
Support LPDDR4, DDR4, DDR3L; Quad SPI with XIP
◆Temperature: consumer electronics (0°C to 95°C Tj); Industrial Controls(-40°C to 105°C Tj)
◆Operating system: support Linux, Android

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2.2、Mainboard Resource：
Hardware Resources
CPU
NXP i.MX8M Mini processor,Quad ARM® Cortex™-A53+Cortex-M4, 1.8
GHz of i.MX8M, 400MHz of Cortex®-M4
RAM
2GB LPDDR4
Flash
8GB EMMC, ( 16GB EMMC、32GB EMMC Optional)
Network
1-ch AR8035 Internet chip adopts RGMII supporting adaptability
l10M/100M/1000M
1-ch LAN 7430 port chip, supporting 10M/ 100M/1000M
Onboard WIFI (AP6236)
Communi
cation
4-ch RS232, 2-ch debug UART
4-ch USB 2.0, 1-ch USB-OTG
2-ch CAN 2.0
Display
4-ch MIPI each Display channel’ s resolution up to 1920 * 1200
Audio
McASP audio interface; binaural output; MIC audio input
Input
Standrad I2C Capacitive panel
1-ch CSI camera interface (4-ch)
Expansion
Interface
MINI-PCIE interface with SIM socket for 4g module
Memory
Interface
1-ch SD card
Expansion
Interface
GPIO interface
Other
Reset circuit, Watch dog, RTC, Buzzer, JTAG interface
Power
Input
+12V power supply
Software Resource
Developm
ent
Tools
Development environment: Virtual Machine VM9.0.2+ubuntu14.04 or
Ubuntu 14.04
Application layer development debug tool
Cross-compiler
Common terminal development debugging tool
Image File
ISO of matched operating system
Test
Program
Interface using demo test program and test program source code
Source
Code
Bootloader, kernel, system source code
Manual
Mainboard User manual,Hardware Manual, Device Manual

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Mechanic
al Chart
Carrier Boardd’s Structure & Size
Electrical Property
Size
Core Board:55mm*60mm, 8-layer high precision immersion gold process
Back Board: 200mm*130mm ，4-layer high precision immersion gold
process
Power
Consumpt
ion
≤5W (Non-loaded consumption)
Operation
Temperatu
re
-40℃ ~ +85℃ ( industrial level )，0℃ ~ +85℃ （Consumer Level,
According to customers’ requirements）
Operation
Humidity
5% ~ 95%, Non-Condensing
2.3、SOM Resource：
IAC-IMX8MM adopts 8-layer high precision immersion gold process PC board and high glass transition
temperature material with reliable electrical specification and disturbance rejection behaviour. SOM integrates CPU,
LPDDR4, eMMc, power management circuits and so on. More than 150 pin from board to board connector apply
to IAC-IMX8MM to expand its hardware resource. According to Pin status and multiplex combination of different
interface functions, back panel would be designed.
Chart 2

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◆Onboard with NXP I.MX8M Mini Processor;
◆Onboard with 2GB LPDDR4,8GB EMMC (Default Setting)
◆SOM adopts 8-layer high precision gold immersion process technology;
◆SOM Size: 55mm*60mm, suits for various applications.
◆SOM adopts 2X2*50PIN Board To Board connector to draw out the SOM source.
◆Adopts 5V, onboard with power management chipset; SOM power consumption <2W;
◆Supports Linux4.14.98+QT5.10.1
◆Supports Android 9.0;
◆Interfaces and Pins’ definition from the core board see in the Functions on Board part.
Ⅲ.Functions on Carrier Board
Interface Framework
Chart 3

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Chart 4
3.1. Basic Function Description:
Label
Function
J1
DC 12V Power In
J4
16-ch GPIO
J5
USB2.0
J6
USB2.0
J8
MIC Audio Input
J9
Audio Output
J10
Speaker Output
J11
Gigabit Ethernet
J12
MINI_PCIE
J14
CSI1 Camera (4-Lane CSI)
J15
MIPI & I2C
J17
JTAG (M4 JTAG)

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J18
RS232 (I.MX8M Debug UART)
J19
UART4 (M4 Debug UART)
J20
CAN
J21
CAN
J22
RS232 (COM3)
J23
RS485 (COM1)
J24
RS232 (COM2)
J25
RS232(COM4)
J26
Gigabit Ethernet
J27
WIFI-IPEX Antenna
J29
SD Card Socket
J30
DC12V Power Input
J42
USB-OTG
SW1
ON/OFF Button
SW2
Reset Button
BZ1
Buzzer
BT1
Battery for RTC(+3.0V)
S1
SIM Card Socket
U34
WIFI Module (AP6236 )
3.2. DIP Switch Setting
SW3：BOOT MODE
SW setting in SOM:
SW1
SW2
BOOT MODE
0
0
Boot From Fuses

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0
1
Serial Downloader
1
0
Internal Boot (Development)
1
1
Reserved
3.3. Pin Definition:
J28-1: (On SOM Pin)
Signal Name
Pin No.
Pin No.
Signal Name
ECSPI1_SS0
1
2
GND
ECSPI1_SCLK
3
4
DSI_DN0
ECSPI1_MISO
5
6
DSI_DP0
ECSPI1_MOSI
7
8
GND
GND
9
10
DSI_DN1
ECSPI2_SS0
11
12
DSI_DP1
ECSPI2_SCLK
13
14
GND
ECSPI2_MISO
15
16
DSI_CKN
ECSPI2_MOSI
17
18
DSI_CKP
GND
19
20
GND
I2C2_SCL
21
22
DSI_DN2
I2C2_SDA
23
24
DSI_DP2
I2C3_SCL
25
26
GND
I2C3_SDA
27
28
DSI_DN3
I2C4_SCL
29
30
DSI_DP3

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I2C4_SDA
31
32
GND
GND
33
34
CSI_DN0
UART2_RXD
35
36
CSI_DP0
UART2_TXD
37
38
GND
UART4_RXD
39
40
CSI_DN1
UART4_TXD
41
42
CSI_DP1
GND
43
44
GND
JTAG_TDO
45
46
CSI_CKN
JTAG_TDI
47
48
CSI_CKP
JTAG_TMS
49
50
GND
JTAG_nTRST
51
52
CSI_DN2
JTAG_TCK
53
54
CSI_DP2
GND
55
56
GND
SD2_DATA0
57
58
CSI_DN3
SD2_DATA1
59
60
CSI_DP3
SD2_DATA2
61
62
GND
SD2_DATA3
63
64
PCIE_RXN
SD2_nRST
65
66
PCIE_RXP
SD2_CLK
67
68
GND
SD2_CMD
69
70
PCIE_TXN
SD2_nCD
71
72
PCIE_TXP
GND
73
74
GND
SAI3_MCLK
75
76
PCIE_CLKN
SAI3_TXFS
77
78
PCIE_CKKP
SAI3_TXC
79
80
GND

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SAI3_TXD
81
82
USB1_VBUS
SAI3_RXFS
83
84
USB1_DN
SAI3_RXC
85
86
USB1_DP
SAI3_RXD
87
88
USB1_ID
GND
89
90
GND
QSPIA_nSS0
91
92
USB2_VBUS
QSPIA_SCLK
93
94
USB2_DN
QSPIA_MOSI
95
96
USB2_DP
QSPIA_MISO
97
98
USB2_ID
GND
99
100
GND
J28-2: (On SOM Pin)
Signal Name
Pin No.
Pin No.
Signal Name
VCC_SYS_5V0
1
2
VCC_SYS_5V0
VCC_SYS_5V0
3
4
VCC_SYS_5V0
VCC_SYS_5V0
5
6
VCC_SYS_5V0
VCC_SYS_5V0
7
8
VCC_SYS_5V0
GND
9
10
GND
GND
11
12
GND
GND
13
14
GND
GND
15
16
GND
GND
17
18
GND
GND
19
20
GND
NVCC_ENET
21
22
GND
NVCC_ENET
23
24
GND
ENET_TX_CTL
25
26
REF_CLK_32K

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ENET_TXC
27
28
GND
GND
29
30
IO_PWM1_OUT
ENET_TD0
31
32
POR_B
ENET_TD1
33
34
SYS_nRST
ENET_TD2
35
36
ONOFF
ENET_TD3
37
38
USB_HUB_RST
GND
39
40
IO_CAN1_nRST
ENET_RX_CTL
41
42
IO_CAN2_nRST
ENET_RXC
43
44
IO_CAN1_nINT
GND
45
46
IO_CAN2_nINT
ENET_RD0
47
48
GPIO_ENET1_INT
ENET_RD1
49
50
GPIO_TP_INT
ENET_RD2
51
52
GPIO_CSI_PWDN
ENET_RD3
53
54
GPIO_CSI_RST
GND
55
56
QSPIA_DATA3
ENET_MDC
57
58
QSPIA_DATA2
ENET_MDIO
59
60
SAI2_MCLK
GND
61
62
SAI2_RXFS
SD1_CLK
63
64
SAI2_RXC
SD1_CMD
65
66
SAI1_RXFS
GND
67
68
SAI1_RXC
SD1_DATA0
69
70
SAI1_MCLK
SD1_DATA1
71
72
SAI1_TXFS
SD1_DATA2
73
74
SAI1_TXC
SD1_DATA3
75
76
SAI5_RXFS

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WL_WAKE_HOST
77
78
SAI5_MCLK
WL_REG_ON
79
80
SAI5_RXC
IO_CLK_REQ
81
82
SAI5_RXD0
GND
83
84
SAI5_ RXD1
UART1_RXD
85
86
SAI5_ RXD2
UART1_TXD
87
88
SAI5_ RXD3
UART1_CTS
89
90
SPDIF_TX
UART1_RTS
91
92
SPDIF_RX
SAI2_RXD
93
94
SPDIF_EXT_CLK
SAI2_TXD
95
96
BT_REG_ON
SAI2_TXC
97
98
BT_WAKE_DEV
SAI2_TXFS
99
100
BT_WAKE_HOST
J4：GPIO Interface
Signal Name
Pin No.
Pin No.
Signal Name
EXP_IO1
1
2
EXP_IO9
EXP_IO2
3
4
EXP_IO10
EXP_IO3
5
6
EXP_IO11
EXP_IO4
7
8
EXP_IO12
EXP_IO5
9
10
EXP_IO13
EXP_IO6
11
12
EXP_IO14
EXP_IO7
13
14
EXP_IO15
EXP_IO8
15
16
EXP_IO16
I2C4_SDA
17
18
QSPIA_DATA3
GND
19
20
GND

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J6: USB
Pin No.
Signal Name
1
VCC_USB3(5V0)
2
USB_DN3
3
USB_DP3
4
GND
J8：MIC Audio Input
Pin No.
Signal Name
1
MIC-
2
MIC+
J10：Audio Output (Amplifier Output)
Pin No.
Signal Name
1
SPKPL
2
SPKNL
3
SPKNR
4
SPKPR
J12：MINI-PCIE：
Signal Name
Pin No.
Pin No.
Signal Name
NC
1
2
VCC_PCIE_3V3
NC
3
4
GND
NC
5
6
NC
NC
7
8
SIM_VDD
GND
9
10
SM_DATA

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NC
11
12
SIM_CLK
NC
13
14
SIM_RST
GND
15
16
NC
NC
17
18
GND
NC
19
20
PCIE_nDISEN
GND
21
22
PCIE_nRST
NC
23
24
VCC_PCIE_3V3
NC
25
26
GND
GND
27
28
NC
GND
29
30
NC
NC
31
32
NC
NC
33
34
GND
GND
35
36
PCIE_USB_DN
GND
37
38
PCIE_USB_DP
VCC_PCIE_3V3
39
40
GND
VCC_PCIE_3V3
41
42
VCC_PCIE_3V3
GND
43
44
NC
NC
45
46
NC
NC
47
48
NC
NC
49
50
GND
NC
51
52
VCC_PCIE_3V3
J14：CSI(4-Lane CSI):
Pin No.
Signal Name
1
VCC_DVP_5V0