Samsung MM-G25 User manual

SERVICE
Manual
Micro Component
Audio System
Model Name : MM-G25
Model Code : MM-G25T/XAP
Micro Component Audio System
Refer to the service manual in the GSPN (see the rear cover) for the more information.
CONTENTS
1. Precaution
2. Product Specification
3. Disassembly & Reassembly
4. Troubleshooting
5. Exploded View & Part List
6. PCB Diagram
7. Schematic Diagram
MM-G25
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This Service Manual is a property of Samsung Electronics
Co.,Ltd. Any unauthorized use of Manual can be punished
under applicable International and/or domestic law.
GSPN (Global Service Partner Network)
Area Web Site
North America service.samsungportal.com
Latin America latin.samsungportal.com
CIS cis.samsungportal.com
Europe europe.samsungportal.com
China china.samsungportal.com
Asia asia.samsungportal.com
Mideast & Africa mea.samsungportal.com
© Samsung Electronics Co.,Ltd. Apr. 2009
Printed in Korea
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Contents
1. Precaution
1-1 Safety Precautions...........................................................................................1-1
1-2 Servicing Precautions ......................................................................................1-3
1-3 Precautions for Electrostatically Sensitive Devices (ESDs).............................1-4
2. Product Specification
2-1 Product Feature ...............................................................................................2-1
2-2 Specifications...................................................................................................2-2
2-3 Specifications Analysis.....................................................................................2-4
2-4 Accessories......................................................................................................2-5
3. Disassembly & Reassembly
3-1 Overall Disassembly & Reassembly ................................................................3-1
4. Troubleshooting
4-1 Checkpoints by Error Mode..............................................................................4-2
4-2 MICOM, MPEG Initialization & Update ............................................................ 4-11
4-3 Buyer-Region Code Setting Method ................................................................4-12
5. Exploded View & Part List
5-1 Exploded View .................................................................................................5-2
5-2 Speaker System...............................................................................................5-4
5-3 Electrical Part List ............................................................................................5-5
6. PCB Diagram
6-1 Wiring Diagram ................................................................................................6-2
6-2 FRONT PCB Top.............................................................................................. 6-3
6-3 FRONT PCB Bottom ........................................................................................6-5
6-4 TAPE PCB Top.................................................................................................6-6
6-5 TAPE PCB Bottom ...........................................................................................6-8
6-6 MAIN PCB Top .................................................................................................6-9
6-7 MAIN PCB Bottom ...........................................................................................6-12
6-8 MPEG PCB Top ...............................................................................................6-14
6-9 MPEG PCB Bottom..........................................................................................6-17
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Contents
7. Schematic Diagram
7-1 Overall Block Diagram .....................................................................................7-2
7-2 FRONT.............................................................................................................7-3
7-3 TAPE ................................................................................................................7-4
7-4 MAIN ................................................................................................................7-5
7-5 MPEG...............................................................................................................7-6
7-6 SMPS...............................................................................................................7-7
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Samsung Electronics 2-1
Product Specification
2. Product Specification
2-1 Product Feature
2-1-1 MM-DG25 Product Feature
120W Power
2 CH
- Powerful Sound Experience
DVD
USB Host w/ video playback
Tuner
Various Multimedia Playback
- DIVX, MP3, WMA, Photo Files
2-1-2 MM-G25 Product Feature
120W Power
2 CH
- Powerful Sound Experience
CD RIPPING
USB Host w/ video playback
Tuner
Various Multimedia Playback
- MP3, WMA
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2-2 Samsung Electronics
Product Specification
2-2 Specifications
2-2-1 MM-DG25 Specications
Basic Specification
RADIO FM
Signal/noise ratio 62 dB
Usable sensitivity 10 dB
Total harmonic
distortion 0.4 %
COMPACT
DISC
PLAYER
Capacity 1 disc
Frequency range 20 Hz - 20 KHz (± 1 dB)
Signal/noise ratio 90 dB (at 1 KHz) with filter
Distortion 0.1 % (at 1 KHz)
Channel separation 75 dB
Disc sizes Diameter: 120 or 80 mm. Thickness: 1.2 mm
AMPLIFIER
Output power
Front Speaker (4Ω) 60 Watts/CH RMS, IEC (total harmonic distortion: 10 %)
Channel separation 60 dB
Signal/noise ratio 70 dB
GENERAL
Power Consumption 35W
Dimensions 230 (D) x 154 (H) x 251 (W) mm
Weight 2.2 Kg
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Samsung Electronics 2-3
Product Specification
2-2-2 MM-G25 Specifications
Basic Specification
RADIO FM
Signal/noise ratio 62 dB
Usable sensitivity 10 dB
Total harmonic
distortion 0.4 %
COMPACT
DISC
PLAYER
Capacity 1 disc
Frequency range 20 Hz - 20 KHz (± 1 dB)
Signal/noise ratio 90 dB (at 1 KHz) with filter
Distortion 0.1 % (at 1 KHz)
Channel separation 75 dB
Disc sizes Diameter: 120 or 80 mm. Thickness: 1.2 mm
AMPLIFIER
Output power
Front Speaker (4Ω) 60 Watts/CH RMS, IEC (total harmonic distortion: 10 %)
Channel separation 60 dB
Signal/noise ratio 70 dB
GENERAL
Power Consumption 35W
Dimensions 230 (D) x 154 (H) x 251 (W) mm
Weight 2.2 Kg
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2-4 Samsung Electronics
Product Specification
2-3 Specifications Analysis
Model Name MM-DG25 MM-G25 MM-DA25
Photo
OUTPUT POWER 120W 120W 50 x 2
FRONT DISPLAY VFD VFD VFD
SLEEP 
DIMMER 
CD/DVD CD/DVD CD CD/DVD
MP3 
USB HOST VIDEO VIDEO 
CD RIPPING   X
EQ/DSP   X
AUDIO IN 
HEAD JACK/MIC 
AM X X X
FM 
RDS 
TUNER MEMORY 20 20 20
REMOTE KEY 60 Key 37 Key 60 Key
UNIVERSAL 
DUAL VOLTAGE 
SPK IMPEDANCE 4Ω 4Ω 4Ω
: application, X: non-application
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Samsung Electronics 2-5
Product Specification
2-4 Accessories
2-4-1 Supplied Accessories
Accessories Item Item code Remark
Remote Control AH59-02147C
Samsung Service
Center
FM Antenna AH39-00320C
User's Manual AH68-02157L
AH68-02157Z
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2-6 Samsung Electronics
MEMO
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Samsung Electronics 1-1
Precaution
1. Precaution
Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards such
as electrical shock and X-rays.
1-1 Safety Precautions
1. Be sure that all of the built-in protective devices are replaced.
2. When reinstalling the chassis and its assemblies, be sure to restore all protective devices, including control
knobs and compartment covers.
3. Make sure that there are no cabinet openings through which people--particularly children--might insert fingers
and contact dangerous voltages. Such openings include the spacing between the picture tube and the cabinet
mask, excessively wide cabinet ventilation slots, and improperly fitted back covers.
4. Design Alteration Warning:
Never alter or add to the mechanical or electrical design of the unit.
Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard.
Also, any design changes or additions will void the manufacturer’s warranty.
5. Leakage Current Hot Check (Fig. 1-1):
Warning: Do not use an isolation transformer during this
test. Use a leakage-current tester or a metering system
that complies with American National Standards Institute
(ANSI C101.1, Leakage Current for Appliances), and
Underwriters Laboratories (UL Publication UL1410,
59.7).
With the unit completely reassembled, plug the AC line
cord directly into a 120V AC outlet. With the unit’s AC
switch first in the ON position and then OFF, measure
the current between a known earth ground (metal water
pipe, etc.) and all exposed metal parts. Examples:
Handle brackets, metal cabinets, screwheads and control shafts. The current measured should not exceed 0.5
milliamp. Reverse the powerplug prongs in the AC outlet and repeat.
6. Insulation Resistance Cold Check:
(1) With the unit’s AC plug disconnected from the AC
source, connect an electrical jumper across the two AC
prongs. (2) Set the power switch to ON. (3) Measure
the resistance between the shorted AC plug and any
exposed metallic parts.
Example: Screwheads, antenna, control shafts or handle
brackets.
If any of the exposed metallic parts has a return path
to the chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the
measured resistance should be “infinite.” If the resistance is outside these limits, a shock hazard might exist.
See Fig. 1-2.
DEVICE
UNDER
TEST
LEAKAGE
CURRENT
TESTER
TEST ALL
EXPOSED METAL
SURFACES
2-WIRE CORD
ALSO TEST WITH
PLUG REVERSED
(USING AC
ADAPTER PLUG
AS REQUIRED)
EARTH
GROUND
(READING
SHOULD NOT BE
ABOVE 0.5mA)
<Fig. 1-1 AC Leakage Test>
Antenna
Terminal
ohm
<Fig. 1-2 Insulation Resistance Test>
Exposed
Metal Part
Ohmmeter
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1-2 Samsung Electronics
Precaution
7. Components, parts and wiring that appear to have overheated or that are otherwise damaged should be
replaced with parts that meet the original specifications. Always determine the cause of damage or overheating,
and correct any potential hazards.
8. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and
especially the AC and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.
Do not change the spacing between components and the printed circuit board. Check the AC power cord for
damage. Make sure that no wires or components touch thermally hot parts.
9. Product Safety Notice:
Some electrical and mechanical parts have special safety-related characteristics which might not be obvious
from visual inspection. These safety features and the protection they give might be lost if the replacement
component differs from the original--even if the replacement is rated for higher voltage, wattage, etc.
10.Components that are critical for safety are indicated in the circuit diagram by shading, or . Use
replacement components that have the same ratings, especially for flame resistance and dielectric strength
specifications. A replacement part that does not have the same safety characteristics as the original might
create shock, fire or other hazards.
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Samsung Electronics 1-3
Precaution
1-2 Servicing Precautions
1. Servicing precautions are printed on the cabinet. Follow them.
2. Always unplug the unit’s AC power cord from the AC power source before attempting to: (a) Remove or reinstall
any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in
parallel with an electrolytic capacitor.
3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes
used. The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such
elements to their original position.
4. After servicing, always check that the screws, components and wiring have been correctly reinstalled.
Make sure that the portion around the serviced part has not been damaged.
5. Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal
panels, input terminals and earphone jacks).
6. Insulation Checking Procedure: Disconnect the power cord from the AC source and turn the power switch ON.
Connect an insulation resistance meter (500V) to the blades of the AC plug.
The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.
7. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies)
unless all solid-state heat sinks are correctly installed.
8. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive
lead; always remove the instrument’s ground lead last.
First read the “Safety Precautions” section of this manual. If some unforeseen circumstance
creates a conflict between the servicing and safety precautions, always follow the safety
precautions.
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1-4 Samsung Electronics
Precaution
1-3 Precautions for Electrostatically Sensitive Devices (ESDs)
1. Some semiconductor (“solid state”) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs). Examples include integrated circuits
and some field-effect transistors. The following techniques will reduce the occurrence of component damage
caused by static electricity.
2. Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from
your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to
remove it prior to applying power--this is an electric shock precaution.)
3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.
4. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.
5. Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.
6. Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these
can accumulate sufficient electrical charge to damage ESDs).
7. Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam,
aluminum foil or other conductive materials.
8. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
9. Minimize body motions when handing unpackaged replacement ESDs. Motions such as brushing clothes
together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.
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Samsung Electronics 5-1
Exploded View & Part List
This Document can not be used without Samsung’s authorization.
5. Exploded View & Part List
5-1 Exploded View ......................................................................................5-2
5-2 Speaker System....................................................................................5-4
5-3 Electrical Part List................................................................................5-5
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5-2 Samsung Electronics
Exploded View & Part List
This Document can not be used without Samsung’s authorization.
5-1 Exploded View
JCW2
AC080
AK170
BCW2
AC501
AD480
AL210
AS503
AK420
AC010
AC020
AC501
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Samsung Electronics 5-3
Exploded View & Part List
This Document can not be used without Samsung’s authorization.
Part List
Loc. No. Part No. Description;Specification Q’ty SNA Remark
AC010 AH64-05041C CABINET FRONT;MM-DG25,ABS+PMMA,120,150,2 1 SA
AC020 AH64-05043E CABINET-BOTTOM;MM-DG25,SECC,T0.8,222,230 1 SA
AC080 AH64-05042C CABINET-TOP 1;MM-DG25,HIPS,106.4,229.4,2 1 SA
AC501 3809-001434 CABLE-FLAT;30V,80C,100MM,12P,1.25MM,UL28 1 SA
AC501 3809-002301 CABLE-FLAT;30V,80C,100mm,27P,1.25mm,UL28 1 SA
AD480 AH64-05047C DOOR-CD;MM-DG25,ABS,2,5.3,9.8,124,BLK, 1 SA
AK170 AH64-05045A KNOB-FUNCTION;MM-DG25,ABS+PMMA,2,14.5,16 1 SA
AK420 AH64-05044A KNOB-VOLUME;MM-DG25,ABS+PMMA,2,60,22.5,B 1 SA
AL210 AH67-00542A LENS-VOLUME;MM-DG25,ABS,WHITE,34.5,2.9,M 1 SA
AS503 AH63-01946A SHEET-LENS;MM-G25,PET,0.05,31,31,BLACK 1 SA
BCW2 AH39-20008M LEAD CONNECTOR ASSY;5264,5395,2P,150MM,1 1 SA
JCW2 AH39-00291A LEAD CONNECTOR ASSY;RCA300,1007#26,6P,15 1 SA
MECHA AH96-00010A ASSY DECK;MAX-DG89,WITH DOOR,CABLE R BEN 1 SA
PCB-FRONT AH92-03027A ASSY PCB FRONT;MINI-DVD/CD,MM-DG25,ASSY 1 SA
PCB-MAIN AH92-03026C ASSY PCB MAIN;MINI-DVD,MM-DG25,South Ame 1 SA
PCB-MPEG AH92-03015A ASSY PCB DECK;MPEG,MAX-G25,DVD,- 1 SA
POWER CORD AC39-10200N CBF-POWER CORD;AT,US,EP2/Y,HOUSING(2P),1 1 SA
A 6003-000275 SCREW-TAPTYPE;BH,+,-,B,M3,L10,ZPC(BLK),S 12 SA
B 6003-001375 SCREW-TAPTYPE;BH,+,-,B,M3,L8,ZPC(WHT),SW 17 SA
C 6003-001464 SCREW-TAPTYPE;BH,+,B,M3,L10,ZPC(WHT) 8 SA
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5-4 Samsung Electronics
Exploded View & Part List
This Document can not be used without Samsung’s authorization.
5-2 Speaker System
Part List
Loc. No. Code No. Description;Specification Q’ty SNA Remark
Front Speaker
(L/R) AH59-02136E SPEAKER SYSTEM-RCL;PS-G25,RCL,2.0CH 1 SA
RL
Front
Speaker (L)
Front
Speaker (R)
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Samsung Electronics 5-5
Exploded View & Part List
This Document can not be used without Samsung’s authorization.
5-3 Electrical Part List
Loc. No. Part No. Description;Specification Q’ty SNA Remark Loc. No. Part No. Description;Specification Q’ty SNA Remark
AH59-02136E SPEAKER SYSTEM-RCL;PS-G25,RCL,2.0CH 1 SNA
AH64-05142A PANEL FRONT;PS-G25,ABS,BLACK HIGH G 2 SNA
AH81-04723D A/S PART-CORE WIRE;PS-DG25,-,-,CORE 2 SA
AH81-04723F A/S PART-FOOT;PS-DG25,-,-,FOOT,-,-, 8 SA
AH81-04723J A/S PART-WOOFER UNIT;PS-G25,WOOFER 2 SA
AH81-04723L A/S PART-CABINET;PS-DG25,WOOD,CABIN 2 SA
AH81-04723P A/S PART-CUSHION;PS-G25,EPS,CUSHION 1 SA
AH81-05179A A/S PART-GRILL W/F;PS-G25,STEEL,-,G 2 SA
AH59-02147C REMOCON-ASSY;MM-G25-XAA,SAMSUNG,173 1 SA
AH83-00005B CKD-CASE-TOP;VR9038,ABS LG121 1 SNA
AH83-00006A CKD-CASE-BOTTOM;VR9038,ABS LG121 1 SNA
AH83-00007B CKD-RUBBER-KEY;VR9038,SILICONE-REBB 1 SNA
AH83-00008A CKD-SPRING-REMOCON(+);VR9038,SUS 30 1 SNA
AH83-00009A CKD-SPRING-REMOCON(-);VR9038,SUS 30 1 SNA
AH83-00010A CKD-SPRING-REMOCON(C);VR9038,SUS 30 1 SNA
AH83-00011A CKD-E PASSED-LABEL;VR9038,40*10mm 1 SNA
AH83-00012A CKD-PE-BAG;VR9038,70*265mm 1 SNA
AH83-00013A CKD-PASSED-LABEL;VR9038,26*10mm 1 SNA
AH83-00014A CKD-PCB-REMOCON;VR9038,KB-1150 T1.6 1 SNA
AH83-00015A CKD-R-CHIP;VR9038,1ohm 1 SNA
AH83-00016A CKD-C-ELEC;VR9038,47uF,16V 1 SNA
AH83-00017A CKD-C-CHIP;VR9038,Y104 1 SNA
AH83-00018A CKD-LED-IR;VR9038,LA503F1CR-1A-02,S 1 SNA
AH83-00019B CKD-IC-MCU;VR9038,ADAM26P20S 1 SNA
AH83-00020A CKD-RESONATOR-CERAMIC;VR9038,3.64MH 1 SNA
AK83-01003A CKD-DOOR-BATTERY;VR9047,ABS(HF-0680 1 SNA
PCB-MPEG AH92-03015A ASSY PCB DECK;MPEG,MAX-G25,DVD,- 1 SA
BIC1 0801-002683 IC-CMOS LOGIC;74HCT245,TRANSCEIVER, 1 SA
C1 2401-003010 C-AL;1000uF,20%,6.3V,GP,TP,8x11.5mm 1 SA
C10 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C11 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C12 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C13 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C14 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C15 2203-000626 C-CER,CHIP;0.022nF,5%,50V,C0G,1608 1 SA
C16 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C17 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C18 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C19 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C2 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C20 2203-000440 C-CER,CHIP;1nF,10%,50V,X7R,1608 1 SA
C21 2203-000669 C-CER,CHIP;27nF,10%,25V,X7R,1608 1 SA
C22 2203-000669 C-CER,CHIP;27nF,10%,25V,X7R,1608 1 SA
C23 2203-000440 C-CER,CHIP;1nF,10%,50V,X7R,1608 1 SA
C24 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C25 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C26 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C27 2203-000332 C-CER,CHIP;0.012nF,5%,50V,C0G,1608 1 SA
C28 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C3 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C4 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C5 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C6 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C7 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5 1 SA
C8 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
C9 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
CN12 3708-001616 CONNECTOR-FPC/FFC/PIC;9P,1mm,STRAIG 1 SA
DAC1 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
DAC10 2203-001607 C-CER,CHIP;0.22nF,5%,50V,NP0,1608 1 SA
DAC11 2401-000918 C-AL;22uF,20%,16V,GP,-,6.3x7,5 1 SA
DAC12 2401-000918 C-AL;22uF,20%,16V,GP,-,6.3x7,5 1 SA
DAC13 2401-000042 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 1 SA
DAC14 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
DAC15 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
DAC16 2401-000042 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 1 SA
DAC2 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 1 SA
DAC3 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
DAC5 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 1 SA
DAC6 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 1 SA
DAC7 2203-000888 C-CER,CHIP;4.7nF,10%,50V,X7R,TP,160 1 SA
DAC8 2203-000888 C-CER,CHIP;4.7nF,10%,50V,X7R,TP,160 1 SA
DAC9 2203-001607 C-CER,CHIP;0.22nF,5%,50V,NP0,1608 1 SA
DAIC1 1002-001294 IC-D/A CONVERTER;PCM1742KE,24BIT,TS 1 SA
DAIC2 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,DUAL,1 1 SA
DAL1 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 1 SA
DAL2 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 1 SA
DAR1 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA
DAR10 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
DAR11 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
DAR12 2007-000082 R-CHIP;3.3Kohm,5%,1/10W,TP,1608 1 SA
DAR13 2007-000082 R-CHIP;3.3Kohm,5%,1/10W,TP,1608 1 SA
DAR14 2007-000123 R-CHIP;1.5Kohm,5%,1/10W,TP,1608 1 SA
DAR15 2007-000123 R-CHIP;1.5Kohm,5%,1/10W,TP,1608 1 SA
DAR16 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
DAR17 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
DAR18 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 1 SA
DAR19 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 1 SA
DAR2 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA
DAR20 2007-000309 R-CHIP;10ohm,5%,1/10W,TP,1608 1 SA
DAR21 2007-000309 R-CHIP;10ohm,5%,1/10W,TP,1608 1 SA
DAR22 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
DAR23 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
DAR3 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA
DAR4 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA
DAR5 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA
DAR6 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA
DAR7 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 1 SA
DAR8 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
DAR9 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
DC10 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 1 SA
DC3 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
DC4 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5 1 SA
DC5 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
DC5A 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
DC6 2401-002042 C-AL;220uF,20%,10V,GP,TP,6.3x11,5 1 SA
DC7 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
DD2 0407-000123 DIODE-ARRAY;DAN202K,80V,100mA,CA2-3 1 SA
DIC1 1003-001978 IC-MOTOR DRIVER;AM5766,HSOP28H,28P, 1 SA
DR1 2007-000029 R-CHIP;0ohm,5%,1/8W,TP,2012 1 SA
DR15 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
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5-6 Samsung Electronics
Exploded View & Part List
Loc. No. Part No. Description;Specification Q’ty SNA Remark Loc. No. Part No. Description;Specification Q’ty SNA Remark
This Document can not be used without Samsung’s authorization.
DR16 2007-000805 R-CHIP;36Kohm,5%,1/10W,TP,1608 1 SA
DR17 2007-000080 R-CHIP;2Kohm,5%,1/10W,TP,1608 1 SA
DR18 2007-000080 R-CHIP;2Kohm,5%,1/10W,TP,1608 1 SA
DR19 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 1 SA
DR19A 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
DR19B 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 1 SA
DR2 2007-000504 R-CHIP;2.2ohm,5%,1/4W,TP,3216 1 SA
DR20 2007-000130 R-CHIP;39Kohm,5%,1/10W,TP,1608 1 SA
DR21 2007-000805 R-CHIP;36Kohm,5%,1/10W,TP,1608 1 SA
EL5 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
EL7 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
EL8 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
EMS1 0406-001128 DIODE-TVS;MLVS-0603-E08,50V 1 SA
EMS2 0406-001128 DIODE-TVS;MLVS-0603-E08,50V 1 SA
FC22 2203-001596 C-CER,CHIP;2200nF,+80-20%,50V,Y5V,2 1 SA
FC23 2203-001596 C-CER,CHIP;2200nF,+80-20%,50V,Y5V,2 1 SA
FC35 2203-001607 C-CER,CHIP;0.22nF,5%,50V,NP0,1608 1 SA
FC36 2203-001607 C-CER,CHIP;0.22nF,5%,50V,NP0,1608 1 SA
FR1 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
FR23 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
FR24 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 1 SA
FR25 2007-001179 R-CHIP;8.2Kohm,5%,1/10W,TP,1608 1 SA
FR26 2007-001179 R-CHIP;8.2Kohm,5%,1/10W,TP,1608 1 SA
FR3 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
HEATSINK AH62-00062J HEAT SINK-MPEG;AL,T2.0 1 SA
HP-JACK 3722-000143 JACK-PHONE;1P(VER),AG,BLK,ANGLE 1 SA
JB1 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 1 SA
JB12 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 1 SA
JB13 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 1 SA
JB2 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 1 SA
JB3 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 1 SA
JB4 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 1 SA
JB5 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 1 SA
JB6 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 1 SA
JB7 2007-000033 R-CHIP;0ohm,5%,1/4W,TP,3216 1 SA
JC1 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
JC12 2401-001092 C-AL;330uF,20%,10V,GP,-,8x11.5,2.5m 1 SA
JC3 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
JC4 2203-005221 C-CER,CHIP;15nF,10%,50V,X7R,1608 1 SA
JC5 2203-005221 C-CER,CHIP;15nF,10%,50V,X7R,1608 1 SA
JC6 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
JC7 2401-001092 C-AL;330uF,20%,10V,GP,-,8x11.5,2.5m 1 SA
JC8 2203-005221 C-CER,CHIP;15nF,10%,50V,X7R,1608 1 SA
JC9 2203-005221 C-CER,CHIP;15nF,10%,50V,X7R,1608 1 SA
JCW1 3708-000249 CONNECTOR-FPC/FFC/PIC;27P,1.25mm,ST 1 SA
JCW2 AH39-00291A LEAD CONNECTOR ASSY;RCA300,1007#26, 1 SA
JL1 2703-000275 INDUCTOR-SMD;33UH,10%,2012 1 SA
JL2 2703-000275 INDUCTOR-SMD;33UH,10%,2012 1 SA
JR1 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SA
JR3 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 1 SA
KB1 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 1 SA
KC1 2203-001596 C-CER,CHIP;2200nF,+80-20%,50V,Y5V,2 1 SA
KC10 2401-000414 C-AL;10uF,20%,16V,GP,TP,4x7,5 1 SA
KC11 2401-001952 C-AL;4.7uF,20%,50V,GP,TP,5x7mm,5mm 1 SA
KC12 2203-000189 C-CER,CHIP;100nF,+80-20%,25V,Y5V,16 1 SA
KC13 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1 1 SA
KC14 2203-000189 C-CER,CHIP;100nF,+80-20%,25V,Y5V,16 1 SA
KC15 2203-001126 C-CER,CHIP;0.68nF,10%,50V,X7R,1608 1 SA
KC16 2203-000189 C-CER,CHIP;100nF,+80-20%,25V,Y5V,16 1 SA
KC17 2203-000189 C-CER,CHIP;100nF,+80-20%,25V,Y5V,16 1 SA
KC18 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1 1 SA
KC19 2203-000189 C-CER,CHIP;100nF,+80-20%,25V,Y5V,16 1 SA
KC2 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,TP,1608 1 SA
KC20 2203-000715 C-CER,CHIP;3.3nF,10%,50V,X7R,1608 1 SA
KC21 2401-001975 C-AL;47uF,20%,16V,GP,TP,5x11mm,5mm 1 SA
KC3 2203-000715 C-CER,CHIP;3.3nF,10%,50V,X7R,1608 1 SA
KC4 2203-001596 C-CER,CHIP;2200nF,+80-20%,50V,Y5V,2 1 SA
KC5 2203-005015 C-CER,CHIP;150nF,+80-20%,16V,Y5V,16 1 SA
KC6 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1 1 SA
KC7 2203-000236 C-CER,CHIP;0.1nF,5%,50V,C0G,1608 1 SA
KC8 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1 1 SA
KC9 2203-001126 C-CER,CHIP;0.68nF,10%,50V,X7R,1608 1 SA
KIC1 1204-002731 IC-AUDIO PROCESSOR;R2A15906SP,SOP,2 1 SA
KR1 2007-000124 R-CHIP;2.2Kohm,5%,1/10W,TP,1608 1 SA
KR10 2007-000134 R-CHIP;33Kohm,5%,1/10W,TP,1608 1 SA
KR11 2007-000134 R-CHIP;33Kohm,5%,1/10W,TP,1608 1 SA
KR2 2007-000129 R-CHIP;27Kohm,5%,1/10W,TP,1608 1 SA
KR22 2007-000092 R-CHIP;15Kohm,5%,1/10W,TP,1608 1 SA
KR23 2007-000092 R-CHIP;15Kohm,5%,1/10W,TP,1608 1 SA
KR24 2007-000092 R-CHIP;15Kohm,5%,1/10W,TP,1608 1 SA
KR3 2007-001010 R-CHIP;51Kohm,5%,1/10W,TP,1608 1 SA
KR4 2007-000092 R-CHIP;15Kohm,5%,1/10W,TP,1608 1 SA
KR5 2007-000092 R-CHIP;15Kohm,5%,1/10W,TP,1608 1 SA
KR6 2007-000092 R-CHIP;15Kohm,5%,1/10W,TP,1608 1 SA
KR7 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 1 SA
KR8 2007-000091 R-CHIP;12Kohm,5%,1/10W,TP,1608 1 SA
KR9 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 1 SA
MC15A 2203-000236 C-CER,CHIP;0.1nF,5%,50V,C0G,1608 1 SA
MC22 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC23 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 1 SA
MC30 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC31 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC32 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC33 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC34 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC35 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC36 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC37 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC38 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC39 2203-000815 C-CER,CHIP;0.033nF,5%,50V,C0G,1608 1 SA
MC40 2203-000440 C-CER,CHIP;1nF,10%,50V,X7R,1608 1 SA
MC41 2203-000440 C-CER,CHIP;1nF,10%,50V,X7R,1608 1 SA
MC42 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC43 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 1 SA
MC44 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC45 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 1 SA
MC46 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 1 SA
MC47 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC48 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC49 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC50 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC51 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 1 SA
MC52 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
MC53 2203-000681 C-CER,CHIP;0.027nF,5%,50V,C0G,1608 1 SA
MC54 2203-000681 C-CER,CHIP;0.027nF,5%,50V,C0G,1608 1 SA
MC55 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 1 SA
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