Index
1. Overall Introduction ...................................................................................................... 4
2. AT Command ................................................................................................................. 4
2.1. List of supported commands................................................................................. 4
2.2. AT Command Sets................................................................................................ 5
2.2.1. “Write” Commands................................................................................................ 5
2.2.2. “Read” Commands ............................................................................................... 8
2.2.3. Response (Default)............................................................................................... 9
2.3. Default Info ..........................................................................................................11
2.4. Pin Assignment................................................................................................... 12
3. How to Control via External MCU .............................................................................. 14
3.1. How to Send AT Commands............................................................................... 14
3.2. How to Transmit Data ......................................................................................... 16
3.3. How to Return to Setting of Default Flash........................................................... 16
4. Test Report................................................................................................................... 17
4.1. Current Test ........................................................................................................ 17
4.2. Throughput Test.................................................................................................. 18
5. Product Dimension ..................................................................................................... 20
5.1. PCB Dimensions & Pin Indication....................................................................... 20
5.2. Recommended Layout of Solder Pad................................................................. 22
5.3. RF Layout Suggestion (aka Keep-Out Area) ...................................................... 26
5.4. Footprint & Design Guide ................................................................................... 28
6. Main Chip Solution...................................................................................................... 29
7. Shipment Packaging Information .............................................................................. 30
7.1. Marking on Metal Shield ..................................................................................... 31
7.2. Packaging Info.................................................................................................... 31
7.3. Order Code......................................................................................................... 33
8. Specification ................................................................................................................ 34
8.1. Absolute Maximum Ratings ................................................................................ 34
8.2. Operation Conditions.......................................................................................... 34
8.3. Electrical Specifications...................................................................................... 35
9. Antenna........................................................................................................................ 40