Quectel SC66 Supplement

SC66 Hardware Design
Smart LTE Module Series
Rev: SC66_Hardware_Design_V1.0
Date: 2019-08-13
Status: Released
www.quectel.com
Model:SC66-A

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About the Document
History
Revision Date Author Description
1.0 2019-08-13
Jian WU/
Chris ZHANG Initial

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Contents
About the Document...................................................................................................................................2
Contents.......................................................................................................................................................3
Table Index...................................................................................................................................................6
Figure Index.................................................................................................................................................8
1Introduction........................................................................................................................................13
1.1. Safety Information.....................................................................................................................14
2Product Concept................................................................................................................................15
2.1. General Description ..................................................................................................................15
2.2. Key Features.............................................................................................................................19
2.3. Functional Diagram...................................................................................................................22
2.4. Evaluation Board.......................................................................................................................23
3Application Interfaces .......................................................................................................................24
3.1. General Description ..................................................................................................................24
3.2. Pin Assignment .........................................................................................................................25
3.3. Pin Description..........................................................................................................................26
3.4. Power Supply............................................................................................................................42
3.4.1. Power Supply Pins.........................................................................................................42
3.4.2. Decrease Voltage Drop..................................................................................................42
3.4.3. Reference Design for Power Supply..............................................................................43
3.5. Turn on and off Scenarios.........................................................................................................45
3.5.1. Turn on the Module Using PWRKEY.............................................................................45
3.5.2. Turn on the Module Automatically..................................................................................47
3.5.3. Reboot/Turn off the Module ...........................................................................................47
3.6. VRTC Interface .........................................................................................................................48
3.7. Power Output............................................................................................................................49
3.8. Battery Charge and Management.............................................................................................49
3.9. USB Interfaces..........................................................................................................................52
3.9.1. Type-C Interface.............................................................................................................52
3.9.1.1. USB Type-C Mode...............................................................................................52
3.9.1.2. DisplayPort Mode.................................................................................................54
3.9.2. Micro USB Interface.......................................................................................................55
3.9.3. USB Interface Design Considerations...........................................................................57
3.10. UART Interfaces........................................................................................................................58
3.11. (U)SIM Interfaces......................................................................................................................60
3.12. SD Card Interface .....................................................................................................................62
3.13. GPIO Interfaces ........................................................................................................................64
3.14. I2C Interfaces............................................................................................................................65
3.15. I2S Interfaces............................................................................................................................66
3.16. SPI Interface .............................................................................................................................68
3.17. ADC Interfaces..........................................................................................................................68

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3.18. LCM Interfaces..........................................................................................................................69
3.19. Touch Panel Interfaces .............................................................................................................74
3.20. Camera Interfaces.....................................................................................................................75
3.20.1. Design Considerations...................................................................................................81
3.21. Sensor Interfaces......................................................................................................................83
3.22. Audio Interfaces........................................................................................................................84
3.22.1. Reference Circuit Design for Microphone Interface.......................................................85
3.22.2. Reference Circuit Design for Earpiece Interface...........................................................86
3.22.3. Reference Circuit Design for Headphone Interface.......................................................87
3.22.4. Reference Circuit Design for Loudspeaker Interface.....................................................87
3.22.5. Audio Interfaces Design Considerations........................................................................87
3.23. Emergency Download Interface................................................................................................88
4Wi-Fi and BT.......................................................................................................................................89
4.1. Wi-Fi Overview..........................................................................................................................89
4.1.1. Wi-Fi Performance.........................................................................................................89
4.1.2. Wi-Fi MIMO Design Guidelines......................................................................................91
4.2. BT Overview..............................................................................................................................91
4.2.1. BT Performance.............................................................................................................92
5GNSS...................................................................................................................................................93
5.1. GNSS Performance ..................................................................................................................93
5.2. GNSS RF Design Guidelines....................................................................................................94
6Antenna Interfaces.............................................................................................................................95
6.1. Main/Rx-diversityAntenna Interfaces.......................................................................................95
6.1.1. Main and Rx-diversityAntenna Interfaces Reference Design.......................................99
6.1.2. Reference Design of RF Layout.....................................................................................99
6.2. Wi-Fi/BTAntenna Interface.....................................................................................................101
6.3. GNSSAntenna Interface.........................................................................................................103
6.3.1. Recommended Circuit for Passive Antenna................................................................104
6.3.2. Recommended Circuit for Active Antenna...................................................................104
6.4. Antenna Installation.................................................................................................................106
6.4.1. Antenna Requirements ................................................................................................106
6.4.2. Recommended RF Connector for Antenna Installation...............................................107
7Electrical, Reliability and Radio Characteristics..........................................................................109
7.1. Absolute Maximum Ratings....................................................................................................109
7.2. Power Supply Ratings.............................................................................................................109
7.3. Operation and Storage Temperatures.....................................................................................110
7.4. Current Consumption...............................................................................................................111
7.5. RF Output Power ....................................................................................................................120
7.6. RF Receiving Sensitivity.........................................................................................................124
7.7. Electrostatic Discharge...........................................................................................................128
8Mechanical Dimensions..................................................................................................................129
8.1. Mechanical Dimensions of the Module...................................................................................129

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8.2. Recommended Footprint ........................................................................................................131
8.3. Top and Bottom View of the Module.......................................................................................132
9Storage, Manufacturing and Packaging........................................................................................133
9.1. Storage....................................................................................................................................133
9.2. Manufacturing and Soldering..................................................................................................134
9.3. Packaging ...............................................................................................................................135
10 Appendix A References...................................................................................................................137
11 Appendix B GPRS Coding Schemes .............................................................................................140
12 Appendix C GPRS Multi-slot Classes............................................................................................141
13 Appendix D EDGE Modulation and Coding Schemes.................................................................143

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Table Index
TABLE 1: SC66-CE* FREQUENCY BANDS..................................................................................................... 15
TABLE 2: SC66-A* FREQUENCY BANDS ....................................................................................................... 16
TABLE 3: SC66-J* FREQUENCY BANDS........................................................................................................ 16
TABLE 4: SC66-E* FREQUENCY BANDS ....................................................................................................... 17
TABLE 5: SC66-W* FREQUENCY BANDS ...................................................................................................... 17
TABLE 6: SC66-MW*(2 × 2 MIMO WIFI) FREQUENCY BANDS ..................................................................... 18
TABLE 7: SC66 KEY FEATURES ..................................................................................................................... 19
TABLE 8: I/O PARAMETERS DEFINITION....................................................................................................... 26
TABLE 9: PIN DESCRIPTION........................................................................................................................... 26
TABLE 10: POWER DESCRIPTION ................................................................................................................. 49
TABLE 11: PIN DEFINITION OF CHARGING INTERFACE ............................................................................. 50
TABLE 12: PIN DEFINITION OF TYPE-C INTERFACE.................................................................................... 52
TABLE 13: PIN DESCRIPTIONS IN USB/DISPLAYPORT MODE.................................................................... 54
TABLE 14: USB1 & USB2 PIN DESCRIPTION................................................................................................. 56
TABLE 15: USB TRACE LENGTH INSIDE THE MODULE.............................................................................. 57
TABLE 16: PIN DEFINITION OF UART INTERFACES..................................................................................... 58
TABLE 17: PIN DEFINITION OF (U)SIM INTERFACES................................................................................... 60
TABLE 18: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 62
TABLE 19: SD CARD SIGNAL TRACE LENGTH INSIDE THE MODULE ....................................................... 64
TABLE 20: PIN DEFINITION OF GPIO INTERFACES ..................................................................................... 64
TABLE 21: PIN DEFINITION OF I2C INTERFACES......................................................................................... 66
TABLE 22: PIN DEFINITION OF I2S INTERFACES......................................................................................... 66
TABLE 23: PIN DEFINITION OF SPI INTERFACE........................................................................................... 68
TABLE 24: PIN DEFINITION OF ADC INTERFACES....................................................................................... 68
TABLE 25: PIN DEFINITION OF LCM INTERFACES....................................................................................... 69
TABLE 26: PIN DEFINITION OF TOUCH PANEL INTERFACES..................................................................... 74
TABLE 27: PIN DEFINITION OF CAMERA INTERFACES............................................................................... 75
TABLE 28: TRACE LENGTH OF MIPI DIFFERENTIAL PAIRS INSIDE THE MODULE .................................. 81
TABLE 29: PIN DEFINITION OF SENSOR INTERFACES............................................................................... 83
TABLE 30: PIN DEFINITION OF AUDIO INTERFACES................................................................................... 84
TABLE 31: WI-FI TRANSMITTING PERFORMANCE....................................................................................... 89
TABLE 32: WI-FI RECEIVING PERFORMANCE.............................................................................................. 90
TABLE 33: BT DATA RATE AND VERSIONS.................................................................................................... 92
TABLE 34: BT TRANSMITTING AND RECEIVING PERFORMANCE ............................................................. 92
TABLE 35: GNSS PERFORMANCE ................................................................................................................. 93
TABLE 36: PIN DEFINITION OF MAIN/RX-DIVERSITY ANTENNA INTERFACES......................................... 95
TABLE 37: SC66-CE* OPERATING FREQUENCIES....................................................................................... 95
TABLE 38: SC66-A* OPERATING FREQUENCIES ......................................................................................... 96
TABLE 39: SC66-J* OPERATING FREQUENCIES.......................................................................................... 97
TABLE 40: SC66-E* OPERATING FREQUENCIES ......................................................................................... 98
TABLE 41: PIN DEFINITION OF WI-FI/BT ANTENNA INTERFACE .............................................................. 101

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TABLE 42: WI-FI/BT FREQUENCY................................................................................................................. 102
TABLE 43: PIN DEFINITION OF GNSS ANTENNA........................................................................................ 103
TABLE 44: GNSS FREQUENCY..................................................................................................................... 103
TABLE 45: ANTENNA REQUIREMENTS........................................................................................................ 106
TABLE 46:ABSOLUTE MAXIMUM RATINGS ................................................................................................ 109
TABLE 47: SC66 MODULE POWER SUPPLY RATINGS............................................................................... 109
TABLE 48: OPERATIONAND STORAGE TEMPERATURES.........................................................................110
TABLE 49: SC66-CE* CURRENT CONSUMPTION ........................................................................................111
TABLE 50: SC66-A* CURRENT CONSUMPTION...........................................................................................113
TABLE 51: SC66-J* CURRENT CONSUMPTION ...........................................................................................115
TABLE 52: SC66-E* CURRENT CONSUMPTION...........................................................................................116
TABLE 53: SC66-CE* RF OUTPUT POWER.................................................................................................. 120
TABLE 54: SC66-A* RF OUTPUT POWER.................................................................................................... 121
TABLE 55: SC66-J* RF OUTPUT POWER..................................................................................................... 122
TABLE 56: SC66-E* RF OUTPUT POWER.................................................................................................... 122
TABLE 57: SC66-CE* RF RECEIVING SENSITIVITY.................................................................................... 124
TABLE 58: SC66-A* RF RECEIVING SENSITIVITY....................................................................................... 125
TABLE 59: SC66-J* RF RECEIVING SENSITIVITY ....................................................................................... 125
TABLE 60: SC66-E* RF RECEIVING SENSITIVITY....................................................................................... 126
TABLE 61: ESD CHARACTERISTICS (TEMPERATURE: 25°C, HUMIDITY: 45%)....................................... 128
TABLE 62: RECOMMENDED THERMAL PROFILE PARAMETERS............................................................. 134
TABLE 63: REEL PACKAGING....................................................................................................................... 136
TABLE 64: RELATED DOCUMENTS.............................................................................................................. 137
TABLE 65: TERMS AND ABBREVIATIONS.................................................................................................... 137
TABLE 66: DESCRIPTION OF DIFFERENT CODING SCHEMES................................................................ 140
TABLE 67: GPRS MULTI-SLOT CLASSES .................................................................................................... 141
TABLE 68: EDGE MODULATION AND CODING SCHEMES......................................................................... 143

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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 23
FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 25
FIGURE 3: VOLTAGE DROP SAMPLE............................................................................................................. 43
FIGURE 4: STRUCTURE OF POWER SUPPLY.............................................................................................. 43
FIGURE 5: REFERFENCE CIRCUIT OF POWER SUPPLY............................................................................ 44
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT................................................................... 45
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 45
FIGURE 8: TIMING OF TURNING ON MODULE............................................................................................. 46
FIGURE 9: TURN ON THE MODULE AUTOMATICALLY................................................................................. 47
FIGURE 10: TIMING OF REBOOTING MODULE ............................................................................................ 47
FIGURE 11: RTC POWERED BY A RECHARGEABLE BUTTON CELL BATTERY......................................... 48
FIGURE 12: REFERENCE DESIGN FOR BATTERY CHARGING CIRCUIT................................................... 51
FIGURE 13: USB TYPE-C INTERFACE REFERENCE DESIGN..................................................................... 54
FIGURE 14: DISPLAYPORT REFERENCE DESIGN....................................................................................... 55
FIGURE 15: MICRO USB INTERFACE ............................................................................................................ 56
FIGURE 16: USB2 HOST.................................................................................................................................. 57
FIGURE 17: REFERENCE CIRCUIT WITH LEVEL TRANSLATOR CHIP (FOR UART6) ............................... 59
FIGURE 18: RS232 LEVEL MATCH CIRCUIT (FOR UART5).......................................................................... 60
FIGURE 19: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
........................................................................................................................................................................... 61
FIGURE 20: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR
........................................................................................................................................................................... 62
FIGURE 21: REFERENCE CIRCUIT FOR SD CARD INTERFACE................................................................. 63
FIGURE 22: LCM0 EXTERNAL BACKLIGHT DRIVER REFERENCE CIRCUIT ............................................. 71
FIGURE 23: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE......................................................... 71
FIGURE 24: REFERENCE CIRCUIT DESIGN FOR LCM0 INTERFACE......................................................... 72
FIGURE 25: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE......................................................... 73
FIGURE 26: REFERENCE CIRCUIT DESIGN FOR TP0 INTERFACE............................................................ 75
FIGURE 27: REFERENCE CIRCUIT DESIGN FOR DUAL CAMERAAPPLICATIONS................................... 78
FIGURE 28: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERAAPPLICATIONS.................................... 79
FIGURE 29: REFERENCE CIRCUIT DESIGN FOR THREE-CAMERAAPPLICATIONS................................ 80
FIGURE 30: REFERENCE CIRCUIT DESIGN FOR ANALOG ECM-TYPE MICROPHONE........................... 85
FIGURE 31: REFERENCE CIRCUIT DESIGN FOR MEMS-TYPE MICROPHONE........................................ 86
FIGURE 32: REFERENCE CIRCUIT DESIGN FOR EARPIECE INTERFACE................................................ 86
FIGURE 33: REFERENCE CIRCUIT DESIGN FOR HEADPHONE INTERFACE ........................................... 87
FIGURE 34: REFERENCE CIRCUIT DESIGN FOR LOUDSPEAKER INTERFACE....................................... 87
FIGURE 35: REFERENCE CIRCUIT DESIGN FOR EMERGENCY DOWNLOAD INTERFACE..................... 88
FIGURE 36: REFERENCE CIRCUIT DESIGN FOR MAIN AND RX-DIVERSITY ANTENNA INTERFACES.. 99
FIGURE 37: MICROSTRIP DESIGN ON A 2-LAYER PCB............................................................................. 100
FIGURE 38: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB......................................................... 100
FIGURE 39: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)

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......................................................................................................................................................................... 100
FIGURE 40: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4AS REFERENCE GROUND)
......................................................................................................................................................................... 101
FIGURE 41: REFERENCE CIRCUIT DESIGN FOR WI-FI/BT ANTENNA INTERFACE................................ 102
FIGURE 42: REFERENCE CIRCUIT DESIGN FOR WI-FI MINO ANTENNA INTERFACE........................... 103
FIGURE 43: REFERENCE CIRCUIT DESIGN FOR GNSS PASSIVE ANTENNA......................................... 104
FIGURE 44: REFERENCE CIRCUIT DESIGN FOR GNSSACTIVE ANTENNA ........................................... 105
FIGURE 45: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM).............................................. 107
FIGURE 46: MECHANICALS OF U.FL-LP CONNECTORS........................................................................... 107
FIGURE 47: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ......................................................... 108
FIGURE 48: MODULE TOPAND SIDE DIMENSIONS................................................................................... 129
FIGURE 49: MODULE BOTTOM DIMENSIONS (TOP VIEW) ....................................................................... 130
FIGURE 50: RECOMMENDED FOOTPRINT (TOP VIEW)............................................................................ 131
FIGURE 51: TOP VIEW OF THE MODULE.................................................................................................... 132
FIGURE 52: BOTTOM VIEW OF THE MODULE............................................................................................ 132
FIGURE 53: RECOMMENDED REFLOW SOLDERING THERMAL PROFILE.............................................. 134
FIGURE 54: TAPE DIMENSIONS................................................................................................................... 135
FIGURE 55: REEL DIMENSIONS................................................................................................................... 136

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OEM/Integrators Installation Manual
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in mobile or fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and different antenna configurations
4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify
compliance as a composite system. When testing the host device for compliance with Part
15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the
transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation
should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band
emissions). The host manufacturer must verify that there are no additional unintentional emissions other
than what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).
The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window on
the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a
second label must be placed on the outside of the final device that contains the following text: “Contains
FCC ID: XMR2019SC66A ”
“Contains IC: 10224A-2019SC66A “
The FCC ID/IC ID can be used only when all FCC/IC compliance requirements are met.

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In the event that these conditions cannot be met (for example certain laptop configurations or co-location
with another transmitter), then the FCC/IC authorization is no longer considered valid and the FCC ID/IC
ID cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for
re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
Federal Communication Commission Interference Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
- Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
Industry Canada Statement
This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the
following two conditions:
(1) This device may not cause interference; and
(2) This device must accept any interference, including interference that may cause undesired
operation of the device.

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Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts
de licence. L'exploitation est autorisée aux deux conditions suivantes:
(1) l'appareil ne doit pas produire de brouillage, et
(2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement."
The device could automatically discontinue transmission in case of absence of information to transmit, or
operational failure. Note that this is not intended to prohibit transmission of control or signaling information
or the use of repetitive codes where required by the technology.
The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for
harmful interference to co-channel mobile satellite systems;
The maximum antenna gain permitted for devices in the bands 5250–5350 MHz and 5470–5725 MHz shall
comply with the e.i.r.p. limit; and
The maximum antenna gain permitted for devices in the band 5725–5825 MHz shall comply with the e.i.r.p.
limits specified for point-to-point and non point-to-point operation as appropriate.
L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations à
transmettre ou de panne opérationnelle. Notez que ceci n'est pas destiné à interdire la transmission
d'informations de contrôle ou de signalisation ou l'utilisation de codes répétitifs lorsque cela est requis par
la technologie.
Le dispositif utilisé dans la bande 5150-5250 MHz est réservé à une utilisation en intérieur afin de réduire
le risque de brouillage préjudiciable aux systèmes mobiles par satellite dans le même canal;
Le gain d'antenne maximal autorisé pour les dispositifs dans les bandes 5250-5350 MHz et 5470-5725
MHz doit être conforme à la norme e.r.p. limite; et
Le gain d'antenne maximal autorisé pour les appareils de la bande 5725-5825 MHz doit être conforme à
la norme e.i.r.p. les limites spécifiées pour un fonctionnement point à point et non point à point, selon le
cas.
CAN ICES-3(B)/ NMB-3(B)
Radiation Exposure Statement
This equipment complies with FCC/IC radiation exposure limits set forth for an uncontrolled environment.
This equipment should be installed and operated with minimum distance 20 cm between the radiator &
your body.

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1Introduction
This document defines the SC66 module and describes its air interfaces and hardware interfaces which
are connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details as well as other related information of SC66 module. Associated with application note
and user guide, customers can use SC66 module to design and set up mobile applications easily.

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1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating SC66 module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidd
en to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to
boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the
use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating ov
er radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or othe
r cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemica
l transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

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2Product Concept
2.1. General Description
SC66 is a series of Smart LTE module based on Qualcomm platform and Android operating system, and
provides industrial grade performance. Its general features are listed below:
Support worldwide LTE-FDD, LTE-TDD, DC-HSDPA, DC-HSUPA, HSPA+, HSDPA, HSUPA,
WCDMA, TD-SCDMA, EVDO/CDMA, EDGE, GSM and GPRS coverage
Support short-range wireless communication via Wi-Fi 802.11a/b/g/n/ac and BT5.0 standards
Integrate GPS/GLONASS/BeiDou satellite positioning systems
Support multiple audio and video codecs
Built-in high performance AdrenoTM GPU 512 graphics processing unit
Provide multiple audio and video input/output interfaces as well as abundant GPIO interfaces
SC66 are available in six variants: SC66-CE*, SC66-A*, SC66-J*, SC66-E*, SC66-W* and SC66-MW*.
The following table shows the supported frequency bands of SC66.
Table 1: SC66-CE* Frequency Bands
Type Frequency Bands
LTE-FDD B1/B3/B5/B8
LTE-TDD B34/B38/B39/B40/B41
WCDMA B1/B8
TD-SCDMA B34/B39
EVDO/CDMA BC0
GSM 900/1800MHz
Wi-Fi 802.11a/b/g/n/ac 2402MHz~2482MHz; 5180MHz~5825MHz

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Table 2: SC66-A* Frequency Bands
Table 3: SC66-J* Frequency Bands
BT5.0 2402MHz~2480MHz
GNSS GPS: 1575.42MHz±1.023MHz GLONASS: 1597.5MHz~1605.8MHz
BeiDou: 1561.098MHz±2.046MHz
Type Frequency Bands
LTE-FDD B2/B4/B5/B7/B12/B13/B14/B17/B25/B26/B66/B71
LTE-TDD B41
WCDMA B2/B4/B5
Wi-Fi 802.11a/b/g/n/ac 2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0 2402MHz~2480MHz
GNSS GPS: 1575.42MHz±1.023MHz GLONASS: 1597.5MHz~1605.8MHz
BeiDou: 1561.098MHz±2.046MHz
Type Frequency Bands
LTE-FDD B1/B3/B5/B8/B11/B18/B19/B21/B26/B28(A+B)
LTE-TDD B41
WCDMA B1/B6/B8/B19
Wi-Fi 802.11a/b/g/n/ac 2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0 2402MHz~2480MHz
GNSS GPS: 1575.42MHz±1.023MHz GLONASS: 1597.5MHz~1605.8MHz
BeiDou: 1561.098MHz±2.046MHz

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Table 4: SC66-E* Frequency Bands
Table 5: SC66-W* Frequency Bands
Type Frequency Bands
LTE-FDD B1/B2/B3/B4/B5/B7/B8/B20/B28(A+B)
LTE-TDD B38/B39/B40/B41
WCDMA B1/B2/B4/B5/B8
GSM
850/900/1800/1900MHz
Wi-Fi 802.11a/b/g/n/ac 2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0 2402MHz~2480MHz
GNSS GPS: 1575.42MHz±1.023MHz GLONASS: 1597.5MHz~1605.8MHz
BeiDou: 1561.098MHz±2.046MHz
Type Frequency Bands
LTE-FDD /
LTE-TDD /
WCDMA /
TD-SCDMA /
CDMA /
GSM /
Wi-Fi 802.11a/b/g/n/ac 2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0 2402MHz~2480MHz
GNSS /

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Table 6: SC66-MW*(2 × 2 MIMO WIFI) Frequency Bands
1. “*” means under development.
2. SC66-A, SC66-J, SC66-E and SC66-MW support Wi-Fi MIMO function.
SC66 is an SMD type module which can be embedded into applications through its 324 pins (including
152 LCC pads and 172 LGA pads). With a compact profile of 43.0mm × 44.0mm × 2.85mm, SC66 can
meet almost all requirements for M2M applications such as smart metering, smart home, security, routers,
wireless POS, mobile computing devices, PDA phone, tablet PC and etc. Besides, SC66 supports AI
applications such as face recognition and vehicle recognition.
Type Frequency Bands
LTE-FDD /
LTE-TDD /
WCDMA /
TD-SCDMA /
CDMA /
GSM /
Wi-Fi 802.11a/b/g/n/ac 2402MHz~2482MHz; 5180MHz~5825MHz
BT 5.0 2402MHz~2480MHz
GNSS /
NOTES

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2.2. Key Features
The following table describes the detailed features of SC66 module.
Table 7: SC66 Key Features
Features Details
Application Processor
Customized 64-bit ARM v8-compliant applications processor
Kryo Gold: quad high-performance cores targeting 2.2 GHz
Kryo Silver: quad low-power cores targeting 1.843 GHz

two quad-core processors with 1MB L2 cache
Modem system LTE Cat 6 (FDD and TDD), 2 × 20 CA(40MHz)
GPU Adreno 512 up to 650 MHz
Memory 32GB eMMC＋3GB LPDDR4x(default)
64GB eMMC
＋
4GB LPDDR4x (optional)
Operating System Android 9
Power Supply VBAT Supply Voltage: 3.55V~4.4V
Typical 4.0V
Transmitting Power
Class 4 (33dBm±2dB) for GSM850/EGSM900
Class 1 (30dBm±2dB) for DCS1800/PCS1900
Class E2 (27dBm±3dB) for GSM850/EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800/PCS1900 8-PSK
Class 3 (24dBm＋1/-3dB) for WCDMAbands
Class 3 (24dBm＋3/-1dB) for EVDO/CDMA BC0
Class 2 (24dBm＋1/-3dB) for TD-SCDMAbands
Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (23dBm±2dB) for LTE-TDD bands
LTE Features
Support 3GPP R12 Cat 6 and Cat 4
Support 1.4 MHz to 20MHz RF bandwidth
Support Multiuser MIMO in DL direction
Cat 6 FDD: Max 300Mbps (DL)/Max 50Mbps (UL)
Cat 6 TDD: Max 265Mbps (DL)/Max 30Mbps (UL)
Cat 4 FDD: Max 150Mbps (DL)/Max 50Mbps (UL)
Cat 4 TDD: Max 130Mbps (DL)/Max 30Mbps (UL)
UMTS Features
Support 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/
HSDPA/HSUPA/WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps (DL)
DC-HSUPA: Max 11.2Mbps (UL)