Quectel SC690A Series Supplement

SC690A Series
Hardware Design
Smart Module Series
Version: 1.0.0
Date: 2021-12-07
Status: Preliminary

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To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers,
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Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
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free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless
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Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage,
service or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular
terminal should notify users and operating personnel of the following safety information by incorporating
these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’
failure to comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the
use of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile
bill is unpaid or the (U)SIM card is invalid. When emergency help is needed in
such conditions, use emergency call if the device supports it. In order to make or
receive a call, the cellular terminal or mobile must be switched on in a service
area with adequate cellular signal strength. In an emergency, the device with
emergency call function cannot be used as the only contact method considering
network connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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About the Document
Revision History
Revision
Date
Author
Description
-
2021-12-07
Mary SHEN/Kevin ZHOU
Creation of the document
1.0.0
2021-12-07
Mary SHEN/Kevin ZHOU
Preliminary

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Contents
Safety Information.......................................................................................................................................3
About the Document...................................................................................................................................4
Contents.......................................................................................................................................................5
Table Index...................................................................................................................................................8
Figure Index...............................................................................................................................................10
1Introduction........................................................................................................................................12
1.1. Special Marks..........................................................................................................................15
2Product Overview ..............................................................................................................................16
2.1. Frequency Bands and Functions............................................................................................16
2.2. Key Features...........................................................................................................................17
2.3. Functional Diagram.................................................................................................................20
2.4. Pin Assignment........................................................................................................................21
2.5. Pin Description........................................................................................................................22
2.6. EVB .........................................................................................................................................35
3Operating Characteristics.................................................................................................................36
3.1. Power Supply..........................................................................................................................36
3.1.1. Power Supply Pins.........................................................................................................36
3.1.2. Battery Charge and Management..................................................................................36
3.1.3. Reference Design for Power Supply..............................................................................38
3.1.4. Requirements for Voltage Stability.................................................................................38
3.2. Turn on....................................................................................................................................40
3.3. Turn off ....................................................................................................................................41
3.4. VRTC Interface........................................................................................................................42
3.5. Power Output ..........................................................................................................................43
4Application Interfaces .......................................................................................................................44
4.1. USB Interfaces........................................................................................................................44
4.2. UART Interfaces......................................................................................................................47
4.3. (U)SIM Interfaces....................................................................................................................49
4.4. SD Card Interface....................................................................................................................51
4.5. GPIO Interfaces.......................................................................................................................52
4.6. I2C Interfaces..........................................................................................................................54
4.7. I2S Interfaces..........................................................................................................................55
4.8. ADC Interface..........................................................................................................................56
4.9. LCM Interfaces........................................................................................................................56
4.10. Touch Panel Interface .............................................................................................................59
4.11. Camera Interfaces...................................................................................................................60
4.12. Sensor Interfaces....................................................................................................................67
4.13. Flash Interfaces.......................................................................................................................67
4.14. Keypad Interfaces ...................................................................................................................68
4.15. Vibration Driver Motor Interfaces............................................................................................68

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4.16. JTAG Interface ........................................................................................................................69
4.17. LED Driver Interface................................................................................................................70
4.18. Audio Interfaces ......................................................................................................................70
4.18.1. Reference Circuit Design for Microphone Interfaces .............................................72
4.18.2. Reference Circuit Design for Receiver Interface....................................................73
4.18.3. Reference Circuit Design for Headset Interface.....................................................73
4.18.4. Reference Circuit Design for Loudspeaker Interface.............................................74
4.18.5. Audio Interfaces Design Considerations................................................................74
4.19. Emergency Download Interface..............................................................................................74
5RF Specifications...............................................................................................................................75
5.1. Cellular Network......................................................................................................................75
5.1.1. Antenna Interface & Frequency Bands..........................................................................75
5.1.2. Tx Power........................................................................................................................76
5.1.3. Reference Design ..........................................................................................................77
5.2. GNSS ......................................................................................................................................77
5.2.1. Antenna Interface & Frequency Bands..........................................................................78
5.2.2. Reference Design ..........................................................................................................78
5.2.2.1. Recommended Circuit for Passive Antenna...................................................78
5.2.2.2. Recommended Circuit for Active Antenna......................................................79
5.2.2.3. GNSS RF Design Guidelines.........................................................................79
5.3. Wi-Fi/Bluetooth........................................................................................................................80
5.3.1. Wi-Fi Overview...............................................................................................................80
5.3.2. Bluetooth Overview........................................................................................................83
5.3.3. Reference Design ..........................................................................................................84
5.4. Reference Design of RF Routing............................................................................................84
5.5. Requirements for Antenna Design..........................................................................................86
5.6. RF Connector Recommendation ............................................................................................87
6Electrical Characteristics & Reliability............................................................................................90
6.1. Absolute Maximum Ratings ....................................................................................................90
6.2. Power Supply Ratings.............................................................................................................91
6.3. Power Consumption................................................................................................................91
6.4. Digital I/O Characteristic .........................................................................................................93
6.5. ESD.........................................................................................................................................94
6.6. Operating and Storage Temperatures.....................................................................................94
7Mechanical Information.....................................................................................................................95
7.1. Mechanical Dimensions..........................................................................................................95
7.2. Recommended Footprint.........................................................................................................97
7.3. Top and Bottom Views.............................................................................................................98
8Storage, Manufacturing & Packaging..............................................................................................99
8.1. Storage Conditions..................................................................................................................99
8.2. Manufacturing and Soldering................................................................................................100
8.3. Packaging Specifications......................................................................................................102

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8.3.1. Carrier Tape..................................................................................................................102
8.3.2. Plastic Reel ..................................................................................................................102
8.3.3. Packaging Process ......................................................................................................103
9Appendix References......................................................................................................................104

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Table Index
Table 1: Special Marks............................................................................................................................... 15
Table 2: Brief Introduction of the Module................................................................................................... 16
Table 3: Wireless Network Type.................................................................................................................16
Table 4: Key Features................................................................................................................................17
Table 5: I/O Parameters Definition............................................................................................................. 22
Table 6: Pin Description ............................................................................................................................. 22
Table 7: Pin Definition of Charging Interface .............................................................................................36
Table 8: Pin Definition of PWRKEY............................................................................................................40
Table 9: Power Description ........................................................................................................................ 43
Table 10: Functions of the USB Interface.................................................................................................. 44
Table 11: Pin Definition of USB Interface................................................................................................... 45
Table 12: USB Trace Length Inside the Module........................................................................................ 46
Table 13: Pin Definition of UART Interfaces...............................................................................................47
Table 14: Pin Definition of (U)SIM Interface............................................................................................... 49
Table 15: Pin Definition of SD Card Interface............................................................................................51
Table 16: SD Card Signal Trace Length Inside the Module....................................................................... 52
Table 17: Pin Definition of GPIO Interfaces...............................................................................................52
Table 18: Pin Definition of I2C Interfaces...................................................................................................55
Table 19: Pin Definition of I2S Interfaces...................................................................................................55
Table 20: Pin Definition ofADC Interfaces.................................................................................................56
Table 21: Pin Definition of LCM Interfaces.................................................................................................56
Table 22: Pin Definition of Touch Panel Interfaces.................................................................................... 59
Table 23: Pin Definition of Camera Interfaces ...........................................................................................61
Table 24: MIPI Trace Length Inside the Module ........................................................................................65
Table 25: Pin Definition of Sensor Interfaces............................................................................................. 67
Table 26: Pin Definition of Flash Interfaces ............................................................................................... 67
Table 27: Pin Definition of Keypad Interfaces............................................................................................ 68
Table 28: Pin Definition of Vibration Driver Motor Interfaces.....................................................................68
Table 29: Pin Definition of JTAG Interface.................................................................................................69
Table 30: Pin Definition of LED Driver Interface ........................................................................................70
Table 31: Pin Definition ofAudio Interfaces...............................................................................................70
Table 32: Pin Definition of Cellular Network Interface ...............................................................................75
Table 33: Operating Frequency of SC690A-NA......................................................................................... 75
Table 34: Operating Frequency of SC690A-EM ........................................................................................76
Table 35: Tx Power.....................................................................................................................................76
Table 36: Pin Definition of GNSSAntenna Interface .................................................................................78
Table 37: GNSS Frequency .......................................................................................................................78
Table 38: Pin Definition of Wi-Fi/BluetoothApplication Interfaces............................................................. 80
Table 39: Wi-Fi/Bluetooth Frequency......................................................................................................... 80
Table 40: Wi-Fi Transmitting Performance.................................................................................................81
Table 41: Wi-Fi Receiving Performance.....................................................................................................82

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Table 42: Bluetooth Data Rate and Version............................................................................................... 83
Table 43: Bluetooth Transmitting and Receiving Performance..................................................................84
Table 44: Requirements for Antenna Design .............................................................................................86
Table 45: Absolute Maximum Ratings........................................................................................................ 90
Table 46: The Module’s Power Supply Ratings ......................................................................................... 91
Table 47: SC690A-NA Power Consumption .............................................................................................. 91
Table 48: SC690A-EM Power Consumption.............................................................................................. 92
Table 49: 1.8 V I/O Requirements.............................................................................................................. 93
Table 50: (U)SIM 1.8 V I/O Requirements................................................................................................. 93
Table 51: (U)SIM 2.95 V I/O Requirements...............................................................................................93
Table 52: Electrostatics Discharge Characteristics (25 °C, 45 % Relative Humidity) ...............................94
Table 53: Operating and Storage Temperatures........................................................................................ 94
Table 54: Recommended Thermal Profile Parameters............................................................................101
Table 55: Carrier Tape Dimension Table (Unit: mm)................................................................................102
Table 56: Plastic Reel Dimension Table (Unit: mm)................................................................................. 103
Table 57: Related Documents..................................................................................................................104
Table 58: Terms and Abbreviations..........................................................................................................104

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Figure Index
Figure 1: Functional Diagram..................................................................................................................... 21
Figure 2: PinAssignment (Top View)......................................................................................................... 21
Figure 3: Reference Design for Battery Charging Circuit..........................................................................37
Figure 4: Reference Circuit of Power Supply.............................................................................................38
Figure 5: Voltage Drop Sample..................................................................................................................39
Figure 6: Structure of Power Supply.......................................................................................................... 39
Figure 7: Turn on the Module Using Driving Circuit...................................................................................40
Figure 8: Turn on the Module Using Keystroke .........................................................................................40
Figure 9: Timing of Turning on Module...................................................................................................... 41
Figure 10: Timing of Turning off Module .................................................................................................... 42
Figure 11: RTC Powered by Coin Cell.......................................................................................................42
Figure 12: USB Type-C Interface Reference Design................................................................................. 46
Figure 13: Reference Circuit with Level Translator Chip (for UART5)....................................................... 48
Figure 14: RS-232 Level Match Circuit (for UART5)................................................................................. 48
Figure 15: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector.........................50
Figure 16: Reference Circuit for SD Card Interface...................................................................................51
Figure 17: Reference Circuit Design for LCM Interface............................................................................. 58
Figure 18: LCM External Backlight Driver Reference Circuit.....................................................................59
Figure 19: Reference Circuit Design for TP Interface................................................................................ 60
Figure 20: Reference Circuit Design for Three-CameraApplications .......................................................63
Figure 21: Reference Circuit Design for Camera Power Supply...............................................................64
Figure 22: Reference Circuit for Vibrator Connection................................................................................69
Figure 23: Reference Circuit Design for LED Interfaces ...........................................................................70
Figure 24: Reference Circuit Design for ECM Microphone Interfaces...................................................... 72
Figure 25: Reference Circuit Design for MEMS Microphone Interfaces ...................................................72
Figure 26: Reference Circuit Design for Receiver Interface...................................................................... 73
Figure 27: Reference Circuit Design for Headset Interface....................................................................... 73
Figure 28: Reference Circuit Design for Loudspeaker Interface...............................................................74
Figure 29: Reference Circuit Design for Emergency Download Interface.................................................74
Figure 30: Reference Circuit for RF Antenna Interfaces............................................................................ 77
Figure 31: Reference Circuit Design for GNSS PassiveAntenna.............................................................78
Figure 32: Reference Circuit Design for GNSS ActiveAntenna................................................................ 79
Figure 33: Reference Circuit Design for Wi-Fi/BluetoothAntenna............................................................ 84
Figure 34: Microstrip Design on a 2-layer PCB.........................................................................................85
Figure 35: Coplanar Waveguide Design on a 2-layer PCB....................................................................... 85
Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground).................... 85
Figure 37: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground).................... 86
Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm)............................................................88
Figure 39: Mechanicals of U.FL-LP Connectors........................................................................................ 88
Figure 40: Space Factor of Mated Connector (Unit: mm)..........................................................................89
Figure 41: Module Top and Side Dimensions (Unit: mm).......................................................................... 95

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Figure 42: Module Bottom Dimensions (TOP View, Unit: mm).................................................................. 96
Figure 43: Recommended Footprint (TOP View).......................................................................................97
Figure 44: Top & Bottom Views of the Module........................................................................................... 98
Figure 45: Recommended Reflow Soldering Thermal Profile .................................................................100
Figure 46: Carrier Tape Dimension Drawing............................................................................................102
Figure 47: Plastic Reel Dimension Drawing ............................................................................................102
Figure 48: Packaging Process.................................................................................................................103

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1Introduction
This document defines the SC690A series and describes its air interfaces and hardware interfaces
which relate to yourapplications.
It can help you quickly understand interface specifications, electrical and mechanical details, as well
as other related information of the module. Associated with application notes and user guides, you can
use this module to design and to set up mobile applications easily.
FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a
mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The
antenna installation and operating configurations of this transmitter, including any applicable source-
based timeaveraging duty factor, antenna gain, and cable loss must satisfy MPE categorical Exclusion
Requirements of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s
body and must not transmit simultaneously with any other antenna or transmitter.
3. A label with the following statements must be attached to the host end product: This device contains
FCC ID: XMR2022SC690ANA
4. This module must not transmit simultaneously with any other antenna or transmitter
5. The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is
required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products.
Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a
permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2
Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining
to the OEM the labeling requirements, options and OEM user manual instructions that are required (see
next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible
when installed in the host, or (2) if the host is marketed so that end users do not have straightforward
commonly used methods for access to remove the module so that the FCC ID of the module is visible;

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then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC
ID: XMR2022SC690ANA” or “Contains FCC ID: XMR2022SC690ANA”must be used. The host OEM
user manual must also contain clear instructions on how end users can find and/or access the module
and the FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for
unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user
that changes, or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate the equipment. In cases where the manual is provided only in a form other
than paper, such as on a computer disk or over the Internet, the information required by this section may
be included in the manual in that alternative form, provided the user can reasonably be expected to have
the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring
compliance with the module(s) installed and fully operational. For example, if a host was previously
authorized as an unintentional radiator under the Supplier’s Declaration of Conformity procedure without
a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring
that the after the module is installed and operational the host continues to be compliant with the Part 15B
unintentional radiator requirements.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install
or remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
IC Statement
IRSS-GEN
"This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following
two conditions: (1) This device may not cause interference; and (2) This device must accept any
interference, including interference that may cause undesired operation of the device." or "Le présent
appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes:
1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement."
Déclaration sur l'exposition aux rayonnements RF
L'autre utilisépour l'émetteur doit être installépour fournir une distance de séparation d'au moins 20 cm
de toutes les personnes et ne doit pas être colocaliséou fonctionner conjointement avec une autre
antenne ou un autre émetteur.
The host product shall be properly labeled to identify the modules within the host product.
The Innovation, Science and Economic Development Canada certification label of a module shall be
clearly visible at all times when installed in the host product; otherwise, the host product must be labeled

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to display the Innovation, Science and Economic Development Canada certification number for the
module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows:
“Contains IC: 10224A-22SC690ANA” or “where: 10224A-22SC690ANA is the module’s certification
number”.
Le produit hôte doit être correctement étiquetépour identifier les modules dans le produit hôte.
L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module
doit être clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte
doit porter une étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement
économique Canada pour le module, précédédu mot «Contient»ou d'un libellésemblable exprimant la
même signification, comme suit:
"Contient IC: 10224A-22SC690ANA" ou "où: 10224A-22SC690ANAest le numéro de certification du
module".
i. the device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential
for harmful interference to co-channel mobile satellite systems;
ii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the
bands 5250-5350 MHz and 5470-5725 MHz shall be such that the equipment still complies with the
e.i.r.p. limit;
iii. for devices with detachable antenna(s), the maximum antenna gain permitted for devices in the
band 5725-5850 MHz shall be such that the equipment still complies with the e.i.r.p. limits as appropriate;
iv. Omnidirectional antenna is recommended
CE Statement
Regulatory Conformance
Hereby, we (Quectel Wireless Solutions Co., Ltd.) declares that the radio equipment type SC690Aseries
are in compliance
with Directive 2014/53/EU.
RF exposure
This equipment complies with CE radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance of 20 cm between the
radiator and your body.
This device may be operated in all member states of the EU.
Observe national and local regulations where the device is used.

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This device is restricted to indoor use only when operating in the 5150 to 5350 MHz,frequency range
in the following countries:
AT
BE
BG
HR
CY
CZ
DK
EE
FI
FR
DE
EL
HU
IE
IT
LV
LT
LU
MT
NL
PL
PT
RO
SK
SI
ES
SE
UK
UK Regulations
Regulations 2017 (SI 2017/1206)
Declaration of Conformity
Quectel Wireless Solutions Co., Ltd. hereby declares that this WCDMA / LTE with Bluetooth, Wi-Fi and
GNSS functions, SC690A series are in compliance with the essential requirements and other relevant
provisions of the UK Radio Equipment Regulations 2017 (SI 2017/1206).
1.1. Special Mark
Table 1: Special Mark
Mark
Definition
*
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface,
pin name, AT command, or argument, it indicates that the function, feature, interface, pin,
AT command, or argument is under development and currently not supported; and the
asterisk (*) after a model indicates that the sample of such model is currently unavailable.

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2Product Overview
The module is a series of smart LTE modules based on Android operating system and provides
industrial grade performance. It supports multiple audio and video codecs, built-in high performance
AdrenoTM GPU 610 graphics processing unit and multiple audio and video input/output interfaces as well
as abundant GPIO interfaces. Its general features are listed below:
Table 2: Brief Introduction of the Module
2.1. Frequency Bands and Functions
Table 3: Wireless Network Type
Categories
Packaging and pins number
LCC + LGA; 323
Dimensions
44 mm ×43 mm ×2.85 mm
Weight
12.24 g
Wireless network functions
LTE-FDD
Wi-Fi & Bluetooth functions
Wi-Fi 802.11a/b/g/n/ac & BT 5.1
GNSS functions
GNSS
Variants
SC690A-NA, SC690A-EM
Wireless Network Type
SC690A-NA
SC690A-EM
LTE-FDD
B2/B4/B5/B7/B12/B13/B14/B17/
B25/B26/B66
B1/B3/B7/B8/B20/B28
LTE-TDD
-
-
WCDMA
-
B1/B3/B8

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2.2. Key Features
Table 4: Key Features
GSM
-
-
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz
Galileo: 1573.5–1577.5MHz
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz
Galileo: 1573.5–1577.5MHz
Wi-Fi
2402–2482 MHz; 5180–5825 MHz
2402–2482 MHz; 5180–5825 MHz
Bluetooth
2402–2480 MHz
2402–2480 MHz
Features
Details
Application Processors
Quad-core Kryo 260 64-bit CPU @ 2.0 GHz ：
⚫Gold cluster: Kryo cores at 2 GHz with 1 MB L2 cache
⚫Silver cluster: Kryo cores at 1.8 GHz with 512 KB L2 cache
Modem DSP
Hexagon DSP, dual-HVX at 1.0 GHz
GPU
Adreno GPU610 at 950 MHz, 3D graphics accelerator with 64-bit
addressing
Memory
⚫64 GB eMMC + 4 GB LPDDR4X SDRAM (default)
⚫32 GB eMMC + 3 GB LPDDR4X SDRAM (optional)
Operating System
Android 11/12
Power Supply
⚫Supply voltage: 3.55–4.4 V
⚫Typical supply voltage: 3.8 V
LCM Interfaces
⚫Supports one group of 4-lane MIPI_DSI, up to 1.5 Gbps/lane.
⚫Supports FHD+ (1080 ×2520) @ 60 fps.
Camera Interfaces
⚫Supports 3 groups of 4-lane MIPI_CSI, up to 2.5 Gbps/lane
⚫Supports 3 cameras (4-lane + 4-lane + 4-lane) or 4 cameras (4-
lane + 4-lane + 2-lane + 1-lane)
⚫Supports triple ISP
⚫Up to 25 MP with dual ISP
Video Codec
⚫EVS, EVRC, EVRC-B, EVRC-WB
⚫G.711 and G7.729A/AB
⚫GSM-FR, GSM-EFR and GSM-HR
⚫AMR-NB,AMR-WB
⚫Video encoding and decoding: up to 1080P at 60 fps

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Audio Interfaces
Audio Inputs
3 analog microphone inputs
2 digital microphone inputs
Audio Outputs
Class AB stereo headphone output
Class AB earpiece differential output
Class AB LINE_OUT output
Audio Codec
Supports MP3; AAC; HE AAC v1, v2; FLAC; APE; ALAC; AIFF
(U)SIM Interface
⚫2 (U)SIM interfaces
⚫Supports USIM/SIM card: 1.8/2.95 V
⚫Supports Dual SIM Dual Standby (supported by default)
I2C Interface
5 I2C interfaces, used for peripherals such as TP, camera, sensor,
etc.
ADC Interfaces
⚫1 generic ADC interface
⚫Supports up to 15-bit resolution
Real Time Clock
Supported
USB Interface
⚫Compliant with USB 3.1 and 2.0 specifications, with transmission
rates up to 5 Gbps on USB 3.1 Gen1 and 480 Mbps on USB 2.0
⚫Supports USB OTG
⚫Used for AT command communication, data transmission,
software debugging, firmware upgrade.
SD Card Interface
⚫Supports SD 3.0 protocol
⚫Supports SD card hot-plug
⚫Supports 1.8/2.95 V SD card
UART Interfaces
UART5:
⚫Supports RTS and CTS hardware flow control
UART1:
⚫Supports RTS and CTS hardware flow control
Debug UART:
⚫Used for debugging
⚫Default baud rate: 115200 bps
Vibrator drive interface
Drive ERM vibrator
Flashlight Interface
2 high current flash and torch LED driver:
⚫1 A for flash mode and 300 mA for torch mode by default
⚫Maximum 1.5 A combined
Charging Interface
Used for battery voltage detection, fuel gauge, battery temperature
detection
Bluetooth Features
Supports Bluetooth 5.1
Supports BR/EDR/BLE
GNSS Features
GPS/GLONASS/BeiDou/Galileo
Antenna Interface
⚫ANT_MAIN

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1
Within operating temperature range, the module is 3GPP compliant.
⚫ANT_DRX
⚫ANT_WIFI/BT
⚫ANT_GNSS
Transmitting Power
⚫WCDMA: Class 3 (24 dBm + 1/ -3 dB)
⚫LTE-FDD: Class 3 (23 dBm ±2 dB)
LTE Features
⚫Supports 3GPP Rel-10 Cat 4 FDD
⚫Supports 1.4 to 20 MHz RF bandwidth
⚫Supports DL 2 ×2 MIMO
⚫Supports uplink QPSK, 16QAM and 64QAM modulation
⚫Supports downlink QPSK, 16QAM modulation
⚫FDD: Max 150 Mbps (DL)/ 50 Mbps (UL)
UMTS Features
⚫Supports 3GPP Rel-8/DC-HSDPA/HSPA+/HSDPA/HSUPA/
WCDMA
⚫Supported modulation: QPSK/16QAM/64QAM
⚫DC-HSDPA: Max 42 Mbps (DL)
⚫DC-HSUPA: Max 5.76 Mbps (UL)
⚫WCDMA: Max 384 kbps (DL)/384 kbps (UL)
WLAN Features
⚫2.4 GHz; 5 GHz,
⚫Supports 802.11a/b/g/n/ac, maximally up to 433 Mbps
⚫Supports AP and STA modes
Temperature Range
⚫Operating temperature range 1: -35 to +75 °C
⚫Storage temperature range: -40 to +90 °C
Firmware Upgrade
Use USB interface
RoHS
All hardware components are fully compliant with EU RoHS directive