– 2 –
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED
LINE WITH MARK 0ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
TABLE OF CONTENTS
1. GENERAL
Identifying the Parts ........................................................ 3
Setting Up the Base Unit ................................................ 4
Preparing the Battery Pack ............................................. 4
Making Calls ................................................................... 5
Receiving Calls ............................................................... 5
2. DISASSEMBLY ......................................................... 11
3. TEST MODE.............................................................. 13
4. ELECTRICAL ADJUSTMENTS
Base Unit ......................................................................... 14
Handset ............................................................................ 16
5. DIAGRAMS
5-1. Block Diagram – BASE UNIT Section (1/2) – ............. 17
5-2. Block Diagram – BASE UNIT Section (2/2) – ............. 19
5-3. Block Diagram – HANDSET Section –........................ 21
5-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 23
5-5. Printed Wiring Board – BASE RF Board –................... 23
5-6. Schematic Diagram – BASE RF Board –...................... 25
5-7. Printed Wiring Board – BASE MAIN Board – ............. 27
5-8. Schematic Diagram – BASE MAIN Board –................ 29
5-9. Printed Wiring Board – BASE I-TAD Board – ............. 32
5-10. Schematic Diagram – BASE I-TAD Board – ................ 33
5-11. Printed Wiring Board – BASE KEY Board – ............... 35
5-12. Schematic Diagram – BASE KEY Board – .................. 36
5-13. Printed Wiring Boards
– HAND RF/MAIN Boards – ......................................... 37
5-14. Schematic Diagram – HAND RF Board – .................... 39
5-15. Schematic Diagram – HAND MAIN Board – .............. 41
5-16. IC Pin Function Description ........................................... 45
6. EXPLODED VIEWS ................................................ 49
7. ELECTRICAL PARTS LIST ............................... 51
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE
DES PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ
DE FONCTIONNEMENT. NE REMPLACER CES COM-
POSANTS QUE PAR DES PIÈCES SONY DONT LES
NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.