
Trusted TMR 120 Vdc Output Module – 32 Channel Table of Contents
Rockwell Automation Publication ICSTT-RM281P-EN-P (PD-T8471) Issue 16 1
Table of Contents
1. Description .............................................................................................................3
1.1. Field Termination Unit (FTU)....................................................................................................... 4
1.2. Front Panel Unit (FPU) ................................................................................................................ 4
1.3. Host Interface Unit (HIU) ............................................................................................................5
1.4. Field Interface Unit (FIU).............................................................................................................5
1.5. Line Monitoring and Output States ............................................................................................ 6
1.6. Housekeeping.............................................................................................................................. 6
1.7. Fault Detection/Testing ..............................................................................................................7
1.8. Sequence of Events Characteristics ............................................................................................ 7
1.9. Output Switch Structure .............................................................................................................8
1.9.1. Switch Diagnostics............................................................................................................... 9
1.9.2. Short Circuit Protection Issues ..........................................................................................10
1.9.3. Group Fail Safe Switches ...................................................................................................10
2. Installation...........................................................................................................11
2.1. Module Insertion and Removal.................................................................................................11
2.2. Cable Selection..........................................................................................................................11
2.3. Termination............................................................................................................................... 12
2.4. Module Pin-out Connections ....................................................................................................12
2.5. Trusted Module Polarisation/Keying. .......................................................................................
13
3. Application ...........................................................................................................15
3.1. Module Configuration...............................................................................................................15
3.2. T8471 Complex Equipment Definition......................................................................................15
3.2.1. Rack 1: DO .........................................................................................................................17
3.2.2. Rack 2: STATE ....................................................................................................................17
3.2.3. Rack 3: AI ........................................................................................................................... 18
3.2.4. Rack 4: CI ...........................................................................................................................19
3.2.5. Rack 5: LINE_FLT................................................................................................................19
3.2.6. Rack 6: DISCREP.................................................................................................................19
3.2.7. Rack 7: Housekeeping .......................................................................................................20
3.2.8. Rack 8: INFO ......................................................................................................................22
3.3. Sequence of Events Configuration............................................................................................24
3.4. System.INI File Configuration....................................................................................................24
4. Operation .............................................................................................................25
4.1. Front Panel ................................................................................................................................25
4.2. Module Status LEDs...................................................................................................................27
4.3. I/O Status LEDs..........................................................................................................................28