
HCD-G2BNiP/G2NiP
2
1. SERVICING NOTES ............................................. 3
2. DISASSEMBLY
2-1. Disassembly Flow........................................................... 10
2-2. Case Block ...................................................................... 11
2-3. Wireless LAN Module (MOD1) ..................................... 11
2-4. Panel (CD Tray) .............................................................. 12
2-5. Panel (Front) Block......................................................... 13
2-6. Panel (Rear) Block.......................................................... 14
2-7. MAIN Board ................................................................... 15
2-8. NET Board...................................................................... 16
2-9. Holder (CD Front) Block................................................ 16
2-10. AMP Board Block........................................................... 17
2-11. AMP Board ..................................................................... 18
2-12. Power Transformer (T901) ............................................. 19
2-13. CD Mechanism Deck Block
(CDM77B-K6BD94DC)................................................. 20
2-14. Belt.................................................................................. 20
2-15. Base Unit (BU-K6BD94DC) .......................................... 21
2-16. Optical Pick-up Block (KSM-213DCP) ......................... 21
2-17. Holder (CD) Block.......................................................... 22
2-18. DCDC Board................................................................... 22
3. TEST MODE ............................................................ 23
4. ELECTRICAL CHECK ......................................... 24
5. DIAGRAMS
5-1. Block Diagram - CD/USB/PANEL Section - ................. 25
5-2. Block Diagram - TUNER/NETWORK Section -........... 26
5-3. Block Diagram - AMP Section -..................................... 27
5-4. Block Diagram - POWER SUPPLY Section -................ 28
5-5. Printed Wiring Board - BD94DC Board - ...................... 30
TABLE OF CONTENTS
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE
WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
5-6. Schematic Diagram - BD94DC Board - ......................... 31
5-7. Printed Wiring Board - TUNER Board - ........................ 32
5-8. Schematic Diagram - TUNER Board - ........................... 32
5-9. Printed Wiring Board - DAB Board (G2BNiP) -............ 33
5-10. Schematic Diagram - DAB Board (G2BNiP) - .............. 33
5-11. Printed Wiring Boards - NETWORK Section -.............. 34
5-12. Schematic Diagram - NETWORK Section - .................. 35
5-13. Printed Wiring Board - MAIN Board (Side A) - ............ 36
5-14. Printed Wiring Board - MAIN Board (Side B) - ............ 37
5-15. Schematic Diagram - MAIN Board (1/3) -..................... 38
5-16. Schematic Diagram - MAIN Board (2/3) -..................... 39
5-17. Schematic Diagram - MAIN Board (3/3) -..................... 40
5-18. Schematic Diagram - AMP Section -.............................. 41
5-19. Printed Wiring Board - AMP Section (1/2) - .................. 42
5-20. Printed Wiring Boards - AMP Section (2/2) -................. 43
5-21. Printed Wiring Boards
- HP/JOG1/JOG2/USB Boards -..................................... 44
5-22. Schematic Diagram - HP/JOG1/JOG2/USB Boards -.... 45
5-23. Printed Wiring Board - FL-NET Board -........................ 46
5-24. Schematic Diagram - FL-NET Board -........................... 47
5-25. Printed Wiring Boards - POWER SUPPLY Section - .... 48
5-26. Schematic Diagram - POWER SUPPLY Section -......... 49
6. EXPLODED VIEWS
6-1. Overall Section ............................................................... 62
6-2. Front Panel Section......................................................... 63
6-3. Rear Panel Section .......................................................... 64
6-4. MAIN Board Section ...................................................... 65
6-5. Chassis Section ............................................................... 66
6-6. CD Mechanism Deck Section
(CDM77B-K6BD94DC)................................................. 67
7. ELECTRICAL PARTS LIST .............................. 68
This appliance is classified as a
CLASS 1 LASER product. This
marking is located on the rear
exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radia-
tion exposure.
Trademarks, etc.
sPARTY STREAMING and PARTY STREAMING
logo are trademarks of Sony Corporation.
sVAIO and VAIO Media are registered trademarks of
Sony Corporation.
sMPEG Layer-3 audio coding technology and patents
licensed from Fraunhofer IIS and Thomson.
sMicrosoft, Windows, Windows Vista, Windows 7™,
Windows Media are trademarks or registered
trademarks of Microsoft Corporation in the United
States and/or other countries.
sMac and Macintosh are trademarks of Apple Inc.
sAirPlay, the AirPlay logo, iPhone, iPod, iPod classic,
iPod nano, and iPod touch are trademarks of Apple Inc.,
registered in the U.S. and other countries.
s“Made for iPod,” and “Made for iPhone” mean that an
electronic accessory has been designed to connect
specifically to iPod or iPhone, respectively, and has
been certified by the developer to meet Apple
performance standards. Apple is not responsible for the
operation of this device or its compliance with safety
and regulatory standards. Please note that the use of this
accessory with iPod or iPhone may affect wireless
performance.
sApple is not responsible for the operation of this device
or its compliance with safety and regulatory standards.
s“ ” is a mark of the Wi-Fi Alliance.
sDLNA®, the DLNA Logo and DLNA CERTIFIED™
are trademarks, service marks, or certification marks of
the Digital Living Network Alliance.
sWake-on-LAN is a trademark of International Business
Machines Corporation in the United States.
sThis product is protected by certain intellectual
property rights of Microsoft Corporation. Use or
distribution of such technology outside of this product
is prohibited without a license from Microsoft or an
authorized Microsoft subsidiary.
sThe system names and product names indicated in this
manual are generally the trademarks or registered
trademarks of the manufacturer.
sIn this manual, Microsoft Windows XP Home Edition,
Microsoft Windows XP Professional and Microsoft
Windows XP Media Center Edition are referred to as
Windows XP.
sIn this manual, Microsoft Windows Vista Home Basic,
Microsoft Windows Vista Home Premium, Microsoft
Windows Vista Business and Microsoft Windows Vista
Ultimate are referred to as Windows Vista.
sIn this manual, Microsoft Windows 7 Starter, Microsoft
Windows 7 Home Premium, Microsoft Windows 7
Professional, Microsoft Windows 7 Ultimate are
referred to as Windows 7.
s™ and ® marks are omitted in this manual.