Sony D-NE700 User manual

D-NE700
AEP Model
UK Model
E Model
Australian Model
Chinese Model
SERVICE MANUAL
PORTABLE CD PLAYER
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-961-338-01
2003L1678-1
© 2003.12
SPECIFICATIONS
Ver 1.0 2003. 12
Model Name Using Similar Mechanism D-NE1
CD Mechanism Type CDM-3325ER2
Optical Pick-up Name DAX-25E
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength: λ= 770 - 800 nm
Emission duration: Continuous
Laser output: Less than 44.6 µW
(This output is the value measured at a distance
of 200 mm from the objective lens surface on
the optical pick-up block with 7 mm aperture.)
D-A conversion
1-bit quartz time-axis control
Frequency response
20 - 20 000 Hz
+1
–2
dB (measured by JEITA)
Output (at 4.5 V input level)
Line output (stereo minijack)
Output level 0.7 V rms at 47 kΩ
Recommended load impedance over 10 kΩ
Headphones (stereo minijack)
Approx. 5 mW + Approx. 5 mW at 16 Ω
(Approx. 1.5 mW + Approx. 1.5 mW at 16 Ω)*
Optical digital output
(optical output connector)
*
Output level: –21 - –15 dBm
Wavelength: 630 - 690 nm at peak level
* European models only
Power requirements
•Two Sony NH-7WMAA rechargeable
batteries: 1.2 V DC × 2
•Two LR6 (size AA) batteries: 1.5 V DC × 2
•AC power adaptor (DC IN 4.5 V jack)
Battery life
1
(approx. hours)
When you use the CD player on a flat and stable
surface.
When LIGHT mode and SOUND mode are set to
“OFF.”
Playing time varies depending on how the CD
player is used.
When using two NH-7WMAA (charged for about
5 hours
2
)
G-PROTECTION
“G-PRO 1” “G-PRO 2”
Audio CD 25 23
ATRAC CD*
3
44 44
MP3 CD*
4
33 33
When using two Sony alkaline batteries LR6
(SG) (produced in Japan)
G-PROTECTION
“G-PRO 1” “G-PRO 2”
Audio CD 55 50
ATRAC CD*
3
86 86
MP3 CD*
4
70 70
*1 Measured value by the standard of JEITA (Japan
Electronics and Information Technology
Industries Association)
*2 Charging time varies depending on how the
rechargeable batteries are used.
*3 Recorded at 48 kbps
*4 Recorded at 128 kbps
*
*
Photo : SILVER
— Continued on next page —

2
D-NE700
TABLE OF CONTENTS
1. SERVICING NOTE ·························································· 4
2. GENERAL ·········································································· 6
3. DISASSEMBLY
3-1. CABINET (MIDDLE) SECTION································· 8
3-2. UPPER LIDASSY, MAIN BOARD,
CD MECHANISM DECK (CDM-3325ER2) ··············· 9
3-3. SWITCH BOARD······················································· 10
3-4. TURN TABLE MOTOR ASSY ·································· 10
3-5. MOTOR ASSY (M902),
OPTICAL PICK-UP (DAX-25E)································ 11
4. ELECTRICAL CHECKING········································· 12
5. DIAGRAMS······································································ 13
5-1. BLOCK DIAGRAM ··················································· 14
5-2. PRINTED WIRING BOARD
– MAIN BOARD (SIDE A) – ····································· 15
5-3. PRINTED WIRING BOARD
– MAIN BOARD (SIDE B) – ····································· 16
5-4. SCHEMATIC DIAGRAMS
– MAIN BOARD (1/4) –············································· 17
5-5. SCHEMATIC DIAGRAMS
– MAIN BOARD (2/4) –············································· 18
5-6. SCHEMATIC DIAGRAMS
– MAIN BOARD (3/4) –············································· 19
5-7. SCHEMATIC DIAGRAMS
– MAIN BOARD (4/4) –············································· 20
5-8. PRINTED WIRING BOARD
– SWITCH BOARD – ················································· 21
5-9. SCHEMATIC DIAGRAMS
– SWITCH BOARD – ················································· 22
5-10.IC PIN FUNCTION DESCRIPTIONS ······················· 25
6. EXPLODEDVIEWS
6-1. OVERALL ASSY ······················································· 30
6-2. UPPER LID BLOCK SECTION ································ 31
6-3. CABINET (UPPER) BLOCK SECTION ··················· 32
6-4. CD MECHANISM DECK SECTION
(CDM-3325ER2)························································· 33
7. ELECTRICAL PARTS LIST ······································· 34
Operating temperature
5°C - 35°C (41°F - 95°F)
Dimensions (w/h/d) (excluding
projecting parts and controls)
Approx. 130.3 ×21.0 ×130.3 mm
(5
1
⁄ 8 ×
27
⁄ 32 ×5
1
⁄ 8 in.)
Mass (excluding accessories)
Approx. 160 g (5.7 oz.)
Supplied accessories
AC power adaptor (1)
Rechargeable batteries (2)
Battery carrying case (1)
Headphones/earphones (1)
Remote control (1)
CD-ROM (SonicStage Simple Burner) (1)
User's guide for SonicStage Simple Burner (1)
Operating instruction
US and foreign patents licensed from Dolby
Laboratories.
Design and specifications are subject to change
without notice.

3
D-NE700
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
CAUTION
• INVISIBLE LASER RADIATION
WHEN OPEN
• DO NOT STARE INTO BEAM OR
VIEW DIRECTLY WITH OPTICAL
INSTRUMENTS
• CLASS 1M INVISIBLE LASER
RADIATION WHEN OPEN
• DO NOT VIEW DIRECTLY WITH
OPTICAL INSTRUMENTS
On AC power adaptor
• Use only the AC power adaptor supplied.
If your CD player is not supplied with the
one, use the AC-E45HG AC power
adaptor. Do not use any otherAC power
adaptor. It may cause a malfunction.
Polarity of the plug
• Do not touch the AC power adaptor with
wet hands.
• Connect the AC power adaptor to an easily
accessible AC outlet. Should you notice an
abnormality in the AC power adaptor,
disconnect it from the AC outlet
immediately.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINEWITH
MARK 0ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.

4
D-NE700 SECTION 1
SERVICING NOTE
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
BEFORE REPLACINGTHE OPTICAL PICK-UP BLOCK
Pleasebesureto check thoroughly the parameters as par the “Optical
Pick-Up Block Checking Procedures” (Part No.: 9-960-027-11)
issued separately before replacing the optical pick-up block.
Note and specifications required to check are given below.
•FOK output: IC601 yg pin
When checking FOK, remove the lead wire to disc motor.
•RF signal P-to-P value: 0.45 to 0.65 Vp-p
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
Fig. 1 Method to push the S820
S820
lever(lid detection)
lever(lid detection)
MAIN BOARD
IC601
IC601 FOK output yg pin
– MAIN BOARD (SIDE B) –
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S820. (push switch type)
The following checking method for the laser diode is operable.
•Method:
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. With a disc not set, turn on the S820 with a screwdriver having a
thin tip as shown in Fig.1.
3. Press the ubutton.
4. Observing the objective lens, check that the laser diode emits
light.
When the laser diode does notemit light, automatic power control
circuit or optical pickup is faulty.
In this operation, the objective lens will move up and down 4
times along with inward motion for the focus search.

5
D-NE700
SERVICE MODE
The following confirmation can be performed when the Service
Mode is set.
1. How to set the Service Mode.
To set the Service Mode, the following method is available.
1) Confirm the set is not powered on.
2) Confirm the following settings.
OPEN/CLOSE detect switch (S820) ........ OFF
Solder Land (SL825) ................................ OPEN
[HOLD] switch (S810)............................... OFF
G-PROTECTION FUNCTION ................ G-PRO1
AVLS FUNCTION ................................... OFF
3) Short the solder land SL824 (TEST) on the MAIN board.
4) Turn on the main power.
2. Operation when the Service Mode is set.
When the Service Mode becomes active, following messages are
displayed onthe remote control LCD.
1) Turn off the power.
2) Open the solder land SL824 (TEST) on the MAIN board.
Note : The solder should be removed clean.
Microcomputer
version display
VP094f
S820
(OPEN/CLOSE)
SL825
(OPEN)
SL824
(TEST)
– MAIN BOARD (SIDE A) –

6
D-NE700 SECTION 2
GENERAL This section is extracted
from instruction manual.
Locating the controls
CD player
1Display
2OPR (operation) lamp
Color of the lamp changes according to
the type of music source being played.
Red: Audio CD, Green: ATRAC3plus/
ATRAC3 file, Orange: MP3 file
For some time after the CD is inserted,
the lamp lights up in red, orange and
green in turn.
This lamp also functions as the HOLD
lamp and the CHG (charge) lamp.
3( group) – button
4( group) + button
5VOL (volume) +*1/–buttons
6i(headphones)/LINE OUT
(OPTICAL)*2 jack
Switch the function of the jack, using the
menu.
7HOLD switch (rear)
Slide the switch in the direction of the
arrow to disable the buttons on the CD
player. etc.
8Operation button
u: play/pause
.: AMS*3/rewind
>: AMS/fast forward
x/CHG: stop/charge
DSPL/MENU: Use to
select menu items and enter
the selection.
9Fbutton
Use to select a file, play mode, etc.
0fbutton
Use to select a file, play mode, etc.
qa DC IN 4.5 V (external power input) jack
qs OPEN switch
Slide the switch to open the CD player
lid.
*1 The button has a tactile dot.
*2 European models only
*3 Automatic Music Sensor
DSPL/MENU

7
D-NE700
1
2
3
4
5
6
7
8
9
q;
Remote control
1VOL (volume) +/– control
Turn to adjust the volume.
2x(stop) button
3Jog lever (.u/ENT >)
u(play/pause)/ENT (enter):
Press during stop to start play, and press
during play to pause play. When
selecting menu items, press to enter the
selection.
Flick toward .or >: AMS, rewind,
fast forward
4Display
5( group) +/– buttons
6Clip
7HOLD switch
Slide the switch in the direction of the
arrow (a yellow mark appears) to disable
the buttons on the remote control.
8DISPLAY button
9P MODE/ button
q; SOUND button
Note
Use only the supplied remote control. You cannot
operate this CD player with the remote control
supplied with other CD players.

8
D-NE700
3-1. CABINET (MIDDLE) SECTION
5 eight screws
1 four screws
7 cabinet (middle) section
4 upper lid assy
2 spring (L open)
3 spring (R open)
6 claw
groove
Note : Follow the disassembly procedure in the numerical order given.
SECTION 3
DISASSEMBLY
Note : Disassemble the unit in the order as shown below.
SWITCH BOARD MOTOR ASSY (M902),
OPTICAL PICK-UP
(DAX-25E)
TURN TABLE MOTOR ASSY
UPPER LID ASSY,
MAIN BOARD,
CD MECHANISM DECK
(CDM-3325ER2)
CABINET (MIDDLE) SECTION
SET

9
D-NE700
0 MAIN board
9 Remove the soldering.
To attach,align the switch
position as shown.
4 flexible board
(15P) (CN601)
6 CD mechanism deck
(CDM-3325ER2)
5 three insurators
7 flexible flat cable
(20P) (CN2001)
8 upper lid assy
qa
1 connector
(CN401)
2 connector
(CN402)
3 spacer
spacer
3-2. UPPER LID ASSY, MAIN BOARD, CD MECHANISM DECK (CDM-3325ER2)

10
D-NE700
1 three screws
(B1.7 × 4)
2 turn table motor assy
(spindle) (M901)
3-3. SWITCH BOARD
3-4.TURNTABLE MOTOR ASSY
1 six screws
2 lid cover
4 menu button
8 SWITCH board
5 flexible flat cable
6 connector (CN2003)
7 liquid crystal display pane
l
3 operation button

11
D-NE700
5 feed screw assy
7 optical pick-up
(DAX-25E)
4 gear B
6 sled spring
2 gear cover
3 motor assy
(sled) (M902)
1 three screws
(B1.7
× 4)
3-5. MOTOR ASSY (M902), OPTICAL PICK-UP (DAX-25E)

12
D-NE700
The CD section adjustments are done automatically in this set.
In case of operation check, confirm that RF level.
Precautions for Check
1. Perform check in the order given.
2. UseYEDS-18 disc (Part No.: 3-702-101-01) unless otherwise
indicated.
3. Power supply voltage requirement : DC4.5V in terminals
(J401).
VOLUME button : Minimum
AVLS FUNCTION : OFF
HOLD switch : OFF
G-PROTECTION FUNCTION : G-PRO1
Checking Location:
RF Level Check
Condition:
• Hold the set in horizontal state.
Connection:
Procedure:
1. Connect the oscilloscope to the test points TP746 (RF) and
TP701 (AGND) on the MAIN board.
2. Set a disc. (YEDS-18)
3. Press the ubutton.
4. Check the oscilloscope waveform is as shown below.
A good eye pattern means that the diamond shape (◊) in the
center of the waveform can be clearly distinguished.
RF Signal referenceWaveform (Eye Pattern)
VOLT/DIV : 100 mV (With the 10:1 probe in use)
TIME/DIV : 500 ns
To watch the eye pattern, set the oscilloscope to AC range and
increasethe verticalsensitivity ofthe oscilloscope for easy watch-
ing.
5. Stop revolving of the disc motor by pressing the xbutton.
Oscilloscope
(AC range)
+
–
MAIN board
TP746 (RF)
TP701 (AGND)
2 k
Ω
RF level
0.45 to 0.65 Vp-p
TP746
(RF)
TP701
(AGND)
– MAIN BOARD (SIDE B) –
IC601
SECTION 4
ELECTRICAL CHECKING

1313
D-NE700
SECTION 5
DIAGRAMS
Note on PrintedWiring Board
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
•MAIN board is multi-layer printed board. However, the pat-
terns of intermediate-layer have not been included in the dia-
gram.
Caution:
Pattern face side: Partson thepattern faceside seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) theparts face are indicated.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS •WAVEFORMS
Note on Schematic Diagram:
•All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or
less are not indicated except for electrolytics and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise specified.
•%: indicates tolerance.
•C: panel designation.
•A: B+ Line.
•Total current is measured with CD installed.
•Power voltage is dc 4.5 V and fed with regulated dc power supply
from terminals (J401).
•Voltages and waveforms are dc with respect to ground in playback
mode.
no mark : CD PLAY
* : Impossible to measure
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler-
ances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler-
ances.
•Circled numbers refer to waveforms.
•Signal path.
J: CD
c: DIGITAL OUT
•Abbreviation
EE : East European model
500 mVp-p
1IC601 if RFAC
100mV/DIV, 400ns/DIV 2IC601 rk XTAO
1V/DIV, 20ns/DIV 3IC801 wk XIN
1V/DIV, 40ns/DIV 4IC403 ef SYNC
1V/DIV, 2us/DIV
59ns 118ns 5.7us
2.1 Vp-p 3.1 Vp-p 2.5 Vp-p
5IC701 e; XTAL
1V/DIV, 20ns/DIV
44ns 3.0 Vp-p
Note: The components identified by mark 0or dotted line
with mark 0are critical for safety.
Replace only with part number specified.

1414
D-NE700
5-1. BLOCK DIAGRAM
+1.4V
REG
• Signal Path
: CD
: DIGITAL OUT
LASER
DIODE
OPTICAL PICK-UP
DAX-25E
PD
LD
M
FOCUS
COIL
TRACKING
COIL
SLED
M902
M901
MOTOR
SPINDLE
MOTOR
F+
F-
T+
T-
S+
S-
SYSTEM CONTROLLER
IC801
VCC
LD
VCC1_2.25V
DETECTOR
COIL/MOTOR
DRIVER
IC403(1/2)
RF
A
E
B
F
PWG
31
INM4
32
FO3
44
PD
RO3
42
FO2
48
RO2
46
FO1
52
RO1
50
COM COM
80
WW
6
VV
4
UU
2
56FI1
55RI1
60FI3
59
RI3
58
FI2
57
RI2
70XBRK
73
APWM
34SYNC
39
DATA
38
CLOK
40LATCH
74
FG
RF AMP,SERVO,DSP,
D/A CONV,D-RAM CONT
IC601
MP3 DECODER
IC701
EEPROM
IC803
RFDC
88
RFAC
84
A
92
B
91
E
89
F
90
X601
16.934MHz
47
XTAO
XTAI
48
SFDR
100
SRDR
99
FFDR
96
FRDR
95
TFDR
98
TRDR
97
MDP
103
C176
104
MDS
102
SDTO
21
CLOK
20
XLAT
23
SENS
22
SCOR
27
FOK
65
R8M
32
GFS
69
XRST
28
D0
D3
A0
A10
XRAS
5
DRAM
IC603
2
XWE
9
XCAS
1
XRAS
A0
A10
2
3
24
25
.
.
.
XWE
4
XCAS
23
BCK
2
PCMD_O
LRCK_O
BCK_O
PCMD
4
LRCK
1
XSK
2
XCS
1
XRESET_I 30
DO
4
DI
3
PI3
13
PCMD_I
LRCK_I
BCK_I
PF4
12
18
XRDE
PI0
15
PI2
14
D0
D3
17
15
13
.
11
.
116
113
.
117
9
12
15
.
19
21
.
8
.
51AOUT1
62
DOUT
56AOUT2
10
FG_I
90
PWRLAT_O
84
MSDTO0_O
83
MSCK0_O
87
XLAT0_O
85
MSDTI0_I
86
SCOR_I
52
FOK_I
28
XIN
53
GFS_I
4
XRST_O
77
HP_PWRSW
65
HP_LIN_SEL_O
6
BEEP_O
AD-DCINMNT
95
JOGKEY_I/FAVKEY_I
36
XLED-DSP1_O
75
LID-SW_I
37
VCC0
OPSTB
OPGSW
4
3
6
5
.
.
.
XSOE
24
88
XSOE_O
7
AMUTE_O
NRST
33
PF0
34
PF3
37
PC1
40
PC2
41
60
XKRESET_O
66
WAKEUP_K_O
11
REQ_I
20
SDIN_I
19
SDOUT_O
PC0
38
18
SDCLK_O
PC3
42
17
SDXLAT_O
67
EEP_CS_O
HG_XSTB_O
12
HG_GUP_O
13
IC702
RSTB35
AD-CHGMNT 93 67
XWAKE_O 32 WAKEUP37
UI
79
VI
78
WI
77
X701
22MHz
29
XTAL
EXTAL
30
108
106
110
109
107
111
SWITCH
Q601
70
OPTPWRCTL_O
9
OPTOUT_I
92
AD-BATMNT
8
LINEOUT_I
31
TSB
OFF
ON
. HOLD
S810
8VCC1 VCC3
TSB
RMKEY
L-IN
5
R-IN
3
BEEP
16
HP/L
2
MUTE1
12
LOUT
14ROUT
HEADPHONE AMP
IC301
(REMOTE)
VCPU
LINE OUT
(OPTICAL)
J302
AEP, UK, EE
EXCEPT AEP, UK, EE
VCC3
RECHARGEABLE
BATTERY
MH-7WMAA
2PCS. 2.4V
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION LR6)
2PCS. 3V
REG
Q408
62
RF1
61
DCIN
63
RS
68
BATM1
53
VD1
5
VD5
1
VD4
12
VIN
8
L5
IC403(2/2)
POWER CONTROL
D402
Q401
CHARGE
SWITCH
65
CHGSW
41
VD3
45
VD23
49
VD12
VCC0VCC0 20
VLGO2
16
VCC218
DC IN 4.5V
J401
D401
D403
69
BATM2
VIN
Q301, 304
B+ SWITCH
VCPUVCPU
IC701 AVD
19
VCC3VCC3 11
CHGMNT
+1.4V
IC806
Q303, 803
32
SWITCH
Q801(1/2)
SWITCH
Q801(2/2)
VCC1VCC1
VCC2
17
L7
10
S820
(OPEN/CLOSE) D2001
OPR
LCD_A0
69
XRD_O
71
XWR_O
72
LCD-XRST_O
73
XLED-DSP2_O
76
AD-KEY2
97
HOLD_I
AD0 - AD7AD0 - AD7
40
FUNCTION
KEY
S2003,2004,
2006,2009,
2011
FUNCTION
KEY
S2005,2007,
2008,2010
LIQUID CRYSTAL
DISPLAY MODULE
AD-KEY1
96
AD-RMKEY
99
MUTING
CONTROL
Q302
LINE OUT
J302
FUNCTION
KEY
S806, 809
Q804
LED DRIVER
44-51

1515
D-NE700
5-2. PRINTEDWIRING BOARD – MAIN BOARD (SIDE A) – • :Uses unleaded solder.
IC603 IC702
IC301
IC803
IC701
IC806
(SIDE A)
2
/
/
or
0
(OPEN / CLOSE)
-
+
1-860-578- (11)
11
(TEST)
(OPEN)
C308
AEP,UK,EE
D401
R817
AEP, UK, EE
C705
L704
L703
VDR702
VDR701
AEP, UK, EE
R312
C629 C628
R202
C310
AEP, UK, EE
AEP, UK, EE
VDR304
VDR309
D306
AEP, UK, EE
EXCEPT AEP, UK, EE
R102
12
A
B
C
D
E
34567 8
• Semiconductor
Location
Ref. No. Location
D302 D-2
D306 B-2
D401 C-7
D402 E-6
D410 D-6
IC301 C-2
IC603 C-3
IC701 D-4
IC702 C-4
IC803 D-4
IC806 D-5
Q301 E-3
Q302 D-2
Q303 B-2
Q304 E-3
Q401 D-6
Q408 D-6
Q601 B-2
Q801 E-4
Q803 D-3
Q804 C-5

1616
D-NE700
5-3. PRINTEDWIRING BOARD – MAIN BOARD (SIDE B) – • : Uses unleaded solder.
IC601
IC801
IC403
ON
OFF
A
SWITCH BOARD
CN2002
(Page 21)
(SIDE B)
(AGND)
1-860-578- (11)
11
C315
C311
C315
C314
C603
R613 R615
R614
VDR804
R849
VDR405
VDR404
VDR406
R499
R458
R401
R402
12
A
B
C
D
E
34567 8
D307
D308
• Semiconductor
Location
Ref. No. Location
D307 C-8
D308 C-8
D403 D-2
D421 C-4
D422 C-3
D801 E-4
IC403 D-3
IC601 C-6
IC801 E-5
Q409 D-2
Q410 D-3
Q411 C-3
Q414 D-2
Q416 D-2
Q418 D-2

1717
D-NE700
5-4. SCHEMATIC DIAGRAMS – MAIN BOARD (1/4) –
(Page 19)
(Page 18)
CN601
C632
TP744
TP745
TP746
TP702
TP747
TP512
TP701
C631
TP742
TP743
TP703
TP739
TP740
TP738
TP741
AP663
AP664
AP666
AP667
AP668
AP670
AP671
AP669
AP665
TP662
C624
R619
R618
R621
C605
C608
R622 R623
R624C609
C612
R662R628 R629
C614
R626
R625
C698
VDR612
C699
R630
SL601
R602
R603
R663
R632
R633
SL602
R605
R604
C616 C617
C601
C611
R670 R610 C610
TP750
R608
TP760
R646
AP695
AP696
AP697
AP698
AP699
AP700
AP702
R607
AP693
FB401
FB402
R404
TP510
AP706
AP707
AP708
AP709
AP710
AP711
C618
C623
AP607
AP608
AP610
IC601
R606
L602
AP639
AP638
AP637
AP636
X601
R611
C627
C604C602
FB601
C619
C621
R648
AP626
FB602
C697
AP628
R649
R645
TP619
TP618
R211
R111
VDR603
VDR602
R615
R642
R641
R640
R639
R638
C606
VDR601
IC603
R302
C607
C613
Q601
R609
C622
L603
L601
R612
15P
0.1
A
B
RF
LD
PD
AGND
22 6.3V
E
F
T-
T+
E+
F-
GFS
FOK
1
2.2k
2.2k
10k
0.1
0.47
1M 220k
10k0.47
100p
47k22k 47k
22p
0
470k
47 4V
0.1
47k
22k
22k
100k
100k
100k
22k
22k
470p 470p
470p
470p
4.7k 100k 10
6.3V
LD-
2.2
LD+
0
0
10
0.1
1
CXD3039AR
470
16.934MHz
0
1
22p10p
22 6.3V
47 6.3V
22k
C629 0.1
C628 0.01
C603 0.1
0.1
0
R613
10k
R614
10k
0
0
0
0
470
470
470
470
470
0.001
41SV44052-100TG
0
0.0047
0.0022uF
2SB167900LSO
0
10
6.3V
47
LRMU
• See page 25 for IC PIN FUNCTION DESCRIPTIONS.

1818
D-NE700
5-5. SCHEMATIC DIAGRAMS – MAIN BOARD (2/4) –
(Page 19)
(Page 17)
(Page 20)
Q301
Q803
AEP,UK,EE
C821
C810
R878
IC301
IC701
Q303
C204
C104
C304
C303
L303
C205
C105
C208
C108
C808
S820
C337
C315
VDR309
C713
C711
C709
C708
X701
L301
C715
C716
C717
C718
C720
VDR702
VDR704
VDR703
VDR701
C703
C701
C706
C710
C712
S810
C714
R303
Q304
FB302
R304
IC806
TP804
IC702
J302
AP715
AP717
AP721
AP719
AP720
AP722
AP718
Q302
C313
R201
R101
R309
R307
R318
D302
C306
C307
C301
C302
C207
C206
C106
C107
C309
R203
R204
R103
R104
R206
FB301
FB202
FB102
R208
AP307
AP102
AP202
TP912
SL825
R873 R316
FB304
FB306
R314
R313
TP306
TP320
TP309
TP308
R731
R707
FB701
TP304
R305
R716
R732
R722
R735
R733
AP704
AP705
AP712
R728 AP713
C702
TP1018
R702
R1001
FB702
R879
AP723
R866
TP907
R106
R108
R701
BCR119W-GEG-E6327
DTC124XE-TL
0.1
1
0
AN17020B-E1
CXR710160-207R
DTA143EUA-T106
AEP,UK,EE
AEP,UK,EE
AEP,UK,EE
EXCEPT AEP,UK,EE
1
1
1
C310 1
0.01
0
470p
470p
0.01
0.01
4700p
0.001
10pF
0.1
0.1
L704 47uH
L703 47uH
0.1
0.1
22MHz
0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
C705
22 4V
0.1
0.1
0.1
10k
2SA1577-T106-QR
22k
XC6206P142MR
XN0NE9200LS0
BCR119W-GEG-E6327
4.7
22k
22k
220k
R102 22k
R202 22k
100k
0
MA2S111-TX
4.7 6.3V
220
4V
47uF
6.3V
22
4V
2.2
10V
220 4V
220 4V
2.2 10V
100
6.3V
C308
22
4V
47
10k
47
10k
4.7
10k
OPEN
OPEN
1M 1k
1k
10k
C314
0.01uF
D307
UDZSTE-175.1B
D306
UDZSTE-175.1B
D308
MA147-TX
RMKEY
COM
1M
100k
AU GND 10
10k
1M
220
10k
1M
100k
47 4V
1.5V
0
470k
0
10k
HOLD
4.7
10k
0

1919
D-NE700
5-6. SCHEMATIC DIAGRAMS – MAIN BOARD (3/4) –
(Page 17) (Page 18)
(Page 20)
L409
L406
C438
CN402
C455
C458
Q411
Q401
C416
L403
C429
C454
C406
C421
C422
C423
C420
C419
BT401
BT402
BT403
C460 VDR402
L401
L402
VDR401
C410
C411
C415
C417
L404
L408
C433
C450
L407
C404
C430
C440
VDR405
VDR406
VDR404
C446
C427
L411
C447
C405
CN401
R422
R424
R429
C435
R452
R415
R453
D421
D422
Q408
R460
R459
TP491
TP492
TP493
TP494
R408
R403 R407
C425 AP403
TP401
C428
R416
R410
D401
FB413
J401
TH401
R420 R433
D403
D402
R413
R411
R412
R418
R423
R402
R417
C426
R485
R486
R487
TP409
R425
TP420
C432
C434
C436 C437
C424
TP498
R438
R480
R406
AP402
AP401
AP404 TP437
R440
R427
R495
R428
R498
R414
TP502
TP511
TP501
AP405
AP433
AP500
TP499
IC403
R419
C403
1
4P
0.0047
1
2SD1664-T100-QR
4.7
0.1
0.1
2.2 16V
0.001
0.001
0.001
0.1
0.1
0.1
1
1
0.22
0.1
1
1
0.1uF
2200p
0.0022
1
0.1
0.001
1
2P
0
0
0
47
6.3V
220k
470k
1M
MA111-TX
MA111-TX
2SA1363-T111-1E
100
100k
U
V
W
COM
0
R499
100
12.2
47 6.3V
VIN
4.7
16V
0
0
R458
0
RB160M-30TR
0
100k
R401
0
0
MA2YD2300LS0
MA2YD2300LS0
22k
220k
47k
100k
220k
100k
100k
220
6.3V
0
0
0
VG
0
VCC0
220
6.3V
10
6.3V
10
6.3V 220 6.3V
4.7
10V
MAIN GND
10k
1M
2.2M
WAKE
1M
100k
0
0
0
0
VCC2
VCC3
VCC1
VCPU
TB2138AFG
47k
470p

2020
D-NE700
5-7. SCHEMATIC DIAGRAMS – MAIN BOARD (4/4) –
(Page 19)
(Page 18)
(Page 22)
C831
C832
C834
C835
C811
C896
C897
VDR802
VDR804
C898
C806
IC803
C899
C812
C805
R801
R448AP905
R813
R812
R889
R970
TP805
AP804
AP803
AP801
R849
R824
R806
TP806
R817
R804
R803
R912
R913
R914
SL802
SL803
SL804
R809
TP810
AP809
AP808AP814
R820
SL805
SL801
D801
R832
R830
R831
R827
R826
R828
TP802
R971
R819
R840
SL806
Q804
TP840 SL824
R880
Q801
TP911
TP801
CN2001
S809
S806
AP802
AP806
AP807
AP817
AP810
AP811
AP812
AP813
TP908
TP909
TP910
TP901
R807
TP803
FB801
R802
R805
R942
FB802
R869
IC801
R808
0.0047
0.0047
0.0047
0.0047
0.001
0.1
0.1
0.1
0
AK6417CH-E2
0.1
0.1
1
0
0D_GND
10k
10k
1
10k
220k
100k
100k
0R816 0
470
R814 1k
2.2k
10k
100k
100k
0
RESET
0
MA4SD0100LS0
1M
470k
1M
4.7k
1M
2.2M
100k
0
10k
XP4214-TXE
TEST TEST
0
XP4501-TXE
20P
0
0
1k
4.7k
100k
0
47k
TMP91CY28FG-2772-01
100k
AEP,UK,EE
LRMU
• See page 28 for IC PIN FUNCTION DESCRIPTIONS.