Sony Vaio VGN-S36C User manual

Confidential
SERVICE MANUAL
BOARD REPAIR
VGN-S36C/S36GP/S36LP/S36SP/S36TP/S38CP/S52B/
S62PS/S62PSY/S62S/S350F/S350FP/S360/S360P/S370F
Ver. 2 2005B
Revision History
S400
B-876-402-02
PERSONAL COMPUTER
•Design and specifications are subject to
change without notice.
Area Model Lineup
VGN-S52B/S
VGN-S62PS/S∗
VGN-S62PSY∗
VGN-S62S/S∗
VGN-S360
VGN-S360P
VGN-S350F
VGN-S350FP
VGN-S370F
VGN-S36GP/S
VGN-S36LP/S
VGN-S36SP/S
VGN-S36TP/S
VGN-S36C/B
VGN-S36C/S
VGN-S38CP/B
∗: CTO Model
Asian/Oceania/
South Africa
International
Chinese
Japanese Japanese
American
US Canadian
Latin
1
[MA]
1
[MA]
1
[MA]
1
[MA]
1
[MA]
1
[MA]
1
[MA]
1
[MA]
1
[MA]
1
[MA]

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VGN-S36C/S36GP/S36LP/S36SP/S36TP/S38CP/S52B/
S62PS/S62PSY/S62S/S350F/S350FP/S360/S360P/S370F
(J/AM/AO)
Confidential
Service and Inspection Precautions
1. Obey precautionary markings and instructions
Labels and stamps on the cabinet, chassis, and components identify areas
requiring special precautions. Be sure to observe these precautions, as well
as all precautions listed in the operating manual and other associated
documents.
2. Use designated parts only
The set’s components possess important safety characteristics, such as
noncombustibility and the ability to tolerate large voltages. Be sure that
replacement parts possess the same safety characteristics as the originals.
Also remember that the mark, which appears in circuit diagrams and
parts lists, denotes components that have particularly important safety
functions; be extra sure to use only the designated components.
3. Always follow the original design when
mounting parts and routing wires
The original layout includes various safety features, such as inclusion of
insulating materials (tubes and tape) and the mounting of parts above the
printer board. In addition, internal wiring has been routed and clamped so
as to keep it away from hot or high-voltage parts. When mounting parts or
routing wires, therefore, be sure to duplicate the original layout.
4. Inspect after completing service
After servicing, inspect to make sure that all screws, components, and wiring
have been returned to their original condition. Also check the area around
the repair location to ensure that repair work has caused no damage, and
confirm safety.
5. When replacing chip components...
Never reuse components. Also remember that the negative side of tantalum
capacitors is easily damaged by heat.
6. When handling flexible print boards...
• The temperature of the soldering-iron tip should be about 270°C.
• Do not apply the tip more than three times to the same pattern.
• Handle patterns with care; never apply force.
Caution: Remember that hard disk drives are easily damaged by
vibration. Always handle with care.
Caution Markings for Lithium/Ion Battery - The following or similar
texts shall be provided on battery pack of equipment or in both the
operating and the service instructions.
CAUTION: Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by
the manufacturer. Discard used batteries according to the
manufacturer’s instructions.
CAUTION: The battery pack used in this device may present a fire
or chemical burn hazard if mistreated. Do not disassemble, heat
above 100°C (212°F) or incinerate.
Dispose of used battery promptly.
Keep away from children.
Information in this document is subject to change without notice.
Sony, VAIO and CLIE are trademarks or registered trademarks of
Sony. Microsoft, Windows, Windows Media, Outlook, Bookshelf
and other Microsoft products are trademarks or registered trademarks
of Microsoft Corporation in the United States and other countries.
The word Bluetooth and the Bluetooth logo are trademarks of
Bluetooth SIG, Inc. AMD, the AMD logo, other AMD product names
and combinations thereof are trademarks of Advanced Micro
Devices, Inc. Intel Inside logo, Pentium and Celeron are trademarks
or registered trademarks of Intel Corporation.Transmeta, the
Transmeta logo, Crusoe Processor, the Crusoe logo and
combinations thereof are trademarks of Transmeta Corporation in
the USA and other countries. Graffiti, HotSync, PalmModem, and
Palm OS are resistered trademarks, and the Hotsync logo and Palm
are trademarks of Palm, Inc. or its subsidiaries. (M) and Motrola
are trademarks of Motrora, Inc. Other Motrola products and services
with (R) mark like Dragomball are the trademarks of Motrola, Inc.
All other names of systems, products and services in this manual
are trademarks or registered trademarks of their respective owners.
In this manual, the (TM) or (R) mark are not specified.

– 3 –
VGN-S36C/S36GP/S36LP/S36SP/S36TP/S38CP/S52B/
S62PS/S62PSY/S62S/S350F/S350FP/S360/S360P/S370F
(J/AM/AO)
Confidential

– 4 –
VGN-S36C/S36GP/S36LP/S36SP/S36TP/S38CP/S52B/
S62PS/S62PSY/S62S/S350F/S350FP/S360/S360P/S370F
(J/AM/AO)
Confidential

– 5 –
VGN-S36C/S36GP/S36LP/S36SP/S36TP/S38CP/S52B/
S62PS/S62PSY/S62S/S350F/S350FP/S360/S360P/S370F
(J/AM/AO)
Confidential
CHAPTER 1. SEMICONDUCTOR PIN
ASSIGNMENTS
Semiconductors Index ..................................................... 1-1
Semiconductor Pin Assignments ..................................... 1-2
(to 1-53)
CHAPTER 2. POWER UP SEQUENCE/
BLOCK DIAGRAM
2-1. Power Up Sequence ......................................................... 2-1
2-2. Block Diagram ................................................................. 2-4
(to 2-4)
CHAPTER 3. DIAGRAMS
Schematic Diagrams and Printed Wired Boards Index ............ 3-1
1. CNX-251.......................................................................... 3-3
2. CNX-261.......................................................................... 3-8
3. IFX-311.......................................................................... 3-15
4. IFX-331.......................................................................... 3-28
5. LEX-61 .......................................................................... 3-33
6. MBX-109 ....................................................................... 3-38
7. SWX-172 ..................................................................... 3-100
8. SWX-173 ..................................................................... 3-105
(to 3-109)
TABLE OF CONTENTS
Section Title Page
Note: The parts location index which precedes
every schematic diagram, serves as the
electrical part list too.
History of the changes is shown as the “Revision
History”at the end of this data.

1-1
INDEX
VGN-S36C/S36GP/S36LP/S36SP/S36TP/S38CP/S52B/
S62PS/S62PSY/S62S/S350F/S350FP/S360/S360P/S370F
(J/AM/AO)
Confidential
CHAPTER 1.
SEMICONDUCTOR PIN ASSIGNMENTS
Semiconductors Index
TYPE PAGETYPE PAGE
015AZ8.2Z(TPL3) __________ 1-53
01ZA8.2(TPL3) ____________ 1-53
1SS388(TPL3) ____________ 1-53
2SB1462J-QR(TX).SO ______ 1-51
2SD2216J-QR(TX).SO ______ 1-51
AD1981BJSTZ-REEL _______ 1-2
ADM1032ARM-REEL _______ 1-3
AN12944A-VB _____________ 1-3
BD3532KN-E2 ____________ 1-4
BD6516F _________________ 1-4
DA82562ET ______________ 1-5
DF8A6.8FK(TE85R) ________ 1-53
EC10QS-04 _______________ 1-53
EC31QS03L-TE12L ________ 1-53
EP05Q03L-TE8L3__________ 1-53
FW82801DBMSL6DN _______ 1-5
HD64F2160BVTE10SNV ____ 1-9
HN1B01FU-TE85R _________ 1-51
HN1C05FE-B(TPLR3) ______ 1-51
HN3C61FU(TE85R) ________ 1-51
HN7G04FU-A/B(TE85R)_____ 1-51
HY5DU283222AFP-33 ______ 1-10
HYB25D128323C-3.3 _______ 1-13
ICS950819 _______________ 1-16
IRF7336D1TR _____________ 1-51
LM2724ASDX _____________ 1-17
LM2729SQX ______________ 1-19
LMV722MMX _____________ 1-21
LTC1799CS5#TR __________ 1-21
LTC3412EFE#TR __________ 1-22
LTC3728LCUH#TR-R4 ______ 1-23
M24C02-WDW6TP _________ 1-24
M93C46-WDW6T __________ 1-25
MA2S111-(K8).SO__________ 1-53
MA6S121-(TX) ____________ 1-53
MA8039-TX _______________ 1-53
MA8051-M-TX_____________ 1-53
MA8140-M-TX_____________ 1-53
MA8180-L-TX _____________ 1-53
MAX1908ETI+TG069 _______ 1-25
MAX1993ETG+TG069 ______ 1-28
MAX4374TEUB-TG069 _____ 1-31
MAX4737EUD _____________ 1-31
MB88153-111_____________ 1-33
MSQA6V1W5T2 ___________ 1-53
NTHS5404T1 _____________ 1-51
R3112N251A-TR ___________ 1-33
R3112N271A-TR ___________ 1-33
RD36SB _________________ 1-53
RG82855PMSL752 _________ 1-34
RN1104F(TPL3) ___________ 1-51
RN2911-TE85R ____________ 1-51
RN4904(TE85R) ___________ 1-51
RN5VD42AA-TL-FA________ 1-38
RSR025N03TL ____________ 1-51
S-24CS02AFT-TB-G ________ 1-39
SC338AIMSTRT___________ 1-39
SI5435DC-T1 _____________ 1-51
SI7840DP-T1 _____________ 1-51
SI7945DP-T1-E3___________ 1-52
SML-310MTT86 ___________ 1-53
SML-311BBTT86Q _________ 1-53
TYPE PAGE
SML-311DTT86____________ 1-53
SML-311YTT86 ____________ 1-53
SML-412MWT86 ___________ 1-53
SN0307009BZHK __________ 1-40
SN74AHC1G00DCKR ______ 1-45
SN74AHC1G02DCKR ______ 1-45
SN74AHC1G08DCKR ______ 1-45
SN74AHC1G86DCKR ______ 1-45
SN74AHC2G00HDCU3 _____ 1-45
SN74AHC2G04HDCU3 _____ 1-46
SN74AHC2G08HDCU3 _____ 1-46
SN74AHC2G14HDCU3 _____ 1-47
SN74CB3T3306DCUR ______ 1-47
SN74CBT3257PWR ________ 1-48
SN74CBTD3306PWR-12 ____ 1-48
SSM3J09FU(TE85L)________ 1-52
SSM3K15FS-TE85L ________ 1-52
TA75S01F ________________ 1-48
TAR5S15U (TE85R) ________ 1-49
TAR5S28U(TE85R) ________ 1-49
TAR5S45U _______________ 1-49
TC7S14FU(TE85R) ________ 1-49
TK11233CMCL-G __________ 1-50
TPC8107(TE12L) __________ 1-52
TPS2220ADBR ____________ 1-50
UDZ-TE-17-6.2B ___________ 1-53
XP4111-TXE ______________ 1-52
XP4213 __________________ 1-52
XP4501 __________________ 1-52

1-2
IC
VGN-S36C/S36GP/S36LP/S36SP/S36TP/S38CP/S52B/
S62PS/S62PSY/S62S/S350F/S350FP/S360/S360P/S370F
(J/AM/AO)
Confidential
AD1981BJSTZ-REEL (ANALOG DEVICES)
SoundMAXRCODEC

1-3
IC
VGN-S36C/S36GP/S36LP/S36SP/S36TP/S38CP/S52B/
S62PS/S62PSY/S62S/S350F/S350FP/S360/S360P/S370F
(J/AM/AO)
Confidential
ADM1032ARM-REEL (ADI)
SYSTEM TEMPERATURE MONITOR
TOP VIEW
(Not to Scale)
8
7
6
5
1
2
3
4
D+
SCLK
D–
THERM
ADM1032
V
DD
GND
ALERT
SDATA
PIN FUNCTION DESCRIPTIONS
Pin
No. Mnemonic Description
1V
DD
Positive Supply, 3 V to 5.5 V.
2 D+ Positive Connection to Remote Temperature Sensor.
3 D– Negative Connection to Remote Temperature Sensor.
4THERM THERM is an open-drain output that can be used to turn a fan on/off or throttle a CPU clock in the event of
an overtemperature condition. Requires pull-up to V
DD
.
5 GND Supply Ground Connection.
6ALERT Open-Drain Logic Output Used as Interrupt or SMBus Alert.
7 SDATA Logic Input/Output, SMBus Serial Data. Open-drain output. Requires pull-up resistor.
8 SCLK Logic Input, SMBus Serial Clock. Requires pull-up resistor.
ADM1032–SPECIFICATIONS
(T
A
= T
MIN
to T
MAX
, V
DD
= V
MIN
to V
MAX
, unless otherwise noted.)
Parameter Min Typ Max Unit Test Conditions/Comments
POWER SUPPLY
Supply Voltage, V
DD
3.0 3.30 5.5 V
Average Operating Supply Current, I
CC
170 215 µA 0.0625 Conversions/Sec Rate
1
5.5 10 µA Standby Mode
Undervoltage Lockout Threshold 2.35 2.55 2.8 V V
DD
Input, Disables ADC, Rising Edge
Power-On Reset Threshold 1 2.4 V
TEMPERATURE-TO-DIGITAL CONVERTER
Local Sensor Accuracy ±1 ±3 °C 0 ≤T
A
≤100°C, V
CC
= 3 V to 3.6 V
Resolution 1 °C
Remote Diode Sensor Accuracy ±1 °C 60°C ≤T
D
≤100°C, V
CC
= 3 V to 3.6 V
±3 °C 0°C ≤T
D
≤120°C
Resolution 0.125 °C
Remote Sensor Source Current 230 µA High Level
2
13 µA Low Level
2
Conversion Time 35.7 142.8 ms From Stop Bit to Conversion Complete
(Both Channels) One-Shot Mode with
Averaging Switched On
5.7 22.8 ms One-Shot Mode with Averaging Off
(i.e., Conversion Rate = 32 or 64
Conversions per Second)
OPEN-DRAIN DIGITAL OUTPUTS
(THERM, ALERT)
Output Low Voltage, V
OL
0.4 V I
OUT
= –6.0 mA
2
High Level Output Leakage Current, I
OH
0.1 1 µA V
OUT
= V
DD2
SERIAL BUS TIMING
2
Logic Input High Voltage, V
IH
2.1 V V
DD
= 3 V to 5.5 V
SCLK, SDATA
Logic Input Low Voltage, V
IL
0.8 V V
DD
= 3 V to 5.5 V
Hysteresis 500 mV
SCLK, SDATA
SDATA Output Low Sink Current 6 mA SDATA Forced to 0.6 V
ALERT Output Low Sink Current 1 mA ALERT Forced to 0.4 V
Logic Input Current, I
IH
, I
IL
–1 +1 µA
Input Capacitance, SCLK, SDATA 5 pF
Clock Frequency 400 kHz
SMBus Timeout 25 64 ms Note 3
SCLK Clock Low Time, t
LOW
1.3 µs t
LOW
between 10% Points
SCLK Clock High Time, t
HIGH
0.6 µs t
HIGH
between 90% Points
Start Condition Setup Time, t
SU:STA
600 ns
Start Condition Hold Time, t
HD:STA
600 ns Time from 10% of SDATA to 90%
of SCLK
Stop Condition Setup Time, t
SU:STO
600 ns Time from 90% of SCLK to 10%
of SDATA
Data Valid to SCLK Rising Edge 100 ns Time for 10% or 90% of SDATA to
Time, t
SU:DAT
10% of SCLK
Data Hold Time, t
HD:DAT
300 ns
Bus Free Time, t
BUF
1.3 µs Between Start/Stop Condition
SCLK, SDATA Rise Time, t
R
300 ns
SCLK, SDATA Fall Time, t
F
300 ns
NOTES
1
See Table VI for information on other conversion rates.
2
Guaranteed by design, not production tested.
3
The SMBus timeout is a programmable feature. By default, it is not enabled. Details on how to enable it are available in the Serial Bus Interface section of this data sheet.
Specifications subject to change without notice.
FUNCTIONAL BLOCK DIAGRAM
ON-CHIP
TEMPERATURE
SENSOR
A/D
CONVERTER
BUSY RUN/STANDBY
EXTERNAL DIODE OPEN-CIRCUIT
ADDRESS POINTER
REGISTER
CONVERSION RATE
REGISTER
REMOTE TEMPERATURE
HIGH LIMIT REGISTER
CONFIGURATION
REGISTER
INTERRUPT
MASKING
LIMIT
COMPARATOR
REMOTE TEMPERATURE
VALUE REGISTER
LOCAL TEMPERATURE
VALUE REGISTER
V
DD
GND SDATA SCLK
THERM
ALERT
D+
D– REMOTE TEMPERATURE
LOW LIMIT REGISTER
LOCAL TEMPERATURE
HIGH LIMIT REGISTER
LOCAL TEMPERATURE
LOW LIMIT REGISTER
ANALOG
MUX
ADM1032
LOCAL THERM LIMIT
REGISTER
EXTERNAL THERM LIMIT
REGISTER
DIGITAL MUX
DIGITAL MUX
STATUS REGISTER
SMBUS INTERFACE
REMOTE OFFSET
REGISTER
AN12944A-VB (PANASONIC)
2ch SPEAKER AMPLIFIER
BLOCK DIAGRAM
PIN FUNCTION DESCRIPTION
Pin No.
Pin Function
Pin No.
Pin Function
Pin name Function Pin name Function
1MUTE L Activist the Low Mute 25 FILT3 L Filter terminal 3
2MUTE H Activist the High Mute 26 FILT2 L Filter terminal 2
3BIAS30 3V Bias Output 27 FILT1 L Filter terminal 1
4EVR_VTL EVR Control Pin 28 EVROUT_L EVR Lch Output
5SPIN R SP Amp Rch Input 29 AMP I L The amplifier input for the gain adjustment
6AMPO R The amplifier output for the gain adjustment 30 GND GND
7GND GND 31 AMPO L The amplifier output for the gain adjustment
8AMP I R The amplifier input for the gain adjustment 32 SPIN_L SP Amp Lch Input
9EVROUT_R EVR Rch Output 33 DET C AGC demodulation Pin
10 FILT1 R Filter terminal 1 34 AGC MOD AGC-ON Level Control
11 FILT2 R Filter terminal 2 35 BIAS45 4.5V Bias Output
12 FILT3 R Filter terminal 3 36 VREF SP The VREG C terminal
13 FILT SW Filter ON/OFF Control 37 GNDSP L GND SP Lch
14 STB SW Standby ON/OFF Control 38 OUT_LN2 SP Amp Lch Output (-)
15 AUDIN L Rch Input 39 OUT LN1 SP Amp Lch Output (-)
16 TC The timing condenser for Precharge 40 OUT_LP2 SP Amp Lch Output (+)
17 GND GND 41 OUT LP1 SP Amp Lch Output (+)
18 VREG C The VREG C terminal 42 VCCSP L VCC SP Lch
19 VCC VCC 43 VCCSP R VCC SP Rch
20 BEEP IN Beep Signal Input 44 OUT RP1 SP Amp Rch Output (+)
21 VREF C The VREF C terminal 45 OUT_RP2 SP Amp Rch Output (+)
22 AUDIN_L Lch Input 46 OUT RN1 SP Amp Rch Output (-)
23 BEEP ADJ Beep signal level adjustment terminal 47 OUT RN2 SP Amp Rch Output (-)
24 AGC SW AGC ON/OFF Control 48 GNDSP R GND SP Rch

1-4
IC
VGN-S36C/S36GP/S36LP/S36SP/S36TP/S38CP/S52B/
S62PS/S62PSY/S62S/S350F/S350FP/S360/S360P/S370F
(J/AM/AO)
Confidential
BD3532KN-E2 (ROHM)
REGULATOR IC FOR TERMINATIONS
BLOCK DIAGRAM
BD6516F (ROHM)
DUAL USB HIGH-SIDE POWER SWITCH
– TOP VIEW –
BLOCK DIAGRAM
PIN DESCRIPTIONS
PIN No. PIN NAME FUNCTION
1 PGND1 Power Ground Terminal 1
2 PGND2 Power Ground Terminal 2
3 SGND Sense Ground Terminal
4 EN Enable Input Terminal
5 N.C. No Connection Terminal
6 VTTS Termination Voltage Detection Terminal
7 N.C. No Connection Terminal
8 N.C. No Connection Terminal
9 N.C. No Connection Terminal
10 VREF Standard Voltage Output Terminal
11 VREFS Standard Voltage Detection Terminal
12 VDDQ Standard Input Voltage Terminal
13 N.C. No Connection Terminal
14 N.C. No Connection Terminal
15 N.C. No Connection Terminal
16 VCC Power Supply Terminal
17 N.C. No Connection Terminal
18 N.C. No Connection Terminal
19 VTT_IN1 Power Supply Terminal 1 for Termination
20 VTT_IN2 Power Supply Terminal 2 for Termination
21 N.C. No Connection Terminal
22 N.C. No Connection Terminal
23 N.C. No Connection Terminal
24 VTT1 Termination Output Terminal 1
25 VTT2 Termination Output Terminal 2
26 N.C. No Connection Terminal
27 N.C. No Connection Terminal
28 N.C. No Connection Terminal
PIN DESCRIPTION
PIN No. PIN NAME I/O PIN DESCRIPTION
1 CTRLA Control Input : High Input>2.5 V, Low Input<0.7 V
4 CTRLB Switch On at "High"
2 FLAGA Error Flag Output : Active-Low, Open-Drain Output
3 FLAGB "Low" at Over Current, Over Temperature Detection
8OUTA
5OUTB
6 GND - Ground
Power Supply
Input Terminal to Switch and Power Supply Input Terminal of
Internal Circuit
IN
-VDD7
OUT
OUT Switch Output

1-5
IC
VGN-S36C/S36GP/S36LP/S36SP/S36TP/S38CP/S52B/
S62PS/S62PSY/S62S/S350F/S350FP/S360/S360P/S370F
(J/AM/AO)
Confidential
DA82562ET (INTEL)
FAST ETHERNET PHYSICAL LAYER CHIP
– TOP VIEW –
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
VCC (DPS)
VCCA (APS)
VSSA (APS)
RBIAS10 (B)
RBIAS100 (B)
VSSA2 (APS)
VCCA2 (APS)
VSS (DPS)
VCCT (APS)
TOP (MLT)
TDN (MLT)
VCCT (APS)
VSS (DPS)
VCCT (APS)
RDP (MLT)
RDN (MLT)
VCCT (APS)
VSS (DPS)
VCCR (APS)
VSSR (APS)
TESTEN (I)
VSSR (APS)
VCCR (APS)
VSS (DPS) VCC (DPS)
TOUT (O)
LILED# (O)
ISOL_TI (I)
ISOL_TEX (I)
ISOL_TCK (I)
SPDLED# (O)
ACTLED# (O)
VSSP (DPS)
LAN_RXD0 (O)
LAN_RXD1 (O)
VCCP (DPS)
LAN_RXD2 (O)
VSSP (DPS)
LAN_CLK (O)
VCCP (DPS)
ADV10 (I)
LAN_RSTSYN
C
LAN_TXD0 (I)
LAN_TXD1 (I)
LAN_TXD2 (I)
X1 (I)
X2 (O)
VSS (DPS)
82562ET
PIN DIAGRAM
SSOP48
Rev 1.0
Top View
FW82801DBMSL6DN (INTEL)
I/O CONTROLLER HUB 4 MOBILE (ICH4-M)