Quectel FG50V Supplement

FG50V Hardware Design
Wi-Fi&BT Module Series
Version: 1.0
Date: 2020-12-08
Status: Released
www.quectel.com

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Copyright

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The information contained here is proprietary technical information of Quectel. Transmitting, reproducing,
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Copyright © Quectel Wireless Solutions Co., Ltd. 2020. All rights reserved.

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About the Document
Revision History
Version Date Author Description
- 2019-11-25 Jared WANG/
Felix FU Creation of the document
1.0 2020-12-08 Hidy CHAI/
Lucas HUANG First official release

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Contents
About the Document ...................................................................................................................................... 3
Contents ........................................................................................................................................................ 4
Table Index ..................................................................................................................................................... 6
Figure Index ................................................................................................................................................... 7
1 Introduction ............................................................................................................................................ 8
1.1. Safety Information ................................................................................................................................. 10
2 Product Concept .................................................................................................................................... 12
2.1. General Description ............................................................................................................................... 12
2.2. Key Features ........................................................................................................................................... 12
2.3. Functional Diagram ................................................................................................................................ 14
2.4. Evaluation Board .................................................................................................................................... 14
3 Application Interfaces ............................................................................................................................ 15
3.1. General Description ............................................................................................................................... 15
3.2. Pin Assignment ...................................................................................................................................... 16
3.3. Pin Description ....................................................................................................................................... 17
3.4. Power Supply ......................................................................................................................................... 21
3.5. WLAN Interface ...................................................................................................................................... 23
3.5.1. WLAN_EN ................................................................................................................................... 24
3.5.2. PCIe Interface ............................................................................................................................. 24
3.6. BT Interface ............................................................................................................................................ 25
3.6.1. BT_EN ......................................................................................................................................... 26
3.6.2. BT_WAKEUP_HOST* and HOST_WAKEUP_BT* ......................................................................... 26
3.6.3. PCM Interface* .......................................................................................................................... 27
3.6.4. UART Interface ........................................................................................................................... 28
3.7. Conexistence Interface .......................................................................................................................... 29
3.8. WLAN_SLP_CLK Interface ...................................................................................................................... 30
3.9. Others Interfaces ................................................................................................................................... 30
3.9.1. SW_CTRL* .................................................................................................................................. 30
3.9.2. WLAN Debug Interface .............................................................................................................. 31
3.9.3. BT Debug Interface ..................................................................................................................... 31
3.10. RF Antenna Interfaces ........................................................................................................................ 31
3.10.1. Operating Frequency ................................................................................................................. 32
3.10.2. Reference Design of RF Antenna Interfaces ............................................................................... 32
3.10.3. Reference Design of RF Layout ................................................................................................... 33
3.10.4. Antenna Requirements .............................................................................................................. 35
3.10.5. Recommended RF Connector for Antenna Installation ............................................................. 35
4 Reliability, Radio and Electrical Characteristics ........................................................................................ 38
4.1. General Description ............................................................................................................................... 38

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4.2. Electrical Characteristics ........................................................................................................................ 38
4.3. I/O Interface Characteristics .................................................................................................................. 39
4.4. Operating and Storage Temperatures .................................................................................................... 40
4.5. Current Consumption ............................................................................................................................ 40
4.5.1. Current Consumption in Low Power Modes .............................................................................. 40
4.5.2. Current Consumption in Normal Operation .............................................................................. 41
4.6. RF Performances .................................................................................................................................... 42
4.6.1. Conducted RF Output Power ..................................................................................................... 42
4.6.2. Conducted RF Receiving Sensitivity ........................................................................................... 44
4.7. Electrostatic Discharge ........................................................................................................................... 45
5 Mechanical Dimensions .......................................................................................................................... 47
5.1. Mechanical Dimensions of the Module ................................................................................................. 47
5.2. Recommended Footprint ....................................................................................................................... 49
5.3. Top and Bottom Views of the Module ................................................................................................... 50
6 Storage, Manufacturing and Packaging ................................................................................................... 51
6.1. Storage ................................................................................................................................................... 51
6.2. Manufacturing and Soldering ................................................................................................................ 52
6.3. Packaging ............................................................................................................................................... 53
7 Appendix References .............................................................................................................................. 54

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Table Index
Table 1: Key Features ................................................................................................................................................. 12
Table 2: I/O Parameters Definition ............................................................................................................................ 17
Table 3: Pin Description ............................................................................................................................................. 17
Table 4: Definition of Power Supply and GND Pins .................................................................................................... 22
Table 5: Pin Definition of WLAN_EN .......................................................................................................................... 24
Table 6: Pin Definition of PCIe Interface .................................................................................................................... 24
Table 7: Pin Definition of BT_EN ................................................................................................................................ 26
Table 8: Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT ..................................................................... 27
Table 9: Pin Definition of Coexistence Interface ........................................................................................................ 29
Table 10: Pin Definition of WLAN_SLP_CLK Interface ................................................................................................ 30
Table 11: Pin Definition of SW_CTRL ......................................................................................................................... 30
Table 12: Pin Definition of WLAN Debug Interface .................................................................................................... 31
Table 13: Pin Definition of BT Debug interface .......................................................................................................... 31
Table 14: Pin Definition of RF Antenna Interfaces ..................................................................................................... 32
Table 15: Operating Frequency of the Module .......................................................................................................... 32
Table 16: Antenna Requirements .............................................................................................................................. 35
Table 17: Absolute Maximum Ratings ....................................................................................................................... 38
Table 18: Recommended Operating Conditions ........................................................................................................ 39
Table 19: General DC Electrical Characteristics.......................................................................................................... 39
Table 20: Operating and storage Temperatures ......................................................................................................... 40
Table 21: Current Consumption of the Module (Low Power Modes, Unit: mm) ....................................................... 40
Table 22: Current Consumption of the Module (Normal Operation, Unit: mA) ........................................................ 41
Table 23: Conducted RF Output Power at 2.4 GHz .................................................................................................... 42
Table 24: Conducted RF Output Power at 5 GHz ....................................................................................................... 43
Table 25: Conducted RF Receiving Sensitivity at 2.4 GHz .......................................................................................... 44
Table 26: Conducted RF Receiving Sensitivity at 5 GHz ............................................................................................. 45
Table 27: Electrostatic Discharge Characteristics ....................................................................................................... 46
Table 28: Recommended Thermal Profile Parameters .............................................................................................. 52
Table 29: Related Documents .................................................................................................................................... 54
Table 30: Terms and Abbreviations ............................................................................................................................ 54

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Figure Index
Figure 1: Functional Diagram of FG50V Module........................................................................................................ 14
Figure 2: Pin Assignment (Top View) ......................................................................................................................... 16
Figure 3: Reference Circuit of power supply from SDX55 platform ........................................................................... 22
Figure 4: WLAN Interface Connection ....................................................................................................................... 23
Figure 5: PCIe Interface Connection .......................................................................................................................... 25
Figure 6: Block Diagram of BT Interface Connection ................................................................................................. 26
Figure 7: PCM Interface Connection .......................................................................................................................... 28
Figure 8: Coexistence Interface Connection .............................................................................................................. 29
Figure 9: SW_CTRL Connection ................................................................................................................................. 30
Figure 10: Reference Circuit for RF Antenna Interfaces ............................................................................................. 33
Figure 11: Microstrip Design on a 2-layer PCB........................................................................................................... 33
Figure 12: Coplanar Waveguide Design on a 2-layer PCB .......................................................................................... 34
Figure 13: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) ........................................ 34
Figure 14: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) ........................................ 34
Figure 15: Dimensions of the U.FL-R-SMT Connector (Unit: mm) ............................................................................. 36
Figure 16: Mechanicals of UF.L-LP Connectors (Unit: mm) ........................................................................................ 36
Figure 17: Space Factor of Mated Connector (Unit: mm) .......................................................................................... 37
Figure 18: FG50V Top and Side Dimensions (Top and Side View) ............................................................................. 47
Figure 19: FG50V Bottom Dimension (Bottom View) ................................................................................................ 48
Figure 20: Recommended Footprint (Top View) ....................................................................................................... 49
Figure 21: Top View of the Module ........................................................................................................................... 50
Figure 22: Bottom View of the Module ..................................................................................................................... 50
Figure 23: Recommended Reflow Soldering Thermal Profile .................................................................................... 52

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1
Introduction
This document defines the FG50V module and describes its air interfaces and hardware interfaces which are
connected with your application.
This document can help you quickly understand module interface specifications, electrical and mechanical details,
as well as other related information of the module. Associated with application notes and user guides, you can use
FG50V module to design and set up applications easily.
Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [FG50V] is in
compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address:
http://www.quectel.com.
The device could be used with a separation distance of 20cm to the human body.
FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based timeaveraging
duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and
must not transmit simultaneously with any other antenna or transmitter.
3. A label with the following statements must be attached to the host end product: This device contains FCC ID:
XMR202103FG50V
4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF radiation,
maximum antenna gain (including cable loss) must not exceed:
WIFI 2.4G/5G : 5.38 dBi
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and conditions
that must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is required to
satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating configurations,
including portable configurations with respect to 2.1093 and different antenna configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products.
Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

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A certified modular has the option to use a permanently affixed label, or an electronic label. For a permanently
affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2 Certification (labeling
requirements) above). The OEM manual must provide clear instructions explaining to the OEM the labeling
requirements, options and OEM user manual instructions that are required (see next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when
installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used
methods for access to remove the module so that the FCC ID of the module is visible; then an additional
permanent label referring to the enclosed module: “Contains Transmitter Module FCC ID: XMR202103FG50V” or
“Contains FCC ID: XMR202103FG50V” must be used. The host OEM user manual must also contain clear
instructions on how end users can find and/or access the module and the FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for
unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user that
changes or modifications not expressly approved by the party responsible for compliance could void the user's
authority to operate the equipment. In cases where the manual is provided only in a form other than paper, such
as on a computer disk or over the Internet, the information required by this section may be included in the manual
in that alternative form, provided the user can reasonably be expected to have the capability to access information
in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference received,
including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to operate
the equipment.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring
compliance with the module(s) installed and fully operational. For example, if a host was previously authorized as
an unintentional radiator under the Supplier’s Declaration of Conformity procedure without a transmitter certified
module and a module is added, the host manufacturer is responsible for ensuring that the after the module is
installed and operational the host continues to be compliant with the Part 15B unintentional radiator
requirements.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove
this RF module in the user’s manual of the end product which integrates this module. The end user manual shall
include all required regulatory information/warning as show in this manual.
Wireless Access Systems including Radio Local Area Networks (WAS/RLANs) frequency range 5150 – 5350 MHz is
Restricted to indoor use in EU, this device contains 5150-5250 MHz.

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1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service or repair
of any cellular terminal or mobile incorporating FG50V module. Manufacturers of the cellular terminal should notify
users and operating personnel of the following safety information by incorporating these guidelines into all manuals
of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes distraction and
can lead to an accident. Please comply with laws and regulations restricting the use of
wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation of
wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use of
wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so please be
aware of the restrictions on the use of wireless devices when in hospitals, clinics or other
healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network cannot be
guaranteed to connect in certain conditions, such as when the mobile bill is unpaid or the
(U)SIM card is invalid. When emergency help is needed in such conditions, use
emergency call if the device supports it. In order to make or receive a call, the cellular
terminal or mobile must be switched on in a service area with adequate cellular signal
strength. In an emergency, the device with emergency call function cannot be used as
the only contact method considering network connection cannot be guaranteed under all
circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives and
transmits radio frequency signals. RF interference can occur if it is used close to TV sets,
radios, computers or other electric equipment.

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In locations with explosive or potentially explosive atmospheres, obey all posted signs
and turn off wireless devices such as mobile phone or other cellular terminals. Areas with
explosive or potentially explosive atmospheres include fuelling areas, below decks on
boats, fuel or chemical transfer or storage facilities, and areas where the air contains
chemicals or particles such as grain, dust or metal powders.

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2
Product Concept
2.1. General Description
FG50V is a Wi-Fi and Bluetooth (BT) module with low power consumption. It is a single-die WLAN (Wireless Local
Area Network) and BT combo solution supporting IEEE 802.11a/b/g/n/ac/ax 2.4/5 GHz WLAN
standards and BT 5.1* standard, which enables seamless integration of WLAN and BT low energy technologies.
With a low-power PCIe Gen 2 interface for WLAN, a UART and PCM* interface for BT, and an LTE/5G & WLAN/BT
coexistence interface, FG50V can provide WLAN and BT functions.
2.2. Key Features
The following table describes the key features of FG50V module.
Table 1: Key Features
Features Details
Power Supply
 Core supply voltage: 0.95 V, 1.35 V, 1.95 V
 I/O supply voltage: 1.8 V
 RF supply voltage: 3.85 V
Operating Frequency
 2.4 GHz WLAN: 2.400–2.4835 GHz
 5 GHz WLAN: 5.150–5.850 GHz
 BT: 2.402–2.480 GHz
Transmission Data Rates
 802.11a: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48
Mbps, 54 Mbps
 802.11b: 1 Mbps, 2 Mbps, 5.5 Mbps, 11 Mbps
 802.11g: 6 Mbps, 9 Mbps, 12 Mbps, 18 Mbps, 24 Mbps, 36 Mbps, 48
Mbps, 54 Mbps
 802.11n: HT20 (MCS0-7), HT40 (MCS8-15)
 802.11ac: VHT20 (MCS0-8), VHT40 (MCS0-9), VHT80 (MCS0-9)
 802.11ax: HE20 (MCS0-11), HE40 (MCS0-11), HE80 (MCS0-11)

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Transmitting Power
2.4 GHz
802.11b @ 11 Mbps: 20 dBm
802.11g @ 54 Mbps: 17 dBm
802.11n, HT20 @ MCS7: 16 dBm
802.11n, HT40 @ MCS7: 16 dBm
802.11ax, HE20 @ MCS11: 13 dBm
802.11ax, HE40 @ MCS11: 13 dBm
5 GHz
802.11a @ 54 Mbps: 15.5 dBm
802.11n, HT20 @ MCS7: 15 dBm
802.11n, HT40 @ MCS7: 15 dBm
802.11ac, VHT20 @ MCS8: 14 dBm
802.11ac, VHT40 @ MCS9: 14 dBm
802.11ac, VHT80 @ MCS9: 14 dBm
802.11ax, HE20 @ MCS11: 13 dBm
802.11ax, HE40 @ MCS11: 13 dBm
802.11ax, HE80 @ MCS11: 13 dBm
Protocol Features
 IEEE 802.11a/b/g/n/ac/ax
 BT 5.1*
Operation Mode AP, STA
Modulation BPSK, QPSK, CCK, 16QAM, 64QAM, 256QAM, 1024QAM
WLAN Interface PCIe
BT Interface UART and PCM*
RF Antenna Interfaces
 ANT_WIFI0, ANT_WIFI1, ANT_BT*
 50 Ω impedance
Physical Characteristics
 Size: (19.5 ±0.2) mm × (21.5 ±0.2) mm × (2.1 ±0.2) mm
 Package: LGA
 Weight: TBD
Temperature Range
 Operating temperature range: -40 °C to +85 °C
1)
 Storage temperature range: -40 °C to +95 °C
RoHS All hardware components are fully compliant with EU RoHS directive
1.
1)
Within operating temperature range, the module is IEEE compliant.
2. “*” means under development.
NOTES

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2.3. Functional Diagram
The following figure shows a block diagram of FG50V module.
BB
VDD_CORE_VL
VDD_CORE_VM
VDD_CORE_VH
VDD_IO
5G
xFEM
VDD_RF
2.4G
xFEM
BPF
BPF
Diplexer
Diplexer ANT_WIFI1
ANT_WIFI0
PCIe
48MHz
XO
COEX
Control
BT UART
BT PCM
Debug UART × 2
WLAN_SLP_CLK Switch/
BT xLNA BPF ANT_BT
Optional dedicated BT
antenna switch/xLNA
Figure 1: Functional Diagram of FG50V Module
2.4. Evaluation Board
In order to help you to develop applications with FG50V module conveniently, Quectel supplies the
evaluation board (EVB), USB to RS-232 converter cable, USB data cable, power adapter, antenna and
other peripherals to control or test the module. For more details, see document [1].

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3
Application Interfaces
3.1. General Description
FG50V module is equipped with 108 LGA pins that can be connected to the cellular application platform. The
subsequent chapters will provide a detailed introduction to the following interfaces and pins of the module:
 Power supply
 WLAN interface
 BT interface*
 Coexistence interface
 WLAN_SLP_CLK interface
 Other interfaces
 RF antenna interfaces
“*” means under development.
NOTE

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3.2. Pin Assignment
Figure 2: Pin Assignment (Top View)

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3.3. Pin Description
The following tables show the pin description of FG50V module.
Table 2: I/O Parameters Definition
Table 3: Pin Description
Please keep all RESERVED pins open.
Type Description
AI Analog Input
AO Analog Input
DI Digital Input
DO Digital Output
IO Bidirectional
PI Power Input
Power Supply
Pin Name Pin No. I/O Description DC Characteristics Comment
VDD_CORE_VL 1, 2, 47 PI
0.95 V power
supply for the
module’s main
part
Vmin = 0.9 V
Vnorm = 0.95 V
Vmax = 1.0 V
It must be provided
with sufficient current
of up to 1.7 A.
VDD_CORE_VM 45 PI
1.35 V power
supply for the
module’s main
part
Vmin = 1.28 V
Vnorm = 1.35 V
Vmax = 1.42 V
It must be provided
with sufficient current
of up to 0.4 A.
NOTE

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VDD_CORE_VH 46 PI
1.95 V power
supply for the
module’s main
part
Vmin = 1.85 V
Vnorm = 1.95 V
Vmax = 2.05 V
It must be provided
with sufficient current
of up to 0.4 A.
VDD_IO 43 PI
1.8 V power
supply for the
module’s I/O pins
Vmin = 1.7 V
Vnorm = 1.8 V
Vmax = 1.9 V
It must be provided
with sufficient current
of up to 0.05 A.
VDD_RF 19, 20,
63 PI
3.85 V power
supply for the
module’s RF part
Vmin = 3.3 V
Vnorm = 3.85 V
Vmax = 4.25 V
It must be provided
with sufficient current
of up to 1.3 A.
GND 6, 24, 26, 27, 29, 30, 31, 32, 34, 44, 51, 66, 67, 69, 70, 74, 75, 85–108
WLAN Interface
Pin Name Pin No. I/O Description DC Characteristics Comment
WLAN_EN 84 DI WLAN enable
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
Active high.
It is suggested to pull
down this pin with a
100 kΩ resistor.
PCIE_REFCLK_P 54 AI PCIe reference
clock (+)
Require differential
impedance of 85 Ω.
PCIE_REFCLK_M 9 AI PCIe reference
clock (-)
PCIE_TX_P 52 AO PCIe transmit (+)
PCIE_TX_M 7 AO PCIe transmit (-)
PCIE_RX_P 56 AI PCIe receive (+)
PCIE_RX_M 11 AI PCIe receive (-)
PCIE_CLKREQ_N 12 DO PCIe clock request VOLmax = 0.45 V
VOHmin = 1.35 V
1.8 V power domain.
Active low.
PCIE_RST_N 14 DI PCIe reset
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
PCIE_WAKE_N 13 DO PCIe wake up VOLmax = 0.45 V
VOHmin = 1.35 V
BT Interface
Pin Name Pin No. I/O Description DC Characteristics Comment

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BT_EN 83 DI BT enable
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
Active high.
It is suggested to pull
down this pin with a
100 kΩ resistor.
PCM_DIN* 76 DI PCM data input
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
PCM_SYNC* 35 DI PCM data frame
sync
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
PCM_CLK* 37 DI PCM clock
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
PCM_DOUT* 36 DO PCM data output VOLmax = 0.45 V
VOHmin = 1.35 V
1.8 V power domain.
Externally pull this pin
up to VDD_IO.
BT_RTS 77 DO BT UART request
to send
VOLmax = 0.45 V
VOHmin = 1.35 V 1.8 V power domain.
BT_CTS 38 DI BT UART clear to
send
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
BT_TXD 39 DO BT UART transmit VOLmax = 0.45 V
VOHmin = 1.35 V 1.8 V power domain.
BT_RXD 78 DI BT UART receive
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
BT_WAKEUP_
HOST* 61 DO BT wakes up host VOLmax = 0.45 V VOHmin = 1.35 V 1.8 V power domain.
HOST_WAKEUP_
BT* 60 DI Host wakes up BT
VILmin = -0.3 V
VILmax = 0.63 V
VIHmin = 1.17 V
VIHmax = 2.1 V
1.8 V power domain.
Externally pull this pin
down.
Coexistence Interface
Pin Name Pin No. I/O Description DC Characteristics Comment