SenseAir S8 Series User manual

NOTE:
ESD sensitive product.
Use ESD protection equipment.
ESD
!
Particle lter
Document Edition Page
ANO102 1 1 (2)
NOTE:
Handle sensor by holding PCB only.
Never touch sensor with bare hands! Use clean gloves
to avoid dust, grease or other contaminations.
OBA shall not be subjected to any force.
NOTE:
To ensure airow, and quick sensor response time to
changes in environment: do not block particle lter!
Handling Manual
S8
Miniature CO2sensor module
with NDIR technique
Installation and soldering
See IPC-J-STD-001 for acceptable soldering conditions in general.
Selective soldering machine (drag soldering method): Soldering temperature 295°C during three seconds.
Hand soldering: Soldering iron temperature 380°C during two seconds/pin.
Mechanical properties
Please refer to mechanical drawing for detailed specication of dimensions and tolerances.
Layout considerations:
Use cut-outs or slits in main board to reduce mechanical stress to sensor due to board thermal expansion.

Document Edition Page
ANO102 1 2 (2)
1.0≤
1.0≤
1.5≤
[mm]
Storage
Storage in sealed ESD bags.
Storage temperature: -40 ─ 70°C
Requirements on storage environment: In normal IAQ environments corrosive environments are excluded.
Inspection - verication
Transport, handling and assembly may affect calibration. Accuracy is dened after minimum three weeks of
continuous operation with ABC in normal IAQ applications. Different options exist and can be customized
depending on the application. Please, contact SenseAir for further information!
Preferably, please inspect and perform zero calibration after any, or all, transports.
NOTE:
1.0mm≤ minimum distance
from OBA to cover/PCB.
NOTE:
No gluing or moulding on OBA.
NOTE:
1.0mm≤ minimum distance
from OBA to cover/PCB.
[mm][mm]
NOTE:
1.5mm≤ minimum distance
from particle lter to cover/PCB