Sony DSC-H50 User manual

Sony EMCS Co.
2008I0800-1
©2008.09
Published by KohdaTEC
SUPPLEMENT-1
File this supplement with the service manual previously issued.
(DI08-234)
SERVICE MANUAL
Ver. 1.2 2008. 09
DSC-H50_L2
9-852-286-81
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Hong Kong Model
Chinese Model
Korea Model
Argentine Model
Brazilian Model
Thai Model
Japanese Model
Tourist Model
LEVEL 2
• Change of Repair Parts
DSC-H50
RMT-DSC2

— 2 —
DSC-H50_L2
Page
2. DISASSEMBLY
2-2. DISASSEMBLY
Before change After change
2-8
: Changed portion.
2-2-6. LCD SECTION 2-2-6. LCD SECTION
A
2 CK-198 Board
HELP11
1-4 (Claw)
1-6
(#1/#14) 1-3
2-7
(#14) 2-8
A
2 CK-198 Board2 CK-198 Board
HELP11
1-4 (Claw)
1-6
(#1/#14) 1-3
2-7
(#1)
2-7
(#1) 2-82-8
Page
5. REPAIR PARTS LIST
5-1. EXPLODED VIEWS
Before change After change
5-7
: Changed portion.
5-1-6. LCD SECTION 5-1-6. LCD SECTION
A
#14
254
255 256
25
7
A
#1
254
255 256
25
7

SERVICE MANUAL
LEVEL 3
DSC-H50_L3
Ver. 1.3 2009.06
Sony EMCS Co.
2009F0800-1
© 2009.06
Published by KohdaTEC
SUPPLEMENT-2
File this supplement with the service manual.
(DI09-081)
Subject
• Change of Schematic Diagrams
• Change of Electrical Parts List
4. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
4-2. SCHEMATIC DIAGRAMS
Before Change
Page
-: Points changed portion
4-5
After Change
SY-201 BOARD (1/10) (Location: F-7 to G-9)
4-6
SY-201 BOARD (1/10) (Location: F-7 to G-9)
SY-201 BOARD (2/10) (Location: C-2 to C-3) SY-201 BOARD (2/10) (Location: C-2 to C-3)
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Hong Kong Model
Chinese Model
Korea Model
Argentine Model
Brazilian Model
Thai Model
Japanese Model
Tourist Model
DSC-H50
RMT-DSC2
9-852-286-83
C041 220p
C028 XX
1
C044
22u
F7
DDCBL_RS
E7
VBUS_IN
D10
XMS_IN
G5
XEXT_IN
D9
XPWR_ON3
D8
XPWR_ON2
D7
XPWR_ON1
C10
XPWR_OFF
D6
XRESET_REQ
D5
XNAND_RESET
C9
XSYS_RESET
C7
SO
C6
SI
C8
SCK
C5
XCE
A10
TEST2
B10
DDC1P8_RF
B9
DDC1P8_INM
A9
DDC1P8_PG
A8
DDC1P8_LX
B8
DDC1P8_PWR
B6
DDC1P8_VFB R051 XX
R031 1k
R032 1k
C065 XX
0
4
3
0
1
2
L009 10uH
C064 0.1u
C0
2
2
C041 220p
C028 XX
1
C044
XX
F7
DDCBL_RS
E7
VBUS_IN
D10
XMS_IN
G5
XEXT_IN
D9
XPWR_ON3
D8
XPWR_ON2
D7
XPWR_ON1
C10
XPWR_OFF
D6
XRESET_REQ
D5
XNAND_RESET
C9
XSYS_RESET
C7
SO
C6
SI
C8
SCK
C5
XCE
A10
TEST2
B10
DDC1P8_RF
B9
DDC1P8_INM
A9
DDC1P8_PG
A8
DDC1P8_LX
B8
DDC1P8_PWR
B6
DDC1P8_VFB R051 XX
R031 1k
R032 1k
C065 XX
0
4
3
0
1
2
L009 10uH
C064 XX
C0
2
2
C209
0.1u
C3
REGC
C205
1u
REG_GND
C209
XX
C3
REGC
C205
1u
REG_GND

— 2 —
DSC-H50_L3
Before Change
Page
-: Points changed portion
4-7
After Change
SY-201 BOARD (3/10) (Location: A-2 to B-3) SY-201 BOARD (3/10) (Location: A-2 to B-3)
SY-201 BOARD (4/10) (Location: C-3) SY-201 BOARD (4/10) (Location: C-3)
4-8 SY-201 BOARD (4/10) (Location: B-7) SY-201 BOARD (4/10) (Location: B-7)
SY-201 BOARD (5/10) (Location: C-6) SY-201 BOARD (5/10) (Location: C-6)
4-9
C212
XX
C211
0.1u
C213
0.1u
D_3.1V
D_3.1V
IC211
PRX515103
V4
V5
R4
R5
B16
L14
AE24
AF24
AB22
AC23
IOVDD
IOVDD
GND
GND
IOVDD
GND
IOVDD
IOVDD
GND
GND
LENS CONTROL, MOD
(1/5)
CPU, CAMERA DSP, AV SIG
C212
XX
C211
XX
C213
XX
D_3.1V
D_3.1V
IC211
PRX515103
V4
V5
R4
R5
B16
L14
AE24
AF24
AB22
AC23
IOVDD
IOVDD
GND
GND
IOVDD
GND
IOVDD
IOVDD
GND
GND
LENS CONTROL, MOD
(1/5)
CPU, CAMERA DSP, AV SIG
2
4
C243
0.1u
AB12
AB11
AE17
AC17
PI
AVSS_PI
AVCC_PI
CCD1_IOVDD
CCD2_IOVDD
A_3.1V
2
4
C243
XX
AB12
AB11
AE17
AC17
PI
AVSS_PI
AVCC_PI
CCD1_IOVDD
CCD2_IOVDD
A_3.1V
C249
22u
C249
XX
C282
0.1u
B8
K10
K11
L10
L11
M10
M11
N10
N11
K12
L12
GN
EM
EM
EM
EM
GN
GN
GN
GN
GN
GN
C282
XX
B8
K10
K11
L10
L11
M10
M11
N10
N11
K12
L12
GN
EM
EM
EM
EM
GN
GN
GN
GN
GN
GN

— 3 —
DSC-H50_L3
Before Change
Page
-: Points changed portion
4-10
After Change
SY-201 BOARD (6/10) (Location: A-6 to B-7) SY-201 BOARD (6/10) (Location: A-6 to B-7)
SY-201 BOARD (6/10) (Location: F-6 to G-7) SY-201 BOARD (6/10) (Location: F-6 to G-7)
SY-201 BOARD (6/10) (Location: E-10 to F-11) SY-201 BOARD (6/10) (Location: E-10 to F-11)
C390
0.1u
C389
0.1u
C321
0.1u C322
XX
C325
0.1u
C326
0.1u C385
0.1u C387
0.1u
R
C382
XX
C395
22u
123
L312
XX
M
_13V
C390
0.1u
C389
XX
C321
XX C322
XX
C325
0.1u
C326
XX C385
0.1u C387
XX
R
C382
XX
C395
XX
123
L312
XX
M
_13V

— 4 —
DSC-H50_L3
Before Change
Page
-: Points changed portion
4-12
After Change
SY-201 BOARD (8/10) (Location: F-2 to F-3) SY-201 BOARD (8/10) (Location: F-2 to F-3)
SY-201 BOARD (8/10) (Location: C-4 to E-5) SY-201 BOARD (8/10) (Location: C-4 to E-5)
SY-201 BOARD (8/10) (Location: D-10 to D-11) SY-201 BOARD (8/10) (Location: D-10 to D-11)
3.1
2.8
C512
1u
C504
1u
A_3.1V
V
3
V
4
PITCH-
YAW+
PITCH+
YAW-
C503
0.1u
C507
0.1u
0.1u
10V
A1
PGND
E1
PGND
A10
PGND
E10
PGND
F1
DVCC
F10
DGND
D1
OUT0A
B1
OUT0B
D10
OUT1A
B10
OUT1B
E2
MD_IN0
F2
MD_BR0
G2
MD_EN0
E9
MD_IN1
F9
MD_BR1
G9
MD_EN1
G7
xMD_PS
VCCA3
K1
VCCA3
K6
GNDA3
K7
GNDA3
K10
OP_IP0
H2
G4
TEST
CL509
0.6
2.8
3.1
0.7
3.0 C522
0.1u
0
.
047u
C532
0.047u
22 23 24 25 26 27 28
DGND
LPFAIN1
DVcc
CLK
LPFBIN1
DATA
AGND
3.1
2.8
C512
1u
C504
XX
A_3.1V
V
3
V
4
PITCH-
YAW+
PITCH+
YAW-
C503
XX
C507
XX
0.1u
10V
A1
PGND
E1
PGND
A10
PGND
E10
PGND
F1
DVCC
F10
DGND
D1
OUT0A
B1
OUT0B
D10
OUT1A
B10
OUT1B
E2
MD_IN0
F2
MD_BR0
G2
MD_EN0
E9
MD_IN1
F9
MD_BR1
G9
MD_EN1
G7
xMD_PS
VCCA3
K1
VCCA3
K6
GNDA3
K7
GNDA3
K10
OP_IP0
H2
G4
TEST
CL509
0.6
2.8
3.1
0.7
3.0 C522
XX
0
.
047u
C532
0.047u
22 23 24 25 26 27 28
DGND
LPFAIN1
DVcc
CLK
LPFBIN1
DATA
AGND

— 5 —
DSC-H50_L3
Before Change
Page
-: Points changed portion
4-13
After Change
SY-201 BOARD (9/10) (Location: C-2 to C-3) SY-201 BOARD (9/10) (Location: C-2 to C-3)
0
3.1
0
0
C603
10u
C604
1u
R601
10
R1114Q281D-TR-FA
IC604
1
CE
2
GND VOUT
3
VDD
4
C619
1u
D601
MA2S1110G8S0
2.8V REG
0
3.1
0
0
C603
XX
C604
1u
R601
10
R1114Q281D-TR-FA
IC604
1
CE
2
GND VOUT
3
VDD
4
C619
XX
D601
XX
2.8V REG
!: Points deleted portion
5. REPAIR PARTS LIST
5-2. ELECTRICAL PARTS LIST
Page Before change After change
5-12
Ref. No. Part No. DescriptionRef. No. Part No. Description
< CAPACITOR >
C044 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C064 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C209 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C211 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C213 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C243 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C249 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C282 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
*C321 1-114-582-11 CERAMIC CHIP 0.1uF 10% 16V
C326 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
SY-201 BOARD SY-201 BOARD
$
$
$
$
$
$
$
$
$
$
SY-201 BOARD (9/10) (Location: D-2 to E-3) SY-201 BOARD (9/10) (Location: D-2 to E-3)

— 6 —
DSC-H50_L3
-: Points changed portion
!: Points deleted portion
Page Before change After change
5-13
Ref. No. Part No. DescriptionRef. No. Part No. Description
< CAPACITOR >
C387 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C389 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C395 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C503 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C504 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C507 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C522 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C603 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C619 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
< DIODE >
*D601 6-501-947-01 DIODE MA2S1110G8S0
< RESISTOR >
R601 1-218-929-11 RES-CHIP 10 5% 1/16W
SY-201 BOARD SY-201 BOARD
$
$
$
$
$
$
$
$
$
$
< RESISTOR >
R601 1-218-990-11 SHORT CHIP 0
[
5-15

Revision History
Revision History
Sony EMCS Co.
DSC-H50_L2
SERVICE MANUAL
LEVEL 2
Link
DISASSEMBLY
SERVICE NOTE
SPECIFICATIONS
SCHEMATIC DIAGRAMS
FRAME SCHEMATIC DIAGRAM
BLOCK DIAGRAMS
REPAIR PARTS LIST
PRINTED WIRING BOARDS
Link
Internal memory
ON BOARD
Internal memory
ON BOARD
Ver. 1.4 2009.08
2009H0800-1
© 2009.08
Published byTokaiTEC
9-852-286-34
The components identified by
mark 0or dotted line with
mark 0are critical for safety.
Replace only with part num-
ber specified.
Les composants identifiés par une
marque 0sont critiques pour la
sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
DSC-H50
RMT-DSC2
Photo: Black
DIGITAL STILL CAMERA
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Hong Kong Model
Chinese Model
Korea Model
Argentine Model
Brazilian Model
Thai Model
Japanese Model
Tourist Model
• Precaution on Replacing the SY-201 Board
Revised-3
Replace the previously issued
SERVICE MANUAL 9-852-286-33
with this Manual.

— 2 —
DSC-H50_L2
SPECIFICATIONS
Camera
[System]
Image device: 7.70 mm (1/2.3 type) color CCD, Primary color filter
• Only 7.30mm (1/2.5type equivalent) area is used in the camera.
Total pixel number of camera: Approx. 10.3 Megapixels
Effective pixel number of camera: Approx. 9.1 Megapixels
Lens: Carl Zeiss Vario-Tessar 15Å~ zoom lens
f = 5.2 - 78 mm (31 - 465 mm (35 mm film equivalent))
F2.7(W) - 4.5(T)
Exposure control: Automatic exposure, Shutter
speed priority, Aperture priority, Manual exposure,
Scene Selection (10 modes)
White balance: Automatic, Daylight, Cloudy,
Fluorescent 1,2,3, Incandescent, Flash, One push
File format (DCF compliant):
Still images: Exif Ver. 2.21 JPEG compliant, DPOF compatible
Movies: MPEG1 compliant (Monaural)
Recording media: Internal Memory (approx. 15MB),
“Memory Stick Duo”
Flash: Flash range (ISO sensitivity
(Recommended exposure Index) set toAuto):
Approx. 0.2 to 9.1m (77/8inches to 29feet 103/8inches) (W)/
approx. 1.2 to 5.5m (3feet 111/4inches to 18feet 5/8inches) (T)
Viewfinder: Electric view finder (color)
[Input and Output connectors]
Multi connector: Video output
Audio output (Monaural)
USB communication
USB communication: Hi-Speed USB (USB 2.0 compliant)
[LCD screen]
LCD panel: 7.5cm (3.0type) TFT drive
Total number of dots: 230 400 (960 Å~ 240) dots
[Finder]
Panel: 0.5cm (0.2type) color
Total number of dots: Approx. 200 000 dots equivalent
[Power, general]
Power: Rechargeable battery pack
NP-BG1, 3.6V
NP-FG1 (not supplied), 3.6V
AC-LS5K AC Adaptor (not supplied), 4.2V
Power consumption (during shooting, LCD screen on): 1.1 W
Operating temperature: 0 to 40°C (32 to 104°F)
Storage temperature: –20 to +60°C (–4 to +140°F)
Dimensions: 116.1 ×81.4 ×86.0mm
(45/8 ×31/4 ×31/2inches) (W/H/D, excluding protrusions)
Mass: Approx. 547g (1lb 3.3oz)
(including NP-BG1 battery pack, strap, etc.)
Microphone: Monaural
Speaker: Monaural
Exif Print: Compatible
PRINT Image Matching III: Compatible
PictBridge: Compatible
BC-CSGB/BC-CSGC battery charger
Power requirements:AC 100V to 240V, 50/60Hz,
2.6W (BC-CSGB)/2W (BC-CSGC)
Output voltage: DC 4.2V, 0.25A
Operating temperature: 0 to 40°C (32 to 104°F)
Storage temperature: –20 to +60°C (–4 to +140°F)
Dimensions: Approx. 62 ×24 ×91mm
(2 1/2 ×31/32 ×35/8 inches) (W/H/D)
Mass: Approx. 75g (2.7oz)
Rechargeable battery pack NP-BG1
Used battery: Lithium-ion battery
Maximum voltage: DC 4.2V
Nominal voltage: DC 3.6V
Capacity: 3.4Wh (960mAh)
Design and specifications are subject to change without notice.

— 3 —
DSC-H50_L2
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINEWITH
MARK 0ONTHE SCHEMATIC DIAGRAMS AND INTHE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2. Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair. Point
them out to the customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
CAUTION
Dangerofexplosionifbattery isincorrectlyreplaced.
Replace only with the same or equivalent type.

1-1
ENGLISH JAPANESE
ENGLISH JAPANESE
DSC-H50_L2
1. SERVICE NOTE
1-2. SELF-DIAGNOSIS FUNCTION
1-2-1. Self-diagnosis Function
When problems occur while the unit is operating, the self-diagnosis
function starts working, and displays on the LCD screen what to
do.
Details of the self-diagnosis functions are provided in the Instruction
manual.
1-2-2. Self-diagnosis Display
When problems occur while the unit is operating, the LCD screen
shows a 4-digit display consisting of an alphabet and numbers, which
blinks at 3.2 Hz. This 5-character display indicates the “repaired
by:”, “block” in which the problem occurred, and “detailed code”
of the problem.
0 0
3 2C
Repaired by:
Refer to “1-2-3. Self-diagnosis Code Table”.
Indicates the appropriate
step to be taken.
E.g.
13 ....Format the “Memory Stick Duo”.
32 ....Turn on power again.
Block Detailed Code
Blinks at 3.2 Hz
C : Corrected by customer
E : Corrected by service
engineer
LCD screen
1-1. PRECAUTION ON REPLACING THE SY-201 BOARD
DESTINATION DATA
When you replace to the repairing board, the written destination data of repairing board also might be changed to original setting.
Refer to Service Manual ADJ, and perform “DESTINATION DATA WRITE”.
USB SERIAL No.
The set is shipped with a unique ID (USB Serial No.) written in it.
This ID has not been written in a new board for service, and therefore it must be entered after the board replacement.
Refer to Service Manual ADJ, and perform “USB SERIAL No. INPUT”.

1-2
ENGLISH JAPANESE
ENGLISH JAPANESE
DSC-H50_L2
1-2-3. Self-diagnosis Code Table
C
C
E
E
E
E
E
E
E
E
E
Block
Function
13
32
61
61
62
62
62
62
62
91
92
Detailed
Code
01
01
00
10
02
10
11
12
20
01
00
Symptom/State
The internal memory has experienced a
format error.
“Memory Stick Duo” is unformatted.
“Memory Stick Duo” is broken.
“Memory Stick Duo” type error
The camera cannot read or write data
on the “Memory Stick Duo”.
Trouble with hardware
Difficult to adjust focus
(Cannot initialize focus)
Zoom operations fault
(Cannot initialize zoom lens.)
Abnormality of IC for steadyshot.
Lens initializing failure.
Lens overheating (PITCH).
Lens overheating (YAW).
Abnormality of thermistor.
Abnormality when flash is being charged.
Non-standard battery is used.
Self-diagnosis Code
Repaired by:
Correction
Format the internal memory.
Format the “Memory Stick Duo”.
Insert a new “Memory Stick Duo”.
Insert a supported “Memory Stick Duo”.
Turn the power off and on again, or taking out and inserting the
“Memory Stick Duo” several times.
Turn the power off and on again.
Retry turn the power on by the power switch. If it does not
recover, check the focus reset sensor of lens block (pin wj of
CN401 on the SY-201 board). If it is OK, check the focus motor
drive IC (IC401 on the SY-201 board).
Retry turn the power on by the power switch. Check the zoom
reset sensor of lens block (pin qj of CN401 on the SY-201
board), if zooming is performed when the zoom button is
operated. If it is OK, check the zoom motor drive IC (IC401 on
the SY-201 board).
Check or replacement of the IC for steadyshot (IC503 on the SY-
201 board).
Check or replacement of the IC for steadyshot (IC503 on the SY-
201 board).
Check the HALL element (PITCH) of optical image stabilizer
(pin eg, ej of CN401 on the SY-201 board). If it is OK, check
PITCH/YAW angular velocity sensor (SE502 on the SY-201
board) peripheral circuits.
Check the HALL element (YAW) of optical image stabilizer (pin
e;, es of CN401 on the SY-201 board). If it is OK, check
PITCH/YAW angular velocity sensor (SE501 on the SY-201
board) peripheral circuits.
Replacement of lens block.
Checking of flash unit or replacement of flash unit. (Note)
Use the compatible battery only.
Note: After repair, be sure to perform “1-3. PROCESSAFTER FIXING FLASH ERROR”.

1-3
ENGLISH JAPANESE
ENGLISH JAPANESE
DSC-H50_L2
1-4. METHOD FOR COPYING OR ERASING THE DATA IN INTERNAL MEMORY
The data can be copied/erased by the operations on the HOME screen. (When erasing the data, execute formatting the internal memory.)
Note 1: When replacing the SY-201 board, erase the data in internal memory of the board before replacement.
Note 2: When replacing the SY-201 board, execute formatting and initialize the internal memory after replacement.
Method for Copying the Data in Internal Memory
Method for Formatting the Internal Memory
Copies all images in the internal memory to a “Memory Stick Duo”.
1Insert a “Memory Stick Duo” having sufficient free capacity.
2Select [Copy] with v/Von the control button, then press z.
The message “All data in internal memory will be copied” appears.
3Select [OK] with v, then press z.
Copying starts.
To cancel copying
Select [Cancel] in step 3, then press z.
Use a fully charged battery pack. If you attempt to copy image files using a battery pack with little
remaining charge, the battery pack may run out, causing copying to fail or possibly corrupting the data.
You cannot select images to copy.
The original images in the internal memory are retained even after copying. To delete the contents of the
internal memory, remove the “Memory Stick Duo” after copying, then format the internal memory
([Format] in [Internal Memory Tool]).
A new folder is created on the “Memory Stick Duo” and all the data will be copied to it. You cannot
choose a specific folder and copy images to it.
The (Print order) marks on the images are not copied.
Copy
This item does not appear when a “Memory Stick Duo” is inserted in the camera.
Formats the internal memory.
Note that formatting permanently erases all data in the internal memory, including even protected images.
1Select [Format] with v/Von the control button, then press z.
The message “All data in internal memory will be erased” appears.
2Select [OK] with v, then press z.
Formatting starts.
To cancel formatting
Select [Cancel] in step 2, then press z.
Format
1-3. PROCESS AFTER FIXING FLASH ERROR
When “FLASH error” (Self-diagnosis Code E : 91 : 01) occurs, to prevent any abnormal situation caused by high voltage, setting of the flash
is changed automatically to disabling charge and flash setting.
After fixing, this setting needs to be deactivated. Flash error code can be initialized by the operations on the HOME screen.
Method for Initializing the Flash Error Code
Initializes the setting to the default setting. Even if you execute this function, the images
stored in the internal memory are retained.
1Select [Initialize] with v/Von the control button, then press z.
The message “Initialize all settings” appears.
2Select [OK] with v, then press z.
The settings are reset to the default setting.
To cancel initializing
Select [Cancel] in step 2, then press z.
Be sure not to power off the camera while initializing.
Initialize

1-4
ENGLISH JAPANESE
ENGLISH JAPANESE
DSC-H50_L2
1-5. HOW TO WRITE DATA TO INTERNAL MEMORY
Usually, the camera has been set so as to disable the data writing from the PC to the internal memory of the camera.
This setting must be changed temporarily when the data is to be written to the internal memory such as a case after the board replacement.
To change the setting, use the write enable tool “WriteEnableTool.exe”.
Data writing method
1) Connect the PC to the camera (USB mode: Mass Storage), and switch the driver to the “Sony Seus USB Driver”.
2) Start the Write Enable Tool and the SeusEX.
3) Click the [Activate Write Enable Mode] button of the Write Enable Tool.
4) Upon completion of the setting change, the following message will be displayed.
5) Return the driver to the original one, and connect the PC to the camera (USB mode: Mass Storage).
6) Write the data read out into the PC to the internal memory of the camera.
7) Disconnect the PC from the camera, and turn off the camera.
Note: By turning off the camera, the write enable setting is reset.

1-5
ENGLISH JAPANESE
ENGLISH JAPANESE
DSC-H50_L2
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2-1
DSC-H50_L2
2. DISASSEMBLY
NOTE FOR REPAIR
• Make sure that the flat cable and flexible board are not cracked of bent at the terminal.
Do not insert the cable insufficiently nor crookedly.
• When remove a connector, don’t pull at wire of connector.It is possible that a wire is snapped.
• When installing a connector, don’t press down at wire of connector.
It is possible that a wire is snapped.
• Do not apply excessive load to the gilded flexible board.
Cut and remove the part of gilt
which comes off at the point.
(Be careful or some
pieces of gilt may be left inside)
DISCHARGING OF THE ST-194 BOARD’S CHARGING CAPACITOR (C205)
The charging capacitor (C205) of the ST-194 board is charged
up to the maximum 315 V potential.
There is a danger of electric shock by this high voltage when the
capacitor is handled by hand. The electric shock is caused by
the charged voltage which is kept without discharging when the
main power of the unit is simply turned off. Therefore, the
remaining voltage must be discharged as described below.
Preparing the Short Jig
To preparing the short jig, a small clip is attached to each end of
a resistor of 1 k1/1 W (1-215-869-11).
Wrap insulating tape fully around the leads of the resistor to
prevent electrical shock.
1 k1/1 W
Wrap insulating tape.
Note: High-voltage cautions
Discharging the Capacitor
Short-circuit between the two points with the short
jig about 10 seconds.
To avoid the spark with the metal plate,wrap the
short jig with the insulation tape.
ST-194 Board
Alminum Elect Cap
180uF 315V
(C205)
R:1 k1/1 W
(Part code: 1-215-869-11)