Sony SPP-SS950 User manual

CORDLESS TELEPHONE
MICROFILM
US Model
E Model
General
Spread method Direct-Sequence Spread-Spectrum
Access method FDMA-TDD
Frequency band 902 – 928 MHz
Operation channel 20 channels
Supplied Accessories AC power adaptor AC-T37 (1) (US model)
AC power adaptor AC-T47 (1) (E model)
Telephone line cords (2) (US model)
Telephone line cord (1) (E model)
Rechargeable battery pack BP-T18 (1)
Directories (2 sheets)
Wall bracket/stand (1)
Screws (2) (E model)
Handset
Power source Rechargeable battery pakc BP-T18
Battery life Standby: Approx. 7 days (RING ON mode)
Approx. 3 weeks (BATT SAVE mode)
Talk: Approx. 4 hours
Dimensions Approx. 58 ×177 ×46 mm (w/h/d), antenna
excluded
Antenna: 72 mm
Mass Approx. 250 g, battery included
Base unit
Power source DC 9V from AC power adaptor
Battery charging time Approx. 12 hours
Dimensions Approx. 128 ×58 ×208 mm (w/h/d), antenna
excluded
Antenna: 165 mm
Mass Approx. 320 g, wall bracket excluded
Design and specifications are subject to change without notice.
SPECIFICATIONS
SERVICE MANUAL
SPP-SS950
Ver 1.2 2000. 06
With SUPPLEMENT-1
(9-925-727-81)

– 2 –
TABLE OF CONTENTS
1. GENERAL
Setting up the phone ........................................................ 3
Making and receiving calls..............................................3
Speed dialing ................................................................... 4
Paging .............................................................................. 4
Mounting the base unit on a wall .................................... 4
2. DISASSEMBLY.......................................................... 5
3. 900MHz SYSTEM OPERATION
3-1. Access method ................................................................. 7
3-2. Protocol............................................................................ 7
4. TEST MODE
4-1. Base Unit Test Mode A.................................................... 10
4-2. Base Unit Test Mode B.................................................... 10
4-3. Handset Test Mode .......................................................... 11
5. ELECTRICAL ADJUSTMENTS
5-1. Base Unit Section ............................................................ 12
5-2. Handset Section ............................................................... 13
6. DIAGRAMS
6-1. Schematic Diagram – Base Unit Section –...................... 16
6-2. Printed Wiring board – Base Unit Section – ................... 19
6-3. Printed Wiring Board – Handset Section –...................... 21
6-4. Schematic Diagram – Handset Section – ........................ 23
6-5. IC Pin Function Description ............................................ 26
7. EXPLODED VIEWS ................................................ 30
8. ELECTRICAL PARTS LIST ................................ 32
SERVICING NOTES
Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270 ˚C during
repairing.
•Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•Be careful not to apply force on the conductor when soldering or
unsoldering
Notes on chip component replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK !OR DOTTED LINE
WITH MARK !ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.

– 3 –
This section is extracted from
instruction manual.
SECTION 1
GENERAL

– 4 –

– 5 –
Note: Follow the disassembly procedure in the numerical order given.
REAR CABINET
SECTION 2
DISASSEMBLY
2 two screws
(BTP 2.6 × 10)
1 Remove the battery case lid
to direction of the arrow A .
3 two claws
4 claw
5 Remove the rear cabinet to
direction of the arrow B .
3 two claws
A
B

– 6 –
HAND MAIN BOARD
LOWER CABINET
3 screw
(BTP 2.6 × 8)
1 connector
2 four screws
(P 3 × 16)
1 connector
3 three screws
(BTP 2.6 × 8)
4 HAND MAIN board
1 two screws
(BTP 2.6 × 8)
2 two claws
1 two screws
(BTP 2.6 × 8)
3 lower cabinet

– 7 –
3-1. ACCESS METHOD
1. Transfer format & rate
The transfer format & rate of our system is as follows;
Table 3-1.Transfer method
Access method FDMA-TDD
Channel number 20 channel
Channel spacing 1.2MHz
Modulation method DBPSK
Baseband transfer rate 960Kbps
Spread method Direct Sequence Spread Spectrum
Chip rate 12 chips/bit
Data transfer rate 80 Kbps
2. Channel Number & Frequencies
RF channels occupy the frequency band 902 – 928 MHz are num-
bered 1 to 20.
RF channel numbers & center frequencies are specified as fol-
lows.
Table 3-2. Channel number & Channel frequency
Channle Channel Center Channel Channel Center
Number Frequency (MHz) Number Frequency (MHz)
1 903.6 11 915.6
2 904.8 12 916.8
3 906.0 13 918.0
4 907.2 14 919.2
5 908.4 15 920.4
6 909.6 16 921.6
7 910.8 17 922.8
8 912.0 18 824.0
9 913.2 19 925.2
10 914.4 20 926.4
SECTION 3
900MHz SYSTEM OPERATION
3-2. PROTOCAL
1. General
This system realizes the TX/RX superframe by TDD system. The
relation of master/slave dose not decide identification regarding
the protocol between BS and HS, but the initiated side is the mas-
ter and the requested side is the slave when the RF link has been
established.
2. Initial acquistition
In order to establish the RF link between BS and HS, both of BS
and HS need to have the same system ID. When “power” is ap-
plied to this system, the system have to do Initial Acquisition in
order to have the same system ID. It si to exchange a parameter
when the HS is parked on the BS, as soon as the system do System
Parameters Re-initilization.
3. System parameter re-initilization
This System Parameters Re-initilization can realize that the HS is
parked on the BS. So after the BS recoginized to be parked the
HS, the BS calculates a system parameter, and then it outputs this
data from the ARTO port, and then the system establishs the RF
link. In order to establish this link, the HS send theA-Frame to the
BS after the HS received the system parameter, and then the BS
send the A-Frame to the HS. The process of System Parameters
Re-initilization is as follows.
Fig. 3-1. System Parameters Re-initialization
Base Station Handset
System ID
confirmed
System ID
confirmed
(Park Detect)(Park Detect)
(PARK)
System Parameters
A-Frame
A-Frame

– 8 –
(2) BS
The BS is supplied the power by AC line. While the BS is the
stand-by, the BS is always a wake state. While the BS monitors
the current channel, the BS monitors also the other channel at the
same time
Because if the current channel can not use by some interference,
the system needs the clear channel information as a part of system
parameter for a channel hop.
If the BS can not receive the A-Frame of Heart-beat from the HS,
it become “link error”, and the system become error recovery mode.
4. Stand-by Mode Operation
(1) HS
When the HS is the stand-by mode (sleep mode), the HS do the
intermittent operation for power save, because the HS is the bat-
tery operation.
This process of stand-by mode operation is as follows.
10 sec
10 sec
Heart-Beat Heart-Beat
1 sec 1 sec
RX
RX RX RX RX RX
1 sec
2 msec
2 msec 10 msec
10 msec
RXTXRX
Heart Beat
(Exchange A-Frame for Link confirmation purpose)
RX
Heart-Beat
10 sec
Fig. 3-2. Stand-by mode operation (HS)

– 9 –
Master Slave
System ID
confirmed
System ID
confirmed
A-Frame
A-Frame
V-Frame
V-Frame
V-Frame
V-Frame
5. Link Establishment
Accoding to the following Fig. 3-1, the requested side for link
establishment is the master.
The system have to exchange theA-Frame for link establishment,
and each system ID should be the same ID, and then the system
link is established.
The protocol and timing chart of link establishment are as fol-
lows.
Fig. 3-3. Link Establishment protocol
Master TX
Master RX
Slave RX
Slave TX
Master
Time Slot
Trip Delay
TX RX TX RX TX
AV
A' V
V
V
VA
VA'
V
Fig. 3-4. Link EstablishmentTiming Chart
6. State Change/Tarmination
After the RF link between HS and BS was established, a move-
ment of each state (State: ON-Hook, OFF-Hook, PAGE, InterCom,
etc) is sent through supervisory bits.
7. Error Recovery
In case of the following situation, The system becomes “Error
Recovery Mode”.
(1) The system failed to move to “Heart-Beat” during “Stand-by
mode, or failed “link establishment”.
(2) The system failed to keep the link.

– 10 –
4-1. BASE UNITTEST MODE A
[Start-up]
1. Set [DIALMODE] switch to the P (PULSE) side.
2. With [PAGE] button kept pressed, reset the POWER ON (con-
nect theAC adapter plug) and return [DIALMODE] switch from
P (PULSE) side to T (TONE) side, then again to the P (PULSE)
side.
3. Release the [PAGE] button, and the Test Mode A will start.
4. When the Test Mode A started, the Dial Test is carried out.
5. If [DIALMODE] switch is changed over from P (PULSE) to T
(TONE) side, the base set goes in Test Mode IdleA status.
[DialTest]
1. When the Test Mode started, a line is connected.
2. “0” is output with 10pps (PLUSE) signal.
3. After 2 seconds, “1” “4” “8” “#” are output with DTMF
(TONE) signals.
4. Then, the line is placed in the busy status.
[TDDTest Mode on Each Channel]
1. In the Test Mode IdleA status, the statused of respective blocks
are as follows:
Radio block – TDD mode (Master timing, 1CH)
Audio block – Line busy status
2. Each time [PAGE] button is pressed, channels are changed over
as follows:
Test Mode
Idle A →2CH →3CH →4CH →. . . →20CH
(1CH)
↑
3. On the channels 2 to 20, the statuses of respective blocks are as
follows:
Radio block – TDD mode (Slave timing)
Audio block – Line busy status
[Charging Detection Test, ARTO Pin Output Test, and
EEPROM Clear]
1. In the Test Mode IdleA status, if charging is detected, a rectan-
gular wave of 2.4 kHz is output from the IC751 Pin #¢ (ARTO
pin).
2. At this time, the contents of the EEPROM memory are all
cleared.
SECTION 4
TEST MODE
4-2. BASE UNITTEST MODE B
[Start-up]
1. Set [DIALMODE] switch to the T (TONE) side.
2. With [PAGE] button kept pressed, reset the POWER ON (con-
nect theAC adapter plug) and return [DIALMODE] switch from
T (TONE) side to P (PULSE) side, then again to the T (TONE)
side.
3. Release the [PAGE] button, and the Test Mode B will start.
4. In the Test Mode B, two kinds of idle statuses can be selected
depending on the[DIALMODE] switch setting.
DIAL MODE switch Idle statuses
T (TONE) side Test Mode Idle B-1 *1
P (PULSE) ise Test Mode Idle B-2 *2
*1: Radio block – TDD mode (Master timing)
Audio block – Line busy status
*2: Radio block – Standby status
Audio block – Line open
[Charging Detection Test, ARTO Pin Output Test, and
EEPROM Clear]
1. In the Test Mode Idle B-1 status, if charging is detected, a rect-
angular wave of 2.4 kHz is output from the IC751 Pin #¢
(ART0 pin).
2. At this time, the contents of the EEPROM memory are all
clearered.
[Terminating Signal DetectionTest]
1. In the Test Mode Idle B-2 status, if a terminating signal is
detected, H →L →. . . are output from the IC751 Pin *ª in
synchronization with H →L →. . . of terminating signal de-
tected.
[Continuous Receive Mode, Continuous Transmit Mode
andTDDTest Mode with High, Mid, and Low Power]
In the Test Mode Idle B-2 status, each time [PAGE] button is pressed,
the mode changes as follows:
[PAGE] button Radio Block
pressing times
1 CONT. RECEIVE (1CH, LNA ON,AGC ON)
2 CONT. RECEIVE (10CH, LNA ON,AGC ON)
3 CONT. RECEIVE (20CH, LNA ON,AGC ON)
4 CONT. TRANSMIT (1CH, High power)
5 CONT. TRANSMIT (1CH, Mid power)
6 CONT. TRANSMIT (1CH, Low pwer)
7 CONT. TRANSMIT (10CH, High pwer)
8 CONT. TRANSMIT (10CH, Mid pwer)
9 CONT. TRANSMIT (10CH, Low pwer)
10 CONT. TRANSMIT (20CH, High pwer)
11 CONT. TRANSMIT (20CH, Mid pwer)
12 CONT. TRANSMIT (20CH, Low pwer)
13 TDD Mode (Master timing, 1CH, High power)
14 TDD Mode (Master timing, 1CH, Mid power)
15 TDD Mode (Master timing, 1CH, Low power)
16 Return to Test Mode Idle B-2
* In the statuses of 1 – 15, the audio block is placed in the line busy status.

– 11 –
4-3. HAND SET
[Start-up]
1. Withthe powersupplied,press[TALK] [0] [1] keys simultaneously,
and the Test Mode will start.
2. Immediately after the Test Mode started, the ringer sounds for
500 msec, and the handset goes in Test Mode Idle status.
3. In the Test Mode Idle status, the statuses of respective blocks
are as follows:
Radio block – TDD Mode (Master timing, 1CH)
Audio block – Line busy status
4. In the Test Mode Idle status, respective test modes can be ex-
ecuted by key input properly.
5. In respective test modes, the Test Mode Idle status is resumed
by entering “0 1 #” keys.
6. In any mode, if “0 0 #” keys are entered, the Test Mode is can-
celled and normal operating condition is resumed.
[Continuous Receive Mode]
1. Enter “1 1 #” keys, and the Continuous Receive (1CH, LHA
ON, AGC ON) mode is activated.
2. Each time [*] key is pressed, channels are changed over as fol-
lows:
1CH →2CH →3CH →4CH →. . . →20CH
↑
[ContinuousTransmit mode]
1. Enter “2 1 #” keys, and the Continuous Transmit (1CH, High
power) mode is activated.
2. Enter “2 2 #” key to activate Continuous Transmit (1CH, Mid
power) mode.
3. Enter “2 3 #” key to activate Continuous Transmit (1CH, Low
power) mode.
4. In respective modes, each time [*] key is pressed, channels are
changed over as follows:
1CH →2CH →3CH →4CH →. . . →20CH
↑
[LoopbackTest Mode]
Key input Test mode
31# Code Forward Loopback (L1)
32# ADPCM Forward Loopback (L2)
33# ADPCM →RADIO Loopback
34# ADPCM Reverse Loopback
[TDDTest Mode with High, Mid, and Low Power]
Audio block
Line busy status
Line busy status
Line busy status
Standby status
Radio block
TDD mode (Master timing,
1CH, High power)
TDD mode (Master timing,
1CH, Mid power)
TDD mode (Master timing,
1CH, Low power)
TDD mode (Slave timing)
Key input
41#
42#
43#
44#
[Key MatrixTest Mode and LEDTest Mode]
• Key Matrix Test mode
1. Enter “5 1 #” keys, and the Key Matrix Test mode is activated.
2. If pressing the keys in the order shown below, an acknowledge
tone is output. Or, if pressing other keys, and error tone will be
output.
[TALK] →[OFF] →[FLASH] →[PGM/VOL] →[SPEEDDIAL] →
[REDIAL/PAUSE] →[1] →[2] →[3] →[4] →[5] →[6] →[7] →
[8] →[9] →[*] →[0] →[#]
3. When an acknowledge tone or error tone is output, the initial
status of key matrix test and LED test mode is activated. From
this status, the key matrix test and LED test can be executed
with the key input.
• LED Test mode
1. Enter “5 4 #” keys, and the LED Test mode is activated.
2. When LED Test mode started, all LEDs turn on immediately.
[TDDTest Mode on Each Channel]
1. Enter “6 1 #” keys, and the TDD mode (Master timing, 1CH,
Line busy status) is activated.
2. Each time [*] key is pressed, channels are changed over as fol-
lows:
1CH →2CH →3CH →4 CH →. . . →20CH
↑
[EEPROM Clear]
Enter “7 1 #” keys, and the contents of EEPROM memory are all
cleared.

– 12 –
SECTION 5
ELECTRICAL ADJUSTMENTS
5-1. BASE UNIT SECTION
• Make the set in Test mode (see page 10)
1. Checking RX I&Q Output Level
Setting:
Procedure:
1. Place the base unit in the Continous Receive mode (1CH, LNA
ON, AGC ON).
2. Set the SSG frequency to the frequency on 1CH + 300 kHz,
and the RF output level to –95 dBm.
3. Measure the output level of RXIN, RXIP, RXQN and RXQP
with a level meter. At this time, confirm with an oscilloscope
that a sine wave of 300 kHz is output.
4. confirm that the measured output level is –25.2 to –20.5 dBV.
If IC951 was replaced (there is no ID data), the output level
is –30.2 to –25.5 dBV.
5. Also, execute steps 1 through 4 for the channels 10 and 20.
* For the frequency on each channel, see page 7.
2. CheckingTX Center Frequency
Setting :
• short: TP918 ↔TP919
+
level meter
oscilloscope
–
+
–
TP903: RXIP
TP904: RXIN
TP905: RXQP
TP906: RXQN
TP919: GND
SG
ANTENNA TERMINA
L
Procedure:
1. Short TP918 and TP919 (GND) on the MAIN board in the base
unit.
2. Place the base unit in the Continuous Transmit mode (1CH,
High power).
3. Measure theANT OUT frequency of the RF module in the base
unit using a frequency counter.
4. Confirm that the measured freuquency is 903.600 MHz ±
27 kHz.
5. Also, execute steps 1 through 4 for the channels 10 and 20.
+
frequency counter
ANTENNA TERMINA
L
–
3. CheckingTX Output
Setting:
Procedure:
1. Place the base unit in the Continuous Transmit mode (1CH,
High power).
2. Measure the ANT OUT output of the RF module in the base
unit using a peak power meter.
3. Confirm that the measured output is 17.7 mW (MIN 5.9 mW).
4. Also, execute steps 1 through 4 for the channels 10 and 20.
+
peak power meter
–ANTENNA TERMINA
L

– 13 –
5-2. HANDSET SECTION
• Make the set in Test mode (see page 11)
1. Checking RX I&Q Output Level
Setting:
Procedure:
1. Place the handset in the Continuous Receive mode (1CH, LNA,
AGC ON).
2. Set the SSG frequency to the frequency on 1CH + 300 kHz,
and the RF output level to –95 dBm.
3. Measure the output lvel of RXIN, RXIP, RXQN, and RXQP
with a level meter. At this time, confirm with an oscilloscope
that a sine wave of 300 kHz is output.
4. confirm that the measured output level is –23.3 to –20.9 dBV.
If IC502 was replaced (there is no ID data), the output level
is –28.3 to –25.9 dBV.
5. Also, execute steps 1 through 4 for the channels 2 – 20.
* for the frequency on each channel, see page 7.
2. CheckingTX Center Frequency
Setting:
• short: TP555 ↔TP553
+
level meter
oscilloscope
–
+
–
TP520: RXIP
TP521: RXIN
TP522: RXQP
TP523: RXQP
TP553: GND
SG
ANTENNA TERMINA
L
+
frequency counter
ANTENNA TERMINA
L
–
Procedure:
1. Short TP555 andTP553 (GND) on the MAIN board in the base
unit.
2. Place the handset in the Continuous Transmit mode (1CH, High
power).
3. Measure theANTOUT frequencyofthe RF module in thehand-
set using a frequency counter.
4. Confirm that the measured freuquency is 903.600 MHz ±
27 kHz.
5. Also, execute steps 1 through 4 for the channels 2 – 20.
3. CheckingTX output
Setting:
Procedure:
1. Place the handset in the Continuous Transmit mode (1CH, High
power).
2. Measure theANT OUT output of the RF module in the handset
using a peak power meter.
3. Confirm that the measured output is 29 mW (MIN 17.4 mW).
4. Also, execute steps 1 through 4 for the channels 2 – 20.
+
peak power meter
–ANTENNA TERMINA
L

– 14 –
ANTENNA TERMINAL
SG : Checking RX I&Q Output level
frequency counter : CheckingTX Center Frequency
peak power meter : CheckingTX Output
ADJUSTMENT LOCATION:
[BASE MAIN BOARD] (Conductor Side)
TP918 and TP919 short:
Checking TX Center Frequency
TP903: RXIP
TP904: RXIN
TP905: RXQP
TP906: RXQN
level meter: Checking RX I & Q Output Level











– 15 –
[HAND MAIN BOARD] (Conductor Side)
ANTENNA TERMINAL
SG : Checking RX I&Q Output level
frequency counter : Checking TX Center Frequency
peak power meter : Checking TX Output
TP555 and TP553 short:
Checking TX Center Frequency
TP520: RXIP
TP521: RXIN
TP522: RXQP
TP523: RXQN
level meter:
Checking RX I & Q Output Level






SPP-SS950
– 16 – – 17 – – 18 –
4 Vp-
p
9.6 MHz
• Waveform
1IC751 oj (XTALI)
SECTION 6
DIAGRAMS

SPP-SS950
– 19 – – 20 –

SPP-SS950
– 21 – – 22 –

SPP-SS950
– 23 – – 24 – – 25 –
• IC Block Diagram
IC401, 701 10497-14
• Waveform
1IC501 oj (XTALI)
2.9 Vp-p
9.6 MHz
12 3 45 6 7 8
9
10
16
15
14
13
12
11
MODULATOR
& FILTER
CONTROL
REGISTOR
16 BIT
REGISTOR
16 BIT
REGISTOR
MODULATOR
& FILTER
1719 182021222324
28
29
30
27
26
25
31
32
VOXRNT
VOXSND
AVDD
LINE-IN
AVSS
MICIN
RBIAS
NC
REFCNTL XCLKO NC ICLK FRAM SPKPO SPKMO LINEO
RESETB
MCLK
DVSS
DATAI
DATAO
DVDD
NC
NC
NC NC NC NC NC
AGND
VREF
MICBIAS

– 26 –
1 KEYPADB5 — Not used
2-4 D0-2 — Not used
5 D3 I DIAL MAKE rate selection input H: 40%, L: 33%
6 D4 I Model selection input H: SPP-SS950
7-9 D5-7 — Not used
10-14 KEY PADI0-4 — Not used
15 KEYPADI5 I PAGE key input
16 VSSC — Ground
17 VDDC — Power supply (+5 V)
18 VDDP — Power supplu (+5 V)
19 VSSC — Ground
20, 21 OSC1, 2 — Not used
22, 23 KEYPADB3, 4 — Not used
24 CDCDATAI I CODEC DATA input
25 CDCDATAO I/O CODEC DATA output
26 CDCMCLK O CODEC master CLK output
27 RESETO O Reset signal output
28 CDCICLK O CODEC interface CLK output
29 VDDP — Power supply (+5 V)
30 VSSP — Ground
31 KEYPADB2 O PAGE key output
32 CDCFRAME O CODEC FRAM output
33 ARTI I ART input
34 ARTO O ART output
35, 36 KEYPADB1, 0 — Not used
37 GPIOB7 O RELAY ON/OFF output H: active
38 VDDP — Power supply (+5 V)
39 LCDCS — Not used
40 VDDC — Power supply (+5 V)
41 VSSC — Ground
42 TEST I Test mode select input L: active
43 LNAATN O LNA gain select output H: low gain
44 RXEN O RX enable output H: active
45 VDDA — Power supply (+5 V)
46 VSSA — Ground
47 VDDA — Power supply (+5V)
48 VSSA — Ground
49 TXDATA O TX DATA output
50 VRP O Analog standard voltage output
51 RXIP I RX input (I positive)
52 RXIN I RX input (I negative)
53 RXQP I RX input (Q positive)
54 RXQN I RX input (Q negative)
55 NC — Not used
56 IBIAS I Analog bias input
57 AGND O Analog ground
6-5. IC PIN FUNCTION DESCRIPTION
• BASE MAIN BAORD IC751 C7302-11 (RDSSS9M-ASIC)
Pin No. Pin Name I/O Function