Sony SPP-N1001 User manual

SPP-N1001/N1003
SERVICE MANUAL
CORDLESS TELEPHONE
SPECIFICATIONS
US Model
SPP-N1003
Canadian Model
SPP-N1001/N1003
E Model
SPP-N1001
Photo : SPP-N1003
General
Operating frequency 902-928 MHz (0.3mW)
Frequency control Crystal-controlled PLL
Operation mode FM, duplex
Operation channel 30 channels
Supplied accessories AC power adaptor AC-T127
Telephone line cord
Headset TL-HD10, for the use of the left ear only (SPP-N1003)
Rechargeable battery pack BP-T50G
Directories (2 sheets)
Handset
Power source Rechargeable battery pack BP-T50
Battery life Standby: Approx. 30 days
Talk: Approx. 10 hours
Dimensions Approx. 2 1/4x 7 1/8x 1 15/16 inches (w/h/d), antenna excluded
(approx. 55 x 180 x 48 mm)
Antenna: Approx. 1 1/8inches (approx. 27 mm) (SPP-N1001)
Antenna: Approx. 1 15/16 inches (approx. 48 mm) (SPP-N1003)
Mass Approx. 5.5 oz (approx. 155 g), battery included
Base unit
Power source DC 9V from AC power adaptor
Battery charging time Approx. 12 hours
Dimensions Approx. 3 7/8x 2 1/8x 8 3/8inches (w/h/d)
(approx. 97 x 52 x 212 mm) (SPP-N1001)
Approx. 4 1/4x 2 1/8x 8 3/8inches (w/h/d), antenna excluded
(approx. 107 x 52 x 212 mm) (SPP-N1003)
Antenna: Approx. 4 5/8inches (approx. 115 mm) (SPP-N1003)
Mass Approx. 7.6 oz (approx. 215 g)
Head set (TL-HD10, for the use of the left ear only) (SPP-N1003)
Cord length Approx. 47 1/4inches (approx. 1.2 m)
Mass Approx. 2 oz (approx. 55 g)
Design and specifications are subjec to change without notice.
9-927-979-12
2001E0200-1
© 2001.5
Sony Corporation
Personal Audio Company
Shinagawa Tec Service Manual Production Group
Ver 1.1 2001.05
with SUPPLEMENT-1
(9-927-979-81)

– 2 –
Specifications ........................................................................... 1
1. GENERAL
Setting up the phone .......................................................... 3
Making and Receiving calls............................................... 4
Speed dialing...................................................................... 4
Paging ................................................................................ 4
Making and Receiving calls using the
head set (SPP-N1003) ........................................................ 5
Mounting the base unit on a wall ....................................... 5
Resetting the digital security code ..................................... 5
2. DISASSEMBLY
2-1. Cabinet (Upper) .......................................................... 6
2-2. Base Main Board ........................................................ 6
2-3. Cabinet (Rear)............................................................. 7
2-4. Jack Board (SPP-N1003 Only)................................... 7
2-5. Hand Main Board ....................................................... 8
3. TEST MODE................................................................... 9
4. ELECTRICAL ADJUSTMENTS
Base Unit Section..............................................................11
Handset section ................................................................ 13
5. DIAGRAMS
5-1. Explanation of IC Terminals..................................... 15
5-2. Block Diagrams (Base Unit Section)........................ 17
5-3. Block Diagrams (Handset Section) .......................... 19
5-4. Printed Wiring Boards (Base Unit Section).............. 21
5-5. Schematic Diagram (Base Unit Section) .................. 23
5-6. Printed Wiring Boards (Handset Section) ................ 25
5-7. Schematic Diagram (Handset Section)..................... 27
5-8. Printed Wiring Boards (Jack Section)
(SPP-N1003 Only) ................................................... 29
5-7. Schematic Diagram (Jack Section)
(SPP-N1003 Only) ................................................... 30
6. EXPLODED VIEWS
6-1. Base Unit Section ..................................................... 31
6-2. Handset Section ........................................................ 32
6-3. Head set Section (SPP-N1003 Only)........................ 33
7. ELECTRICAL PARTS LIST.................................... 34 SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK !OR DOTTED LINEWITH
MARK !ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICALTO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN INTHIS MANUAL OR IN
SUPPLEMENTS PUBLISHED BY SONY.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE !SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.
NOTE ON BASE MAIN BOARD AND HAND MAIN
BOARD REPAIR
As for base main board and hand main board, there are two type
of “A type” and “B type” by difference of diodes (D401 and
D402) used.
Difference parts list
Base main board A type B type
D401, D402 BB145B-115 or 1SV314 (TPH3)
HVU-355BTRF
C451 10PF 12PF
C453 4PF 6PF
C454 8PF 7PF
• D401 and D402 using same thing.
Hand main board A type B type
D401, D402 BB145B-115 or 1SV314 (TPH3)
HVU-355BTRF
C428 10PF 7PF
C450 10PF 12PF
C454 10PF 7PF
L405 15nH 18nH
L409 15nH 18nH
R418 10K 15K
R428 180 220
• D401 and D402 using same thing.

– 3 –
SECTION 1
GENERAL This section is extracted from
instruction manual.

– 4 –

– 5 –
(SPP-N1003)

–6 –
SECTION 2
DISASSEMBLY
Note :Follow the disassembly procedure in the numerical order given.
2-1. CABINET (UPPER)
2-2. BASE MAIN BOARD
rThe equipment can be removed using the following procedure.
Cabinet (upper)Base unit Base main board
Cabinet (rear)Handset Jack board (SPP-N1003 only) Hand main board
2 Claw
1 Screw (+P 3x8)
1 Screws (+P 3x8)
Cabinet (lower
)
Cabinet (lower)
Cabinet (upper)
Cabinet (upper)
3
2 Screws (+BTP 2.6x8)
1 Screws (+BTP 2.6x8)
Cabinet (lower)
4
White
Red
3 Remove solder
Base main board

–7 –
2-3. CABINET (REAR)
2-4. JACK BOARD (SPP-N1003 ONLY)
2 Screws (+BTP 2.6x12)
1
4
3
Claws
3 Claws
Cabinet (front)
Cabinet (rear)
Cabinet (front)
Cabinet (rear)
Lid, battery cas
e
Cabinet (front)
Cabinet (rear)
1 Screws
(+BTP 2.6x8)
2 Claws
3
Cabinet (front)
Cabinet (rear)
Jack board
CN801

–8 –
Cabinet (front)
Cover (antenna)
4
Black
Red
1 Remove solder
2 Screws (+BTP 2.6x10)
Hand main board
3
2-5. HAND MAIN BOARD

–9 –
SECTION 3
TEST MODE
BASE UNIT MANUALTEST MODE
1 Base Unit ManualTest Mode Startup Procedure
1. Turn on the power while holding down the HANDSET LO-
CATOR key, then perform the following steps within 10 sec-
onds.
2. Set Charge ON (Place the handset on the base unit).
3. Set Charge OFF (Remove the handset).
4. Set Charge ON.
5. Set Charge OFF.
6. Release the HANDSET LOCATOR key.
7. Press the HANDSET LOCATOR key twice. (Transmit power
turns on. Default Channel = 1)
2 Changing Channels
The current channel number increases by 1 each time the HAND-
SET LOCATOR key is pressed after shifting to test mode. Chan-
nel 1 is the default channel.
After being in CH32, pressing the HANDSET LOCATOR key
returns to CH1.
CHANNEL MAPHandset TX Handset RX
CH Base RX Base RX
(MHz) (MHz)
1 902,200 924,900
2 902,300 925,000
3 902,400 925,100
4 902,500 925,200
5 902,600 925,300
6 902,700 925,400
7 902,800 925,500
8 902,900 925,600
9 903,000 925,700
10 903,100 925,800
11 903,200 925,900
12 903,300 926,000
13 903,400 926,100
14 903,500 926,200
15 903,600 926,300
16 903,700 926,400
17 903,800 926,500
18 903,900 926,600
19 904,000 926,700
20 904,100 926,800
21 904,200 926,900
22 904,300 927,000
23 904,400 927,100
24 904,500 927,200
25 904,600 927,300
26 904,700 927,400
27 904,800 927,500
28 904,900 927,600
29 905,000 927,700
30 905,100 927,800
31 902,000 924,700
32 905,300 928,000
HANDSET MANUALTEST MODE
1 Handset ManualTest Mode Startup Procedure
1. Hold down the TALK key for at least 2 seconds while pressing
the 0 and 1 keys in idle.
2. The call bell rings for half a second (500 msec) as test mode
starts up.
(Status after startup is called Test Idle mode).
2 Detecting Electromagnetic Intensity (RSSI)
Aftertest mode startsup, electromagnetic intensity(RSSI)is mea-
sured. The TALK led lights up if the electromagnetic intensity
exceeds a certain level (Level indicating RF during normal re-
ceive scanning).
3 Key operation inTest Idle Mode
The following keys function as shown during test idle mode.
KEY DESCRIPTION REMARKS
CHANNEL Increments channel by +1 each
timepressed. Pressing Default CH=1
CHANNEL after being in CH32
returns to CH1.
1 Transmit power on Default TX
4 Transmit power off = off
2 Receive mute off Default RX
5 Receive mute on mute = off
3 RSSI sensitivity setting HIGH Default level
6 RSSI sensitivity setting HIGH = High
SPEED Half-mute off
DIAL Default
REDIAL/ Half-mute on HMUTE = off
PAUSE Telephone receiver volume Default volume
FLASH selector (HIGH tMID t
NORMAL tHIGH) = High
OFF Quit test mode
Using the following keys in test idle mode shifts operation to a
specific mode. Shifting to these modes disables the key operations
in the above table. Pressing the OFF key returns to test idle mode.
KEY DESCRIPTION REMARKS
7Power saving measurement
mode 1 (in call status)
8Power saving measurement
mode 2 (in call receive)
9Power saving measurement
mode 3 (in standby)
(STAR) Shifts to destination check mode
# (POUND) Shifts to battery voltage test
mode

–10 –
4 Power Saving Measurement Mode
To enter power saving measurement mode, press one of the 7, 8,
9 keys while in test idle mode. Pressing the OFF key after enter-
ing power saving measurement mode returns the operation to test
idle mode.
KEY DESCRIPTION TALK Lighted
LED Key
7 Shifts to same status as during a call ON ON
8Shifts to same status as in call OFF OFF
receive. (transmit off)
9Shifts to same status as during OFF OFF
standby. (transmit/receive off)
5 Destination Check
To enter destination check mode, press the (star) key in test
idle mode. Pressing the OFF key after entering destination check
mode returns the operation to test idle mode.
Battery Lighted Key
Mexican model ON ON
Cenreal & South American model OFF OFF
US, Canadian model BLINK OFF
6 BatteryVoltageTest Mode
To enter battery voltage test mode, press the # (pound) key in test
idle mode. In this mode, the TALK LED lights up when the battery
is low.
Pressing the OFF key after entering battery voltage test mode re-
turns the operation to test idle mode.
Battery low TALK LED on
Battery OK TALK LED off
7 Data Reset
Recharging the handset while in test idle mode, resets the secu-
rity code (handset ID), quick-dial & redial information, and dif-
ferent settings.

–11 –
SECTION 4
ELECTRICAL ADJUSTMENTS
BASE UNITTX ADJUSTMENT
1. Transmit Mode Setting Procedure
1. Start up the test mode according to the “Manual Test Mode
Startup Procedure”. (See page 9)
2. Press the PAGE key (HANDSET LOCATOR) and make the
channel settings. (Default CH=1)
3. Ground TP201 (RING DET).
2. TX FrequencyAdjustment
Connect the frequency counter to TP406 (ANT), and adjust the
TX frequency by turning CT501.
Standard value : Transmit frequency ±1kHz
BASE UNIT BASE UNIT RX ADJUSTMENT
1. Transmit Mode Setting Procedure
1. Start up the test mode according to the Manual Test Mode
Startup Procedure. (See page 9)
2. Press the PAGE key (HANDSET LOCATOR) and make the
channel settings. (Default CH=1)
2. RX Carrier Adjustment
1. Start up the test mode according to the Manual Test Mode.
2. Set the signal generator to Setting1 and the audio analyzer to
DIST. mode. Turn T401 and adjust so that the output level is
near maximum and the DC voltage of TP404 is 1.1 volts.
Check that the output level on the audio analyzer is within the
standard value.
Standard value: 210 to 410 mV.
Also check on an oscilloscope that there is no waveform dis-
tortion on the demodulated signal.
3. RSSI (H) Sensitivity Adjustment
Set the signal generator to Setting 2 and adjust RV401 so that the
RSSI output voltage is 220 mV.
SIGNAL GENERATOR SETTINGS
Setting Frequency RF Output Modulation Modulation
No. (MHz) (dBµVEMF) (kHzINT) Factor
Setting 1 60 1 20kHz
Setting 2 no signal - -

–12 –
TP406
(ANT)
TP407
(RF GND)
TP101
TP102
(GND)
(VDD)
TP404
(AF OUT)
TP401
(RSSI)
IC401
CT501: TX Frequency adjustmernt
TP401
(RSSI)
T401 : RX Carrier adjustment
IC401 t;
IC401 rl
RV401 :
RSSI (H) Sensitivity adjustmen
t
BASE MAIN BOARD (SIDE B)
BASE MAIN BOARD (SIDE A)
frequency counter
audio analyzer
oscilloscope
FM RF signal
generator
TP406
(ANT)
TP407
(RF GND)
TP406
(ANT)
TP407
(RF GND)
TP406
(ANT)
TP407
(RF GND)
TP404
(AF OUT)
digital
voltmeter
digital
voltmeter
Connection and adjustment location :

–13 –
HANDSET
HANDSETTX ADJUSTMENT
1 Initial Settings
1. Start up test mode according to the “Manual Test Mode Startup
Procedure”. (See page 9)
2. Press the CHANNEL key and make the channel settings. (De-
fault CH=1)
3. Press the 1 key and set TX to ON.
2. TX FrequencyAdjustment
Connect the frequency counter to TP401 (ANT), and adjust the
TX frequency by turning CT501.
Standard value: Transmit frequency ±1 kHz
HANDSET RX CHECK
1 Initial Settings
1. Start up test mode according to the “Manual Test Mode Startup
Procedure”. (See page 9)
2. Press the CHANNEL key and make the channel settings. (De-
fault CH=1)
2. RX Carrier Adjustment
Set the signal generator to Setting1 and set the audio analyzer to
AC LEVEL mode. Turn T401 and adjust so that the output level
is near maximum and so the DC voltage of adjust TP403 (AF
OUT) is 1.1 V.
Check that the output level on the audio analyzer is within the
standard value.
Standard value: 190 to 320 mV.
Also check on an oscilloscope that there is no waveform distor-
tion on the demodulated signal.
SIGNAL GENERATOR SETTINGS
Setting Frequency RF Output Modulation Modulation
No. (MHz) (dBµVEMF) (kHzINT) Factor
Setting 1 60 1 20kHz
Setting 2 no signal - -

–14 –
TP408
(SPR)
TP409
(SPB)
TP401
(ANT)
TP402
(RF GND)
TP403
(AF OUT)
TP408 (SPR)
TP409 (SPB)
150
Ω
TP403
(AF OUT)
CT501: TX Frequency adjustmernt
T401 :
RX Carrier adjustment
RV401 :
RSSI (H) Sensitivity adjustment
HAND MAIN BOARD (SIDE A)
HAND MAIN BOARD (SIDE B)
TP401 (ANT)
TP402 (RF GND)
TP401
(ANT)
TP402
(RF GND)
audio analyzer
digital
voltmeter
FM RF signal
generator
frequency counte
r
oscilloscope
Connection and adjustment location :

–15 –
SECTION 5
DIAGRAMS
5-1. EXPLANATION OF ICTERMINALS
IC501 TMP87CH847U-1K06 (BASE UNITSYSTEM CONTROL)
Pin No. Pin name I/O Description
1 RF CLK O Serial clock output.
2 DTMF LA O Latch output for DTMF IC.
3 QUICK CHG O Quick charge control output.
4 RX DATA I RX data input.
5–––––––––– —Not used (OPEN).
6 MBR I Pulse Make/Break select input.
7 LINE LED O LED drive output.
8 –12 DTMF 0 –4 O Soft DTMF output 0-4.
13 –––––––––– —Not used (OPEN).
14 RESET I Reset input.
15 X IN I System clock input (8MHz).
16 X OUT O System clock output (8MHz).
17 VSS (VASS) —Ground terminal.
18 VAREF —A/D converter reference voltage.
19 –––––––––– —Not used (OPEN).
20 DTMF CD O Disable output for DTMF IC.
21 –––––––––– —Not used (OPEN).
22 DP O Pulse dial output.
23 BATT V I Power voltage input.
24 RSSI I RSSI volatile detection input.
25 PAGE KEY I Key input.
26 TX POWER O TX power control output.
27 –––––––––– —Not used (OPEN).
28 TX VCO O TX VCO power supply control output.
29 –––––––––– —Not used (OPEN).
30 RING DET I Ringer detection input.
31 CHG IN I Battery charge detection input.
32 TX DATA PU O TX data terminal pull-up output.
33 TX DATA O TX data output.
34 TEST IN2 I Test mode input.
35 TEST IN1 I Test mode terminal. “H”: Test mode. “L”: Normal mode
36 TEST OUT O Test mode output.
37 POWER DET I Power failure detection input.
38 –––––––––– —Not used (OPEN).
39 H MUTE O Half mute control output.
40 VDD —power supply terminal.
41 DTMF DATA O DTMF IC control output.
42 DTMF CLK O Clock output for DTMF IC.
43 RF DATA O RF IC control output.
44 RF STB O Strobe output for RF IC control.

–16 –
IC501 TMP87CH47LU-1K07 (HAND SETSYSTEM CONTROL)
Pin No. Pin name I/O Description
1 RF CLK O Serial clock output.
2 RING OUT O Beep signal output.
3 RING VOL O Beep signal volume control
4 RX DATA I RX data input.
5 VOL SW2 I VOL switch input 1.
6 VOL SW1 I VOL switch input 2.
7 TALK LED O TALK/BATT LED control output.
8 –12 KEY COL 0 –4 I Key matrix input 1-4.
13 TEST I Test terminal.
14 RESET I Reset terminal.
15 X IN I System clock input (4MHz).
16 X OUT O System clock output (4MHz).
17 GND —Ground terminal.
18 VAREF —A/D converter reference voltage.
19 –22 KEY ROW 0 –3 O Key matrix output 0-3.
23 MODEL I Destination select input.
24 RSSI I RSSI voltage detection input.
25 BAT ALM I Battery low voltage detection input.
26 TX POW O TX power control output.
27 TEST OUT O Test mode command output.
28 SPEAKER MUTE O Mute signal output for head set. (N1003)
29 RX POW O RX power control output.
30 POW DET I Power failure detection input.
31 CHG IN I Battery charge detection input.
32 TX DATA PU O TX data terminal pull-up output.
33 TX DATA O TX data output.
34 KEY LED O Back light LED control output.
35 TEST IN I Test mode terminal.
36 CCHG O power supply control output for intermittent operation.
37 WAKE UP I wake up input.
38 DIS CHG O Capacitor discharge output.
39 HMUTE O Half mute control output.
40 VDD —power supply terminal.
41 N/A —Not used (OPEN).
42 TX VCO O TX VCO power supply control output.
43 RF DATA O RF IC control output.
44 RF STB O Strobe output for RF IC control.

– 17 – – 18 –
SPP-N1001/N1003
5-2. BLOCK DIAGRAMS (BASE UNIT SECTION)
• Signal path.
N: RX
O: TX
P: bell
• Abbreviation
CND : Canadian
C&SA : Central and South America

– 19 – – 20 –
SPP-N1001/N1003
5-3. BLOCK DIAGRAMS (HANDSET SECTION)
• Signal path.
N: RX
O: TX
P: bell
• Abbreviation
CND : Canadian
C&SA : Central and South America

– 21 – – 22 –
SPP-N1001/N1003
5-4. PRINTEDWIRING BOARDS (BASE UNIT SECTION)
D101 C-5
D201 D-2
D203 D-4
D204 D-4
D211 G-5
D301 G-5
D302 F-11
D401 E-10
D402 G-6
D403 F-7
D502 E-4
D503 D-3
IC401 F-10
IC501 E-8
IC502 D-7
Q101 B-5
Q211 B-4
Q212 D-3
Q213 E-3
Q301 G-4
Q303 G-6
Q304 G-5
Q401 F-12
Q402 G-11
Q403 F-11
Q404 E-11
Q405 E-11
Q406 G-11
Q407 F-5
Q501 C-8
Q502 E-7
Ref.No. Location
zSemiconductor
Location
02
LINE DC IN 9V
J101
T401
D101
S2
HANDSET
LOCATOR
23 4 5 6 7 89 10 11 12
A
1
B
C
D
E
F
G
H
+
–
CHARGE
TERMINAL
RED
WHT
BE C
BE
C
BE
C
BE C
1 2 3
BE
C
ECB
ECB
B E
E C
ECB
ECB
C211
Q101
Q304
D301
Q212
R214
Q301
TP103
TP107
TP501
TP502
L501
R213
TP50
Q213
TP108
TP201
TP503
TP504
TP505
TP506
TP507
TP402
TP403
TP404
(AF OUT)
TP405
(RX VT)
TP301
TP302
TP104
TP105
TP508
TP511
TP509
TP401
(RSSI)
TP510
TP512
TP303
TP305
TP304
TP406
(ANT)
TP407
(RF GND)
C458
C459
C213
C407
C441
C439
C438
C415
C437
C418
C428
C461
C445
C474
C465
C457
C502
C405
C507
R101
R221
C220
R450
R313
R414
R306
R304
R305
R312
R513
R505
R203
R204
R217
R406
R438
R405
R436
R437
R421
R423
R420
R415
R410
R425
R216
R222
R503
TP513
D503
C104
C101
Q211
TP101
(VDD)
TP102
(GND)
R215 R212
R211
R314
C455
C417
C401
R419
R102
R301
C432
C216
C221
C406
R413
R207
C408
R308
C479
R307
Q303
Q407
PH201
D201
R201
R202
C202
RY201
X501
D211
D403
D302
FL402
FL403
C464
C470
C434
T201
CT501
C201
C103
C416
MJ201
C501
L101
L102
C402
C102
C212
IC501
Q404
IC401
FL401
Q501
D401
D402
Q406
RV401
IC502
Q405
Q402
Q403
Q502
C403
C446
C448
C449
C443
C442
C444
C430
C429
C473
C453
C451
C452
C450
C447
C454
C482
C421
C420
C419 C422
C423
C426
C424
C440
L409
C414 C413
C456 C436
C433
C435 C427
C460
C463
C462
C468
C466
C467
C214
C222
C510
C508
C509
C511
C503
C504
C513
C514
C506
C505
C476
C469
C411
C512
C471
R401
R404
R403
R411
R408
R412
R407
R416
R424
R417
R426
R428
R432
R431
R434
R447
R422
R539
R504
R448
R446
R445
R510
R511
R509
R311
R536
R535 R537
R534 R532
R531
R533
R530
R507
R519
R520
R541
R218
R501
R502
R540
R506
R508
R514
R515
R518
R516
R517
R240
R235
R236
R444
R442
R441
R439
R440
L401
L408
L410
L405
L404
L406
L407
C425
C203
R443
R430
R418
R452
R451
R226
R227
R427
R402
R429
C412
C410 L403
Q401
C409
R409
BASE MAIN BOARD (SIDE B) BASE MAIN BOARD (SIDE A)
x D203 xD204
12
(12)
1-678-635- 12
(12)
1-678-635-
1510
44
40
35
34
12
15
20
22
11
3323 25 30
L302 L301
14
15
20
25
26
151013
40
45
50
52
35 393027
ANT1
ANTENNA
D502
LINE/CHARGE
N1001:Mexican MODEL
N1001:Canadian, C&SA/
N1003:US, Canadian MODEL
N1001:Mexican MODEL
xR1000
Note:
•X: parts extracted from the component side.
•x: parts mounted on the conductor side.
•a:Through hole.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B) pattern face are indicated.
Parts face side: Parts on the parts face side seen from the
(Side A) parts face are indicated.
• Abbreviation
C&SA : Central and South America

– 23 – – 24 –
SPP-N1001/N1003
5-5. SCHEMATIC DIAGRAM (BASE UNIT SECTION)
Note:
• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ωand 1/4W or less unless otherwise
specified.
•: B+ Line.
•H: adjustment for repair.
• Power voltage is dc 9V and fed with regulated dc power
supply from external power voltage jack (J101).
• Voltages and waveforms are dc with respect to ground in
service mode.
• Voltages are taken withaVOM(Input impedance10 MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
zWaveform
1
IC501 qh X OUT
VOLT/DIV : 0.1 V AC
TIME/DIV : 50 nsec
345 mVp-
p
8MHz
• Signal path.
N: RX
O: TX
P: bell
• Abbreviation
CND : Canadian
MX : Mexican
C&SA : Central and South America