Quectel SC66 Supplement

SC66 Hardware Design
Smart LTE Module Series
Rev: SC66_Hardware_Design_V1.0
Date: 2019-08-13
Status: Released
www.quectel.com
Model:SC66-A

Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 1 / 139
Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai,
China 200233
Tel: [phone]
Email: [email protected]m
Or our local office. For more information, please visit:
http://www.quectel.com/support/sales.htm
For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm
Or email to: [e-mail]
GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO
CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARYTECHNICAL INFORMATION OF QUECTEL
WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION AND
EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE FORBIDDEN
WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF DAMAGES. ALL
RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR REGISTRATION OF A UTILITY
MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.

Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 2 / 139
About the Document
History
Revision Date Author Description
1.0 2019-08-13
Jian WU/
Chris ZHANG Initial

Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 3 / 139
Contents
About the Document...................................................................................................................................2
Contents.......................................................................................................................................................3
Table Index...................................................................................................................................................6
Figure Index.................................................................................................................................................8
1Introduction........................................................................................................................................13
1.1. Safety Information.....................................................................................................................14
2Product Concept................................................................................................................................15
2.1. General Description ..................................................................................................................15
2.2. Key Features.............................................................................................................................19
2.3. Functional Diagram...................................................................................................................22
2.4. Evaluation Board.......................................................................................................................23
3Application Interfaces .......................................................................................................................24
3.1. General Description ..................................................................................................................24
3.2. Pin Assignment .........................................................................................................................25
3.3. Pin Description..........................................................................................................................26
3.4. Power Supply............................................................................................................................42
3.4.1. Power Supply Pins.........................................................................................................42
3.4.2. Decrease Voltage Drop..................................................................................................42
3.4.3. Reference Design for Power Supply..............................................................................43
3.5. Turn on and off Scenarios.........................................................................................................45
3.5.1. Turn on the Module Using PWRKEY.............................................................................45
3.5.2. Turn on the Module Automatically..................................................................................47
3.5.3. Reboot/Turn off the Module ...........................................................................................47
3.6. VRTC Interface .........................................................................................................................48
3.7. Power Output............................................................................................................................49
3.8. Battery Charge and Management.............................................................................................49
3.9. USB Interfaces..........................................................................................................................52
3.9.1. Type-C Interface.............................................................................................................52
3.9.1.1. USB Type-C Mode...............................................................................................52
3.9.1.2. DisplayPort Mode.................................................................................................54
3.9.2. Micro USB Interface.......................................................................................................55
3.9.3. USB Interface Design Considerations...........................................................................57
3.10. UART Interfaces........................................................................................................................58
3.11. (U)SIM Interfaces......................................................................................................................60
3.12. SD Card Interface .....................................................................................................................62
3.13. GPIO Interfaces ........................................................................................................................64
3.14. I2C Interfaces............................................................................................................................65
3.15. I2S Interfaces............................................................................................................................66
3.16. SPI Interface .............................................................................................................................68
3.17. ADC Interfaces..........................................................................................................................68

Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 4 / 139
3.18. LCM Interfaces..........................................................................................................................69
3.19. Touch Panel Interfaces .............................................................................................................74
3.20. Camera Interfaces.....................................................................................................................75
3.20.1. Design Considerations...................................................................................................81
3.21. Sensor Interfaces......................................................................................................................83
3.22. Audio Interfaces........................................................................................................................84
3.22.1. Reference Circuit Design for Microphone Interface.......................................................85
3.22.2. Reference Circuit Design for Earpiece Interface...........................................................86
3.22.3. Reference Circuit Design for Headphone Interface.......................................................87
3.22.4. Reference Circuit Design for Loudspeaker Interface.....................................................87
3.22.5. Audio Interfaces Design Considerations........................................................................87
3.23. Emergency Download Interface................................................................................................88
4Wi-Fi and BT.......................................................................................................................................89
4.1. Wi-Fi Overview..........................................................................................................................89
4.1.1. Wi-Fi Performance.........................................................................................................89
4.1.2. Wi-Fi MIMO Design Guidelines......................................................................................91
4.2. BT Overview..............................................................................................................................91
4.2.1. BT Performance.............................................................................................................92
5GNSS...................................................................................................................................................93
5.1. GNSS Performance ..................................................................................................................93
5.2. GNSS RF Design Guidelines....................................................................................................94
6Antenna Interfaces.............................................................................................................................95
6.1. Main/Rx-diversityAntenna Interfaces.......................................................................................95
6.1.1. Main and Rx-diversityAntenna Interfaces Reference Design.......................................99
6.1.2. Reference Design of RF Layout.....................................................................................99
6.2. Wi-Fi/BTAntenna Interface.....................................................................................................101
6.3. GNSSAntenna Interface.........................................................................................................103
6.3.1. Recommended Circuit for Passive Antenna................................................................104
6.3.2. Recommended Circuit for Active Antenna...................................................................104
6.4. Antenna Installation.................................................................................................................106
6.4.1. Antenna Requirements ................................................................................................106
6.4.2. Recommended RF Connector for Antenna Installation...............................................107
7Electrical, Reliability and Radio Characteristics..........................................................................109
7.1. Absolute Maximum Ratings....................................................................................................109
7.2. Power Supply Ratings.............................................................................................................109
7.3. Operation and Storage Temperatures.....................................................................................110
7.4. Current Consumption...............................................................................................................111
7.5. RF Output Power ....................................................................................................................120
7.6. RF Receiving Sensitivity.........................................................................................................124
7.7. Electrostatic Discharge...........................................................................................................128
8Mechanical Dimensions..................................................................................................................129
8.1. Mechanical Dimensions of the Module...................................................................................129

Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 5 / 139
8.2. Recommended Footprint ........................................................................................................131
8.3. Top and Bottom View of the Module.......................................................................................132
9Storage, Manufacturing and Packaging........................................................................................133
9.1. Storage....................................................................................................................................133
9.2. Manufacturing and Soldering..................................................................................................134
9.3. Packaging ...............................................................................................................................135
10 Appendix A References...................................................................................................................137
11 Appendix B GPRS Coding Schemes .............................................................................................140
12 Appendix C GPRS Multi-slot Classes............................................................................................141
13 Appendix D EDGE Modulation and Coding Schemes.................................................................143

Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 6 / 139
Table Index
TABLE 1: SC66-CE* FREQUENCY BANDS..................................................................................................... 15
TABLE 2: SC66-A* FREQUENCY BANDS ....................................................................................................... 16
TABLE 3: SC66-J* FREQUENCY BANDS........................................................................................................ 16
TABLE 4: SC66-E* FREQUENCY BANDS ....................................................................................................... 17
TABLE 5: SC66-W* FREQUENCY BANDS ...................................................................................................... 17
TABLE 6: SC66-MW*(2 × 2 MIMO WIFI) FREQUENCY BANDS ..................................................................... 18
TABLE 7: SC66 KEY FEATURES ..................................................................................................................... 19
TABLE 8: I/O PARAMETERS DEFINITION....................................................................................................... 26
TABLE 9: PIN DESCRIPTION........................................................................................................................... 26
TABLE 10: POWER DESCRIPTION ................................................................................................................. 49
TABLE 11: PIN DEFINITION OF CHARGING INTERFACE ............................................................................. 50
TABLE 12: PIN DEFINITION OF TYPE-C INTERFACE.................................................................................... 52
TABLE 13: PIN DESCRIPTIONS IN USB/DISPLAYPORT MODE.................................................................... 54
TABLE 14: USB1 & USB2 PIN DESCRIPTION................................................................................................. 56
TABLE 15: USB TRACE LENGTH INSIDE THE MODULE.............................................................................. 57
TABLE 16: PIN DEFINITION OF UART INTERFACES..................................................................................... 58
TABLE 17: PIN DEFINITION OF (U)SIM INTERFACES................................................................................... 60
TABLE 18: PIN DEFINITION OF SD CARD INTERFACE ................................................................................ 62
TABLE 19: SD CARD SIGNAL TRACE LENGTH INSIDE THE MODULE ....................................................... 64
TABLE 20: PIN DEFINITION OF GPIO INTERFACES ..................................................................................... 64
TABLE 21: PIN DEFINITION OF I2C INTERFACES......................................................................................... 66
TABLE 22: PIN DEFINITION OF I2S INTERFACES......................................................................................... 66
TABLE 23: PIN DEFINITION OF SPI INTERFACE........................................................................................... 68
TABLE 24: PIN DEFINITION OF ADC INTERFACES....................................................................................... 68
TABLE 25: PIN DEFINITION OF LCM INTERFACES....................................................................................... 69
TABLE 26: PIN DEFINITION OF TOUCH PANEL INTERFACES..................................................................... 74
TABLE 27: PIN DEFINITION OF CAMERA INTERFACES............................................................................... 75
TABLE 28: TRACE LENGTH OF MIPI DIFFERENTIAL PAIRS INSIDE THE MODULE .................................. 81
TABLE 29: PIN DEFINITION OF SENSOR INTERFACES............................................................................... 83
TABLE 30: PIN DEFINITION OF AUDIO INTERFACES................................................................................... 84
TABLE 31: WI-FI TRANSMITTING PERFORMANCE....................................................................................... 89
TABLE 32: WI-FI RECEIVING PERFORMANCE.............................................................................................. 90
TABLE 33: BT DATA RATE AND VERSIONS.................................................................................................... 92
TABLE 34: BT TRANSMITTING AND RECEIVING PERFORMANCE ............................................................. 92
TABLE 35: GNSS PERFORMANCE ................................................................................................................. 93
TABLE 36: PIN DEFINITION OF MAIN/RX-DIVERSITY ANTENNA INTERFACES......................................... 95
TABLE 37: SC66-CE* OPERATING FREQUENCIES....................................................................................... 95
TABLE 38: SC66-A* OPERATING FREQUENCIES ......................................................................................... 96
TABLE 39: SC66-J* OPERATING FREQUENCIES.......................................................................................... 97
TABLE 40: SC66-E* OPERATING FREQUENCIES ......................................................................................... 98
TABLE 41: PIN DEFINITION OF WI-FI/BT ANTENNA INTERFACE .............................................................. 101

Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 7 / 139
TABLE 42: WI-FI/BT FREQUENCY................................................................................................................. 102
TABLE 43: PIN DEFINITION OF GNSS ANTENNA........................................................................................ 103
TABLE 44: GNSS FREQUENCY..................................................................................................................... 103
TABLE 45: ANTENNA REQUIREMENTS........................................................................................................ 106
TABLE 46:ABSOLUTE MAXIMUM RATINGS ................................................................................................ 109
TABLE 47: SC66 MODULE POWER SUPPLY RATINGS............................................................................... 109
TABLE 48: OPERATIONAND STORAGE TEMPERATURES.........................................................................110
TABLE 49: SC66-CE* CURRENT CONSUMPTION ........................................................................................111
TABLE 50: SC66-A* CURRENT CONSUMPTION...........................................................................................113
TABLE 51: SC66-J* CURRENT CONSUMPTION ...........................................................................................115
TABLE 52: SC66-E* CURRENT CONSUMPTION...........................................................................................116
TABLE 53: SC66-CE* RF OUTPUT POWER.................................................................................................. 120
TABLE 54: SC66-A* RF OUTPUT POWER.................................................................................................... 121
TABLE 55: SC66-J* RF OUTPUT POWER..................................................................................................... 122
TABLE 56: SC66-E* RF OUTPUT POWER.................................................................................................... 122
TABLE 57: SC66-CE* RF RECEIVING SENSITIVITY.................................................................................... 124
TABLE 58: SC66-A* RF RECEIVING SENSITIVITY....................................................................................... 125
TABLE 59: SC66-J* RF RECEIVING SENSITIVITY ....................................................................................... 125
TABLE 60: SC66-E* RF RECEIVING SENSITIVITY....................................................................................... 126
TABLE 61: ESD CHARACTERISTICS (TEMPERATURE: 25°C, HUMIDITY: 45%)....................................... 128
TABLE 62: RECOMMENDED THERMAL PROFILE PARAMETERS............................................................. 134
TABLE 63: REEL PACKAGING....................................................................................................................... 136
TABLE 64: RELATED DOCUMENTS.............................................................................................................. 137
TABLE 65: TERMS AND ABBREVIATIONS.................................................................................................... 137
TABLE 66: DESCRIPTION OF DIFFERENT CODING SCHEMES................................................................ 140
TABLE 67: GPRS MULTI-SLOT CLASSES .................................................................................................... 141
TABLE 68: EDGE MODULATION AND CODING SCHEMES......................................................................... 143

Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 8 / 139
Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 23
FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 25
FIGURE 3: VOLTAGE DROP SAMPLE............................................................................................................. 43
FIGURE 4: STRUCTURE OF POWER SUPPLY.............................................................................................. 43
FIGURE 5: REFERFENCE CIRCUIT OF POWER SUPPLY............................................................................ 44
FIGURE 6: TURN ON THE MODULE USING DRIVING CIRCUIT................................................................... 45
FIGURE 7: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 45
FIGURE 8: TIMING OF TURNING ON MODULE............................................................................................. 46
FIGURE 9: TURN ON THE MODULE AUTOMATICALLY................................................................................. 47
FIGURE 10: TIMING OF REBOOTING MODULE ............................................................................................ 47
FIGURE 11: RTC POWERED BY A RECHARGEABLE BUTTON CELL BATTERY......................................... 48
FIGURE 12: REFERENCE DESIGN FOR BATTERY CHARGING CIRCUIT................................................... 51
FIGURE 13: USB TYPE-C INTERFACE REFERENCE DESIGN..................................................................... 54
FIGURE 14: DISPLAYPORT REFERENCE DESIGN....................................................................................... 55
FIGURE 15: MICRO USB INTERFACE ............................................................................................................ 56
FIGURE 16: USB2 HOST.................................................................................................................................. 57
FIGURE 17: REFERENCE CIRCUIT WITH LEVEL TRANSLATOR CHIP (FOR UART6) ............................... 59
FIGURE 18: RS232 LEVEL MATCH CIRCUIT (FOR UART5).......................................................................... 60
FIGURE 19: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
........................................................................................................................................................................... 61
FIGURE 20: REFERENCE CIRCUIT FOR (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR
........................................................................................................................................................................... 62
FIGURE 21: REFERENCE CIRCUIT FOR SD CARD INTERFACE................................................................. 63
FIGURE 22: LCM0 EXTERNAL BACKLIGHT DRIVER REFERENCE CIRCUIT ............................................. 71
FIGURE 23: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE......................................................... 71
FIGURE 24: REFERENCE CIRCUIT DESIGN FOR LCM0 INTERFACE......................................................... 72
FIGURE 25: REFERENCE CIRCUIT DESIGN FOR LCM1 INTERFACE......................................................... 73
FIGURE 26: REFERENCE CIRCUIT DESIGN FOR TP0 INTERFACE............................................................ 75
FIGURE 27: REFERENCE CIRCUIT DESIGN FOR DUAL CAMERAAPPLICATIONS................................... 78
FIGURE 28: REFERENCE CIRCUIT DESIGN FOR TWO-CAMERAAPPLICATIONS.................................... 79
FIGURE 29: REFERENCE CIRCUIT DESIGN FOR THREE-CAMERAAPPLICATIONS................................ 80
FIGURE 30: REFERENCE CIRCUIT DESIGN FOR ANALOG ECM-TYPE MICROPHONE........................... 85
FIGURE 31: REFERENCE CIRCUIT DESIGN FOR MEMS-TYPE MICROPHONE........................................ 86
FIGURE 32: REFERENCE CIRCUIT DESIGN FOR EARPIECE INTERFACE................................................ 86
FIGURE 33: REFERENCE CIRCUIT DESIGN FOR HEADPHONE INTERFACE ........................................... 87
FIGURE 34: REFERENCE CIRCUIT DESIGN FOR LOUDSPEAKER INTERFACE....................................... 87
FIGURE 35: REFERENCE CIRCUIT DESIGN FOR EMERGENCY DOWNLOAD INTERFACE..................... 88
FIGURE 36: REFERENCE CIRCUIT DESIGN FOR MAIN AND RX-DIVERSITY ANTENNA INTERFACES.. 99
FIGURE 37: MICROSTRIP DESIGN ON A 2-LAYER PCB............................................................................. 100
FIGURE 38: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB......................................................... 100
FIGURE 39: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)

Smart LTE Module Series
SC66 Hardware Design
SC66_Hardware_Design 9 / 139
......................................................................................................................................................................... 100
FIGURE 40: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4AS REFERENCE GROUND)
......................................................................................................................................................................... 101
FIGURE 41: REFERENCE CIRCUIT DESIGN FOR WI-FI/BT ANTENNA INTERFACE................................ 102
FIGURE 42: REFERENCE CIRCUIT DESIGN FOR WI-FI MINO ANTENNA INTERFACE........................... 103
FIGURE 43: REFERENCE CIRCUIT DESIGN FOR GNSS PASSIVE ANTENNA......................................... 104
FIGURE 44: REFERENCE CIRCUIT DESIGN FOR GNSSACTIVE ANTENNA ........................................... 105
FIGURE 45: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM).............................................. 107
FIGURE 46: MECHANICALS OF U.FL-LP CONNECTORS........................................................................... 107
FIGURE 47: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ......................................................... 108
FIGURE 48: MODULE TOPAND SIDE DIMENSIONS................................................................................... 129
FIGURE 49: MODULE BOTTOM DIMENSIONS (TOP VIEW) ....................................................................... 130
FIGURE 50: RECOMMENDED FOOTPRINT (TOP VIEW)............................................................................ 131
FIGURE 51: TOP VIEW OF THE MODULE.................................................................................................... 132
FIGURE 52: BOTTOM VIEW OF THE MODULE............................................................................................ 132
FIGURE 53: RECOMMENDED REFLOW SOLDERING THERMAL PROFILE.............................................. 134
FIGURE 54: TAPE DIMENSIONS................................................................................................................... 135
FIGURE 55: REEL DIMENSIONS................................................................................................................... 136