Samsung MM-77 User manual

MICRO
COMPONENT
SYSTEM
MM-77
S
ERVIC
Manual
i
MICRO COMPONENT SYSTEM
APF CCAUT ON -csateistans doce Sale dtaaaroeeeacsanrs 1~9
2; SDOCITICATION a:iinescetcctevecdav unten 10
3. Location of controls ........ccee 11~13
4. Disassembly instruction............ 14~15
5. Basic circuit operation............... 16~17
6. TroubleSHOOTING ......ecceseeeeeeeees 18~26
FAQUUSUMIENT siasrmiccihddiariereds 27~32
8. Block diagram........ccessseseseees 33~34
a
—
“SSE
vec
]
9.Exploded
view
&
parts
list........
35~41
10.Schematic diagram... 42~44
11.PCB Pattern and Marking
HAGMAN asia ste senetuetrsannslncensadagenas 45~48
12. Wiring diagram .....cccccccseseeeeeeeeens 49
13.IC & TR internal diagram .......... 50~57
14. Electrical parts list... eee 58~67
15. List of Abbreviation ..........cccceeeees 68
*Design
and
specification
are
subject
to
change
upon
improvement
without
prior notice.

1. Safety precaution
1-1. Class 1 laser product
This laser disc player is classified as a CLASS 1 laser product.
1-2. Laser warning label
The label shown below may be affixed or not according to country.
(UL) (CSA) (EU)
This Product Complies with CERTIFIED ONLY TO CANADIAN
DHHS Rules 21CFR, Sub ELECTRICAL CODE.
chapter J.At date of Manu- CLASS 1
facture CERTIFIE EN VERTU DU CODE LASER PRODUCT
CANADIAN DE LELETRICITE
SEULEMENT
L
Location: Enclosure back.
(SCAN)
CAUTION ! invisi8Le LASER RADIATION WHEN OPEN
AND INTERLOCKS DEFEATEO AVOIDEXPOSURE TO BEAM (EU)
ADVARSEL USYNLIG LASERSTRALING VED ABNING
NAR SIKKERHEDSAFBRYDERE ER UDE AF FUNKTION
UL : Manufactured for U.S.A. Market.
CSA __ : Manufactured for Canadian Market.
UNDGAUDSAETIELSE FOR STRAUNG EU : Manufactured for European Market.
VARO:AVATTAESSA JA SUOJALUKITUS OHITETTAESSA ; ‘
OLET ALTTINA NAKYMATTOMALLE LASERSATEILYLLE ALA SCAN : Manufactured for Scandinavian
KATSO SATEESEEN! Market
arket.
VARNING\OSYNUG LASERSTRALNING NAR DENNA DEL
AR OPPNAD OCH SPARREN AR URKOPPLAD BETRAKTA
EJSTRALENI
Location : on the disc clamper or inner side of UNIT door or nearby UNIT chassis.
1-3.Laser beam warning
1-4.
1-5.
ADVERSEL -Usynlig saserstraling ved abning, nar Sikkerhedsafbrydere er ude af funktion.
Undga udsaettelse for straling.
VARNING -Osylig laserstralning nar denna del ar Gppnad och sparr ar urkopplad. Stralen ar farlig.
VARITUS -Laite sisaltaa laserdiodin, joka lahettaa nakymatonta silmille vaarallista lasersateilya.
CAUTION -Invisible laser radiation when door is open and interlocks defeate. Avoid exposure to
beam.
Laser diode specification (Optical pick-up)
¢ Material : GaAs+GaAlAs
* Wavelength : 760-800nm
* Emission duration : Continuous
* Laser Output : 0.2mW
* This output is the value measured at distance 1.6mm from the objective lens surface on the optical pick-
up block.
* Classification : CLASS 1
Warning for servicing
WARNING: When servicing, do not approach the LASER exit with the eye too closely. In case it is necessary
to confirm LASER beam emission, be sure to observe from a distance of more than 30cm from
the surface of the objective lens on the optical pick-up block.
VARNING: Nar underhailningsarbeten utfors, narma dig forsiktigt och se inte pa laserutstralningen pa for
nare hall. If all det ar n6dvandigt att betrygga laserstralens utstromning. Var saker att kontrollera
detta fran ett avstaand av mer an 30cm (11.81 inch.) fraan den objektiva linsens yta pa den
optiska utsandningspunkten.
ADVARSEL: Nar repareringsarbejdet udfoeres, naerm dig forsigtigt og se ikke pa laserudstralingen paa for
naer haand. “t ilfaeldet at det er noedvaendigt at bestemme laserstralens udstraling. Vaer sikker
pa kontrollere dette fra en afstand af mere end 30cm (11.81 inch.) fra den objektive linses
overflade pa den optiske udsendningspunkt.
VAROITUS: Silmia on varottava viemasta liian labeile laser-poistokanavaa huoiion aikana. Jos on
valttamatonta varmistaa Laser-Sateen paasto, pysyttels sita tarkasteltaessa vahintaan 30cm
etaiyydella optisen lukon objecktiivilinssin pinnasta..
MM-77 —1—

1-1-6.
(2
—
(3)
MM-77
Before
returning
an
instrument
to
the
customer,
always
make
a
safety
check
of
the
entire
instrument,
including,
but
not
limited
to,
the
following
items:
Be
sure
that
no
built-in
protective
devices
are
defective
or
have
been
defeated
during
servicing.
(1)
Protective
shields
are
provided
to
protect
both
the
technician
and
the
customer.
Correctly
replace
all
missing
protective
shields,
including
any
remove
for
servicing
convenience.
(2)
When
reinstalling
the
chassis
and/or
other
assembly
in
the
cabinet,
be
sure
to
put
back
in
place
all
protective
devices,
including,
but
not
limited
to,
nonmetallic
control
knobs,
insulating
fishpapers,
adjustment
and
compartment
covers/shields,
and
isolation
resistor/
capacitor
networks.
Do
not
operate
this
instrument
or
permit
it
to
be
operated
without
all
protective
devices
correctly
installed
and
functioning.
Be
sure
that
there
are
no
cabinet
openings
throught
which
adults
or
children
might
be
able
to
insert
their
fingers
and
contact
a
hazardous
voltage.
Such
openings
include,
but
are
not
limited
to,
excessively
wide
cabinet
ventilation
slots,
and
an
improperly
fitted
and/or
incorrectly
secured
cabinet
back
cover.
Leakage
Current
Hot
Check-With
the
instrume-nt
completely
reassembled,
plug
the
AC
line
cord
directly
into
a
120V
AC
outlet.
(Do
not
use
a
isolation
transformer
during
this
test.)
Use
a
leakage
current
tester
or
a
metering
system
that
complies
with
American
National
Standards
institute
(ANSI)
C101.1
Leakage
Current
for
App-
liances
and
Underwriters
Laboratories
(UL)
1270
(40.7).
With
the
instrument's
AC
switch
first
in
the
ON
positin
and
then
in
the
OFF
position,
measure
from
a
known
earth
ground
(metal
waterpipe,
conduit,
etc.)
to
all
exposed
metal
parts
of
the
instrument
(antennas,
handle
brackets,
metal
cabinets,
screwheads,
metallic
overlays,
control
shafts,
etc.),
especially
any
exposed
metal
parts
that
offer
an
electrical
return
path
to
the
chassis.
Any
current
measured
must
not
exceed
0.5
millamp.
Reverse
the
instrument
power
cord
plug
in
the
outlet
and
repeat
the
test.
See Figure 1.
Any
measurements
not
within
the
limits
specified
herein
indicate
a
potential
shock
hazard
that
must
be
ellminated
before
returning
the
instrument
to
the
customer.
(Reading should
not be above
0.5mA)
Leakahe
Currant
Tester
Test all
exposed metal
surfaces
2-Wire Cord
Also test with
plug reversed
(using AC adapter
plug as required)
FIG. 1 AC Leakage Test
(4)
Insulation
Resistance
Test
Cold
Check-(1)
Unplug
the
power
supply
cord
and
connect
a
jumper
wire
between
the
two
prongs
of
the
plug.
(2)
Turn
on
the
power
switch
of
the
instrument.
(3)
Measure
the
resistance
with
an
ohmmeter
between
the
jumpered
AC
plug
and
all
exposed
metallic
cabinet
parts
on
the
instrument,
such
as
screwheads,
antenna,
control
shafts,
handie
brackets,
etc.
When
an
exposed
metallic
part
has
a
return
path
to
the
chassis,
the
reading
should
be
between
1
and
5.2
megohm.
When
there
is
no
return
path
to
the
chassis,
the
reading
must
be
infinite.
If
the
reading
is
not
within
the
limits
specified,
there
is
the
possibility
of
a
shock
hazard,
and
the
instrument
must
be
repared
and
rechecked
before
it
is
returned
to
the
customer.
See Figure 2.

Antenna
Terminal
Exposed
Melal Part
Ohmmeter
1-1-7.
1-1-8.
1-1-9.
FIG. 2 Insulation Resistance Test
Read and comply with all caution and safety-
related notes non or inside the cabinet, or on
the chassis.
Design Afteration Warning-Do not alter or add
to the mechanical or electrical design of this
instrument. Design alterations and additions,
including but not limited to, circuit
modifications and the addition of items such
as auxiliary audio output connections, might
alter the safety characteristics of this
instrument and create a hazard to the user.
Any design alterations or additions will make
you, the servicer, responsible for personal
injury or property damage resulting
therefrom.
Observe original lead dress. Take extra care to
assure correct lead dress in the following
areas: (1) near sharp edges, (2) near thermally
hot parts (be sure that leads and components
do not touch thermally hot parts), (3) the AC
supply, (4) high voltage, and (5) antenna
wiring. Always inspect in all areas for pinched,
out-of-place, or frayed wiring. Do not change
spacing between a component and the
printed-circuit board. Check the AC power
cord for damage.
MM-77
1-1-10. Components, parts, and/or wiring that
appear to have overheated or that are
otherwise damaged should be replaced with
components, parts and/or wiring that meet
original specifications. Additionally,
determine the cause of overheating and/or
damage and, if necessary, take corrective
action to remove any potential safety
hazard.
Product Safety Notice-Some electrical and
mechanical parts have special safety-related
characteristics which are often not evident
from visual inspection, nor can the
protection they give necessarily be obtained
by replacing them with components rated
for higher voltage, wattage, etc. Parts that
have special safety characteristics are
identified by shading, an (x) or a ( A\,) on sc-
hematisc and parts lists. Use of a substitute
replacement that does not have the same
safety characteristics as the recommended
replacement part might created shock, fire
and/or other hazards. Product safety is under
review continuously and new instructions
are issued whenever appropriate.

2. Servicing notes
2-1. Before servicing the unit
Be
sure
to
observe
the
safety
notes
attached
on
label,
chassis,
cabinet
top,
cabinet
bottom
and
printed
circuit
board.
2-1-1. Caution on laser beammalfunction
Do
not
try
to
access
objective
lens,
when
DISC
is
not
on
the
tray.
When
pick-up
mechanism
replacement
is
required,
be
sure
to
turn
power
off.
2-1-2. When handling parts
Tube,
tape
or
insulating
parts
are
used
for
sepa-ration
or
insulation
purposes.
Especially
parts
which
generate
excessive
heat
are
kept
away
from
PCB
or
any
other
sensitive
parts.
Therefore,
when
replacing
parts,
be
sure
to
replace
them
in
their
original
position.
2-1-3. When fixing wires
Wires
should
be
fixed
in
such
a
way
with
cable-tie
so
they
won't
move.
When
finished
servicing,
be
sure
to
leave
unit
in
it's
original
configuration.
2-1-4. Use specified parts only
The
safety
specification
built
into
the
electronics
of
this
unit
require
that
you
use
specified
parts
only.
Do
not
use
any
other
replacements.
Using
other
parts
can
result
in
electrical
and
fire
hazard.
2-1-5. After servicing is complete
After
servicing
is
complete,
check
if
there
are
any
missing
parts
or
that
wires
are
properly
fixed
and
any
place
where
over
heating
or
shock
is
likely
to
occur,
can
be
found.
short terminal
SOH91C1(CAR, walkman)
SOH91VI(LDP)
MM-77
2-1-6. Handling the optical pick-up
*
The
laser
diode
in
the
optical
pick
up
may
suffer
electrostatic
breakdown
because
of
potential
static
electricity
from
clothing
and
your
body.
The following method is recommended.
(1)
Place
a
conductive
sheet
on
the
work
bench
(The
black
sheet
used
for
wrapping
repair
parts.)
(2)
Place
the
set
on
the
conductive
sheet
so
that
the
chassis
is
grounded
to
the
sheet.
(3)
Place
your
hands
on
the
conductive
sheet
(This
gives
them
the
same
ground
as
the
sheet).
(4) Remove the optical pick up block.
(5)
Perform
work
on
top
of
the
conductive
sheet.
Be
careful
not
to
let
your
clothes
or
any
other
static
sources
to
touch
the
unit.
*
Be
sure
to
put
on
a
wrist
strap
grounded
to
the
sheet.
*
Be
sure
to
lay
a
conductive
sheet
made
of
copper
etc.
which
is
grounded
to
the
table.
4
Mr Pek
SSte5 vee sy,
= cp
Notes
vy aay
* OSES IM ¢ 1M
; ' Pe
APS”
Lr ea a SS
‘0 THE UNIT AA | a
\s WS, Ant a
< A
(1) WRIST-STRAP oe CONDUCTIVE SHEET
FOR GROUNDING 1M f
(6)
Short
the
short
terminal
on
the
PCB,
which
is
inside
the
Pick-Up
ASS'Y,
before
replacing
the
Pick-Up.
(The short terminal is shorted when the Pick-Up
Ass'y is being lifted or moved.)
(7)
After
replacing
the
Pick-up,
open
the
short
terminal on the PCB.
ON
Sal
a
EF)
terminal
SOH-A1
(CMS-V10,CMS-V30)
terminal
SOH94T4N
(CMS-V10,CMS-V30)

2-2. Servicing Precautions
CAUTION: Before servicing Instruments covered by
this service manual and its supplements, read and
follow the Safety Precautions section of this manual.
Note: If unforseen circument create conflict between
the following servicing precautions and any of the
safety precautions, always follow the safety
precautions.
Remember: Safety First.
2-2-1. General Servicing Precautions
(1) a. Always unplug the instrument's AC power cord
from the AC power source before (1) removing
or reinstalling any component, circuit board,
module or any other instrument assembly, (2)
disconnecting any instrument electrical plug or
other electrical connection, (3) connecting a test
substitute in parallel with an electrolytic
capacitor in the instrument.
b. Do not defeat any plug/socket B+ voltage
interlocks with which instruments covered by
this service manual might be equipped.
c. Do not apply AC power to this instrument
and/or any of its electrical assemblies unless all
solid-state device heat sinks are correctly
installed.
d. Always connect a test instrument's ground lead
to the instrument chassis ground before
connecting the test instrument positive lead.
Always remove the test instrument ground
lead last.
Note: Refer to the Safety Precautions section
ground lead last.
(2) The service precautions are indicated or printed
on the cabinet, chassis or components. When
servicing, follow the printed or indicated service
precautions and service materials.
(3) The components used in the unit have a specified
flame resistance and dielectric strength. When
replacing components, use components which
have the same ratings. Components identified by
shading, by (x) or by (.1 ) in the circuit diagram
are important for safety or for the characteristics
of the unit. Always replace them with the exact
replacement components.
MM-77
(4) An insulation tube or tape is sometimes used and
some components are raised above the printed
wiling board for safety. The internal wiring is
sometimes clamped to prevent contact with
heating components. Install such elements as
they were.
(5) After servicing, always check that the removed
screws, corponents, and wiring have been
installed correctly and that the portion around the
serviced part has not been damaged and so on.
Further, check the insulation between the blades
of the attachment plug and accessible conductive
parts.
2-2-2. Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet
and turn the power ON. Connect the insulation
resistance meter (500V) to the blades of the
attachment plug. The insulation resistance between
each blade of the attachment plug and accessible
conductive parts (see note) should be more than 1
Megohm.
Note: Accesible conductive parts include metal
panels, input terminals, earphone jacks, etc.

2-3. ESD, Precautions
Electrostatically SensitiveDevices (ESD)
Some semiconductor (solid state) devices can be
damaged easily by static electricity.
Such components commonly are called Electro-
statically Sensitive Devices (ESD). Examples of typical
ESD devices are integrated circuits and some field-
effect transistors and semiconductor chip com-
ponents. The following techniques should be used to
help reduce the incidence of component damage
caused by static electricity.
(1) Immediately before handling any semiconductor
component or semiconductor-equipped
assembly, drain off any electrostatic aharge on
your body by touching a known earth ground.
Alternatively, obtain and wear a commercially
available discharging wrist strap device, which
should be removed for potential shock reasons
prior to applying power to the unit under test.
(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a con-
ductive surface such as aluminum foil, to prevent
electrostatic charge buildup or exposure of the
assembly.
(3) Use only a grounded-tip soldering iron to solder
or unsolder ESD devices.
(4) Use only an anti-static solder removal device.
Some solder removal devices not classified as
"anti-static" can generate electrical charges
sufficient to damage ESD devices.
(5
—
Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damge
ESD devices.
MM-77
(6) Do not remove a replacement ESD device from its
protective package until immediately before your
are ready to install it. (Most replacement ESD
devices are packaged with leads electrically
shorted together by conductive foam, aluminum
foil or comparable conductive materials).
(7) Immediately before removing the protective
materials from the leads of a replacement ESD
device, touch the protective material to the
chassis or circuit assembly into which the device
will be installed.
CAUTION: Be sure no power is applied to the
chassis or circuit, and observe all other safety
precautions.
@
Minimize bodily motions when handling unpack-
aged replacement ESD devices. (Otherwise
harmless motion such as the brushing together
of your clothes fabric or the lifting of your foot
from a carpeted floor can generate static
electricity sufficient to damage an ESD device).

3. Chip replacement
3-1. Precaution for the Chip Replacement
(1)Do not touch the part body directly with the
soldering iron. ICS, especially TSOP, are easily
damaged by heat.
(2) Use care regarding soldering iron tip and avoid
rapidly heating parts. Some parts can be
damaged by sudden heating. Preheat the part at
about 100°C for several minutes before installing
it.
(3) Use soldering tip temperature of about 240°C or
larger
parts,
use
a
slightly
higher
temperature
(about 280°C).
(4) The thin (0.3mm) solder for miniature parts does
not contain adequate flux. Supplementary flux is
thus needed in most cases.
The
NoteMaster
486S/25N
series
systems
are
manufactured
using
flux
which
can
be
cleaned
by
water
in
the
factory.
When
your
replace
the
part
or
troubleshooting,
use
proper
flux
and
solder
which
can
be
cleaned
by
water.
Soldering
area
will
corrode,
if
proper
flux
and
solider
are
not
used
in
replace.
And
it
may
cause
a
fatal
error
to
the
system.
(5) Use care not to damage the circuit pattern,
especially when removing.
(6) Because of the many pins, cleanliness of the
pattern is extremely important after removing
the IC.
(7) Use care to avoid solder bridges. Remove any
that occurs.
(8) Position the part carefully. This will also affect the
soldering operation. Be very precise in
positioning the IC. Soldering opposite pins first
holds the IC in place and makes soldering the
other pins easier.
(9) Do not reuse removed parts.
(10) Check for solder joints, especially miniature parts
with small lead.
(11) A defective trimming resistor cannot be adjusted
externally. Replace with an ordinary variable
resistor.
(12) It is important to inspect the work with a
magnifier. Check after installing (cold solder
joints, etc).
3-2.
Tools
for
the
Chip
Replacement
The
tools
for
the
chip
replacement
are
as
follows:
(1) Thin tip type soldering iron
(2) Small flat-blade tip type soldering iron
(3) Special desoldering tip iron
(4) Airblower unit
(5) Flat Package Pick-up
MM-77
6) Flux can be cleaned by water
7)
0.3mm
thin
solder
can
be
cleaned
by
water
8)
Desoldering
wire
9) Tweezers
3-3.
Chip
Resistors
and
Chip
Capacitors
3-3-1.
Kind
jof
the
Part
The
kind
of
chip
resistors
and
chip
capacitors
as
follows
(1) Thick Film Chip Resistors
(2) Carbon Film Chip Resistors
(3) Metal Film Chip Resistors
(4) Chip Ceramic Capacitors
(5) Chip Trimming Resistors
3-3-2. Removing the Part
The
kind
of
chip
resistors
and
chip
capacitors
as
follows
(1) Using two soldering irons:
(D Use thin tip soldering irons.
)
Use
soldering
tip
temperature
of
about
280°C
@) Simultaneously heat both ends of the part.
@
While
heating,
grasp
the
part
with
the
tips
of
the
soldering
irons
and
remove
it.
©)
Use
desoldering
wire
to
completely
remove
the
old
solder
from
the
part
location
of
the
board.
©
A
clean
pattern
for
installing
the
new
part
is
very
important.
FIG, 4
3-3-3. Installing the Part
(1)
Clean
the
area
where
the
new
part
is
to
be
mounted.
(2) Apply flux.
(3) Set part correctly into position, prevent it from
shifting.
(4) Bring the soldering iron tip close to the part
contact without actually touching it. Melt thin
(0.3mm)
solder
between
the
tip
and
part
so
that
it
flows into the part contact.
(5) Check work quality with a magnifier.

3-4. Chip Tantalum Capacitors and Chip
Filters
3-4-1. Kind of the Part
The kind of chip tantalum capacitors and chip filters
are as follows:
(1) Chip Inductors
(2) Chip Tantalum Capacitors
(3) Chip Tantalum Electrolytic Capacitors
(4) Chip Aluminum Electrolytic Capacitors
(5) Chip Transformers
(6) Chip Filters
3-4-2. Removing the Part
(1) Using special desoldering iron:
(D Select soldering tip according to part size.
@ Bring the tip into contact with the soldered points.
When the solder melts, remove the part.
@Remove the old solder with desoldering wire.
(1) Using two soldering irons:
(D Use small flat-blade tips.
(Heat both ends of the part simultaneously.
@ When the solder melts, grasp and remove the part
with the soldering iron tips.
@ Remove the old solder with desoldering wire.
W..
\b=
Awe
wy
!
NE
Wwe
3-4-3. Installing the Part
(1) Clean the area where the new part is to be
mounted.
(2) Apply flux
(3) In part correctly into position, prevent it from
shifting.
(4) Use sharp soldering iron tip. Bring close to the
Part contact without actually touching it. Melt thin
solder between the tip and part so that if flows
into the part contact.
(5) Check work quality with a magnifier.
FIG. 5
MM-77
3-5. Chip VRs, Chip Trimmer Capacitors,
Diodes and Tr.
3-5-1. Kind of the Part
The kind of the part is as follows:
(1) Chip VRs
(2) Chip Trimmer Capacitors
(3) Diode
(4) Transistors
3-5-2. Removing the Part
(1) Using two soldering irons:
@ Use small flat-blade tips.
@ Heat the leads of the part simultaneously.
@) When the solder melts, grasp and remove the part
with the soldering iron tips.
@ Remove the old solder with desoldering wire.
3-5-3. Installing the Part
Oy
YS
/
Y
FIG. 6
(1) Clean the area where the new part is to be
mounted.
(2) Apply flux
(3) Set part correctly into position, prevent it from
shifting.
(4) Use sharp soldering iron tip. Bring close to the
part contact without actually touching it. Melt thin
solder between the tip and part so that it flows
into the part contact.
3-6. Chip ICs
3-6-1. The kind of the Chip ICs
The kind of the chip ICs are as follows:
(1) SOP (Small Outline Package) IC
(2) SSOP (Shrink Small Outline Package) IC
(3) VSOP (Very Small Outline Package) IC
(4) QFP (Quad Fiat Package) IC
(5) VOFP (Very Quad Flat Package) IC
(6) PLCC (Plastic Leaded Chip Carrier) IC
(7) TSOP (Thin Small Outline Package) IC

3-6-2. Removing the Part
(1) Using special desoldering iron:
Select the tip according to the size and shape of
the IC.
@ Thin" the tip with a small amount of the IC leads.
@) Set the tip squarely over the IC leads.
@ When the solder melts, carefully twist the iron.
©) Raise and remove the IC.
(2) Using shaped airblower unit:
@ Select the correct nozzle.
@) Select the temperature and airblow (suggested:
temperature: 7, airblow: 4)
@) Engage the IC removing tool.
@ Use the airblow to preheat the IC for about 5
seconds, then heat with the nozzle until the IC
remover lifts the part from the board.
=
ea
|
FIG. 7
MM-77
3-6-3. Installing the Part
(1)
Use
desoldering
wire
to
remove
the
previous
older.
(2) Clean the location.
(3) Apply flux.
(4) Position the IC and solder two pins at opposite
sides.
(5)
Use
a
sharp
tipped
soldering
iron
and
carefully
solder
each
pin.
(After
graining
experience,
a
thicke
tip
can
be
used
for
better
work
efficiency.)
(6)
Remove
any
solder
bridges
with
desoldering
wire.
(7) Inspect the work with a magnifier.

2. Specification
2-1. General section
2-1-4
POWER
SOUNCE
vs
cazecsic.aes
cen
cusglceastvusdeidvuds
sacs
ie
sacedansvactaevea
dacuuadovts
siaveeas¥Raasacertebneodlunelecectsacdss
See
Label
Rating
2
AZ
A
POWEE
CONMSUNTIDUIGM
ces
vst
cattewssesasatencca
dav
penceacse
ipa
taeewtouetiorieensctutadhesddsiesen
ins
oetseieit
octasie
tet
ret
ath
eek
14-2
85
W
2='|23s-DIVONSION
5
.cevvs
cs
eczevessle2sdccsacesvhvsdacacacd
santas
cdfnctavtaas
toni
d
Snevivusteavieidesdaoedeenunines
500 (W)
x
255(H)
x
215(D)
mm
2-2. Amp section
222711,
POWOP
OUT
PUE.
3429505
csces
Feasedssataudi
tv
cves
vvsedsedaevastevs
cobaun
cote:
ieedhe
Seo
adeba
tne
cde
aceeme
van
ceesftonn
he
13
W/CH
(6Q){10%
DT)
22272
SPREQUENCY
TESPONSC
x.
s25sofazvaresesesa
sacs
ak
cits
idvssecuutedaevde
occupa
vaessucesiudveaddtevian
diaslsds
GOSS
Lc
cscseicckke
20
Hz~20
KHz
Paor
ot
SIG!
LO
MIOISE
EAU
5504.
serch
wes
doves
dis
asiedodetdcm
dise
toad
toed
cutesa
de
dheasians
cacensast
dan
Dakewt
Reese
castete
dee
te
ge
80
dB
22-4
Channel
Se
Dalat!
OF
etivectospuns
ee
cause
ch
asad
accomsnantam
deta
cadet
htt
cen
caesiy
ees
ss
cla
tee
65
dB
2-2-5.
(MPUL:
SONSILIVILY
<2,
.1c2-s:css
3
sends
nedetdadevatigivessbccacszedeeses
obiees
cavsiveiedyocoasusa
tank
udeelsteacdaceadeove
dee
cede
AUX
250
mV
MIC 2.5 mV
2-3. Tuner section
2-3-1. FM part
(TSF
FOEQUENTY
FANG
Oia:
.iicieteclecsScceiageiavinitd
tskceoncvode
ses
yusathvaluec
teins
oediteinised
cdsduacieantlocwiavi
atta
Pade
87.5~108
MHz
74
Fa
EoFe
[SSE
1
ero)
10
4
ann
ee
rT
se
Pry
SOB
7
OR
15
dB
(3)
SIO
Nal
LO
NOISES
RATIO
ante
selene
ts
cat
tesece
Aeadusigtash
co
chuctoass
erat
agiat
tink
eat
ayuil
glen
ruaei
Gate
tiat
a
eaeteaghencsleettetche
eins
waesee
55
dB
(AD
AFG
HERO
NCE
ARO
5
oc
shart
wtenteasnetosbevenvastia
Sees
ioaniceateededaaiate:
ck
Gaede
means
conteecea
hands
teece
doa
ee
easy
Rice
SS
40
dB
19)
LOAD
MAINO
IG
CISEON
CO
sin.
ses
ent
canrctsivass
ctarat
swung
tacwstetaeudautonatat
eteaOearsere.
tase
Mocs
alone
tacit
ax
ehcatcnh
atdatinneatecocdedae
0.5
%
WG
SEGIEO
SOD
ALE
OPN
acts
cp
estsiiencta
Nc
82
ba
laa
eck
ead
et
on
SS
DS
oC
ca
Te
ea
cht,
nk
aplace
rhe
35
dB
2-3-2.
AM (MW) Part
CU)
ERO
Ue
CY.
Fel
sas
Castaic
ty
Reus
isaaisasteaiieed
atts
av
cp
sean
cts
dtaed
ents
arcvtgenbeann
milan
hah
wa
anndutonnabuestodeane
sekaback
522~1611
KHz
AZ
PWS
ATG
SO
ri
STE
IBY
cases
as
exe
iis
c2t
eel
cautarsuss
deseessr
ute
Oe
lian
Heseosnee
tebe:
dane
sat
yaaa
dete
a
tedtadgieinia
tated
dae
axel
ea
tce eee
54
dB
CS
OCT
PTG|
LO
MOISE
TAU
Gast
case
Goran
ciestacie\
sos
budts
aad
desu
usteaternclcadaablewheeaeniceasteete
cupihas
Scrat
duran
ht
suat
ctpstivan
ate
seusnsleecs
40
dB
VA
TINTEPIGTERICE:
PALO
ipssucacts
(cates
Vaxoast
Ce
enansies
tt
stn
tonlac
huis
sit
Gr
cide
Ose
te
has
ac
hata
lua
tice
a
abe.
ke
eta
at
ee
33
dB
(5),
Gta!
Marinoni
Ci
StONiOM
nestle
ad
tae
eal
eve
ate
alee
Maal
ile
auth
ke
eg
Wea
tae
dea
ta
eat
cae
ate”
2%
2-3-3. LW (option) part
CUP
PRECenGy
aig
Gistass
cscicepaavtatets
ner
Sevsc
apes hata
ide
on
Vonautad
dwiathaganalauanvounneamnad
tala
aad
Aaliadesaege
146
~
290
KHz
(ZEISAD
Se
SOMSIEINILY
ansincesndvecitiasa
tas
dscseeschucueade
sais
cugepauscnss
sbobens
atlisntaladoadsSenuoaulateadsoasausstcvhe
adunvvcnicdwaesa
vars
inacedbnaahes
60
dB
USPOOUIN
WALIO
atecesc
tule
ouctapecd
ston
ch
ots
Covi
lvadu
rel
aa
ltt
alenee
tetas
la
hie
Oh
ile
Mee
tesa
alt
alcatel
thd
Sac
eee
even
33
dB
2-4. Deck section
SrA
ORG
ING
VPA
LS
cots
shules
su
eta
bsicdy
leony
lucas
ed
ote SiS
saa
cad
aminedod
eae
dada
acttetanacthicdatanaseuestanluudesatarieeas
125
Hz~8
KHz
BEL
NNO
ELUTE
Pectin
ciated
oxteaseatacet
eas
es
iat
ve
tuners
dee
edacauatynca
inka
Sve
dansatled
cater
ntedstatlaecaca
wei,
ekatels
0.2%
ZoAP
Ss
PTASIDIOOHGCE
janis
sib
nlaks
aesebtaiene
eiiibdalalintereieiot
anantnacdet
snctius.opatelaead
usta
alte
SW
Mea
ac
Ban
tes
60
dB
2-4-4.
Signal
to
noise
ratio
(Record/Play
Mod
e).........ssssssssssssescscssscsesesvsssvstssecscseasacasececsescsusasacavssavecscasaueseaees
40
dB
ZrO
OAR
Ee
POU
Cl
EAS
gsi
on
oats
ace
ace
ai
ta
alah
Se
Re
Ra
oh
a
a
aa
ite
ache
RE
About
120
second
2-5. CD section
Pa
al
C19
1001
gL
a
191
(Re
Ae
eee
ey
Cen
20
Hz~20
KHz
(+
1.5
dB)
2-25
CHAMME!
SE
PALA
ORM
case
rcedvacaszac
aka!
nislendaceh
tag
Shouse
elun
lueaeanauban
teatbestasuediec
tas
aa
eielied
asia
Or
aseseteeeoneds
85
dB
(1
KHz)
2-9-3)
Otel:
Hea
rOiGMi
CIStOLEOM
a
siteids
25
As
occas
atten
cea
tuaua
eaemate
th
ie
carta
ss
jase
Sou
rad
caeusttads
poo
balk
s@bia
0.05
%
ZB
o
SIQUAIO
TIOISE
FAN
Ones
i
tender
MtoN
Siecs
aaa
taal
hee
Yul
an
aaa
duceetutce
eden
aat
Madea
ecst
95
dB
(1
KHz
0
dB)
2-08
DA
CONVEISION
x
cceeascartente
torent
eM
Vleet
Alea
tacit’
tne
fale
Rio
Se
le
ee
Amt
May
Pues
8
over
MM-77
—
10
—

3. Location of controls
3-1. Front view
DISPLAY
FUNCTIONS
MENU
POWER
ON/OFF
CD
COMPARTMENT
CASSETTE
LENGTH
OPEN/CLOSE
SELECTION
FOR
COMPACT
DISC
COMPARTME
COMPACT DISC
SYNCHRONISED RECORD
CD RECORD
COUNTER RESET
(CASSETTE ONLY)
SOUND CUT-OFF
BASS AMPLIFICATION
VOLUME
RECORD/STOP (CASSETTE ONLY)
TIMER SWITCH ON AND OFF
EQUALIZER MODES
MICROPHONE VOLUME
ADJUSTMENT
MICROPHONE CONNECTOR
HEADPHONES CONNECTOR
CASSETTE PLAYER
MM-77 —11—

3-2. Rear view
AM AERIAL CONNECTOR
TERMINALS
FM AERIAL CONNECTOR
TERMINALS (OPTION)
AM AERIAL CONNECTOR
TERMINALS
REAT CUT ANTI-PARASITE
SWITCH (OPTION)
AUXILIARY SOURCE
CONNECTORS
FM
AERIAL
CONNECTOR
TERMINALS
LOUDSPEAKER
CONNECTOR
TERMINALS
VOLTAGE SELECTOR (OPTION)
|
i
eee |
|
| eR =.
L_VOLTAGE SeL_|
MAINS LEAD CONNECTION
SOCKET
MM-77
—
12
—

3-3. Remote control
INFRA=RED SIGNAL TRANSMITTER
POWER ON/OFF
TRACK SELECTION AND
FORWARD SEARCH
TRACK SELECTION AND
REVERSE SEARCH
TWO-FIGURE TRACK SELECTION
TRACK INTRODUCTION SCAN
PRESET RADIO STATION SELECTION
RADIO STATION STORAGE
TRACK PROGRAMMING
STOP AND CANCEL
PLAY AND PAUSE
RANDOM PLAYBACK
TRACK REPEAT
RADIO RECEPTION SELECTION
FREQUENCY BAND SELECTION
CHECK-TIMER-ON/OFF SLEEP CLOCK AUTOMATIC SWITCH OFF
TIMER
CHECK CLOCK
SETTING
TIMER SWITCH ON AND OFF
SOUND
OUT-OFF
FUNCTION
SELECTION
VOLUME INCREASE
FREQUENCY AND STATION
SELECTON AND TIME SETTING
VOLUME DECREASE
PLAYBACK MODE SELECTION
(AUTO-REVERSE) REVERSE MODE
COUNTER RESET
REVERSE PLAY (SIDE B)
PAUSE/RECORD
R T ? FORWARD PLAY (SIDE A)
STOP
(PLAYBACK/RECORD)
FAST
FORWARD/FORWARD
SEARC
REWIND/REVERSE SEARCH
MM-77
—
13
—

4.
Disassembly
instruction
Remove
the
plug
from
the
well
outlet
before
disassembling
the
unit
4-1.
How
to
disassemble
the
rear
of
4-3.
How
to
disassemble
CD-Mecha
cabinet.
(Fig.
1)
(Fig.
3)
4-1-1.
Remove
nine
screws
of
@)
and
eight
of
@
ofitsrear
part.
4-3-1.
Pullits
tray
foreward
and
then
raise
its
cover
tray
of
@)
upward
to
pull
it
out.
4-1-2. Pull its rear part out backward horizontally as shown in the
Fig.
1.
4-3-2.
Remove
one
screw
of
3)
another
one
screw
of
@)
and
then
pull
CD-Mecha
of
@
out.
4-2.
How
to
disassemble
tuner
PCB
4-4.
How
to
disassemble
Main
PCB
and
Holder
back.
(Fig.
2)
(Fig.
4)
4-2-1.
Remove
one
screw
of
@
and
then
trun
Tuner
PCB
of
@
down
aside
a
little
to
pull
it
out
backward.
4-1-2.
Remove
one
screw
of
@)
and
then
raise
Holder
back
@
upward
to
pull
it
out
backward.
4-4-7,
Pull
Main
PCB
of
(2)
backward
horizontally
to
pull
it
out.
es
MM-77
-14.

4-5.
How
to
disassemble
the
front
of
cabinet.
(Fig.
5)
4-5-1.
Remove
three
screws
of
@
and
then
pull
Cabinet
bottom
of
@)
out
backward.
MM-77
-
15
-

5. Basic circuit operation
5-1. u-com
No. PORT Name 1/0 Function
=o
1
P5
2
BGNS_RST
oO
BGNS
RESET
2
PWM1
VOL_ST
oO
VOLUME
IC
STROBE
3
P2
0
OPEN
S/W
I
CD
DOOR
OPEN
S/W
4
1
CLOSE
S/w
|
CD
DOOR
CLOSE
S/W
5
2
OPEN
MT
oO
CD
DOOR
OPEN
MOTOR
6 3
CLS
MOT
@)
CD
DOOR
CLOSE
MOTOR
7
4
SENSE
|
CD
SENSE
8
5
MUTE
oO
CD/TUNER/TAPE
MUTE
9 6
XLT
O
CD
XLT
10
7
LD_XRST
oO
CD
LD/XRST
CONTROL
11 TEST
12 RES RESET
13 XT 1
14 XT 2
15 vss GND
16
CF
1
8MHz
17
CF
2
8MHz
18 VDD
19
P8
0
KEY
1
|
A/D
KEY
INPUT1
20
1
KEY
2
I
A/D
KEY
INPUT2
21
2
EQ
R
|
EQ
LEVEL
INPUT
(RIGHT)
22
3
EQ
L
|
EQ
LEVEL
INPUT
(LEFT)
23
4
AMPS
IN
|
TAPE
AMPS
SIGNAL
IN
24
5
TUN_OPT
|
TUNER
A/D
OPTION
25
6
HALL
I
TAPE
HALL
SIGNAL
IN
26
7
GFS
I
CD
GFS
27
P7
0
SCOR
|
CD
SCOR
INTERRUPT
28
1
INH
|
POWER
CORD
CHECK
29
2
FOK
|
CD
FOCUS
OK
30
3
REMOCON
I
REMOCON
PULSE
IN
31 S 1 GRID 1
32 2 2
33 3 3
34 4 4
35 5 5
36 6 6
37 7 7
38 8 8
39 9 9
40 10 10
41 11 11
42 12 12
43 13 13
44 14 14
45 15 15
46 16
47 VDP
48 vP
49 64 SEG 1
50 S 2 SEG 2
MM-77
—16—

No.
PORT
Name
1/0
Function
51
SEG
14
SEG
3
|
52
13
4
53
12
5
54
11
6
55
10
7
56
9
8
57
8
9
58
10 10
59
11 11
60
12
12
61
13 13
62
14 14
63
15
15
64
16
16.
65
PO
0
Q3(C)
66
1
Q2(B)
67 2 Q1(A)
68
3
Q4(DATA)
69
4
G1
(SEL1)
70
5
G2
(SEL2)
EXPAND
IC
CONTROL
71
6
PWR_SNS
oO
POWER
SENSE
72
7
BGNS_CH
O
BGNS
CHANNEL
SELECT
73
P1
0
BGS_CLK
oO
BGS
CLOCK
74
1
SUBQ
|
SUBQ
75
2
CLKSOCK
O
CLOCK/SOCK
76
3
DATA
oO
CD
SUBQ
DATA
77
4
STEREO
I
STEREO
CHECK
78
5
SD
|
79
6
MO/ST
O
MONO/STEREO
80 7 STOUT |
81
P3
0
TUN_DAT
oO
TUNER
DATA
82
1
TUN_CLK
Oo
TUNER
CLOCK
83
2
TUN_CE
oO
TUNER
CE
84
3
STRO
oO
85
4
REC
oO
TAPE
RECORD
86
5
MOTOR
(@)
TAPE
MOTOR
87
6
SOL
O
TAPE
SOLENOID
ON/OFF
88
7
PLAY
oO
TAPE
PLAY
89 vss
90 VDD
91
P4
0
REC_MUT
Oo
TAPE
RECORD
MUTE
92
1
BGNS_MUT
O
-BGNS
MUTE
ON/OFF
93
2
BGNS_NAR
|
BGNS
NAR
94
3
R_REC
|
R
REC
PROTECT
(L)
95
4
MODE
!
DECK
MECHA
,ModeiL)
96
5
HALF
|
TAPE
existence
or
nonexistence
(L)
97
6
F_REC
|
F
REC
PROTECT
(L)
98
7
CD_HIGH
Oo
CD
HIGH
SPEED
(H)
99
P5
0
BGNS_ST
oO
BGNS
STROBE
100
1
BGNS_DAT
Oo
BGNS
DATA
MM-77
47

5-2. CD section
1) RF Amp(KA9220) : NIC9220
RF 1-V Amp(1) and RF I-V Amp (2) are converted to voltage via
58K internal resistance of 58kQ from the current of PD1(A+C) and PD2
RI Baal (B+D) ; then, this voltage is added to RF summing amplifier.
RFO The signal (A+B+C+D) is applied to RFO (No.2 terminal).
RF output voltage can be calculated as follows:
RF 1-V AMP(1)
58K
Ba ae @ | VRF = -R3 x (iPD1 + iPD2)
+ RF 1-V AMP(2) RF =-R3 x (V1/R1 + V2/R2)
=-R3 x (V1/10K + V2/10K)
=-R3/10K x (V1 + V2)
2)
FOCUS
ERROR
Amp(KA9220)
:
NIC9220
FOCUS
ERROR
Amp
is
the
circuit
which
amplifies
the
difference
between
RF
I-V
Amp(1)
output(A+C)
and
RF
I-V
R2
Amp(2)
output
(B+D).
74k
These
two
signals
are
supplied
to
(-)
and
(+)
input
terminals
C1
25P
of
FOCUS
ERROR
Amp.
The
FOCUS
ERROR
signal
RI
||
}
———+
=
resulting
from
this
difference
voltage
is
applied
to
FE
-(B+D
MUS
(Terminal
No.
57).
The
FE
output
voltage
of
this
low
(B+D)
He
a
67)
frequency
component
varies
depending
on
{
(A+C)
-
(B+D)
}.
a
eae
VFE
can
be
obtained
as follows.
32K
c2
asp
|
rea
we
VFE
=
(R2/R1)
x
(V2-V1)
=
5.4(V2-V1)
FE
Bias
This
FOCUS
ERROR
voltage
is
sent
to
FOCUS
SERVO
circuit to maintain optimum focusing.
Vcc oe GND
3) FOCUS SERVO SYSTEM(KA9220) : NIC9220
The diagram of Focus Servo System is shown in the following.
When
FS3
is
ON,
high
frequency
gain
decreases
in
the
form
of
low
frequency
time
constant
by
pin
17,
pin
19,
and
capacitor
connected
to
internal
resistance.
The
capacitor
between
pin18
and
GND
has
the
time
constant
picking
up
the
low
frequency
operated
in
PLAY
mode.
PHASE
COMPENSATION
The maximum frequency of focus phase compensation is inversely proportional to the resistance connected to pin7.
Focus search peak is about 1.1 Vp-p, and is inversely proportional to the resistance connected to pin22,23 ; however,
if this resistance changes, the peak of track jump and sled kick changes.
The
inversion
input
of
FZC
comparator
is
set
to
5.7%
of
the
difference
between
Vcc
and
VC(pin69)
{
5.7%
x
(Vcc
-VC)
}.
Note:
If
the
resistance
connected
to
pin
7
changes,
the
phase
compensation
peak
of
focus,
tracking,
sled
servo
changes.
At
the
same
time,
‘op-amp’
dynamic
range
and
offset
voltage
also
change.
MM-77 — 18 ~

4)
TRACKING
SLED
SERVO
SYSTEM(KA9220)
:
NIC9220
The
diagram
of
Tracking
Sled
Servo
System
is
shown
in
the
following.
The
capacitor
between
pin15
and
16
has
a
time
constant,
and
lowers
the
high
frequency
when
TG2
is
off.
The
maximum
frequency
of
tracking
phase
compen-
sation
is
inversely
proportional
to
the
resistance
connected
to
pin7(about
1.2KHz
at
470K).
The
tracking
jump
in
the
direction
of
FWD
and
REV
is
decided
when
TM3
and
TM4
are
ON,
and
the
peak
voltage
induced
from
tracking
coil
is
decided
by
the
both
TM3
and
TM4
current
values,
and
feed
back
resistance
of
pin47.
Track
jump
max.
Voltage=
TM3(TM4)
current
x
feedback
resistance.
ISET VREG
O
56K SLED
DRIVER
FWD
or
REV
sled
kick
is
carried
out
when
TM5
of
TMG
is
ON
,
and
the
peak
voltage
added
to
sled
motor
is
decided
by
TM5
or
TM
current
and
the
feedback
resistance
of
pin
no.
41.
Sled
jump
max.
voltage
=
TM5(TM6)
current
x
feedback
resistance.
Each
SW
current
is
decided
by
the
resistance
connected
to
pin
no.22
and
23.
When the resistance is about 150kQ.
TM3 or TM4 = 11pA;
TM5 or TM6 = 22uA.
This
current
is
value
is
almost
inversely
proportional
to
the
resistor,
variable
within
a
range
of
about
5
to
40pA
for
TM3.
STOP
is
the
ON/OFF
detection
signal
for
the
limit
SW
or
the
sled
motor’s
innermost
circumference.
MM-77
—19—