Sony SPP-ID975 - Cordless Telephone User manual

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SERVICE MANUAL
SPECIFICATIONS
General
Frequency band (SPP-ID975)
902 – 928 MHz
Frequency band (SPP-ID976)
923.1 – 927.75 MHz
Base phone : 18 µW
Handset : 73 µW
Operating channel
30 channels
Dial signal
Tone, 10 PPS (pulse) selectable
Supplied accessories
AC power adaptor AC-T122 (1)
Telephone line cords (2)
Wall bracket for base phone (1)
Rechargeable battery pack BP-T23 (1)
Handset
Power source
Rechargeable battery pack BP-T23
Battery charging time
Approx. 12 hours
Battery life
Standby:Approx. 7 days
Talk : Approx. 6 hours
Dimensions
Approx. 58 ×177 ×46 mm (w/h/d),
antenna excluded
(approx. 2 3/8 ×7 ×1 13/16 inches)
Antenna: Approx. 72 mm
(approx. 2 7/8 inches)
MassApprox. 270 g
(approx. 9.5 oz), battery included
SPP-ID975/ID976
US Model
SPP-ID975
Canadian Model
SPP-ID976
CORDLESS TELEPHONE
MICROFILM
Photo: SPP-ID975
Base phone
Power source
DC 9V from AC power adaptor
AC-T122
Battery charging time
Approx. 24 hours
Dimensions
Approx. 166 ×63 ×225 mm (w/h/d),
antenna excluded
(approx. 6 5/8 ×2 1/2 ×8 7/8 inches)
Antenna: Approx. 120 mm
(approx. 4 3/4 inches)
MassApprox. 595 g
(approx. 1 lb 9 oz), wall bracket excluded
Design and specifications are subject to
change without notice.
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Ver 1.0 1999. 11

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TABLE OF CONTENTS
1. GENERAL
Read This First ........................................................................ 3
Checking the Package Contents .............................................. 3
Setting Up the Base Phone ...................................................... 3
Preparing the Battery Pack ...................................................... 4
Entering the Area Code ........................................................... 5
Identifying the Parts ................................................................ 5
Making Calls ........................................................................... 6
Receiving Calls ........................................................................ 7
Speed Dialing .......................................................................... 8
Phone Directory ....................................................................... 8
Setting the Ringer Type ......................................................... 10
Switching the Phones During a Call...................................... 10
Talking Between the Phones (Intercom) ............................... 10
Transferring a Call................................................................. 11
Understanding the Caller ID Service..................................... 11
Looking at the Caller ID List ................................................ 11
Using the Caller ID List ........................................................ 12
Using “Caller ID with Call Waiting” Service........................ 13
Using Visual Message Waiting Service ................................. 13
Mounting the Base Phone on a Wall ..................................... 14
2. DISASSEMBLY
2-1. Case (Rear) ........................................................................ 15
2-2. RF Unit (HS), Hand Main Board ...................................... 15
2-3. Base (Bottom) ................................................................... 16
2-4. Base Main Board............................................................... 16
2-5. RF Unit (BU) .................................................................... 17
2-6. Base Key Board................................................................. 17
3. ELECTRICAL ADJUSTMENTS
3-1. Handset.............................................................................. 18
3-2. Base Phone ........................................................................ 19
4. DIAGRAMS
4-1. Block Diagram –Base Phone Section– ............................. 21
4-2. Block Diagram –Handset Section– ................................... 23
4-3. Schematic Diagram –Base Main Section (1/2)– ............... 25
4-4. Schematic Diagram –Base Main Section (2/2)– ............... 27
4-5. Printed Wiring Board –Base Main Section– ..................... 29
4-6. Printed Wiring Board –Base Key Section– ....................... 33
4-7. Schematic Diagram –Base Key Section–.......................... 35
4-8. Printed Wiring Board –Hand Main Section– ....................37
4-9. Schematic Diagram –Hand Main Section– ....................... 39
5. EXPLODED VIEWS
5-1. Handset Section................................................................. 42
5-2. Base Phone Section ........................................................... 43
6. ELECTRICAL PARTS LIST ........................................ 44
U3003
– BASE MAIN BOARD (SIDE A) –
U1001
– HAND MAIN BOARD (SIDE B) –
Note for Replacement of the ASIC Board
The ID is written in the ASIC board.
When replacing theASIC board, the U3003 on BASE MAIN board
and U1001 on HAND MAIN board should be replaced together as
a pair.
Part No. : X-3378-159-1 ASICASSY (one assy of two parts)

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SECTION 1
GENERAL This section is extracted from
SPP-ID975’s instruction manual.

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– 15 –
SECTION 2
DISASSEMBLY
• The equipment can be removed using the following procedure.
Note : Follow the disassembly procedure in the numerical order given.
2-1. CASE (REAR)
2-2. RF UNIT (HS), HAND MAIN BOARD
HANDSET CASE (REAR) RF UNIT (HS), HAND MAIN BOARD
BASE PHONE BASE (BOTTOM) BASE MAIN BOARD RF UNIT (BU) BASE KEY BOARD
3 BTP 3x12
4
1
5
6
7
8
2
battery case lid (HS)
9 case (rear)
claw
4 - 7
1 BTP 3x12
6 VOL knob (HS)
7 Removal the solders.
3 BTP 3x12
9 Removal the solders.
charge terminals
battery terminals
0 Removal the solders.
qa HAND MAIN board
2 B 2x8
4 B 2x6
5 B 2x6
antenna
(ANT1001)
8 RF unit (HS)

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2-3. BASE (BOTTOM)
2-4. BASE MAIN BOARD
1 BTP 3x12
6 base (bottom)
4
5
2
BTP 3x12
3 BTP 3x12
1 screws (3x30)
9 BASE MAIN board
battery terminal (BU)
charge springs
2 BTP 3x12
4 Removal the solders.
5 Removal the solders.
6 Removal the solders.
7 Removal the solders.
8 Removal the solders.
3 BTP 3x12

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2-5. RF UNIT (BU)
2-6. BASE KEY BOARD
1 BTP 3x12
2 BTP 3x12
lug
3 B 2x8
4 RF unit (BU)
1 BTP 3x12
3 speaker holder
4 B 2x6
7 BASE KEY board
5 B 2x6
6 Removal the solders.
2 BTP 3x12

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3-1. HANDSET
1.Test Mode
Entry— Press “PGM” key and enter “ TEST” on keypad.
Alternative entry— Write 99h into LSB of location 9 in EEPROM.
Exit— Press on “OFF” key.
LCD test— Press the “7” key.
Toggle TX power— Press the “0” key.
Increment RF channel— Press the “#” key.
2.Test Equipment Required and Connection
J1
frequency
counter
J1003
J1004
BATTERY
3.6V U1001
C1031
C1030
C1029
– HAND MAIN BOARD – – RF UNIT (HS) –
SECTION 3
ELECTRICAL ADJUSTMENTS
3. Verify Procedure
Item Remark
18.4MHz Frequency Error Connect the frequency counter to the test point J1, press “0” key to turn on the TX power. Then, check
the frequency ± 1 kHz. If the result is within ± 1 kHz, then no adjustment required. Otherwise, refer to
item 4. for Adjustment Procedure.
4. Adjustment Procedure
Item Adjustment Element Remark
18.4MHz Frequency Error C1030 1. Remove C1031 from the HAND MAIN board.
2. Solder an 20PF chip capacitor C1030 (1-164-160-11) on the
HAND MAIN board (in parallel of C1029).
3. Connect the frequency counter to the test point J1. Adjust for 0 Hz ± 1 kHz.
* *

U3003
C3012
C3002
C3015
– BASE MAIN BOARD
(SIDE A) –
J1
frequency
counter
– BASE MAIN BOARD
(SIDE B) –
– RF UNIT (BU) –
– 19 – – 20 –
3-2. BASE PHONE
1. Test Mode
Entry— Simultaneously press the “INTERCOM” key and toggle the “DIAL MODE” switch.When in test mode, the “LINE” and “CHARGE”
LEDs will be light on.
Alternative entry— Write 99h into LSB of location 9 in EEPROM.
Exit— Remove theAC power adaptor.
Toggle TX power— DIAL MODE switch (S3001)
T (TONE) position : TX ON
P (PULSE) position : TX OFF
Increment RF channel— Press the “INTERCOM” key.
2.Test Equipment Required and Connection
3. Verify Procedure
Item Remark
18.4MHz Frequency Error Connect the frequency counter to the test point J1, press “0” key to turn on the TX power. Then, check
the frequency ± 1 kHz. If the result is within ± 1 kHz, then no adjustment required. Otherwise, refer to
item 4. for Adjustment Procedure.
4. Adjustment Procedure
Item Adjustment Element Remark
18.4MHz Frequency Error C3015 1. Remove C3012 from the BASE MAIN board.
2. Solder an 20PF chip capacitor C3015 (1-164-160-11) on the
BASE MAIN board (in parallel of C3002).
3. Connect the frequency counter to the test point J1. Adjust for 0 Hz ± 1 kHz.

4-1. BLOCK DIAGRAM — BASE PHONE SECTION —
SPP-ID975/ID976
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SECTION 4
DIAGRAMS
67
PLL REF
DSIN
TXDATA
APIN2
GPIO2/MONO2
GPIO5/TST1
APO
AON
P1.1
P6.4
P6.5
P6.0
P6.1
P6.2
P1.5
P6.3
P1.7
P5.0
P5.4
P1.6
55
63 SCLK
62 SOUT
59 SIN
48 XTAL2
49 XTAL1
57 GPIO3/MON3
42
3 11
GPIO0
2DVCC1
AVCC1
78
76 REG CTRL
74 VBAT
14 P1.3
64
68
79
58
4
10
1
5
9
PLL REF
RX AUDIO
TX DATA
RSSI
PLL EN 8
SER DATA OUT 7
SER CLK
3
RX PWR
11
TX PWR
CS
SK
DI
DO
RF UNIT (BU)
1
2
3
4
EEPROM
U3007
43 GPIO1
5V
POWER
CONTROL
Q3001
REG
U1001
HANDSET
CHARGE
Q1006
CHARGE DET
Q1008
REG
U3008
H
S3002
VOL
M
L
T
P
X3001
18.4MHz
83
84
12
AIN 90
ADIN1 80
P1.0 11
FSK 89
RINGER 86
EAOUT 87
EAIN 88
4 12
5 13
6 14
16 10
17
18 9
8
LCD DB4
LCD DB5
11
14
8 12
PCLK
SER
PCLK
LCD DB6
LCD DB7
LCD E
LCD R/W
LCD RS
LCD1
LCD MODULE
30
I
34
35
I
39
ROW0-ROW4
COL0-COL4
7LED POWER
CONTROL
Q3002,3005
ANT3001
TELESCOPIC
ANTENNA SYSTEM CONTROL
U3003
I
P4.0
P4.4
I
RECHARGEABLE
BATTERY
BP-T23
DC 3.6V
CHARGE
TERMINAL
04
• Signal Path
: TX (To Tel Line)
: RX (From Tel Line)
: bell
J1003
J1004
S3001
DIAL MODE 56 GPIO4/TST0
RF POWER
CONTROL
Q3008
3.2V
KEY MATRIX
S1-S21
1-5
15
7
6
Q7
Q6
Q0-Q5
LED CONTROL
U3001
PXI
21 VIN VO1
VO2
4
HTO+
5
PXO 22
MCI
MUT 11
12
CD
1
U3006
MIC
SP1
SPEAKER
5
8
13
2
810
9
14 12
13 5
6
7
AMP
U1003
HOOK DET
U1002
D1007-1009
J1008
LINE
SPEAKER AMP
U3005
T1001
SPEECH PATH
U3004
D14-20
(LCD BACK-LIGHT)
D7-9,11-13
Q1007
BATT DET
Q1001
D10
SPARE BATTERY
J1002
J1005
!
J1001
DC IN 9V