Quectel QuecOpen AG521R-NA Supplement

AG521R-NA QuecOpen
Hardware Design
Automotive Module Series
Version: 1.0.0
Date: 2021-01-26
Status: Preliminary
www.quectel.com

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About the Document
Revision History
Version
Date
Author
Description
-
2020-04-04
Leon HUANG/
Alex ZHANG/ Evan
SHEN/
Creation of the document
1.0
2021-01-26
Charlie Bao/
Jacky CHEN/ Evan
SHEN
Preliminary

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Contents
About the Document...................................................................................................................................................3
Contents.......................................................................................................................................................................4
Table Index..................................................................................................................................................................6
Figure Index................................................................................................................................................................8
1Introduction ......................................................................................................................................................10
1.1. Safety Information..................................................................................................................................12
2Product Concept...............................................................................................................................................14
2.1. General Description................................................................................................................................ 14
2.2. Key Features...........................................................................................................................................15
2.3. Functional Diagram................................................................................................................................17
2.4. Evaluation Board....................................................................................................................................18
3Application Interfaces......................................................................................................................................19
3.1. General Description................................................................................................................................ 19
3.2. Pin Assignment....................................................................................................................................... 20
3.3. Pin Description....................................................................................................................................... 21
3.4. Operating Modes .................................................................................................................................... 37
3.5. Power Saving..........................................................................................................................................37
3.5.1. Sleep Mode................................................................................................................................. 37
3.5.1.1. USBApplication with USB Remote Wakeup Function..................................................38
3.5.1.2. USB Application without USB Remote Wakeup Function............................................. 38
3.5.1.3. USB Application without USB Suspend Function.......................................................... 39
3.5.2. Airplane Mode............................................................................................................................ 40
3.6. Power Supply..........................................................................................................................................40
3.6.1. Power Supply Pins......................................................................................................................40
3.6.2. Decrease Voltage Drop................................................................................................................41
3.6.3. Reference Design for Power Supply...........................................................................................42
3.6.4. Monitor the Power Supply..........................................................................................................42
3.7. Power on and off Scenarios.................................................................................................................... 42
3.7.1. Turn on Module with PWRKEY ................................................................................................ 42
3.7.2. Turn on Module with PON_1 ..................................................................................................... 44
3.7.3. Turn off Module..........................................................................................................................45
3.7.3.1. Turn off Module Using PWRKEY .................................................................................45
3.7.3.2. Turn off Module Using API Interface............................................................................. 46
3.8. Reset the Module....................................................................................................................................46
3.9. (U)SIM Interfaces...................................................................................................................................48
3.10. USB Interfaces........................................................................................................................................50
3.11. UART Interfaces.....................................................................................................................................52
3.12. I2S and I2C Interfaces............................................................................................................................ 54

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3.13. SDIO Interface........................................................................................................................................55
3.14. SPI Interfaces..........................................................................................................................................58
3.15. RGMII Interface ..................................................................................................................................... 59
3.16. WLAN and BT Interfaces*.....................................................................................................................62
3.17. ADC Interfaces....................................................................................................................................... 65
3.18. USB_BOOT Interface.............................................................................................................................66
3.19. GPIO Interfaces...................................................................................................................................... 66
4Antenna Interfaces............................................................................................................................................68
4.1. Main/Rx-diversity Antenna Interface ..................................................................................................... 68
4.1.1. Pin Definition.............................................................................................................................. 68
4.1.2. Operating Frequency...................................................................................................................68
4.1.3. Reference Design of RFAntenna Interfaces............................................................................... 69
4.1.4. Reference Design of RF Layout .................................................................................................70
4.2. Antenna Installation................................................................................................................................ 72
4.2.1. Antenna Requirements................................................................................................................ 72
4.2.2. Recommended RF Connector for Antenna Installation.............................................................. 72
5Reliability, Radio and Electrical Characteristics...........................................................................................74
5.1. Absolute Maximum Ratings...................................................................................................................74
5.2. Power Supply Ratings.............................................................................................................................74
5.3. Operation and Storage Temperatures...................................................................................................... 75
5.4. Current Consumption..............................................................................................................................75
5.5. RF Output Power.................................................................................................................................... 76
5.6. RF Receiving Sensitivity........................................................................................................................77
5.7. Electrostatic Discharge........................................................................................................................... 78
5.8. Thermal Consideration ...........................................................................................................................78
6Mechanical Dimensions.................................................................................................................................... 81
6.1. Mechanical Dimensions.......................................................................................................................... 81
6.2. Recommended Footprint ........................................................................................................................83
6.3. Top and Bottom Views............................................................................................................................84
7Storage, Manufacturing and Packaging.........................................................................................................85
7.1. Storage....................................................................................................................................................85
7.2. Manufacturing and Soldering ................................................................................................................. 86
7.3. Packaging................................................................................................................................................87
8Appendix A References....................................................................................................................................89

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Table Index
Table 1: Frequency Bands of AG521R-NA QuecOpen®Module.............................................................................. 14
Table 2: Key Features................................................................................................................................................ 15
Table 3: I/O Parameters Definition............................................................................................................................ 21
Table 4: Pin Description ............................................................................................................................................ 22
Table 5:Alternate Functions of Multiplexing Pins.................................................................................................... 33
Table 6: Overview of Operating Modes .................................................................................................................... 37
Table 7: VBAT and GND Pins................................................................................................................................... 40
Table 8: PWRKEY Pin Description........................................................................................................................... 42
Table 9: PON_1 Pin Description ............................................................................................................................... 44
Table 10: RESET Pin Description ............................................................................................................................. 46
Table 11: Pin Definition of (U)SIM Interface............................................................................................................ 48
Table 12: Pin Description of USB Interface.............................................................................................................. 50
Table 13: Pin Definition of UART1 Interface............................................................................................................ 52
Table 14: Pin Definition of BT UART Interface........................................................................................................ 52
Table 15: Pin Definition of Debug UART Interface.................................................................................................. 53
Table 16: Logic Levels of Digital I/O........................................................................................................................ 53
Table 17: Pin Definition of I2S Interface................................................................................................................... 54
Table 18: Pin Definition of I2C Interface.................................................................................................................. 55
Table 19: Pin Definition of SDIO Interface............................................................................................................... 55
Table 20: Pin Definition of SPI Interfaces................................................................................................................. 58
Table 21: Parameters of SPI Interface Timing........................................................................................................... 58
Table 22: Pin Definition of RGMII Interface ............................................................................................................ 59
Table 23: Pin Definition of WLAN and BT Interfaces.............................................................................................. 62
Table 24: Pin Definition ofADC Interfaces .............................................................................................................. 65
Table 25: Characteristic of ADC Interface................................................................................................................. 65
Table 26: Pin Definition of USB_BOOT Interface.................................................................................................... 66
Table 27: Pin Definition of GPIOs ............................................................................................................................ 67
Table 28: Pin Definition of Main/Rx-diversity Antenna Interfaces........................................................................... 68
Table 29: Module Operating Frequencies.................................................................................................................. 68
Table 30:Antenna Requirements............................................................................................................................... 72
Table 31: Absolute Maximum Ratings ...................................................................................................................... 74
Table 32: Power Supply Ratings................................................................................................................................ 74
Table 33: Operation and Storage Temperatures......................................................................................................... 75
Table 34: Module Current Consumption (25 °C, 3.8 V Power Supply).................................................................... 76
Table 35: RF Output Power....................................................................................................................................... 77
Table 36: RF Receiving Sensitivity (Unit: dBm)....................................................................................................... 77
Table 37: Electrostatic Discharge Characteristics...................................................................................................... 78
Table 38: Recommended Thermal Profile Parameters .............................................................................................. 86
Table 39: Related Documents.................................................................................................................................... 89
Table 40: Terms andAbbreviations ........................................................................................................................... 89
Table 41: Description of Different Coding Schemes................................................................................................. 92

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Table 42: GPRS Multi-slot Classes ........................................................................................................................... 92
Table 43: EDGE Modulation and Coding Schemes .................................................................................................. 92

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Figure Index
Figure 1: Functional Diagram forAG521R-NAQuecOpen®.................................................................................... 18
Figure 2: PinAssignment (Top View) ....................................................................................................................... 20
Figure 3: Sleep Mode Current Consumption Diagram.............................................................................................. 38
Figure 4: Sleep Mode Application with USB Remote Wakeup................................................................................. 38
Figure 5: Sleep Mode Application without USB Remote Wakeup............................................................................ 39
Figure 6: Sleep Mode Application without Suspend Function.................................................................................. 40
Figure 7: Power Supply Limits during Burst Transmission....................................................................................... 41
Figure 8: VBAT Reference Design............................................................................................................................ 41
Figure 9: 12/24 V Power Supply System Reference Design ..................................................................................... 42
Figure 10: Turn on the Module Using Driving Circuit.............................................................................................. 43
Figure 11: Turn on the Module Using Keystroke...................................................................................................... 43
Figure 12: Power-on Timing...................................................................................................................................... 44
Figure 13: Turn on the Module using PON_1 ........................................................................................................... 45
Figure 14: Power-off Timing..................................................................................................................................... 45
Figure 15: Reference Circuit of RESET by Using Driving Circuit........................................................................... 47
Figure 16: Reference Circuit of RESET by Using Button......................................................................................... 47
Figure 17: Timing of Resetting Module .................................................................................................................... 47
Figure 18: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector...................................... 49
Figure 19: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector........................................ 49
Figure 20: Reference Circuit of USB 2.0Application............................................................................................... 51
Figure 21: Reference Circuit of USB 3.0Application............................................................................................... 51
Figure 22: Reference Circuit with Translator Chip.................................................................................................... 53
Figure 23: Reference Circuit with Transistor Circuit ................................................................................................ 54
Figure 24: Reference Circuit of I2S and I2CApplication with Audio Codec ........................................................... 55
Figure 25: Reference Design of SDIO Interface for eMMCApplication.................................................................. 57
Figure 26: SPI Timing ............................................................................................................................................... 58
Figure 27: Simplified Block Diagram for EthernetApplication................................................................................ 60
Figure 28: Reference Circuit of RGMII Interface with PHYApplication................................................................. 61
Figure 29: Reference Circuit for Connection with WLAN&BT PHY....................................................................... 64
Figure 30: Reference Circuit of USB_BOOT Interface............................................................................................. 66
Figure 31: Reference Circuit of RF Antenna Interfaces ............................................................................................ 69
Figure 32: Microstrip Design on a 2-layer PCB........................................................................................................ 70
Figure 33: Coplanar Waveguide Design on a 2-layer PCB........................................................................................ 70
Figure 34: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground)..................................... 71
Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground)..................................... 71
Figure 36: Description of the HFM Connector.......................................................................................................... 73
Figure 37: Referenced Heatsink Design (Heatsink at the Top of the Module).......................................................... 79
Figure 38: Referenced Heatsink Design (Heatsink at the Backside of Customers’ PCB) ......................................... 79
Figure 39: Module Top and Side Dimensions ........................................................................................................... 81
Figure 40: Module Bottom Dimensions (Top View)................................................................................................. 82
Figure 41: Recommended Footprint (Top View)....................................................................................................... 83

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Figure 42: Top View of the Module........................................................................................................................... 84
Figure 43: Bottom View of the Module..................................................................................................................... 84
Figure 44: Recommended Reflow Soldering Thermal Profile .................................................................................. 86
Figure 45: Tape Specifications .................................................................................................................................. 88
Figure 46: Reel Specifications................................................................................................................................... 88

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1Introduction
QuecOpen®is an application solution where the module acts as a main processor. With the development of
communication technology and the ever-changing market demands, more and more customers have realized the
advantages of QuecOpen®solution. Especially, its advantage in reducing the product cost is greatly valued by
customers. With QuecOpen® solution, development flow for wireless application and hardware design will be
simplified. Main features of QuecOpen® solution are listed below:
⚫Simplifies the development of embedded applications, and shortens product development cycle
⚫Simplifies circuit design, and reduces product cost
⚫Decreases the size of terminal products
⚫Reduces power consumption
⚫Supports remote upgrade of firmware over the air
⚫Improves products’ cost-performance ratio, and enhances products’ competitiveness
This document, describing AG521R-NA QuecOpen®module and its air interface and hardware interfaces
connected to your applications, informs you of the interface specifications, electrical and mechanical details, as
well as other related information of the module.
With the application notes and user guides provided separately, you can easily use the module to design and set up
mobile applications.
FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a
mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based
timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion
Requirements of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s
body and must not transmit simultaneously with any other antenna or transmitter.
3. A label with the following statements must be attached to the host end product: This device contains
FCC ID: XMR2021AG521RNA
4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF
radiation, maximum antenna gain (including cable loss) must not exceed:
radiation, maximum antenna
gain (including cable loss)
must not exceed: Operating
FCC Max Antenna Gain（dBi）
IC Max Antenna Gain（dBi）

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Band
LTE BAND 2
8.00
8.00
LTE BAND 4
8.00
8.00
LTE BAND 5
5.00
5.00
LTE BAND 7
8.00
8.00
LTE B12
5.00
5.00
LTE B13
5.00
5.00
LTE B14
5.00
5.00
LTE B25
8.00
5.00
LTE BAND 26(814-824)
8.00
8.00
LTE BAND 26(824-849)
8.00
8.00
LTE B66
5.00
5.00
LTE B71
5.00
5.00
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and conditions that
must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is
required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating configurations,
including portable configurations with respect to 2.1093 and different antenna configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products.
Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently
affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling
requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling
requirements, options and OEM user manual instructions that are required (see next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when
installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used
methods for access to remove the module so that the FCC ID of the module is visible; then an additional permanent
label referring to the enclosed module: “Contains Transmitter Module FCC ID: XMR2021AG521RNA” or
“Contains FCC ID: XMR2021AG521RNA”must be used. The host OEM user manual must also contain clear
instructions on how end users can find and/or access the module and the FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for
unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that
changes or modifications not expressly approved by the party responsible for compliance could void the user's
authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such as
on a computer disk or over the Internet, the information required by this section may be included in the manual in
that alternative form, provided the user can reasonably be expected to have the capability to access information in
that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate the

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equipment.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring
compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as
an unintentional radiator under the Supplier’s Declaration of Conformity procedure without a transmitter certified
module and a module is added, the host manufacturer is responsible for ensuring that the after the module is
installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove
this RF module in the user’s manual of the end product which integrates this module. The end user manual shall
include all required regulatory information/warning as show in this manual.
IC Statement
IRSS-GEN
"This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following two
conditions: (1) This device may not cause interference; and (2) This device must accept any interference, including
interference that may cause undesired operation of the device." or "Le présent appareil est conforme aux CNR
d’Industrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux
conditions suivantes :
1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement."
Déclaration sur l'exposition aux rayonnements RF
L'autre utilisépour l'émetteur doit être installépour fournir une distance de séparation d'au moins 20 cm de toutes
les personnes et ne doit pas être colocaliséou fonctionner conjointement avec une autre antenne ou un autre
émetteur.
The host product shall be properly labeled to identify the modules within the host product.
The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible
at all times when installed in the host product; otherwise, the host product must be labeled to display the Innovation,
Science and Economic Development Canada certification number for the module, preceded by the word “Contains”
or similar wording expressing the same meaning, as follows:
“Contains IC: 10224A-2021AG521R” or “where: 10224A-2021AG521R is the module’s certification number”.
Le produit hôte doit être correctement étiquetépour identifier les modules dans le produit hôte.
L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module doit être
clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte doit porter une
étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement économique Canada pour le
module, précédédu mot «Contient»ou d'un libellésemblable exprimant la même signification, comme suit:
"Contient IC: 10224A-2021AG521R " ou "où: 10224A-2021AG521R est le numéro de certification du module".
1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service or repair
of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal should notify
users and operating personnel of the following safety information by incorporating these guidelines into all manuals

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of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an accident.
Using a mobile while driving (even with a handsfree kit) causes distraction and can lead to an
accident. Please comply with laws and regulations restricting the use of wireless devices
while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation of
wireless appliances in an aircraft is forbidden to prevent interference with communication
systems. If there is an Airplane Mode, it should be enabled prior to boarding an aircraft.
Please consult the airline staff for more restrictions on the use of wireless devices on an
aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please be aware
of the restrictions on the use of wireless devices when in hospitals, clinics or other healthcare
facilities.
Cellular terminals or mobiles operating over radio signal and cellular network cannot be
guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the
(U)SIM card is invalid. When emergent help is needed in such conditions, use emergency call
if the device supports it. In order to make or receive a call, the cellular terminal or mobile
must be switched on in a service area with adequate cellular signal strength. In an emergency,
the device with emergency call function cannot be used as the only contact method
considering network connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives and
transmits radio frequency signals. RF interference can occur if it is used close to TV sets,
radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted signs and
turn off wireless devices such as mobile phone or other cellular terminals. Areas with
explosive or potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, and areas where the air contains chemicals or
particles such as grain, dust or metal powders.

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2Product Concept
2.1. General Description
AG521R-NA QuecOpen module is a baseband processor platform based on ARM Cortex A7 kernel. The maximum
dominant frequency is up to 1.497 GHz.
AG521R-NA QuecOpen module is a series of automotive-grade LTE-FDD wireless communication modules with
receive diversity. It provides data connectivity on LTE-FDD networks. It also provides GNSS function (optional)
and audio function to meet specific application demands.
AG521R-NA QuecOpen contains global main bands to meet varied market demands.
Engineered to meet the demanding requirements in automotive applications and other harsh operating conditions,
the module offers a premium solution for high performance automotive and intelligent transportation system (ITS)
applications, such as fleet management, onboard vehicle telematics, in-car entertainment systems, emergency
calling, and roadside assistance.
With a compact profile of 38.0 mm ×42.0 mm × 2.65 mm, the module can meet almost all requirements for
automobile applications. It is an SMD type module which can be embedded into applications through its 400 LGA
pins.
Table 1: Frequency Bands of AG521R-NA QuecOpen®Module
Network Type
AG521R-NA QuecOpen Module
LTE-FDD
(with Rx-diversity)
2 ×2 MIMO: B2/B4/B5/B7/B12/B13/B14/B25/B26/B29 1)/B66/B71
WCDMA
(with Rx-diversity)
No supported
GSM
No supported
GNSS
GPS, GLONASS, BeiDou, Galileo, QZSS
NOTE

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1. 1) LTE-FDD B29, B30 and B32 support Rx only.
2.2. Key Features
The following table describes detailed features of the module.
Table 2: Key Features
Feature
Details
Power Supply
VBAT_BB/VBAT_RF:
⚫Supply voltage: 3.3–4.3 V
⚫Typical supply voltage: 3.8 V
Transmitting Power
⚫Class 3 (23 dBm ±2 dB) for LTE-FDD bands
LTE Features
⚫Support up to 3 ×CACat 12 LTE FDD
⚫Support 1.4/3/5/10/15/20 MHz RF bandwidth
⚫Support Multiuser 2 × 2 MIMO in DL direction
⚫FDD: Max 600 Mbps (DL)/150 Mbps (UL)
Internet Protocol Features
⚫Support TCP/UDP/PPP/FTP/HTTP/NTP/PING/QMI/HTTPS/
MMS/FTPS/SSL protocols
⚫Support PAP and CHAP used for PPP connections
SMS
⚫Text and PDU modes
⚫Point to point MO and MT
⚫SMS cell broadcast
⚫SMS storage: ME by default
(U)SIM Interfaces
Support USIM/SIM card: 1.8/3.0 V
Audio Features
⚫Provide one digital audio interface: I2S interface
⚫LTE: AMR/AMR-WB
⚫Support echo cancellation and noise suppression
I2S Interface
Used for external codec function
PCM Interface
⚫Used for external BT function
⚫Support 16-bit linear data format
⚫Support long frame sync and short frame sync
⚫Support master and slave modes, but must be the master in long frame sync
USB Interfaces
⚫USB 3.0 and 2.0 interfaces (slave mode by default; support USB master
mode), with maximum transmission rates up to 5 Gbps on USB 3.0 and 480
Mbps on USB 2.0

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⚫Used for AT command communication, data transmission, firmware
upgrade, software debugging, and voice over USB*
⚫Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6~5.4, and
Android 4.x/5.x/6.x/7.x/8.x/9.x
UART Interfaces
UART1:
⚫Baud rate reach up to 921600 bps, 115200 bps by default
⚫Support RTS and CTS hardware flow control
BT UART:
⚫Baud rate reach up to 921600 bps, 115200 bps by default
⚫Support RTS and CTS hardware flow control
Debug UART:
⚫Used for Linux console and log output, 115200 bps baud rate
SDIO Interface
Support eMMC 4.5.1
SPI Interfaces
⚫Support master mode only
⚫Maximum clock frequency rate: 50 MHz
I2C Interface
⚫Compliant with I2C specification version 3.0
⚫Multi-master is not supported
⚫Used for codec configuration by default
RGMII Interface
Support 10/100/1000 Mbps
Wireless Connectivity
Interface*
⚫PCIe (Gen2) interface for WLAN
⚫UART & PCM interfaces for Bluetooth*
Rx-diversity
Support LTE Rx-diversity
Antenna Interfaces
⚫Main antenna interface (ANT_MAIN)
⚫Rx-diversity antenna interface (ANT_DIV)
⚫GNSS antenna interface (ANT_GNSS)
Physical Characteristics
⚫Dimensions: (38.0 ±0.2) mm ×(42.0 ±0.2) mm ×(2.65 ±0.2) mm
⚫Weight: approx. 9.23 g
Temperature Range
⚫Operation temperature range: -35 °C to +75 °C 1)
⚫Extended temperature range: -40 °C to +85 °C 2)
⚫eCall temperature range: -40 °C to +90 °C 3)
⚫Storage temperature range: -40 °C to +95 °C
Firmware Upgrade
⚫USB 2.0 interface
⚫DFOTA
RoHS
All hardware components are fully compliant with EU RoHS directive
1. 1) Within operation temperature range, the module is 3GPP compliant, and emergency call can be dialed out
with a maximum power and data rate.
2. 2) Within extended temperature range, the module remains fully functional and retains the ability to establish
NOTES

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and maintain functions such as voice, SMS, data transmission and emergency call, without any unrecoverable
malfunction. Radio spectrum and radio network will not be influenced, while one or more specifications, such
as Pout, may undergo a reduction in value, exceeding the specified tolerances of 3GPP. When the temperature
returns to the normal operating temperature level, the module will meet 3GPP specifications again.
3. 3) Within eCall temperature range, the emergency call function must be functional until the module is broken.
When the ambient temperature is between 75 °C and 90 °C and the module temperature has reached the
threshold value, the module will trigger protective measures (such as reduce power, decrease throughput and
unregister the device) to ensure the full function of emergency call.
4. “*” means under development.
2.3. Functional Diagram
The following figure shows a block diagram of the module and illustrates the major functional parts.
⚫Power management
⚫Baseband
⚫LPDDR4X + NAND flash
⚫Radio frequency
⚫Peripheral interfaces

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Baseband
PMIC
Transceiver NAND
LPDDR4X
C-V2X TX/RX Blocks
ANT_CV2X_TRX0
ANT_GNSS
VBAT_BB
VBAT_CV2X
PWRKEY
ADC×2
USIM1_VDD
RESET
38.4M
XO
Control
Control
CV2X Tx
QLINK
ANT_CV2X_TRX1
PCM PCIe USB2.0/3.0 SPI UART×3 I2C SDIORGMII (U)SIM GPIOsI2S
VDD_EXT
TX/RX Blocks
...
...
...
ANT_DIV
...
ANT_MAIN
VBAT_RF
APT
ANT_MIMO3
ANT_MIMO4
TX
PRX
DRX
GNSS
MIPI&GRFC
PRX
DRX
Figure 1: Functional Diagram for AG521R-NA QuecOpen®
2.4. Evaluation Board
To help you develop applications conveniently with the module, Quectel supplies the evaluation board (EVB), USB
data cables, a pair of earphones, antennas and other peripherals to control or test the module. For more details, see
document [1].

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3Application Interfaces
3.1. General Description
The module is designed with 400 LGA pins that can be connected to cellular application platforms. Module
interfaces are described in detail in the following sub-chapters:
⚫Power supply
⚫(U)SIM interfaces
⚫USB 2.0/3.0 interface
⚫UART interfaces
⚫I2S and I2C interfaces
⚫SDIO interface
⚫SPI interfaces
⚫RGMII interface
⚫WLAN and BT interfaces*
⚫ADC interfaces
⚫USB_BOOT interface
⚫GPIO interfaces
“*” means under development.
NOTE