Sony HXC-100 User manual

HD COLOR CAMERA
HXC-100
SERVICE MANUAL
Volume 1 1st Edition

HXC-100/V1 (E)
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!WARNING
This manual is intended for qualified service personnel only.
To reduce the risk of electric shock, fire or injury, do not perform any servicing other than that
contained in the operating instructions unless you are qualified to do so. Refer all servicing to
qualified service personnel.
!WARNUNG
Die Anleitung ist nur für qualifiziertes Fachpersonal bestimmt.
Alle Wartungsarbeiten dürfen nur von qualifiziertem Fachpersonal ausgeführt werden. Um die
Gefahr eines elektrischen Schlages, Feuergefahr und Verletzungen zu vermeiden, sind bei
Wartungsarbeiten strikt die Angaben in der Anleitung zu befolgen. Andere als die angegeben
Wartungsarbeiten dürfen nur von Personen ausgeführt werden, die eine spezielle Befähigung
dazu besitzen.
!AVERTISSEMENT
Ce manual est destiné uniquement aux personnes compétentes en charge de l’entretien. Afin
de réduire les risques de décharge électrique, d’incendie ou de blessure n’effectuer que les
réparations indiquées dans le mode d’emploi à moins d’être qualifié pour en effectuer d’autres.
Pour toute réparation faire appel à une personne compétente uniquement.

HXC-100/V1 (E)
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type
recommended by the manufacturer.
Dispose of used batteries according to the
manufacturer’s instructions.
Vorsicht!
Explosionsgefahr bei unsachgemäßem Austausch
der Batterie.
Ersatz nur durch denselben oder einen vom
Hersteller empfohlenen ähnlichen Typ. Entsorgung
gebrauchter Batterien nach Angaben des
Herstellers.
ATTENTION
Il y a danger d’explosion s’il y a remplacement
incorrect de la batterie.
Remplacer uniquement avec une batterie du même
type ou d’un type équivalent recommandé par le
constructeur.
Mettre au rebut les batteries usagées conformément
aux instructions du fabricant.
ADVARSEL!
Lithiumbatteri-Eksplosionsfare ved fejlagtig
håndtering.
Udskiftning må kun ske med batteri
af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
ADVARSEL
Lithiumbatteri - Eksplosjonsfare.
Ved utskifting benyttes kun batteri som
anbefalt av apparatfabrikanten.
Brukt batteri returneres
apparatleverandøren.
VARNING
Explosionsfara vid felaktigt batteribyte.
Använd samma batterityp eller en likvärdig typ
som rekommenderas av apparattillverkaren.
Kassera använt batteri enligt gällande
föreskrifter.
VAROITUS
Paristo voi räjähtää jos se on virheellisesti
asennettu.
Vaihda paristo ainoastaan laitevalmistajan
suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden
mukaisesti.
注意
指定以外の電池に交換すると，破裂する危険があり
ます。
使用済の電池は，説明書に従って処理してください。
1 (P)

1
HXC-100/V1 (E)
Table of Contents
Manual Structure
Purpose of this manual.................................................................. 3
Related manuals ............................................................................ 3
Trademarks.................................................................................... 3
1. Service Overview
1-1. Connectors and Cables .................................................... 1-1
1-1-1. Connector Input/Output Signals ............................1-1
1-1-2. Wiring Diagrams for Cables .................................. 1-7
1-1-3. Connection Connectors/Cables.............................. 1-7
1-2. Location of Printed Circuit Boards ................................. 1-8
1-3. Circuit Description ........................................................ 1-10
1-4. Opening/Closing the Side Panel.................................... 1-16
1-5. Description of Onboard LED Indicators ....................... 1-17
1-6. Switch Settings.............................................................. 1-20
1-7. Notes on Flexible Card Wire......................................... 1-22
1-7-1. Disconnecting/Connecting Flexible Card Wire ... 1-22
1-7-2. Forming Flexible Card Wire ................................ 1-24
1-8. Notes on Replacement of Circuit Board .......................1-25
1-8-1. EEPROM Data..................................................... 1-25
1-8-2. Actions to Be Taken during Board Replacement
and after Board Replacement/Repair................... 1-25
1-8-3. Adjustment and Settings when Replacing SY-363
Board.................................................................... 1-26
1-9. Setting Intercoms........................................................... 1-27
1-10. Upgrading the Software Programs ................................ 1-28
1-10-1. Upgrading the Main Program .............................. 1-28
1-10-2. Upgrading the Boot Program............................... 1-29
1-11. Note on Replacement of Lithium Battery ..................... 1-30
1-12. Periodic Check and Maintenance.................................. 1-31
1-12-1. Recommended Replacement Parts....................... 1-31
1-12-2. Periodic Replacement Parts ................................. 1-32
1-12-3. Cleaning the Air Vents ......................................... 1-32
1-13. Description of CCD Block Number..............................1-32
1-14. Optional Fixtures........................................................... 1-33
1-15. Notes on Repair Parts.................................................... 1-33
1-16. Unleaded Solder ............................................................ 1-33
1-17. Installing the Accessory Shoe ....................................... 1-34
2. Replacement of Main Parts
2-1. Replacing the CCD Unit .................................................2-1
2-2. Replacing CCD Unit Boards ........................................... 2-3
2-2-1. DR-632 Board........................................................ 2-3
2-2-2. NR-80 Board.......................................................... 2-3
2-2-3. PA-353 Board......................................................... 2-4
2-2-4. TG-265 Board ........................................................ 2-5
2-2-5. SE-949 Board......................................................... 2-5
2-3. Replacing the DC Fan ..................................................... 2-6
2-4. Replacing Operation Parts............................................... 2-7
2-5. Replacing Connectors ..................................................... 2-8
2-5-1. CCU (TRIAX) Connector...................................... 2-8
2-5-2. SDI Connector ..................................................... 2-10
2-6. Replacing the Power Supply Assembly ........................ 2-11
2-7. Removing/Installing the Connector Panel..................... 2-12
2-8. Replacing Boards .......................................................... 2-13
2-8-1. CD-61 Board........................................................ 2-13
2-8-2. CN-3069 Board.................................................... 2-14
2-8-3. CN-3070 Board.................................................... 2-15
2-8-4. CN-3071 Board.................................................... 2-15
2-8-5. CN-3072 Board.................................................... 2-16
2-8-6. DPR-298 Board ................................................... 2-17
2-8-7. ENC-112 Board ................................................... 2-17
2-8-8. FL-348 Board....................................................... 2-18
2-8-9. LE-355 Board ...................................................... 2-19
2-8-10. MB-1125 Board ................................................... 2-19
2-8-11. MS-91 Board ....................................................... 2-20
2-8-12. PS-755 Board....................................................... 2-20
2-8-13. RE-263 Board ...................................................... 2-20
2-8-14. SW-1404 Board.................................................... 2-21
2-8-15. SW-1405 Board.................................................... 2-21
2-8-16. SW-1406/A Board................................................ 2-22
2-8-17. SW-1407 Board.................................................... 2-22
2-8-18. SY-363 Board....................................................... 2-23
2-8-19. TX-126 Board ...................................................... 2-23

2HXC-100/V1 (E)
3. Electrical Alignment
3-1. Preparations..................................................................... 3-1
3-1-1. Equipment Required .............................................. 3-1
3-1-2. Precautions on Adjustments................................... 3-1
3-1-3. File Data at Adjustment .........................................3-2
3-1-4. Maintaining the Grayscale Chart ........................... 3-2
3-1-5. Setup Menu ............................................................ 3-4
3-1-6. Connection of Equipment ...................................... 3-5
3-1-7. Initial Settings ........................................................ 3-6
3-1-8. Adjustment Items and Setup Menu Items.............. 3-7
3-2. Automatic Adjustment..................................................... 3-8
3-3. Electrical Alignment........................................................ 3-8
3-3-1. BLACK SET Adjustment ...................................... 3-8
3-3-2. Sensitivity Adjustment........................................... 3-9
3-3-3. V-SUB Adjustment .............................................. 3-10
3-3-4. Black Shading Adjustment................................... 3-11
3-3-5. White Shading Adjustment .................................. 3-12
3-3-6. RPN Adjustment .................................................. 3-14
3-4. Video System Level Adjustment................................... 3-15
3-4-1. H/V Ratio Adjustment ......................................... 3-15
3-4-2. Detail Level Adjustment ...................................... 3-16
3-4-3. Crispening Adjustment ........................................ 3-17
3-4-4. Level Dependent Adjustment............................... 3-18
3-4-5. Detail Clip Adjustment ........................................ 3-19
3-4-6. Auto-iris Adjustment ........................................... 3-20
3-4-7. Pedestal Level Adjustment................................... 3-21
3-4-8. Flare Adjustment.................................................. 3-22
3-4-9. Gamma Correction Adjustment ........................... 3-23
3-4-10. Knee Point/Knee Slope Adjustment .................... 3-24
3-4-11. White Clip Level Adjustment .............................. 3-25
3-4-12. File Store.............................................................. 3-25
3-5. ND Offset Adjustment................................................... 3-26
3-6. RPN Compensation ....................................................... 3-27
3-6-1. Automatic Compensation (APR).........................3-27
3-6-2. Manual RPN Compensation Adjustment............. 3-27
3-6-3. Procedures to Be Taken When the RPN
Compensation Fails ............................................. 3-29
3-6-4. Performing Automatic RPN Detection
Effectively............................................................ 3-30
3-6-5. RPN Compensation Flowchart ............................3-31
3-7. Vertical Line Compensation .......................................... 3-32
3-8. TRIAX Transmission System Adjustment .................... 3-34
3-8-1. 1.4-MHz Modulation Circuit Adjustment............ 3-34
3-8-2. Demodulation Circuit Adjustment ....................... 3-35
3-9. TEST OUT Output Level Adjustment...........................3-36
4. File System
4-1. File Structure ................................................................... 4-1
4-2. Operator File ................................................................... 4-2
4-3. Preset Operator File......................................................... 4-3
4-4. Scene File ........................................................................ 4-4
4-5. Reference File ................................................................. 4-6
4-6. Lens File.......................................................................... 4-8
4-7. OHB File ....................................................................... 4-10
4-8. File Items....................................................................... 4-12
5. Setup Menu
5-1. Entering the SERVICE Menu ......................................... 5-1
5-2. Settable Special Functions ..............................................5-1
5-3. Description on SERVICE Menu ..................................... 5-2

3
HXC-100/V1 (E)
Manual Structure
Purpose of this manual
This manual is the service manual Volume 1 for HD Color Camera HXC-100.
This manual describes the information items that premise the service based on the
components parts such as service overview, replacement of main parts, electrical
alignment, file system, SERVICE menu, assuming use of system and service engi-
neers.
Related manuals
Besides this service manual Volume 1 the following manual is available for this unit.
.HXC-100 Operating Instructions (Supplied with HXC-100)
This manual is necessary for application and operation of HXC-100.
Part number: 4-137-704-0X (Japanese)
Part number: 4-137-704-1X (English)
.HXC-100 Operating Instructions CD-ROM (Supplied with UC and CE
model)
This manual is necessary for application and operation of HXC-100.
The CD-ROM contains the English, French, German, Italian, and Spanish operating
instructions (PDF).
Part number: 4-137-707-0X
.Service Manual Volume 2 (Available on request)
Describes the parts list, block diagrams, schematic diagrams and board layouts of
HXC-100.
.“Semiconductor Pin Assignments” CD-ROM (Available on request)
This “Semiconductor Pin Assignments” CD-ROM allows you to search for semi-
conductors used in Broadcast and Professional equipment.
The service manual Volume 2 contains a complete list of semiconductors and their
ID Nos., and thus should be used together with the CD-ROM.
Part number: 9-968-546-06
Trademarks
Trademarks and registered trademarks used in this manual are follows.
.FRAM is a registered trademark of Ramtron International Corporation.

1-1
HXC-100/V1 (E)
Section 1
Service Overview
1-1. Connectors and Cables
1-1-1. Connector Input/Output Signals
![
5
6
7
8
9
0
!-
1
2
3
4
!]
!\
!=
Input/Output Signals
1CCU (TRIAX) connector
J: TAGIMI Triax connector
UC: LEMO Triax connector
CE: Fischer Triax connector
2PROMPTER/GENLOCK/RET
BNC type 75 Z, 1.0 V p-p
3TEST OUT
BNC type 75 Z, 1.0 V p-p
Output Signals
4SDI
HD SDI signal
BTA-S004A compliant
BNC type 75 Z, 0.8 V p-p 1.485 Gbps
5EARPHONE
EARPHONE φ3.5 mm stereo mini jack

1-2 HXC-100/V1 (E)
6INTERCOM (5P FEMALE)
(External view)
No. Signal I/O Specifications
1 Intercom MIC (Y) IN CARBON (_20 dBu, Unbalance)
DYNAMIC (_60 dBu, Balance/Unbalance)
MANUAL (_20/_40/_60 dBu, Balance/Unbalance)
2 Intercom MIC (X) IN
3 GND _GND
4 Intercom Left OUT 11 dBu (VR Max, 250 ZLoad)
5 Intercom Right OUT 11 dBu (VR Max, 250 ZLoad)
(0 dBu = 0.775 Vrms)
7REMOTE (8P FEMALE)
17
6
5
4
3
2
8
(External view)
No. Signal I/O Specifications
for RCP for TRUNK (RS-422A)
1 TX (X) TX1 (+) OUT SERIAL DATA OUT/TRUNK DATA OUT
2 TX (Y) TX1 (_) OUT
3 RX (X) RX1 (+) IN SERIAL DATA IN/TRUNK DATA IN
4 RX (Y) RX1 (_)IN
5 TX-GND _GND for TX
6 UNREG-OUT OUT +10.5 to +17 V dc, 200 mA (max)
7 UNREG-GND _GND for UNREG-OUT
8 RCP-PIX OUT 75 Z, 1.0 V p-p (SD Video)
CHASSIS GND _CHASSIS GND

1-3
HXC-100/V1 (E)
8RET CTRL (6P FEMALE)
(External view)
No. Signal I/O Specifications
1 INCOM MIC-ON/OFF (J, UC)
ENG (CE)
IN Zi >10 kZ, ON : GND, OFF : OPEN
2 NC (J, UC) No connection
PROD (CE) IN Zi >10 kZ, ON : GND, OFF : OPEN
3 GND _
4 RET 3-ON/OFF IN Zi >10 kZ, ON : GND, OFF : OPEN
5 RET 1-ON/OFF IN Zi >10 kZ, ON : GND, OFF : OPEN
6 RET 2-ON/OFF IN Zi >10 kZ, ON : GND, OFF : OPEN
9TRACKER (10P FEMALE)
81
54
10 9 27
63
(External view)
No. Signal I/O Specifications
1 TRACKER LEFT OUT TRACKER Output, _20 dBu unbalance
2 GND (TALK) _GND for TRACKER TALK
3 GND (RECEIVE/PGM/TALLY) _GND for RECEIVE/PGM/TALLY
4 TRACKER RIGHT OUT TRACKER Output, _20 dBu unbalance
5 UNREG OUT +10.5 to 17 V dc
6 GND (UNREG) _GND for UNREG
7 TRACKER TALK (X) IN TRACKER TALK
0 dBu /_20 dBu, High impedance balanced
8 TRACKER TALK (Y) IN
9 G TALLY OUT ON : GND
OFF : High impedance (Open collector)
10 R TALLY OUT ON : GND
OFF : High impedance (Open collector)
(0 dBu = 0.775 Vrms)

1-4 HXC-100/V1 (E)
0DC OUT (4P FEMALE)
1
23
4
(External view)
No. Signal I/O Specifications
1 UNREG GND _GND for UNREG-OUT
2 NC No connection
3 NC No connection
4 UNREG-OUT OUT +10.5 to 17 V dc, 500 mA (max)
!- DC IN (4P MALE)
(External view)
No. Signal I/O Specifications
1 EXT_DC (C) _GND for DC (+)
2 NC No connection
3 NC No connection
4 EXT_DC (H) IN +10.5 to 17 V dc
!= AUDIO IN CH1/CH2 (3P FEMALE)
21
3
(External view)
No. Signal I/O Specifications
1 AUDIO CH1/CH2 (G) __60 dBu, _50 dBu, _40 dBu, _30 dBu, _20 dBu,
LINE (0 dBu) selectable, Balanced
2 AUDIO CH1/CH2 (X) IN
3 AUDIO CH1/CH2 (Y) IN
(0 dBu = 0.775 Vrms)

1-5
HXC-100/V1 (E)
![ FRONT MIC (3P FEMALE)
21
3
(External view)
No. Signal I/O Specifications
1 MIC 1 (G) __60 dBu, _50 dBu, _40 dBu, _30 dBu, _20 dBu,
selectable, Balanced
2 MIC 1 (X) IN
3 MIC 1 (Y) IN
(0 dBu = 0.755 Vrms)
!] VF (20P FEMALE)
(External view)
No. Signal I/O Specifications
1 S-DATA IN/OUT TTL level
2 NC No connection
3 NC No connection
4 SCK OUT TTL level
5 NC No connection
6 NC No connection
7 NC No connection
8 G TALLY OUT ON : 5 V, OFF : GND
9 NC No connection
10 NC No connection
11 NC No connection
12 Y VIDEO OUT 1.0 V p-p, Zo = 75 Z
13 VIDEO GND _GND for VIDEO
14 Pb VIDEO OUT ?0.35 V p-p, Zo = 75 Z
15 Pr VIDEO OUT ?0.35 V p-p, Zo = 75 Z
16 NC No connection
17 R TALLY OUT ON : 5 V, OFF : GND
18 NC No connection
19 UNREG GND _GND for UNREG
20 UNREG OUT +10.5 to +17 V

1-6 HXC-100/V1 (E)
!\ LENS (12P FEMALE)
(External view)
No. Signal I/O Specifications
1 RET VIDEO ENABLE IN ENABLE : 0 V, DISABLE : +5 V or OPEN
2 VTR START/STOP IN ENABLE : 0 V, DISABLE : +5 V or OPEN
3 GND _GND for UNREG
4 SERVO MA/AT OUT AUTO : +5 V, MANU : 0 V or OPEN
5 IRIS POSITION OUT +3.4 V (F16) to +6.2 V (F2.8)
6 UNREG OUT +10.5 to +17 V
7 IRIS POSITION IN +3.4 V (F16) to +6.2 V (F2.8)
8 IRIS AT/MA OUT AUTO IRIS : 0 V, MANUAL IRIS : +5 V
9 EXTENDER ON/OFF IN EX 2 ON : GND
EX 0.8 ON : 30 kZto GND
OFF : OPEN
10 ZOOM POSITION IN WIDE : 2 V, TELE : 7 V
11 FOCUS POSI (/LENS RX) IN %: 7 V, min. : 2 V
12 (LENS TX) OUT
EX 2 ON
30 k7
EX 0.8 ON

1-7
HXC-100/V1 (E)
1-1-2. Wiring Diagrams for Cables
CCA-5 Cable
BrownBrown
Brown
Red
Red
White
White
White
Orange
Black
— 8P CONNECTOR (MALE) —
(WIRING SIDE)
1-1-3. Connection Connectors/Cables
Connection made with the connector panels during installation or service, should be made with the con-
nectors/complete cable assemblies specified in the following list, or equivalent parts.
Connector Name Connector/Cable
CCU (TRIAX) Fujikura φ8.5 mm
Fujikura φ14.5 mm
Belden 9232 φ13.2 mm
TEST OUT
PROMPTER/GENLOCK/RET
SDI
(BNC)
1-569-370-12 Plug, BNC
AUDIO IN CH1/CH2
MIC
(3P FEMALE)
1-508-084-00 XLR, 3P Male or ITT Cannon XLR-3-12C equivalent
RET CONTROL (6P FEMALE) 1-560-078-00 Plug, 6P Male or HIROSE HR10-7PA-6P equivalent
DC OUT (4P FEMALE) 1-566-425-11 Plug, 4P Male or HIROSE HR10A-7P-4P equivalent
INTERCOM (5P FEMALE) 1-508-370-11 XLR, 5P Male or ITT Cannon XLR-5-12C equivalent
DC IN (4P MALE) 1-508-362-00 XLR, 4P Female or ITT Cannon XLR-4-11C equivalent
DC cable CCDD-X2 (2 m)
REMOTE (8P FEMALE) .1-766-848-11 Plug, 8P Male or CCA-5 cable assembly
(CCA-5-10 (10 m)/CCA-5-3 (3 m)) (optional)*2 *3
.REMOTE cable 1-783-372-11 (supplied with RM-B150, 10 m) *1 *2 *3
TRACKER (10P FEMALE) 1-506-522-12 Connector, Round Type 10P
or HIROSE HR10A-10P-10P equivalent
*1: Use of REMOTE cable enables to monitor video signals. (The pin 8 is available for the video signal line.)
The down-converted SD signal is output.
*2: If you want to use a cable of length different from a standard product, contact your local Sony Sales Office/Service Center.
n
*3: The pin 8 of CCA-5 cable is GND (ground).
The pin 8 of REMOTE cable is not GND (ground).
INTERCOM MIC Cable
(1) Balance (HEAD SET menu UNBAL: OFF)
G
XINTERCOM
MIC
Y
(2) Unbalance (HEAD SET menu UNBAL: ON)
XINTERCOM
MIC
Y

1-8 HXC-100/V1 (E)
1-2. Location of Printed Circuit Boards
SY-363
RE-263
CD-61
FL-348 DPR-298
ENC-112
MB-1125
PS-755
SW-1406 (J, UC)
SW-1406A (CE)
SW-1407
CN-3073
CN-3072
CN-3078
CN-3077
SW-1402
SW-1404
SW-1405 MS-91
CN-3074
CN-3075
CN-3076
CN-3069
CN-3701
CN-3070
SW-1403
LE-355
TX-126

1-9
HXC-100/V1 (E)
NR-80
SE-949
DR-632
TG-265
PA-353

1-10 HXC-100/V1 (E)
1-3. Circuit Description
Optical System Block (CCD Unit)
PA-353 Board
This board, consisting of a CCD drive H driver and a sample-hold IC, performs correlated double sam-
pling for signals from the CCD and outputs them differentially. The sample-hold IC adjusts sensitivity.
DR-632 Board
This board consists of a CCD V driver circuit and a buffer for CCD and sample-hold IC drive pulses.
TG-265 Board
This board consists of the following circuits.
.A PLD that generates CCD and sample-hold IC drive pulses and a video amplifier
.A circuit to lock (using PLL) and synchronize the INT PLL H signal generated by the PLD with the
PLL H X and PLL H Y signals sent from the DPR-298 board
The master gain is switched with the step gain in the video amplifier.
NR-80 Board
This board performs CCD defect correction and black shading, etc.
SE-949 Board
This board detects the ND filter disk position.
Signal Processing Block
DPR-298 Board
This board performs main camera signal processing for video signals.
Video signals are digitized by the video amplifier and the A/D converter, and are transferred to the main
process IC (IC401) through the pre-process PLDs (IC301 to 303) for video signal processing.
The sub-process IC (IC501) and the PLD (IC701) perform video processing for the external interface.
This board also contains a serial digital signal converter IC, an analog video D/A converter, and a refer-
ence clock signal generator.
CD-61 Board
This board encodes the main-line signal and decodes the return signal and the prompter signal.
Main-Line Signal
The main-line signal processed on the DPR-298 board is encoded by the encoder and is transferred to the
OFDM modulation IC. This IC multiplexes the main-line signal and the audio signal and a command sent
from the SY-363 board to a 2-channel signal, D/A-converts the 2-channel signal, and then sends it to the
TX-126 board.
Return Signal
This board receives the OFDM-demodulated stream signal from the TX-126 board, and divides it into a
return video signal, prompter signal, audio signal for intercom, and a command signal.
The return video signal is decoded to a baseband signal by the decoder, and is then sent to the DPR-298
board.
The audio signal and the command are sent to the SY-363 board.

1-11
HXC-100/V1 (E)
Prompter Signal
This signal is sent to the MPEG2 decoder on the ENC-112 board for decoding.
In the case of the VBS prompter, the decoded signal is output from the VBS encoder (IC1201) on the
CD-61 board to the SY-363 board.
In the case of the HD prompter, the decoded signal is sent to the DPR-298 board.
ENC-112 Board
This small board is mounted on the CD-61 board, and compresses/decompresses the video signal for
prompter.
IC100 functions for MPEG2 encoding and decoding, but is used only for decoding in this unit.
Signal Transmission Block
TX-126 Board
This board consists of a OFDM signal transmitter/receiver circuit for transmission of the video signal,
audio signal, intercom signal, and commands, and an FM modulation/demodulation circuit for transmis-
sion of the standby intercom signal, synchronizing signal, and TONE signal.
OFDM Signal Transmitter/Receiver Circuit
The OFDM signal output consists of six waves F1 to F6 to transmit video, sub video, microphone, inter-
com, and command signals.
The OFDM signal transmitter, consisting of two systems: LOW band (F1 to F3) and MID band (F4 to F6),
amplifies the OFDM signal generated by the D/A converter on the CD-61 board independently for each
band. The LOW band signal is mixed with the 1.4 MHz FM-modulated signal and is combined with the
MID band signal in the MPX filter (FL601), and then the composite signal is output to the CCU.
The OFDM signal input consists of three waves F7 to F9 to transmit return video, prompter video, inter-
com, PGM, and command signals.
The OFDM signal receiver that is composed independently for F7 to F9 amplifies the waves F7 to F9
output from the HPF of the MPX filter (FL601), selects them by band with the BPF (FL301, FL401, and
FL501), and then processes them.
The level of each signal selected by band is regulated by the step gain amplifier that automatically switch-
es amplifier gain to four steps according to the input level and by the AGC amplifier (IC302, IC402, and
IC502), and then the center frequency of F7 to F9 is converted to 36 MHz by the MIXER IC (IC303,
IC403, and IC503). The converted OFDM signal is converted to TS data by the demodulator ICs (IC603,
IC604, and IC605), and then the serial data is output to the CD-61 board.
FM Modulation and Demodulation Circuits
The FM modulation circuit mixes the standby INCOM signal (STB INCOM TO CCU: CHU →CCU)
and the TONE signal (16.38 kHz), modulates (FM) the mixed signal with a carrier frequency of 1.4 MHz,
and then sends the signal to the CCU.
In the FM demodulation circuit, the FM signal (that is modulated with 1.0 MHz carrier frequency) is
extracted from the RF signal sent from the CCU by the MPX filter (FL601) and the BPF (FL2), and the
FM signal is demodulated to a standby INCOM signal (STB INCOM FR CCU: CCU →CHU) and a
synchronizing signal by the demodulator (IC13 LA2135M).
The demodulated standby INCOM signal is output by the output amplifier at a signal level of 220 mVp-p
(0 dBu input). The synchronizing signal waveform is shaped, and the signal is output with an amplitude of
3.3 Vp-p.
The 1.0 MHz FM-modulated wave is detected by IC16 to check the presence of an FM signal wave.

1-12 HXC-100/V1 (E)
System Control Block
SY-363 Board
This board comprises a CPU, peripheral devices, interfaces, a sync separator circuit, a video amplifier,
and a audio circuit.
CPU and Peripheral Devices
The CPU runs on the program stored in the flash memory (IC118, IC119).
The program can be upgraded with a Memory Stick through the Memory Stick controller (IC128).
The SY-363 board also comprises SRAM chips (IC122, IC123) and a FRAM chip (IC127) to record
system setup data and other data.
The CPU’s serial communication port is used to control the CCD block, and serial lens.
The analog input ports (AN0 to AN7) are used to read analog lens signals (Iris, Focus, Zoom, and Extend-
er), temperatures of the CCD and boards, and audio volume.
The CPU’s external bus (IC109, IC114, and IC125) is used to control the video signal processing LSI and
PLD on the DPR-298 board and the communication LSI and PLD on the CD-61 board through the
MB-1125 board.
In addition to these, this board is provided with a calendar function RTC (IC108). BT101 and C118
function as the RTC backup power supply.
700 Protocol Communication
IC145 performs 700 protocol communication between the camera and the REMOTE connector of the
CCU. Data to be sent for communication with the CCU is multiplexed on the CD-61 board, and is then
sent to the CCU. The REMOTE connector is shared with TRUNK, which are switched by the AT-PLD.
AT-PLD (IC151)
The AT-PLD is a PLD to control external inputs/outputs and the internal devices of the unit. The AT-PLD
has the following functions.
.I2C communication and 3-wire serial communication with the CCD block
.I2C communication with the viewfinder and tally output
.I2C communication with the front boards
.Inputs of rear panel switches, handle switch, and two rotary encoders
.Tally output to the handle and TRACKER connector
.D/A converter output for lens iris control
.CPU’s V interrupt control
.Communication with the character generator on the DPR-298 board
.Fan speed detection
.Monitoring PLD and power status on each board