Quectel LTE-A Series Supplement

EG18 Hardware Design
LTE-A Module Series
Rev. EG18_Hardware_Design_V1.1
Date: 2019-12-21
Status: Released
www.quectel.com

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About the Document
History
Revision
Date
Author
Description
1.0
2019-07-25
Oscar LIU/
Xavier XIA
Initial
1.1
2019-12-21
Archibald JIANG/
Xavier XIA
1. Updated the current consumption and sensitivity
data of EG18-NA;
2. Updated the timing information of powering on,
powering off, resetting, (U)SIM and USB in
Chapter 3;
3. Added description about the position of the
temperature sensors corresponding to the
temperatures obtained with AT+QTEMP command
in Chapter 6.8.

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Contents
About the Document...................................................................................................................................2
Contents.......................................................................................................................................................3
Table Index...................................................................................................................................................6
Figure Index.................................................................................................................................................8
1Introduction........................................................................................................................................10
1.1. Safety Information....................................................................................................................11
2Product Concept................................................................................................................................12
2.1. General Description.................................................................................................................12
2.2. Key Features ...........................................................................................................................14
2.3. Functional Diagram .................................................................................................................16
2.4. Evaluation Board .....................................................................................................................17
3Application Interfaces .......................................................................................................................18
3.1. Pin Assignment........................................................................................................................19
3.2. Pin Description.........................................................................................................................20
3.3. Operating Modes.....................................................................................................................31
3.4. Power Saving...........................................................................................................................32
3.4.1. Sleep Mode....................................................................................................................32
3.4.1.1. UART Application.................................................................................................32
3.4.1.2. USB Application with USB Remote Wakeup Function........................................33
3.4.1.3. USB Application with USB Suspend/Resume and RI Function ..........................34
3.4.1.4. USB Application without USB Suspend Function................................................34
3.4.2. Airplane Mode................................................................................................................35
3.5. Power Supply...........................................................................................................................36
3.5.1. Power Supply Pins.........................................................................................................36
3.5.2. Decrease Voltage Drop..................................................................................................37
3.5.3. Reference Design for Power Supply..............................................................................38
3.5.4. Monitor the Power Supply..............................................................................................38
3.6. Turn on and off Scenarios.......................................................................................................39
3.6.1. Turn on the Module Through PWRKEY.........................................................................39
3.6.2. Turn off the Module........................................................................................................41
3.6.2.1. Turn off the Module Through PWRKEY..............................................................41
3.6.2.2. Turn off the Module Through AT Command........................................................41
3.7. Reset the Module.....................................................................................................................42
3.8. (U)SIM Interfaces.....................................................................................................................44
3.9. USB Interface ..........................................................................................................................47
3.10. UART Interfaces......................................................................................................................50
3.10.1. Main UART Interface......................................................................................................50
3.10.2. Debug UART Interface...................................................................................................51
3.10.3. BT UART Interface.........................................................................................................51
3.10.4. UART Application...........................................................................................................51

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3.11. SPI Interface*...........................................................................................................................53
3.12. PCM and I2C Interfaces..........................................................................................................55
3.13. ADC Interfaces ........................................................................................................................57
3.14. Network Status Indication........................................................................................................58
3.15. Operation Status Indication.....................................................................................................60
3.16. RI Behaviors............................................................................................................................60
3.17. PCIe Interface* ........................................................................................................................61
3.17.1. Root Complex Mode ......................................................................................................63
3.17.2. Endpoint Mode...............................................................................................................64
3.18. SDIO Interface*........................................................................................................................65
3.19. Antenna Tuner Control Interfaces*..........................................................................................67
3.20. USB_BOOT Interface..............................................................................................................68
3.21. GPIOs......................................................................................................................................69
4GNSS Receiver...................................................................................................................................70
4.1. General Description.................................................................................................................70
4.2. GNSS Performance.................................................................................................................70
4.3. Layout Guidelines....................................................................................................................71
5Antenna Interfaces.............................................................................................................................72
5.1. Main/Rx-diversity/MIMO Antenna Interfaces...........................................................................72
5.1.1. Pin Definition..................................................................................................................72
5.1.2. Operating Frequencies...................................................................................................72
5.1.3. Reference Design of RF Antenna Interfaces.................................................................74
5.2. GNSS Antenna Interface.........................................................................................................75
5.2.1. Pin Definition..................................................................................................................75
5.2.2. GNSS Frequency...........................................................................................................75
5.2.3. Reference Design of GNSS Antenna Interface.............................................................76
5.3. Reference Design of RF Layout..............................................................................................77
5.4. Antenna Installation.................................................................................................................78
5.4.1. Antenna Requirements ..................................................................................................78
5.4.2. Recommended RF Connector for Antenna Installation.................................................79
6Electrical, Reliability and Radio Characteristics............................................................................81
6.1. Absolute Maximum Ratings.....................................................................................................81
6.2. Power Supply Ratings.............................................................................................................82
6.3. Operation and Storage Temperatures ....................................................................................82
6.4. Current Consumption ..............................................................................................................83
6.4.1. EG18-EA Current Consumption.....................................................................................83
6.4.2. EG18-NA Current Consumption ....................................................................................85
6.5. RF Output Power.....................................................................................................................87
6.6. RF Receiving Sensitivity..........................................................................................................87
6.6.1. EG18-EA Receiving Sensitivity......................................................................................87
6.6.2. EG18-NA Receiving Sensitivity......................................................................................88
6.7. Electrostatic Discharge............................................................................................................89
6.8. Thermal Considerations ..........................................................................................................89

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7Mechanical Dimensions....................................................................................................................93
7.1. Mechanical Dimensions of the Module....................................................................................93
7.2. Recommended Footprint.........................................................................................................95
7.3. Design Effect Drawings of the Module....................................................................................96
8Storage, Manufacturing and Packaging..........................................................................................97
8.1. Storage ....................................................................................................................................97
8.2. Manufacturing and Soldering ..................................................................................................98
8.3. Packaging................................................................................................................................99
9Appendix A References...................................................................................................................101

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Table Index
TABLE 1: FREQUENCY BANDS, CA COMBINATIONS AND GNSS TYPES OF EG18 MODULE................. 12
TABLE 2: KEY FEATURES OF EG18............................................................................................................... 14
TABLE 3: I/O PARAMETERS DEFINITION...................................................................................................... 20
TABLE 4: PIN DESCRIPTION........................................................................................................................... 20
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................ 31
TABLE 6: RF FUNCTION STATUS AND RELEVANT AT COMMANDS.......................................................... 35
TABLE 7: VBAT AND GND PINS...................................................................................................................... 36
TABLE 8: PWRKEY PIN DESCRIPTION.......................................................................................................... 39
TABLE 9: RESET_N PIN DESCRIPTION......................................................................................................... 42
TABLE 10: PIN DEFINITION OF THE (U)SIM INTERFACES.......................................................................... 44
TABLE 11: PIN DEFINITION OF USB INTERFACE......................................................................................... 47
TABLE 12: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................ 50
TABLE 13: PIN DEFINITION OF DEBUG UART INTERFACE......................................................................... 51
TABLE 14: PIN DEFINITION OF THE BT UART INTERFACE......................................................................... 51
TABLE 15: LOGIC LEVELS OF DIGITAL I/O ................................................................................................... 51
TABLE 16: PIN DEFINITION OF SPI INTERFACE .......................................................................................... 53
TABLE 17: PARAMETERS OF SPI INTERFACE TIMING ............................................................................... 54
TABLE 18: PIN DEFINITION OF PCM INTERFACE AND I2C INTERFACE ................................................... 56
TABLE 19: PIN DEFINITION OF THE ADC INTERFACES.............................................................................. 58
TABLE 20: CHARACTERISTICS OF ADC INTERFACES................................................................................ 58
TABLE 21: PIN DEFINITION OF NETWORK STATUS/ACTIVITY INDICATOR.............................................. 58
TABLE 22: WORKING STATE OF THE NETWORK STATUS/ACTIVITY INDICATOR................................... 59
TABLE 23: PIN DEFINITION OF STATUS........................................................................................................ 60
TABLE 24: RI BEHAVIORS............................................................................................................................... 61
TABLE 25: PIN DEFINITION OF THE PCIE INTERFACE................................................................................ 61
TABLE 26: PIN DEFINITION OF SDIO INTERFACE ....................................................................................... 65
TABLE 27: PIN DEFINITION OF RFFE INTERFACE USED TO CONTROL ANTENNA TUNER................... 67
TABLE 28: PIN DEFINITION OF GPIO INTERFACE USED TO CONTROL ANTENNA TUNER.................... 67
TABLE 29: PIN DEFINITION OF USB_BOOT INTERFACE............................................................................. 68
TABLE 30: PIN DEFINITION OF GPIOS .......................................................................................................... 69
TABLE 31: GNSS PERFORMANCE................................................................................................................. 70
TABLE 32: PIN DEFINITION OF THE MAIN/RX-DIVERSITY/MIMO ANTENNA INTERFACES..................... 72
TABLE 33: EG18-EA OPERATING FREQUENCIES........................................................................................ 72
TABLE 34: EG18-NA OPERATING FREQUENCIES ....................................................................................... 73
TABLE 35: PIN DEFINITION OF GNSS ANTENNA INTERFACE.................................................................... 75
TABLE 36: GNSS FREQUENCY ...................................................................................................................... 75
TABLE 37: ANTENNA REQUIREMENTS......................................................................................................... 78
TABLE 38: ABSOLUTE MAXIMUM RATINGS ................................................................................................. 81
TABLE 39: THE MODULE’S POWER SUPPLY RATINGS .............................................................................. 82
TABLE 40: OPERATION AND STORAGE TEMPERATURES......................................................................... 82
TABLE 41: EG18-EA CURRENT CONSUMPTION.......................................................................................... 83

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TABLE 42: EG18-NA CURRENT CONSUMPTION.......................................................................................... 85
TABLE 43: RF OUTPUT POWER..................................................................................................................... 87
TABLE 44: EG18-EA CONDUCTED RF RECEIVING SENSITIVITY............................................................... 87
TABLE 45: EG18-NA CONDUCTED RF RECEIVING SENSITIVITY............................................................... 88
TABLE 46: ELECTROSTATIC DISCHARGE CHARACTERISTICS................................................................. 89
TABLE 47: RECOMMENDED THERMAL PROFILE PARAMETERS .............................................................. 98
TABLE 48: RELATED DOCUMENTS ............................................................................................................. 101
TABLE 49: TERMS AND ABBREVIATIONS................................................................................................... 101

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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM............................................................................................................... 16
FIGURE 2: PIN ASSIGNMENT (TOP VIEW).................................................................................................... 19
FIGURE 3: DRX RUN TIME AND CURRENT CONSUMPTION IN SLEEP MODE ......................................... 32
FIGURE 4: SLEEP MODE APPLICATION VIA UART INTERFACES.............................................................. 33
FIGURE 5: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP.................................................... 33
FIGURE 6: SLEEP MODE APPLICATION WITH RI......................................................................................... 34
FIGURE 7: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION................................................ 35
FIGURE 8: POWER SUPPLY LIMITS DURING TX POWER........................................................................... 37
FIGURE 9: STAR STRUCTURE OF THE POWER SUPPLY........................................................................... 37
FIGURE 10: REFERENCE CIRCUIT OF POWER SUPPLY............................................................................ 38
FIGURE 11: TURN ON THE MODULE WITH A DRIVING CIRCUIT ............................................................... 39
FIGURE 12: TURN ON THE MODULE USING A BUTTON............................................................................. 40
FIGURE 13: TIMING OF TURNING ON THE MODULE................................................................................... 40
FIGURE 14: TIMING OF TURNING OFF THE MODULE................................................................................. 41
FIGURE 15: REFERENCE CIRCUIT OF RESET_N WITH A DRIVING CIRCUIT........................................... 42
FIGURE 16: REFERENCE CIRCUIT OF RESET_N WITH A BUTTON........................................................... 43
FIGURE 17: TIMING OF RESETTING THE MODULE..................................................................................... 43
FIGURE 18: REFERENCE CIRCUIT OF A (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 45
FIGURE 19: REFERENCE CIRCUIT OF A (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 45
FIGURE 20: TIMING OF (U)SIM....................................................................................................................... 46
FIGURE 21: TIMING OF HOT-PLUG................................................................................................................ 46
FIGURE 22: REFERENCE CIRCUIT OF USB APPLICATION......................................................................... 48
FIGURE 23: TIMING OF USB ENUMERATION ............................................................................................... 49
FIGURE 24: LEVEL TRANSLATION REFERENCE CIRCUIT WITH AN IC..................................................... 52
FIGURE 25: LEVEL TRANSLATION REFERENCE CIRCUIT WITH MOSFETS............................................. 53
FIGURE 26: TIMING OF SPI INTERFACE....................................................................................................... 54
FIGURE 27: PRIMARY MODE TIMING............................................................................................................ 55
FIGURE 28: AUXILIARY MODE TIMING.......................................................................................................... 56
FIGURE 29: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ................................... 57
FIGURE 30: REFERENCE CIRCUIT OF THE NETWORK INDICATOR ......................................................... 59
FIGURE 31: REFERENCE CIRCUITS OF STATUS ........................................................................................ 60
FIGURE 32: PCIE INTERFACE REFERENCE CIRCUIT (RC MODE)............................................................. 63
FIGURE 33: PCIE INTERFACE REFERENCE CIRCUIT (EP MODE)............................................................. 64
FIGURE 34: REFERENCE CIRCUIT OF SD CARD APPLICATION................................................................ 66
FIGURE 35: REFERENCE CIRCUIT OF USB_BOOT INTERFACE................................................................ 68
FIGURE 36: REFERENCE CIRCUIT OF RF ANTENNA INTERFACES.......................................................... 74
FIGURE 37: REFERENCE CIRCUIT OF GNSS ANTENNA INTERFACE....................................................... 76
FIGURE 38: MICROSTRIP DESIGN ON A 2-LAYER PCB.............................................................................. 77
FIGURE 39: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB.......................................................... 77

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FIGURE 40: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)
................................................................................................................................................................... 77
FIGURE 41: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)
................................................................................................................................................................... 78
FIGURE 42: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM)............................................... 79
FIGURE 43: MECHANICALS OF U.FL-LP CONNECTORS............................................................................. 80
FIGURE 44: SPACE FACTOR OF MATING PLUGS (UNIT: MM).................................................................... 80
FIGURE 45: REFERENCE DESIGN OF HEATSINK (HEATSINK AT THE TOP OF THE MODULE)............. 90
FIGURE 46: REFERENCE DESIGN OF HEATSINK (HEATSINK AT THE BACKSIDE OF PCB)................... 90
FIGURE 47: RESPONSE OF AT+QTEMP ....................................................................................................... 91
FIGURE 48: TEMPERATURE SENSOR DISTRIBUTION................................................................................ 92
FIGURE 49: MODULE TOP AND SIDE DIMENSIONS (UNIT: MM) ................................................................ 93
FIGURE 50: MODULE BOTTOM DIMENSIONS (TOP VIEW, UNIT: MM)....................................................... 94
FIGURE 51: RECOMMENDED FOOTPRINT (TOP VIEW, UNIT: MM) ........................................................... 95
FIGURE 52: TOP VIEW OF THE MODULE...................................................................................................... 96
FIGURE 53: BOTTOM VIEW OF THE MODULE.............................................................................................. 96
FIGURE 54: REFLOW SOLDERING THERMAL PROFILE.............................................................................. 98
FIGURE 55: TAPE SPECIFICATIONS (UNIT: MM).......................................................................................... 99
FIGURE 56: REEL SPECIFICATIONS (UNIT: MM)........................................................................................ 100

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1Introduction
This document defines EG18 module and describes its air interface and hardware interfaces which are
connected to customers’ applications.
This document helps customers quickly understand interface specifications, electrical and mechanical
details, as well as other related technical information of EG18 module. Associated with relevant
application notes and user guides, the module will be used to design and set up mobile applications
easily.

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1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating EG18 module. Manufacturers of the
cellular terminal should notify users and operating personnel of the following safety information by
incorporating these guidelines into all manuals supplied with the product. If not so, Quectel assumes no
liability for any user’s failure to observe these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on aircraft.
Wireless devices may cause interference with sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember to use emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference may occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as mobile phone or other cellular terminals. Areas with
potentially explosive atmospheres include fueling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

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2Product Concept
2.1. General Description
EG18 is a series LTE-FDD/LTE-TDD/WCDMA wireless communication module with diversity reception. It
provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, and WCDMA
networks.
EG18 supports embedded operating systems such as Windows, Linux and Android. It also provides
GNSS 1) and voice functionality 2) to meet specific application demands.
The module comprises two variants: EG18-EA and EG18-NA. Customers can choose a dedicated variant
based on the region or operator.
The following table shows the frequency bands, CA combinations 3) and GNSS types of EG18 module.
Table 1: Frequency Bands, CA Combinations and GNSS Types of EG18 Module
Mode
EG18-EA
EG18-NA
LTE-FDD
(with Rx-diversity)
B1/B3/B5/B7/B8/B20/B28
B2/B4/B5/B7/B12/B13/B14/B25/B26/
B29 4)/B30/B66/B71
LTE-TDD
(with Rx-diversity)
B38/B40/B41
B41
2×CA (DL)
B1+B1/B3/B5/B7/B8/B20/B28/B38/B40/
B41;
B3+B3/B5/B7/B8/B20/B28/B38/B40/B41;
B7+B5/B7/B8/B20/B28;
B20+B38/B40;
B38+B38;
B40+B40;
B41+B41
B2+B2/B4*/B5/B7/B12/B13/B14/
B29/B30/B66/B71;
B25+B5/B12/B25/B26/B41;
B4+B4/B5/B7/B12/B13/B29/B30/
B71;
B66+B5/B7/B12/B13/B14/B29/B30/
B66/B71;
B7+B5/B7/B12;
B30+B5/B12/B14/B29;
B26+B41
2×CA (UL)
B3+B3; B7+B7; B38+B38; B40+B40;
B41+B41
B7+B7; B41+B41

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1. 1) GNSS function is optional.
2. 2) EG18 module contains Telematics version and Data-only version. Telematics version supports
both voice and data functions, while Data-only version only supports data function.
3. 3) For more details about CA combinations, please refer to document [1].
4. 4) LTE-FDD B29 support Rx only, and in CA mode it is only for secondary component.
5. 5) 5×CA (DL) cannot support 4×4 MIMO.
6. “*” means under development.
With a compact profile of 37.0mm × 39.5mm × 2.8mm, EG18 meets almost all requirements for M2M
applications such as automotive, security, 4G router, CPE, wireless POS Terminal, mobile computing
device, PDA phone, and tablet PC.
EG18 is an SMD type module and can be embedded in applications through its 299 LGA pins.
3×CA (DL)
B1+B3+B3/B5/B7/B8/B20/B28/B38/B41;
B1+B40+B40; B1+B41+B41;
B1+B7+B20;
B3+B3+B7/B20/B28;
B3+B7+B7/B8/B20/B28;
B3+B40+B40;
B3+B41+B41;
B7+B7+B20/B28;
B40+B40+B40;
B41+B41+B41
B2+B4+B5*/B13*/B71*;
B2+B5+B66; B2+B12+B30;
B2+B13+B66; B2+B7+B12/B66;
B4+B30+B5/B12/B29;
B4+B7+B12;
B30+B66+B5/B12/B29;
B2+B2+B5/B12/B13/B29/B66;
B5+B5+B2/B30/B66;
B7+B7+B2/B4/B5;
B66+B66+B2/B5/B13/B66;
B41+B41+B25/B26/B41;
4×CA (DL)
B1+B3+B3+B5/B7/B8/B28/B41;
B1+B3+B7+B5/B7/B8/B20/B28;
B3+B3+B7+B7/B20/B28;
B3+B7+B7+B20/B28;
B3+B41+B41+B41;
B2+B4+B30+B5/B12;
B2+B66+B66+B5/B13;
B5+B5+B66+B66;
B12+B30+B66+B66;
5×CA (DL) 5)
B1+B3+B3+B7+B7;
B1+B3+B7+B7+B28;
B2+B5+B5+B66+B66/B30;
B2+B13+B66+B66+B66;
B5+B5+B30+B66+B6;
WCDMA
(with Rx-diversity)
B1/B3/B5/B8
B2/B4/B5
GNSS
GPS;
GLONASS;
BeiDou;
Galileo;
QZSS;
GPS;
GLONASS;
BeiDou;
Galileo;
QZSS;
NOTES

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2.2. Key Features
The following table describes the detailed features of EG18.
Table 2: Key Features of EG18
Feature
Details
Power Supply
Supply voltage: 3.3V~4.3V
Typical supply voltage: 3.8V
Transmitting Power
Class 3 (23dBm±2dB) for LTE-TDD bands
Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (24dBm+1/-3dB) for WCDMA bands
LTE Features
Support FDD/TDD LTE Category 18 with CA and MIMO
Support uplink QPSK and 16-QAM and 64-QAM modulation
Support downlink QPSK, 16-QAM and 64-QAM and 256-QAM modulation
Support 1.4MHz to 100MHz (5×CA) RF bandwidth
Support 4×4 MIMO in DL direction
FDD: Max 1.175Gbps (DL)/150Mbps (UL)
TDD: Max 545Mbps (DL)/90.6Mbps (UL)
UMTS Features
Support 3GPP R9 DC-HSDPA, DC-HSUPA, HSPA+, HSDPA, HSUPA and
WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps
DC-HSUPA: Max 11.5Mbps
WCDMA: Max 384Kbps (DL)/384Kbps (UL)
Internet Protocol Features
Support PPP/QMI/TCP*/UDP*/FTP*/HTTP*/NTP*/PING*/HTTPS*/SMTP*/
MMS*/FTPS*/SMTPS*/SSL* protocols
Support PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) usually used for PPP connections
SMS
Text and PDU mode
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interfaces
Support (U)SIM card: 1.8V/3.0V
Dual SIM Single Standby
Audio Features
Provide one digital audio interface: PCM interface
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
PCM Interface
Used for audio function with external codec
Support 16-bit linear data format
Support long frame synchronization and short frame synchronization

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Support master and slave modes, but must be the master in long frame
synchronization
USB Interface
Comply with USB 3.0 and 2.0 specifications, with maximum transmission
rates up to 5Gbps on USB 3.0 and 480Mbps on USB 2.0
Used for AT command communication, data transmission, firmware
upgrade, software debugging, GNSS NMEA sentence output, and voice
over USB*
Support USB serial drivers for: Windows 7/8/8.1/10; Linux 2.6/3.x/4.1~4.15;
Android 4.x/5.x/6.x/7.x/8.x/9.x
UART Interfaces
Main UART interface:
Used for AT command communication and data transmission
Baud rate reaches up to 921600bps, 115200bps by default
Support RTS and CTS hardware flow control
Debug UART interface:
Used for Linux console and log output
115200bps baud rate
BT UART interface:
Used for Bluetooth communication and can be multiplexed into SPI
interface*
115200bps baud rate
PCIe ×1 Interface*
Comply with PCI Express Specification Revision 2.1 and support 5Gbps
per lane
Used for data transmission
Rx-diversity
Support LTE/WCDMA Rx-diversity and LTE HO-diversity
GNSS Features
Gen9HT-Lite of Qualcomm
Protocol: NMEA 0183
AT Commands
Comply with 3GPP TS 27.007 and 27.005, and Quectel enhanced AT
commands
Network Indication
Two pins (NET_MODE and NET_STATUS) to indicate network connectivity
status
Antenna Interfaces
Main antenna interface (ANT_MAIN)
Rx-diversity antenna interface (ANT_DIV)
Two MIMO antenna interfaces (ANT_MIMO1, ANT_MIMO2)
GNSS antenna interface (ANT_GNSS)
Physical Characteristics
Size: (37.0±0.15)mm ×(39.5±0.15)mm ×(2.8±0.20)mm
Weight: approx. 9.0g
Temperature Range
Operation temperature range: -30°C ~ +70°C 1)
Extended temperature range: -40°C ~ +85°C 2)
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade
USB 2.0 interface and DFOTA
RoHS
All hardware components are fully compliant with EU RoHS directive

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EG18_Hardware_Design 16 / 104
1. “*”means under development.
2. 1) Within operating temperature range, the module is 3GPP compliant.
3. 2) Within extended temperature range, proper mounting, heating sinks and active cooling may be
required to make certain functions of the module such as voice, SMS, data transmission to be
realized. Only one or more parameters like Pout might reduce in their value and exceed the specified
tolerances. When the temperature returns to normal operating temperature levels, the module will
meet 3GPP specifications again.
2.3. Functional Diagram
The following figure shows a block diagram of EG18 and illustrates the major functional parts.
Power management
Baseband
LPDDR2 SDRAM+NAND Flash
Radio frequency
Peripheral interfaces
PMIC
Transceiver NAND Flash
LPDDR2 SDRAM
Tx/Rx Blocks
ANT_DIV ANT_MAIN
ANT_MIMO2
VBAT_BB
VBAT_RF
ET/APT
PWRKEY
ADCs
VDD_EXT
USB2.0/3.0 USIMx2 PCM UART
I2C
RESET_N
38.4M
XO
STATUS
GPIOs
Control
QLINK Control
Tx
PRx DRx
Baseband
PCIe*
I2S_MCLK
SDIO*
BT_UART/SPI
ANT_GNSS ANT_MIMO1
VDD_RF
Figure 1: Functional Diagram
NOTES

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2.4. Evaluation Board
To help with the development of applications with EG18, Quectel supplies the evaluation board (EVB),
USB to RS-232 converter cable, earphone, antenna, and other peripherals to control or test the module.
For more details, please refer to document [2].

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3Application Interfaces
EG18 is designed with 299 LGA pins that can be connected to cellular application platform. This chapter
mainly describes the following application interfaces and indication signals of EG18:
Power supply
(U)SIM interfaces
USB interface
UART interfaces
SPI interface* 1)
PCM and I2C interfaces
ADC interfaces
Network status indication
Operation status indication
RI Behaviors
PCIe interface*
SDIO interface*
Antenna tuner control interfaces*
USB_BOOT interface
GPIOs
1. “*” means under development.
2. 1) SPI interface is multiplexed from BT UART interface.
NOTES

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3.1. Pin Assignment
The following figure shows the pin assignment of EG18.
299
176
298
174
172
170
168
166
164
162
160
158
156
154
152
150
148
146
144
142
140
138
136
134
132
130
175
173
171
169
167
165
163
161
159
157
155
153
151
149
147
145
143
141
139
137
135
133
131
129 127 125 123 121 119 117 115 111 109 107 105 103 101
99 97 95
128
113
126 124 122 120 118 116 114 112 110 108 106 104 102 100
98 96
214 213 212 211 210 209 208 207 206 205 204 203 202 201 200 199 198
93 91 89
94 92 90
197 196
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
73
75
77
79
81
83
85
87
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
82
84
86
88
41 39 37 35 33 31 29 27 23 21 19 17 15 13 11
9 7
40
25
38 36 34 32 30 28 26 24 22 20 18 16 14 12 10
8
195 194 193 192 191 190 189 188 187 186 185 184 183 182 181 180 179
5 3 1
6 4 2
178 177
Power Pins GND Pins GPIO and OtherPins RESERVED Pins
297
296
216 217 218215 219 220 221 222 223
224
233
242
251
260
269
278
287
225
234
243
252
261
270
279
288
226
235
244
253
262
271
280
289
227
236
272
281
290
228
237
273
282
291
229
238
274
283
292
230
239
248
257
266
275
284
293
231
240
249
258
267
276
285
294
232
241
250
259
268
277
286
295
PCIe Pins PCM Pins (U)SIM Pins USB Pins
I2C Pins
SDIO Pins
ADCPins UARTPins SPI Pins ANTPins CLK Pins
RESET_N PWRKEY
BT_EN
WLAN_PWR_EN
USIM1_DET USIM1_CLK
USIM1_DATA
USIM1_VDD
USIM1_RST
USB_VBUS
USB_DM USB_DP
USB_ID
USB_SS_TX_M
USB_SS_TX_P
USB_SS_RX_P
USB_SS_RX_M
I2C_SDA
I2C_SCL
SD_VDD
SD_DATA2 SD_DATA3
SD_DATA0 SD_DATA1
SD_CMD SD_DET
SD_CLK
CTS
RTS RXD
DCD TXD
RI DTR
PCM_SYNC
PCM_CLK PCM_IN
PCM_OUT
USIM2_DATA
USIM2_RSTUSIM2_DET
USIM2_CLK
VBAT_RF
VBAT_RF VBAT_RF
VBAT_RF
ANT_MAIN
ANT_GNSS
ANT_DIV
RESERVED
DBG_RXD
GPIO_1
USB_BOOT
VDD_P2
DBG_TXD
GPIO_2
OTG_PWR_EN
COEX_UART_TX
NET_MODE
WLAN_EN
W_DISABLE#
SLEEP_IND
COEX_UART_RX
WAKEUP_IN
I2S_MCLK
VBAT_BB
VBAT_BB
WAKE_ON_WIRELESS
BT_TXD
BT_RXD
BT_CTS
BT_RTS
VDD_EXT WLAN_SLP_CLK
GND
NET_STATUS STATUS
ADC0
ADC1
GND
GND GND
GND
GND
GND
GND GND
GND
GND GND
GND
PCIE_REFCLK_P
PCIE_REFCLK_M
PCIE_TX_M
PCIE_TX_P
PCIE_RX_M
PCIE_RX_P
PCIE_CLK_REQ_N
PCIE_RST_N
PCIE_WAKE_N
GND
GND
GND GND
GND GND
GND GND
GND GND
GND GND
GND GND
GND
245 246 247
254 255 256
263 264 265
GPIO_3
GPIO_4
VDD_RF
GPIO_5
RESERVED
RESERVED RESERVED
RESERVED RESERVED
RESERVED GND RESERVED
GND RESERVED
RESERVED
GND
RESERVED
RESERVED RESERVED
GND
GND GND
GND
RESERVED RESERVED
RESERVED
GND
RESERVED
GND GND GND
GND
GND
GND RESERVED RESERVED
RESERVED
RESERVED
ANT_MIMO2 ANT_MIMO1
RESERVED
USIM2_VDD
RFFE_DATARESERVED
RFFE_CLK
RESERVED
RESERVED RESERVED RESERVED
RESERVED
RESERVED RESERVED RESERVED RESERVED
RESERVED
RESERVED
Figure 2: Pin Assignment (Top View)