Sony PMW-300 User manual

SOLID-STATE MEMORY CAMCORDER
PMW-300
SERVICE MANUAL
1st Edition

警告
このマニュアルは， サービス専用です。
お客様が， このマニュアルに記載された設置や保守， 点検， 修理などを行うと感電や火災，
人身事故につながることがあります。
危険をさけるため， サービストレーニングを受けた技術者のみご使用ください。
WARNING
This manual is intended for qualified service personnel only.
To reduce the risk of electric shock, fire or injury, do not perform any servicing other than that
contained in the operating instructions unless you are qualified to do so. Refer all servicing to
qualified service personnel.
WARNUNG
Die Anleitung ist nur für qualifiziertes Fachpersonal bestimmt.
Alle Wartungsarbeiten dürfen nur von qualifiziertem Fachpersonal ausgeführt werden. Um die
Gefahr eines elektrischen Schlages, Feuergefahr und Verletzungen zu vermeiden, sind bei
Wartungsarbeiten strikt die Angaben in der Anleitung zu befolgen. Andere als die angegeben
Wartungsarbeiten dürfen nur von Personen ausgeführt werden, die eine spezielle Befähigung
dazu besitzen.
AVERTISSEMENT
Ce manual est destiné uniquement aux personnes compétentes en charge de l’entretien. Afin
de réduire les risques de décharge électrique, d’incendie ou de blessure n’effectuer que les
réparations indiquées dans le mode d’emploi à moins d’être qualifié pour en effectuer d’autres.
Pour toute réparation faire appel à une personne compétente uniquement.
Model Name Serial No.
PMW-300K1 (UC) 0100001 and Higher
PMW-300K1 (E) 0200001 and Higher
PMW-300K1 (J) 0300001 and Higher
PMW-300K1 (CE) 0400001 and Higher
PMW-300K1 (CN) 0500001 and Higher
PMW-300K2 (UC) 0140001 and Higher
PMW-300K2 (E) 0240001 and Higher
PMW-300K2 (J) 0340001 and Higher
PMW-300K2 (CE) 0440001 and Higher
PMW-300K2 (CN) 0540001 and Higher
PMW-300

CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type rec-
ommended by the manufacturer.
When you dispose of the battery, you must obey the
law in the relative area or country.
ATTENTION
Il y a danger d’explosion s’il y a remplacement incor-
rect de la batterie. Remplacer uniquement avec
une batterie du même type ou d’un type équivalent
recommandé par le constructeur.
Lorsque vous mettez la batterie au rebut, vous devez
respecter la législation en vigueur dans le pays ou la
région où vous vous trouvez.
VORSICHT
Explosionsgefahr bei Verwendung falscher Batterien.
Batterien nur durch den vom Hersteller empfohlenen
oder einen gleichwertigen Typ ersetzen.
Wenn Sie die Batterie entsorgen, müssen Sie die
Gesetze der jeweiligen Region und des jeweiligen
Landes befolgen.
注意
指定以外の電池に交換すると，破裂する危険があります。
必ず指定の電池に交換してください。
使用済みの電池は，国または地域の法令に従って
処理してください。
FÖRSIKTIGHET!
Fara för explosion vid felaktigt placerat batteri.
Byt endast mot samma eller likvärdig typ av batteri,
enligt tillverkarens rekommendationer.
När du kasserar batteriet ska du följa rådande lagar
för regionen eller landet.
PAS PÅ
Fare for eksplosion, hvis batteriet ikke udskiftes
korrekt.
Udskift kun med et batteri af samme eller tilsvarende
type, som er anbefalet af fabrikanten.
Når du bortskaffer batteriet, skal du følge
lovgivningen i det pågældende område eller land.
HUOMIO
Räjähdysvaara, jos akku vaihdetaan virheellisesti.
Vaihda vain samanlaiseen tai vastaavantyyppiseen,
valmistajan suosittelemaan akkuun.
Noudata akun hävittämisessä oman maasi tai
alueesi lakeja.
FORSIKTIG
Eksplosjonsfare hvis feil type batteri settes i.
Bytt ut kun med samme type eller tilsvarende
anbefalt av produsenten.
Kasser batteriet i henhold til gjeldende avfallsregler.
⊼ᛣ
⊼ᛣ
བᵰ᳈ᤶⱘ⬉∴ϡℷ⹂ˈህӮ᳝⟚⚌ⱘ䰽DŽ
া᳈ᤶৠϔ㉏ൟ៪ࠊ䗴ଚ᥼㤤ⱘ⬉∴ൟোDŽ
໘⧚⬉∴ᯊˈᖙ乏䙉ᅜⳌ݇ഄ៪೑ᆊⱘ⊩ᕟDŽ
PMW-300

Table of Contents
Manual Structure
Purpose of this manual....................................................................................................................5
Related manual............................................................................................................................5
Trademarks...............................................................................................................................5
1. Service Overview
1-1. External Connectors...........................................................................................................1-1
1-1-1. Connector Input/Output Signals........................................................................................1-1
1-2. Location of Printed Wiring Boards............................................................................................1-5
1-3. Circuit Description............................................................................................................1-6
1-3-1. CMOS Block and Lens Block..........................................................................................1-6
1-3-2. Camera Block System..................................................................................................1-6
1-3-3. Video Signal System...................................................................................................1-7
1-3-4. Media Recording/Playback System....................................................................................1-7
1-3-5. Audio System...........................................................................................................1-8
1-3-6. System Control........................................................................................................1-10
1-3-7. Power Supply System.................................................................................................1-10
1-3-8. VF Block..............................................................................................................1-12
1-4. Service Tools/Measuring Equipment List...................................................................................1-13
1-4-1. Service Tools..........................................................................................................1-13
1-4-2. Measuring Equipment.................................................................................................1-13
1-5. Updating the Firmware......................................................................................................1-14
1-6. Notes on Service.............................................................................................................1-15
1-6-1. Actions to Be Taken when Replacing Parts and Boards..............................................................1-15
1-6-2. Actions to Be Taken when the Lens Has Been Replaced.............................................................1-15
1-6-3. Notes on Replacing Onboard Parts....................................................................................1-15
1-6-4. Backup Battery........................................................................................................1-15
1-7. Flexible Card Wire and Fine-Wire Coaxial Cable...........................................................................1-16
1-7-1. Disconnecting/Connecting Flexible Card Wire.......................................................................1-16
1-7-2. Disconnecting/Connecting Fine-Wire Coaxial Cable.................................................................1-16
1-8. Lead-free Solder.............................................................................................................1-18
2. Replacement of Main Parts
2-1. General Information for Parts Replacement..................................................................................2-1
2-1-1. Index....................................................................................................................2-1
2-1-2. Basic Knowledge.......................................................................................................2-6
2-1-3. Tightening Torque......................................................................................................2-7
2-2. Zoom Lens....................................................................................................................2-8
2-3. VF Block......................................................................................................................2-9
2-3-1. VF Assembly...........................................................................................................2-9
2-3-2. Loupe Assembly.......................................................................................................2-10
2-3-3. VF Loupe..............................................................................................................2-11
2-3-4. Elbow Assembly......................................................................................................2-12
2-3-5. Elbow Sub Assembly/VF Mirror Assembly..........................................................................2-13
2-3-6. SW-1603 Board/VR-351 Board.......................................................................................2-14
2-3-7. IF-1242 Board/LCD Module..........................................................................................2-16
PMW-300 1

2-3-8. Hinge Assembly.......................................................................................................2-17
2-4. Lithium Battery..............................................................................................................2-19
2-5. Bottom Panel Assembly.....................................................................................................2-20
2-6. Inside Block..................................................................................................................2-21
2-6-1. Inside Panel Assembly................................................................................................2-21
2-6-2. SW-1610/1611/1613 Board...........................................................................................2-22
2-6-3. EN-164/KY-706 Board................................................................................................2-24
2-7. Outside Section..............................................................................................................2-25
2-7-1. Outside Panel Assembly..............................................................................................2-25
2-7-2. Outside IO Assembly..................................................................................................2-26
2-8. Rear Panel Assembly........................................................................................................2-27
2-9. SxS Block....................................................................................................................2-28
2-9-1. SxS Slot Assembly....................................................................................................2-28
2-9-2. SWC-56 Board/EC-78 Board.........................................................................................2-29
2-10. IO Block.....................................................................................................................2-31
2-11. Handle Block.................................................................................................................2-33
2-11-1. Handle Assembly......................................................................................................2-33
2-11-2. Handle U-case Assembly..............................................................................................2-35
2-11-3. KSW-65 Board........................................................................................................2-36
2-11-4. AXM-50 Board........................................................................................................2-37
2-11-5. HN-411 Board.........................................................................................................2-40
2-12. Battery Case Assembly......................................................................................................2-41
2-13. VPR-124 Board..............................................................................................................2-42
2-14. DCP-64 Board...............................................................................................................2-45
2-15. Front Lens Assembly........................................................................................................2-47
2-16. DPR-355 Board..............................................................................................................2-48
2-17. AU-357/RE-320/RE-321/RE-322 Board....................................................................................2-49
2-18. Fan...........................................................................................................................2-52
2-19. Lens Unit.....................................................................................................................2-53
2-20. Prism Block Assembly.......................................................................................................2-55
3. SERVICE Menu
3-1. Outline of SERVICE Menu...................................................................................................3-1
3-1-1. Basic Menu Operations.................................................................................................3-1
3-1-2. SERVICE Menu Structure..............................................................................................3-1
3-1-3. Display/Hide the SERVICE Menu.....................................................................................3-1
3-2. SERVICE Menu List..........................................................................................................3-3
3-2-1. MAINTENANCE Menu................................................................................................3-3
3-2-2. RPN CORRECT Menu.................................................................................................3-3
3-2-3. INFORMATION Menu................................................................................................3-4
3-3. FAN Check....................................................................................................................3-5
3-4. Self-Diagnosis.................................................................................................................3-6
3-4-1. Self-Diagnostic Items...................................................................................................3-6
3-4-2. Executing Self-Diagnosis...............................................................................................3-6
3-4-3. Details of Self-Diagnosis...............................................................................................3-7
3-5. Error Code List...............................................................................................................3-13
4. Electrical Adjustment
4-1. Preparation....................................................................................................................4-1
PMW-300 2

4-1-1. Notes on Adjustments..................................................................................................4-1
4-1-2. Service Tools and Equipment..........................................................................................4-1
4-1-3. Connection..............................................................................................................4-1
4-2. MAINTENANCE Menu......................................................................................................4-2
4-2-1. Test Saw Setting........................................................................................................4-2
4-2-2. Executing Auto Black Balance.........................................................................................4-2
4-2-3. Black Shading Adjustment.............................................................................................4-2
4-2-4. White Shading Adjustment.............................................................................................4-3
4-2-5. Flare Adjustment.......................................................................................................4-4
4-3. RPN CORRECT Menu........................................................................................................4-6
4-3-1. Executing Auto Detection..............................................................................................4-6
4-3-2. Channel Setting.........................................................................................................4-6
4-3-3. Cursor Setting...........................................................................................................4-6
4-3-4. Cursor H Position Setting...............................................................................................4-6
4-3-5. Cursor V Position Setting...............................................................................................4-6
4-3-6. Operating Cursor Next..................................................................................................4-7
4-3-7. Operating Cursor Prev..................................................................................................4-7
4-3-8. Executing Record.......................................................................................................4-7
4-3-9. Executing Delete........................................................................................................4-7
4-3-10. Executing Reset.........................................................................................................4-7
5. Spare Parts
5-1. Note on Repair Parts..........................................................................................................5-1
5-2. Exploded Views...............................................................................................................5-2
5-3. Electrical Parts List..........................................................................................................5-20
5-4. Supplied Accessories........................................................................................................5-23
6. Diagrams
Overall..................................................................................................................................6-1
Frame Wiring...........................................................................................................................6-2
PMW-300 3

Manual Structure
Purpose of this manual
This document is the service manual of Solid-State Memory Camcorder PMW-300.
When servicing the unit, parts are replaced on a board basis in principle. Therefore, this manual includes no circuit
diagram and board layout.
Related manual
The following manual is provided for the unit in addition to this “Service Manual”.
If you need the manual, contact your local Sony Sales Office/Service Center.
• Operating Instructions (Supplied with the unit)
This manual contains information required to operate and maintain the unit.
Trademarks
Trademarks and registered trademarks used in this manual are follows.
• SxS is the registered trademarks or trademarks of the Sony Corporation.
Other system names and product names written in this manual are usually registered trademarks or trademarks of
respective development manufacturers.
PMW-300 5

Section 1
Service Overview
1-1. External Connectors
1-1-1. Connector Input/Output Signals
12
3
4
1
6
13
9
1011
814
2
7
15
5
16
Input/Output Signals
1. GENLOCK IN
BNC type
SD binary sync/HD tri-level sync, 1.0 Vp-p, 75 Ω,
termination
2. VIDEO OUT
BNC type
1.0 Vp-p, 75 Ω, unbalanced
3. SDI OUT 1, 2
SDI signal SMPTE 292 M/259 M compliant
BNC type, 0.8 Vp-p, 75 Ω, 270 Mbps/1.5 Gbps
4. TC IN/OUT
Both IN and OUT, BNC type
TC IN: 0.5 V to 18 Vp-p
TC OUT: 1.0 Vp-p, 75 Ω, unbalanced
5. HEADPHONE
Stereo mini jack
–20.5 dBu (reference level output 16 Ω loaded)
Sound monitor, monaural/stereo selectable
6. DC IN
- External View -
DC jack, Type 4
GNDEXT DC
PMW-300 1-1

7. AUDIO OUT CH-1/CH-2
(0 dBu = 0.775 Vrms)
RCA jack, Female
- External View -
12
No. Signal I/O Specifications
1 LINE (X) OUT Unbalanced, –10 dBu
2 LINE (G) — GND
8. AUDIO IN CH-1/CH-2
1
2
3
- External View -
(0 dBu = 0.775 Vrms)
XLR 3-pin, Female
No. Signal I/O Specifications
1 MIC/LINE
(G)
— –65 dBu to –8 dBu
+4 dBu, selectable
High impedance, Bal-
anced
2 MIC/LINE
(H)
IN
3 MIC/LINE
(C)
IN
9. i.LINK (HDV/DV)
14
- External View -
4-pin, IEEE1394, S400
No. Signal I/O Specifications
1 TPB– IN/OUT Strobe on receive, data on
transmit B (–)
2 TPB+ IN/OUT Strobe on receive, data on
transmit B (+)
3 TPA– IN/OUT Data on receive, strobe on
transmit A (–)
4 TPA+ IN/OUT Data on receive, strobe on
transmit A (+)
10. USB (Mini B)
15
- External View -
5-pin, mini-B, USB2.0 Hi-Speed
No. Signal I/O Specifications
1 VCC — USB Vcc
2 D– IN/OUT I/O USB–
3 D+ IN/OUT I/O USB+
4 ID — NC
5 GND — Ground
11. BATTERY
- External View -
5-pin, Male
12 3 45
No. Signal I/O Specifications
1 BATT (+) — +11 to +17 V dc
2 BATT SCL OUT —
3 BATT SDA IN/OUT —
4 BATT ID
DATA
IN —
5 BATT (–) — —
12. HDMI OUT
- External View -
19-pin, Type A
19 1
18 2
No. Signal I/O Specifications
1 TMDS DATA2+ OUT —
2 TMDS DATA2
SHIELD
— —
3 TMDS DATA2– OUT —
4 TMDS DATA1+ OUT —
5 TMDS DATA1
SHIELD
— —
6 TMDS DATA1– OUT —
7 TMDS DATA0+ OUT —
8 TMDS DATA0
SHIELD
— —
9 TMDS DATA0– OUT —
Continued
PMW-300 1-2

No. Signal I/O Specifications
10 TMDS CLOCK+ OUT —
11 TMDS CLOCK
SHIELD
— —
12 TMDS CLOCK– OUT —
13 CEC (N.C.) — —
14 RESERVED (N.C.) — —
15 SCL OUT —
16 SDA IN/OUT —
17 DDC/CEC GND — —
18 +5V POWER OUT —
19 HPD IN —
13. USB (A)
4-pin, USB (Series A)
- External View -
14
No. Signal I/O Specifications
1 USB_VBUS — USB Vcc
2 DATA (–) IN/OUT I/O USB–
3 DATA (+) IN/OUT I/O USB+
4 GND — Ground
14. LENS REMOTE
- External View -
8-pin, Female
8 1
7 2
6
5 4
3
No. Signal I/O Specifications
1 COMMON
–V
OUT GND
2 ZOOM IN GND: WIDE, 1.66 V:
STOP, 3.33 V: TELE
3 COMMON
+V
OUT 3.33 V
4 COMMON IN 1.66 V
5 REC IN GND: ON, OPEN: OFF
6 RET IN GND: ON, OPEN: OFF
7 SW COM-
MON
OUT GND
8 FRAME
GND
—
15. REMOTE
- External View -
8-pin, Female
No. Signal I/O Specifications
1 TX RCP DA-
TA (X)
OUT SERIAL DATA OUT
2 TX RCP DA-
TA (Y)
OUT SERIAL DATA OUT
3 RX RCP DA-
TA (X)
IN SERIAL DATA IN
4 RX RCP DA-
TA (Y)
IN SERIAL DATA IN
5 VIDEO (G) — GND for VIDEO
6 UNREG +12
V
OUT +11 V to 17 V
7 UNREG
(GND)
— GND for UNREG
8 VIDEO (X) OUT 1.0 V p-p, Zo = 75 Ω
16. VF
- External View -
113
1426
26-pin, Rectangular
No. Signal I/O
1 SHIELD
GND
—
2 LVDS 1- OUT
3 LVDS 2- OUT
4 LVDS 3- OUT
5 LVDS CLK- OUT
6 LVDS 4- OUT
7 LVDS 5- OUT
8 VF ON IN
9 SDAT IN/OUT
10 UNREG OUT
11 UNREG OUT
12 GND —
13 GND —
14 GND —
15 LVDS 1+ OUT
16 LVDS 2+ OUT
17 LVDS 3+ OUT
18 LVDS CLK+ OUT
Continued
PMW-300 1-3

No. Signal I/O
19 LVDS 4+ OUT
20 LVDS 5+ OUT
21 SRX OUT
22 SCLK OUT
23 UNREG OUT
24 UNREG OUT
25 GND —
26 SHIELD
GND
—
PMW-300 1-4

1-2. Location of Printed Wiring Boards
PSW-104
IO-259
RM-241
DC-169
HN-412
SW-1617
IF-1244
IR-60
SE-1139
HN-411
FP-189
KSW-65
A
XM-50
HN-413
AU-357
IO-258
IO-260
SW-1612
DCP-64
DPR-355
RE-321
EC-78
VPR-124
CN-3634
SWC-56
RE-320
RE-322
BI-292
BI-294
SW-1616
SW-1610
EN-164
VR-351
IF-1242
KY-706
SW-1603
SW-1611
SW-1613
IF-1209
PMW-300 1-5

1-3. Circuit Description
1-3-1. CMOS Block and Lens Block
BI-292/294 Boards
The BI-292/294 boards are used to supply power bias/synchronization signals to the CMOS image sensor (ICl) and to
transmit output signals to the VPR-124 board. These boards are provided with a 40-pin connector for transmitting video
signals and a 22-pin power connector.
The CMOS image sensor converts an optical signal to an electrical signal, and its internal A/D converter converts the
electrical signal to a 12-bit digital signal and outputs the digital signal. The BI-292 board is for G channel, and the BI-294
board is for R and B channels (one board each).
This board is also provided with functions as an electronic shutter and an analog gain amplifier. The sync signal and the
serial communication signal from the VPR-124 board are input to the CMOS image sensor.
Various types of decoupling capacitors and damping resistors are also mounted on this board.
The temperature sensor (IC3) of the BI-292 board sends the temperature data to the camera microcomputer SUN (IC702)
on the DCP-64 board through the I2C bus.
SE-1139 Board
The SE-1139 board is connected to the BI-292/294 boards and the DCP-64 board.
CMOS block power is supplied from the DCP-64 board through the SE-1139 board to the BI-292/294 boards.
1-3-2. Camera Block System
VPR-124 Board
The camera block consists of a camera signal processor IC that processes the digital camera signal and a camera
microcomputer that controls the camera signal processor IC, CMOS image sensor, and lens. This block outputs the
digital video signal (Y/C) to the following video signal system (baseband).
The S/N ratio of digital video signals from the BI-292/294 boards is improved by the FPGA (IC100) on the VPR-124
board, and then the digital video signals are input to the camera signal processor IC (IC101: RISE). The camera signal
processor detects values (including video signal average value and peak value) necessary for the camera operations such
as white balance, black balance, focus, iris, knee processing, and then sends the detected values to the camera
microcomputer SUN (IC702) on the DCP-64 board.
The digital video signal enters first the selector circuit that selects digital video signal or the test signal, and is then
transferred to the CMOS image sensor correction circuit and the lens correction circuit.
After that, the digital video signal receives white balance processing, and then the matrix signal and the detail signal are
added to the video signal. The video signal then receives pedestal control, knee correction, gamma correction, and white/
black clip processing. The video signal is output to the baseband processing IC T-ONE (IC900) on the DCP-64 board .
The processing for converting the number of pixels from 1920/1080 to 1440/1080 or from 1920/1080 to 1280/720 is
also performed in the camera signal processor IC (IC101: RISE).
PMW-300 1-6

1-3-3. Video Signal System
DCP-64 Board
The camera microcomputer SUN (IC702) performs the overall camera control, and is controlled by the system
microcomputer (IC2100: MELON) on the DPR-355 board. SUN's peripheral ICs FLASH ROM (IC701) and SDRAM
(IC700) are mounted on the DCP-64 board.
The digital video signal (Y/C) sent from the camera signal processor IC (IC101: RISE) on the VPR-124 board is input
to the baseband processing IC T-ONE (IC900).
The baseband processing IC T-ONE that incorporates scaler functions (supporting multi-format output), OSD, PLL (54
to 74 MHz), and CPU performs baseband processing for video and audio signals.
The baseband signal processed by T-ONE is sent to the router IC ANDV (IC1700), and is then distributed to inputs and
outputs. The following table lists inputs and outputs of the baseband processing IC T-ONE.
Signal name and input/output
• HD/SD digital component signal
Output to the router IC (Used for outputting SDI/HDMI/VIDEO OUT (without characters))
• HD/SD analog component signal
Output through the A/D converter (IC805) to the router IC (Used for outputting SDI/HDMI/VIDEO OUT (with
characters))
• Analog composite signal
Output to the IO-260 board
• Video signal for LCDVF
Output through the CN-3634 board to the LCD
• Video signal for CODEC
Output through the router IC to the CODEC (IC500: NATH) on the DPR-355 board
• Return video signal
Input from the router IC
• Audio interface signal
Output to the AU-357 board
The peripheral circuit of the baseband processing IC T-ONE contains the following circuit and devices.
• Master clock 54 MHz VCXO (X1400) control circuit (including IC1401)
• Mobile DDR SDRAM (IC1100, IC1101)
• FLASH ROM (IC1201) and SDRAM (IC1200) as peripheral ICs of the internal CPU
1-3-4. Media Recording/Playback System
DPR-355 Board
Output signals from the baseband processor IC (IC900) on the DCP-64 board are transferred to the router IC ANDV
(IC1700) and the selector IC CAVS (IC100) on the DPR-355 board, and are then input to the MPEG encoder/decoder
NATH (IC500) or the media block controller (IC1000).
The MPEG encoder/decoder (IC500) is a single-chip MPEG CODEC IC that encodes and decodes high-quality HD
image and audio signals in real time. It has various interfaces with MPEG video bitstream and baseband video input/
output.
The media block controller (IC1000) processes these signals and then files them, and writes the file data to the SxS
memory card through the SWC-56 board or the EC-78 board with the PCI-Express interface.
This controller performs operation opposite to this procedure in the playback mode.
Furthermore, the media block controller (IC1000) has an internal CPU and a USB device controller for router IC CAVS
(IC100) control, serial communication with the system controller (IC2100), and data communication with each controller
through the PCI bus.
PMW-300 1-7

A flash ROM (IC1201, IC1202) is also connected to IC1000, and the CPU program in IC1000 is read at the first startup.
Controlled by the system controller (IC2100) in the same way as other main devices, the DPR-355 board performs video/
audio stream control, SxS memory card access, mass storage operation through the USB connection, and HDV device
control through the i-LINK connection.
Peripheral Devices
SxS memory card slot
The 2-channels PCI-Express signals from the media block controller (IC1000) is input to the two memory card slot
boards (SWC-56, EC-78) through the 0.4 mm-pitch 30-pin fine-wire coaxial cables connected to CN1500 and CN1501.
The 2-channels USB host signals that is output from the media block controller (IC1000) by controlling USB host
controller (IC1401) is sent to the SWC-56 and EC-78 boards through fine-wire coaxial cables in the same way as the
PCI-Express signal. IC1401 is controlled by IC1000 through the PCI bus.
USB device controller
USB device signals input/output from the USB device controller in the media block controller (IC1000) are input to the
USB Mini-B connector (CN1200).
USB host controller
The USB host controller (IC1401) takes charge of one channel for connection to Wi-Fi adapter or USB memory in
addition to two channels of slots for SxS memory card.
The USB host signal input/output from the USB host controller (IC1401) is transferred to the USB TYPE-A connector
(CN1400).
IC1401 is controlled by IC1000 through the PCI bus.
i-LINK controller
The i-LINK signal that is output from the i-LINK controller (IC1400) by controlling IC1400 from the media block
controller (IC1000) is sent to the 4-pin i-LINK connector (CN1401). IC1400 is controlled by IC1000 through the PCI
bus.
1-3-5. Audio System
FP-189 Board
The FP-189 board relays audio signals between the internal microphone and the KSW-65 board.
AXM-50 Board
This connector board contains EXT LINE/MIC input XLR (3P) connectors and LINE/MIC/MIC+48 V input select
switches for two channels.
KSW-65 Board
• The KSW-65 board amplifies the internal microphone by the bias power supply and the head amplifiers (Q104 and
Q106, Q105 and Q107) and outputs balanced audio signals.
• When the LINE input level (+4 dBu) is selected for the EXT input signal, an input attenuator is inserted by switches
(Q109 to Q112, Q116 to Q119).
PMW-300 1-8

IF-1244 Board
The MIC input level (-30 dBu to -60 dBu/10 dB step) of the EXT input signal is common to the LINE input level (+4
dBu: input reference -30 dBu selected), and the gain of this signal is adjusted by the switches (Q302 to Q305, Q308 to
Q309).
A speaker is connected to the speaker connector (CN102).
AU-357 Board
The AU-357 board mainly has motherboard, audio, and RTC functions.
Motherboard function
The AU-357 board relays signals to main boards (DPR-355, DCP-64) and power supply boards (RE-321, RE-322) as
a motherboard function.
Audio signal flow
• Input
Analog audio input signals are transferred from the IF-1244 board through the HN-412 board and the A/D converter
to the FPGA (IC501). The digital playback signal (bidirectional bus) is transferred from the DPR-355 board to the
FPGA.
• Input processing by FPGA
The EE input signal is selected by the FPGA and is transferred to the DSP (IC601). The playback signal is transferred
to the DSP.
• Signal processing
The DSP enables many functions including AGC, Wind Filter, monitor volume, monitor switching control, and
SG Tone.
• Output processing by FPGA
The FPGA receives recording signals and SDI output signals from the DSP and outputs them.
• Output
Monitor output signals (headphone or speaker) are transferred from the DSP through the D/A converter to the SP
amplifier and the HP amplifier.
Headphone output signals are output from the RM-241 board through the HN-412 board, IF-1244 board, HN-413
board, and HN-411 board.
Speaker output signals are output from the IF-1244 board through the HN-412 board.
The media recording signal (bidirectional bus) from the FPGA is sent to the DPR-355 board.
The analog line output (RCA pin output of IO-260 board) signal from the DSP is sent to the DCP-64 board through
the D/A converter and SDI output signals from the FPGA are sent to the DCP-64 board.
Control
• The FPGA is totally controlled by the ARM CPU (IC900) on the DCP-64 board through the SIO interface.
• The DSP is booted (SPI boot) by the FPGA and is controlled via the FPGA.
• Analog audio circuit control signals are output by the FPGA.
Clock
• The audio system clock is supplied from IC900 on the DCP-64 board to the FPGA and is distributed from the FPGA
to the A/D converter and the D/A converter.
PMW-300 1-9

1-3-6. System Control
DPR-355 Board
The 32-bit RISC CPU (ARM) with ARM core is built-in as the system controller (IC2100).
It has the peripheral interface functions of SDRAM, USB, SCI, and I2C. It operates on a 27 MHz clock (X2100).
FLASH ROM (IC2107), SDRAM (IC2106), and EEPROM (IC2301) are mounted as the peripheral ICs.
It performs the system control through serial communication with IC702 (DCP-64 board) of the camera block system,
IC900 (DCP-64 board) of the video signal system, and IC1000 (DPR-355 board) of the media recording/playback system.
Main Functions of the System Controller and Peripherals
Reading operation switch information
Reading the switch information and the LED control are performed by I2C bus communication with each sub-
microprocessor.
• Handle switch: IC202 on the KSW-65 board
• Inside panel switch: IC300 on the KY-706 board
• Power supply switch: IC202 on the RE-320 board
Clock IC (RTC) control
The AU-357 board contains a clock IC (IC700).
The clock IC (IC700) backed up by a lithium coin battery monitors the battery voltage via IC300 on the KY-706 board.
The clock IC (IC700) and the system controller set and read the current clock time through serial communication.
Infrared remote control demodulation
The RM-241 board has an IC (IC100) for REAR infrared remote control signal demodulation, and it receives the
command codes via IC300 on the KY-706 board. The FP-189 board has an IC (IC100) for FRONT infrared remote
control signal demodulation, and it receives the command codes via IC202 on the KSW-65 board.
Info-Battery communication
The Info-Battery of SM bus specifications is supported.
The serial terminal of the battery connector is connected to IC202 on the RE-320 board. This IC202 read the battery
authentication, battery type, remaining power, and other information and send them to the system controller via I2C bus
communication.
Power supply voltage detection
The power supply voltage at the DC IN connector is measured by the A/D port on IC202 on the RE-320 board, and it
is posted to the system controller as the input voltage value.
Power system control
IC202 on the RE-320 board checks that the power switch on the unit is turned ON, and turns on the system controller
of IC2100 (DPR-355 board). After that, it controls the power for each circuit block according to the system controller.
The system controller controls the respective power supply systems in the RE-321 and RE-322 boards according to the
operation mode of the device, via the power supply microcomputer (IC202) on the RE-320 board.
1-3-7. Power Supply System
RE-320/321/322 Boards
The RE-320/321/322 Boards consist of a power circuit (RE-321/322 boards) and a power control unit (RE-320 board).
PMW-300 1-10