RAYTAC MDBT53V User manual

Version: A
Issued Date: 2021/09/13
Approval Sheet
(產品承認書)
產品名稱
(Product)
Bluetooth Low Energy Module
產品型號
(Model No.)
MDBT53V(Chip Antenna)
MDBT53V –P (PCB Antenna)

Index
1. Overall Introduction ...................................................................................................... 3
1.1. Application............................................................................................................ 3
1.2. Features ............................................................................................................... 4
2. Product Dimension ....................................................................................................... 6
2.1. PCB Dimensions & Pin Indication......................................................................... 6
2.2. Recommended Layout of Solder Pad................................................................... 8
2.3. RF Layout Suggestion (aka Keep-Out Area) ...................................................... 12
2.4. Footprint & Design Guide ................................................................................... 15
2.5. Pin Assignment................................................................................................... 16
3. Main Chip Solution...................................................................................................... 18
4. Specification................................................................................................................ 19
4.1. Absolute Maximum Ratings................................................................................ 19
4.2. Operating Conditions.......................................................................................... 19
4.3. Electrical Specifications...................................................................................... 20
4.4. Application CPU Performance............................................................................ 22
4.5. Network CPU Performance ................................................................................ 23
4.6. Power Management............................................................................................ 23
5. FCC Compliance.......................................................................................................... 31
6. IC Caution .................................................................................................................... 34
7. NCC 警語 ...................................................................................................................... 36

1.Overall Introduction
Raytac’s MDBT53V & MDBT53V-P is a BT 5.2 stack (Bluetooth low energy or BLE) module
designed based on Nordic nRF5340 SoC solution, which incorporates: GPIO, SPI, UART,
TWI, I2S, PDM, PWM, ADC, NFC and USB interfaces for connecting peripherals and sensors.
Features:
1. Embedded 2.4GHz transceiver supports Bluetooth 5.2 ( ), IEEE 802.15.4
(& Zigbee) & 2.4Ghz RF & ANT+ upon customer’s preference.
2. Compact size with (L) 12.4 x (W) 7.8 x (H) 1.85 or 1.6 mm.
3. Low power requirements, ultra-low peak, average and idle mode power consumption.
4. Be compatible with a large installed base of mobile phones, tablets and computers.
5. Fully coverage of BLE software stack.
6. BLE & RF transmission switching helps products fit all operation system and most
hardware.
1.1. Application
‧Advanced computer peripherals and I/o devices
‧Multi-touch trackpad
‧Advanced wearables
‧Health / fitness sensor and monitor devices
‧Wireless payment enabled devices.
‧Wireless audio devices
‧Bluetooth Low EnergyAudio
‧True wireless earbuds
‧Headphones, microphones and speakers
‧Internet of Things (IoT)
‧Smart home sensors and controllers
‧Industrial IoT sensors and controllers
‧Interactive entertainment devices
‧Remote controls
‧Gaming controllers
‧Professional Lighting
‧Wireless connected luminaire

1.2. Features
‧Supply voltage range 1.7V to 5.5V
‧1.8 V to 3.3 V regulated supply for external components
‧Single 32 MHz crystal operation
‧25 general purpose I/O pins
‧Operating temperature from -40 to +105°C
Network Core
‧ARM® Cortex® -M33 with TrustZone® technology
‧64 MHz operation
‧256 kB flash
‧64 kB low leakage RAM
‧Bluetooth® 5.2, IEEE 802.15.4-2006, 2.4 GHz transceiver
‧-98 dBm sensitivity in 1 Mbps Bluetooth Low Energy mode
‧-104 dBm sensitivity in 125 kbps Bluetooth Low Energy mode (long range)
‧-101 dBm sensitivity in IEEE 802.15.4
‧-20 to +3 dBm configurable TX power
‧On-air compatible with nRF52, nRF51, nRF24L, and nRF24AP Series
‧Supported data rates:
‧Bluetooth 5.2 - 2 Mbps, 1 Mbps, 500 kbps, and 125 kbps
‧IEEE 802.15.4-2006 - 250 kbps
‧Proprietary 2.4 GHz - 2 Mbps, 1 Mbps
‧Angle of Arrival (AoA) and Angle of Departure (AoD) direction finding
‧128-bit AES/ECB/CCM/AAR co-processor (on-the-fly packet encryption)
‧SPI master/slave with EasyDMA
‧I2C compatible two-wire master/slave with EasyDMA
‧UART (CTS/RTS) with EasyDMA
‧Up to 3x 32-bit timer with counter mode
‧Up to 2x real-time counter (RTC)
Application Core
‧ARM® Cortex® -M33 with TrustZone® technology
‧128 MHz or 64 MHz operation
‧Single-precision floating-point unit (FPU)
‧Digital signal processing (DSP) instructions
‧1 MB flash and 512 kB low leakage RAM

‧ARM TrustZone CryptoCell™-312 security subsystem
‧USB 2.0 full speed (12Mbps) controller
‧QSPI peripheral for communicating with an external flash memory device
‧Near field communication (NFC-A) tag with wake-on field
‧Up to 5x SPI master/slave with EasyDMA
‧Up to 4x I2C compatible two-wire master/slave with EasyDMA
‧Up to 4x UART (CTS/RTS) with EasyDMA
‧Audio peripherals: I2S, digital microphone interface (PDM)
‧Up to 4x pulse width modulator (PWM) units with EasyDMA
‧12-bit, 200 kspsADC with EasyDMA - eight configurable channels with programmable gain
‧Up to 3x 32-bit timer with counter mode
‧Up to 2x 24-bit real-time counter (RTC)
‧Up to 2x Quadrature decoder (QDEC)

2.Product Dimension
2.1. PCB Dimensions & Pin Indication
‧MDBT53V
PCB Size (in mm)
Min.
Norm
MAX.
L
- 0.15
12.4
+ 0.2
W
7.8
H
1.85

‧MDBT53V-P
PCB Size (in mm)
Min.
Norm
MAX.
L
- 0.15
12.4
+ 0.2
W
7.8
H
1.6

2.2. Recommended Layout of Solder Pad
Graphs are all in Top View, Unit in mm.

2.3. RF Layout Suggestion (aka Keep-Out Area)
Please follow below instruction to have better wireless performance. Make sure to keep the
“No-Ground-Pad” as wider as you can when there is no enough space in your design.
No Ground Pad should be included in the corresponding position of the antenna in EACH
LAYER.
Place the module towards the edge of PCB to have better performance than placing it on the
center.
Welcome to send us your layout in PDF for review at [email protected] or your contact at
Raytac with title “Layout reviewing –Raytac Model No. –YOUR company’s name”.

Examples of “NOT RECOMMENDED” layout

If there is limited space for layout, the module can be put on the upper right corner to
minimize the layout space.
2.4. Footprint & Design Guide
Please visit “Support” page of our website to download. The package includes footprint,
2D/3D drawing, reflow graph/solder profile and recommended spec for external 32.768khz.

2.5. Pin Assignment
Pin No.
Name
Pin Function
Description
(1)
GND
Power
Ground
(2)
SWDIO
Debug
Serial wire debug I/O for debug and programming
(3)
SWCLK
Debug
Serial wire debug I/O for debug and programming
(4)
nRESET
Reset
Pin RESET with internal pull-up resistor
(5)
P0.26
Digital I/O
General-purpose I/O
AIN5
Analog input
Analog input
(6)
P0.18
Digital I/O
General-purpose I/O
CSN
CSN for QSPI
Dedicated pin for Quad SPI
(7)
P0.25
Digital I/O
General-purpose I/O
AIN4
Analog input
Analog input
(8)
P0.17
Digital I/O
General-purpose I/O
SCK
SCK for QSPI
Dedicated pin for Quad SPI
(9)
P0.12
Digital I/O
General-purpose I/O
DCX
DCX for SPIM4
Dedicated pin for high-speed SPI
(10)
P0.16
Digital I/O
General-purpose I/O
IO3
IO3 for QSPI
Dedicated pin for Quad SPI
(11)
P0.11
Digital I/O
General-purpose I/O
CSN
CSN for SPIM4
Dedicated pin for high-speed SPI
(12)
P0.15
Digital I/O
General-purpose I/O
IO2
IO2 for QSPI
Dedicated pin for Quad SPI
(13)
P0.10
Digital I/O
General-purpose I/O
MISO
MISO for SPIM4
Dedicated pin for high-speed SPI
(14)
P0.14
Digital I/O
General-purpose I/O
IO1
IO1 for QSPI
Dedicated pin for Quad SPI
(15)
P0.09
Digital I/O
General-purpose I/O
MOSI
MOSI for SPIM4
Dedicated pin for high-speed SPI
(16)
P0.13
Digital I/O
General-purpose I/O
IO0
IO0 for QSPI
Dedicated pin for Quad SPI

Pin No.
Name
Pin Function
Description
(17)
P0.08
Digital I/O
General-purpose I/O
SCK
SCK for SPIM4
Dedicated pin for high-speed SPI
(18)
GND
Power
Ground
(19)
P1.03
Digital I/O
General-purpose I/O
TWI
TWI 1 Mbps
High-speed pin for 1 Mbps TWI
(20)
P1.02
Digital I/O
General-purpose I/O
TWI
TWI 1 Mbps
High-speed pin for 1 Mbps TWI
(21)
P0.03
Digital I/O
General-purpose I/O
NFC2
NFC input
NFC antenna connection
(22)
P0.02
Digital I/O
General-purpose I/O
NFC1
NFC input
NFC antenna connection
(23)
P0.00
Digital I/O
General-purpose I/O
XL1
Analog input
Connection for 32.768 kHz crystal
(24)
P0.01
Digital I/O
General-purpose I/O
XL2
Analog input
Connection for 32.768 kHz crystal
(25)
DCCH
Power
DC/DC converter output
(26)
VDD
Power
Power supply
(27)
GND
Power
Ground
(28)
P0.05
Digital I/O
General-purpose I/O
AIN1
Analog input
Analog input
(29)
VDDH
Power
High voltage power supply
(30)
P0.04
Digital I/O
General-purpose I/O
AIN0
Analog input
Analog input
(31)
DCCD
Power
DC/DC converter output
(32)
P1.13
Digital I/O
General-purpose I/O
(33)
DECD
Power
Digital regulator supply decoupling
(34)
P1.12
Digital I/O
General-purpose I/O
(35)
DCC
Power
DC/DC converter output
(36)
P1.11
Digital I/O
General-purpose I/O

Pin No.
Name
Pin Function
Description
(37)
DECR
Power
Regulator supply decoupling
(38)
P0.31
Digital I/O
General-purpose I/O
(39)
GND
Power
Ground
3.Main Chip Solution
RF IC
Crystal Frequency
Nordic NRF5340
32MHZ / CL = 8pF / 20ppm
32MHz crystal is already inside the module. The module does NOT
include external capacitor of 32MHZ. Please follow below instruction
to enable FW setting of internal capacitor.
SDK Default setting: B =1, internal capacitor enable / A = 01100

4.Specification
Any technical spec shall refer to Nordic’s official documents as final reference. Contents
below are from “nRF5340 Objective Production Specification v1.1”, please click to download
full spec.
4.1. Absolute Maximum Ratings
4.2. Operating Conditions

4.3. Electrical Specifications
4.3.1.General Radio Characteristics
4.3.2.Radio Current Consumption (Transmitter)