Sony MDR-NC300D User manual

SERVICE MANUAL
Sony Corporation
Audio&Video Business Group
Published by Sony Techno Create Corporation
MDR-NC300D
SPECIFICATIONS
NOISE CANCELING HEADPHONES
9-889-563-03
2010A05-1
© 2010.01
US Model
AEP Model
UK Model
E Model
Chinese Model
Tourist Model
Ver. 1.2 2010.01
General
Type: dynamic, closed
Wear method: vertical in-the-ear
Driver units: 16 mm, dome type
(CCAW adopted)
Power handling capacity:
100 mW
Impedance: 16  (at 1 kHz)
Sensitivity: 103 dB/mW
Frequency response:
6 – 24,000 Hz
Total Noise Suppression Ratio*2:
Approx. 18 dB*1
Cord: 1.2 m (47 1/4 in) OFC litz
cord
Plug: Gold-plated stereo
mini-plug
Power source: DC 1.5 V, 1 × AA/LR6 dry
battery
Mass: Headphones section:
Approx. 8 g (without cord)
Control box section:
Approx. 53 g (without
cord, including battery)
Supplied accessories
Extension cord (1 m, gold-plated stereo
mini-plug) (1) (Except US)
Cord adjuster (1)
Clip (1)
Plug adaptor for in-ight use*3(single/dual) (1)
Carrying case (1)
Carrying pouch (1)
Earbuds (SS × 2, S × 2, MS × 2, M × 2, ML × 2,
L × 2, LL × 2)
Sony alkaline AA/LR6 dry battery (1) (US,
Operating Instructions (1)
Product Information (1)
*1
Equivalent to approx. 98.4 % reduction of
energy of sound compared with not
wearing headphones (NC MODE A).
*2
Under the Sony measurement standard.
For details about the Total Noise
Suppression Ratio amount for each mode,
refer to the Product Information booklet.
*3
May not be compatible with some in-ight
music services.
Design and specications are subject to
change without notice.
Battery life
Battery Approx. hours*1
Sony alkaline AA/LR6
dry battery
20 hours*2
*1 At 1 kHz, 0.1 mW + 0.1 mW output
*2
Time stated above may vary, depending on
the temperature or conditions of use.
AEP, UK and Tourist models)
Card warranty (1) (US, AEP, UK, Chinese and
Tourist models)
Extension cord (0.6 m (23 / in), gold-plated
stereo mini-plug) (1) (US)
NOTES ON CHIP COMPONENT REPLACEMENT
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
• Keep the temperature of soldering iron around 270 °C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.

MDR-NC300D
2
1. SERVICING NOTES ............................................. 2
2. DISASSEMBLY
2-1. Disassembly Flow........................................................... 3
2-2. Case Assy........................................................................ 3
2-3. Headphone Assy ............................................................. 4
2-4. SUB Board...................................................................... 5
2-5 LCD Sub Assy (SVX)..................................................... 6
2-6. MAIN Board ................................................................... 7
3. TEST MODE ............................................................ 7
4. ELECTRICAL ADJUSTMENT ........................... 7
5. DIAGRAMS
5-1. Block Diagram................................................................ 8
5-2. Printed Wiring Board - MAIN Board - ........................... 10
5-3. Schematic Diagram - MAIN Board -.............................. 11
5-4. Printed Wiring Board - SUB Board -.............................. 12
5-5. Schematic Diagram - SUB Board -................................. 13
6. EXPLODED VIEWS
6-1. Case Section.................................................................... 17
6-2. Chassis Section ............................................................... 18
7. ELECTRICAL PARTS LIST .............................. 19
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS
SECTION 1
SERVICING NOTES
NOTE THE CN302, IC301, IC302, IC303, IC304 AND
IC501 ON THE MAIN BOARD REPLACING
CN302, IC301, IC302, IC303, IC304 and IC501 on the MAIN
board cannot exchange with single. When these parts are damaged,
exchange the entire mounted board.
NOTE THE CN301, IC403, IC404, IC405, IC406, IC407,
IC601, IC602 AND Q404 ON THE SUB BOARD RE-
PLACING
CN301, IC403, IC404, IC405, IC406, IC407, IC601, IC602 and
Q404 on the SUB board cannot exchange with single. When these
parts are damaged, exchange the entire mounted board.
NOTE THE MAIN BOARD, SUB BOARD OR HEAD-
PHONE ASSY REPLACING
When the MAIN board, SUB board or headphone assy are replaced, ex-
ecute the adjustment referring to “NOISE CANCEL VOLUME ADJUST-
MENT” (page 7) on the electrical adjustment.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Ver. 1.2

MDR-NC300D
3
SECTION 2
DISASSEMBLY
• This set can be disassembled in the order shown below.
2-1. DISASSEMBLY FLOW
Note: Follow the disassembly procedure in the numerical order given.
2-2. CASE ASSY
SET
2-2. CASE ASSY
(Page 3)
2-3. HEADPHONE ASSY
(Page 4)
2-4. SUB BOARD
(Page 5)
2-5. LCD SUB ASSY (SVX)
(Page 6)
2-6. MAIN BOARD
(Page 7)
4knob (power & hold)
Note 1: Please remove so as not to injure
knob (power & hold) and case assy.
5two special head screws
2screw (M1.4)
SUB board
switch (S607)
knob (power & hold)
Note 2: When installing knob (power & hold),
the position of switch (S607) and
claw of knob (power & hold)
is set and installed. 3lid battery assy
1Open the
battery lid.
6two claws
flat-head
screwdriver
battery lid side
8case assy
7
headphone cord side
Ver. 1.2

MDR-NC300D
4
2-3. HEADPHONE ASSY
Note 1: When replacing the headphone assy, please refer to “NOTE THE MAIN BOARD, SUB BOARD OR HEADPHONE ASSY REPLACING”
of service note (see page 2).
1Lift the cap (bushing).
2two screws
3three claws
4battery lock block
cap (bushing)
The lib is set to the ditch and install.
stopper
ditch
headphone assy
6cover (bottom)
7headphone assy
5connector (CN303)
Note 3: When remove the connecor,
please remove the connector
in tweezers etc..
There is a possibility of disconnecting
when the lead wire is pulled.
Note 2: Please install headphone assy
as shown in figure.

MDR-NC300D
5
2-4. SUB BOARD
Note: When replacing the headphone assy, please refer to “NOTE THE MAIN BOARD, SUB BOARD OR HEADPHONE ASSY REPLACING”
of service note (see page 2).
5two sheets (TACT SW)
2connector (CN651)
3screw
1sheet
(SUB PWB)
6sheet (SLIDE SW)
7SUB board
liquid crystal display panel flexible cable
4connector (CN301)

MDR-NC300D
6
2-5. LCD SUB ASSY (SVX)
2Remove solder.
(TP412)
MAIN board block
4
5sheet
(MAIN PWB)
1two claws
1two claws
3screw
q; LCD sub assy (SVX)
7straight
8shield (LCD) case
9two claws
6Remove solder.
6Remove solder.
MAIN board block
Ver. 1.2

MDR-NC300D
MDR-NC300D
77
2-6. MAIN BOARD
Note: When replacing the headphone assy, please refer to “NOTE THE MAIN BOARD, SUB BOARD OR HEADPHONE ASSY REPLACING”
of service note (see page 2).
1Remove solder of
battery (–) terminal.
5MAIN board
3Remove solder of
battery (+) terminal.
4battery (+) terminal
2battery (–) terminal
SECTION 3
TEST MODE
SECTION 4
ELECTRICAL ADJUSTMENT
SETTING THE TEST MODE
Procedure:
1. Slide the [POWER] switch to turn the power on (At this time,
[HOLD] is off).
2. Slide the [HOLD] switch to HOLD on.
3. Press the button as following order.
Note 1: Press the button as it is continuously though “HOLD” is displayed
on the liquid crystal display whenever the button is pressed.
[NC OPTIMIZE] →[VOLUME +] →[VOLUME –] →
[MONITOR] →[SOUND MODE] →[VOLUME +] →
[VOLUME –] →[MONITOR] →[SOUND MODE] →
[NC OPTIMIZE]
4. After the message “TestMode” is displayed on the liquid crys-
tal display for two seconds, the test command selection menu
is displayed.
Note 2: Turn off [HOLD] and execute the operation from procedure 2
again when “TestMode” is not displayed on liquid crystal display,
or it makes a mistake in the operation on the way.
OPERATING THE TEST MODE
Procedure:
1. Press the [VOLUME +] or [VOLUME –] button to select the
test command.
• Test command list
Command name Content
NC Adjust The NC gain is adjusted. Refer to “SEC-
TION 4 ELECTRICAL ADJUSTMENT”.
Debug Never execute this mode. The setting
value is destroyed.
FW Ver The firmware version is displayed.
Ext Control Never execute this mode. Not used for the
servicing.
2. Press the [SOUND MODE] button, and execute the selected
test command.
3. The test command is ended when the [MONITOR] button is
pressed while executing the test command and it returns to the
menu.
4. Press the [MONITOR] button with the test command selection
menu displayed to end the test mode.
FACTORY SHIPMENT MODE
Execute this mode when returning the set to the customers.
Procedure:
1. While pressing the [NC OPTIMIZE] button, slide the [POW-
ER] switch to turn the power on.
2. It is confirmed that “ALL RESET” was displayed on the liquid
crystal display, and release the [NC OPTIMIZE] button.
3. It is confirmed that “ALL RESET” disappeared from the liq-
uid crystal display, and pull out the battery without turning off
power.
NOISE CANCEL VOLUME ADJUSTMENT
Connection:
+
–
amplifier
speaker
AF oscillator
Procedure:
1. Generate a sine wave of specific frequency (250 Hz) from a AF
oscillator, and output it from a speaker placed at the forward
position.
2. Wear this headphones on the ear, and slide the [POWER]
switch to turn the power on.
3. Slide the [HOLD] switch to HOLD on.
4. Press the button as following order.
[NC OPTIMIZE] →[VOLUME +] →[VOLUME –] →
[MONITOR] →[SOUND MODE] →[VOLUME +] →
[VOLUME –] →[MONITOR] →[SOUND MODE] →
[NC OPTIMIZE]
5. After the message “TestMode” is displayed on the liquid crys-
tal display for two seconds, the test command selection menu
is displayed.
6. Press the [VOLUME +] or [VOLUME –] button to select the
“NC Adjust”, and press the [SOUND MODE] button.
7. The screen for the adjustment is displayed (Refer to the figure
below).
8. With this headphones worn, adjust the gain at the position that
decreases the sound from the speaker on the audibility most
and hears.
[SOUND MODE] button :
L-ch/R-ch/L+R-ch changes whenever the button is pressed.
[VOLUME +]/[VOLUME –] buttons:
The gain value changes whenever the button is pressed.
Note: When the headphones are not covered with the ear pieces complete-
ly, the adjustment may not be performed correctly.
Make sure that the ear pieces cover the headphone completely.
9. Press the [MONITOR] button to release the “NC Adjust”
mode.
10. Press the [MONITOR] button to release the test mode.
11. Slide the [POWER] switch to turn the power off, execute
“FACTORY SHIPMENT MODE” in test mode.

MDR-NC300D
MDR-NC300D
88
SECTION 5
DIAGRAMS
5-1. BLOCK DIAGRAM
A +2.8V
R-CH
HEADPHONE
ASSY (1/2)
AUDIO IN L
AUDIO IN R
: AUDIO
: MIC
SIGNAL PATH
R-ch is omitted due to same as L-ch.
R-CH
R-CH
MIC L SIG
MIC R SIG
R-CH
HEADPHONE
ASSY (2/2)
LIQUID
CRYSTAL
DISPLAY
PANEL
MDD L-P
MDD L-N
R-CH
MDD R-P
MDD R-N
LINE AMP,
MIC AMP
IC301
DSP
IC501
MIC BIAS
Q101
POWER ON
DETECT
Q602
AINMAINL9
AINSUBL
6
OUTPL 84
OUTNL 85
X501
49.152MHz
XfsoOUT
XfsoIN
30
33
SYSTEM CONTROLLER
IC601
S602
MONITOR
14
RESET_N KM_RESETG2
I2C_SDA
G8
I2C_SCL
F6
KM_IO1
C6
KM_IO2
A8
SDA 50
SCL 47
GPIO1 52
GPIO2 51
MAINPWR_EN
VDD
F5
BATTCHK_EN F8
KM_STANDBYF2
STANDBY_N 28
LCD_/RESA6
LCD_SCL
C4
LCD_/CS1B6
LCD_A0
B4
LCD_SIB3
KEY_MONITOR
E8
S603
SOUND MODE KEY_SOUND
D7
S604
NC OPTIMIZE KEY_NCOPTIMIZE
E7
S605
VOLUME - KEY_-
D8
S606
VOLUME + KEY_+
D4
KEY_POWER
D5
BATTERY
DETECT
Q601
KEY_HOLD
D6
S607
POWER
(NEUTRAL)
HOLD
A_PWR +1.5V
D +2.8V
DRY BATTERY
SIZE “AAA”
(IEC DESIGNATION R03)
1PC. 1.5V
C3
VBATT_CHECK
RESET SIGNAL
GENERATOR
IC602
+2.8V
REGULATOR
IC405
A +2.8V
+2.8V
REGULATOR
IC404
LINE AMP +1.4V
+1.4V
REGULATOR
IC304
MIC AMP R +1.4V
+1.4V
REGULATOR
IC303
MIC AMP L +1.4V
+1.4V
REGULATOR
IC302
D_CORE +1.5V
+1.5V
REGULATOR
IC407
A_PRI +1.5V
DC/DC
CONVERTER
IC408, 409, Q404
G4
_RESET
F4
REG15_EN
+1.5V
REGULATOR
IC406
+1.5V
REGULATOR
IC403

MDR-NC300D
MDR-NC300D
99
• IC Block Diagrams
– MAIN Board –
IC302 – 304 TK63714AB6GHB-C
– SUB Board –
IC403, 406, 407 TK63715AB6GHB-C
IC404, 405 TK63728AB6GHB-C
IC408, 409 XC9128D45CDR
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ωand 1/4 W or less unless otherwise
specified.
• C: Panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
• A: B+ Line.
• Power voltage is dc 1.5 V and fed with regulated dc power
supply from battery terminal.
• Signal path.
F: AUDIO
N: MIC
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
For Printed Wiring Boards.
Note:
• Y: Parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
• MAIN and SUB boards are multi-layer printed wiring
board. However, the patterns of intermediate-layers have
not been included in diagrams.
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• Lead layouts
surface
CSP (Chip Size Package)Lead layout of conventional IC
A1GND B2 VIN
B1 VOUT
A2VCONT
ON/OFF
CONTROL
VREF
+
–
THERMAL &
OVER CURRENT
PROTECTION
A1GND B2 VIN
B1 VOUT
A2VCONT
ON/OFF
CONTROL
VREF
+
–
THERMAL &
OVER CURRENT
PROTECTION
DRIVER
10 VOUT
9MODE
8FB
7AGND
6AEN/
1
PGND
2
Lx
3
BAT
4
EN
5
FO
CURRENT SENSE,
LIMIT, PFM
EN,
THERMAL SHUTDOWN
VREF WITH
SOFT START
PWM
COMPARATOR
PHASE
COMPENSATION
ERROR
AMP.
PWM/PFM
CONTROLLER,
LOGIC
CURRENT LIMIT,
THERMAL,
SOFT START,
EN
RAMP WAVE
GENERATOR
OSCMODE

MDR-NC300D
MDR-NC300D
1010
5-2. PRINTED WIRING BOARD - MAIN Board - • : Uses unleaded solder.
TP202
TP203
TP201
TP301
TP101
TP102
TP103
TP351
TP251 TP151
TP302
TP408
TP409
TP413
TP412
TP622
TP623
S602
C531
C526
C527
C530
R518
R517
C533
R519
C532
R516
C209
C502
C109
C106
C306
Q101
R102
C102
R101
C104
S603
R262
FB406
R103
C307
C255
C153
C152
R159
R158
R157
R155
R153
R152
R151
C253
C252
C151
R259
R258
R257
R255
R253
R252
C155 R251
R162
C303
R203
C205
R209
R208
C103
R207
R204
D203 D201
D103
IC301
C105
C251
R109
R108
R107
C302
C206
R104
C204
D101
C301
C309
C308 C310
IC304
IC303
IC302
C618
C617
L102
R536
R537
C208
C207
R531
R216
R215
R115
R116
C108
C107
L202
L101
L201
C517
C513
C515
C516
C523
R504
R505
C529
C522
C528
C539
R521
R520
C537 C536
R524
C201
R523
R522
C540
C541
C538
C545
C514
C509
C510
R535
C504
C503
C501
C544
R527
R526
R525
C520
C521
R534
R533
IC501
R532
C524
C525
C202
L403
L404
C101
C203
CN302
C402
C401
C403
X501
CN303
Q201
R202
R201
C404
ASUB BOARD
CN301
1-879-156-
11
(11)
1-879-157-
11
(11)
MAIN BOARD (SIDE A)
MAIN BOARD (SIDE B)
A1
A2 B1 B2
A1A2
B1B2
115
16
20
11
106
5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
43
44
45
46
31
32
33
47
48
49
34
35
36
50
51
52
37
38
39
53
54
55
40
41
42
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
HEADPHONE
ASSY
DRY BATTERY
SAZE "AAA"
(IEC DESIGNATION R03)
1PCS. 1.5V
SOUND
MODE
MONITOR
A
B
C
D
1 2 3 4 5 6
Note 1: CN302, IC301, IC302, IC303, IC304 and IC501 on the MAIN board cannot exchange
with single. When these parts are damaged, exchange the entire mounted board.
Note 2: When the MAIN board or headphone assy are replaced, execute the adjustment referring to
“NOISE CANCEL VOLUME ADJUSTMENT” (page 7) on the electrical adjustment.

MDR-NC300D
MDR-NC300D
1111
5-3. SCHEMATIC DIAGRAM - MAIN Board - • See page 9 for IC Block Diagrams. • See page 14 for IC Pin Function Description.
TP302
TP412
TP623
D101
D203
D201
IC501
CN303
TP151
TP351
TP251
TP102
TP103
TP101
C103
C102
Q101
C104
R251
R151
R152 C151
R252 C251 R253 C252
R255 C253 R259
R257R102
R101
R258
C302
R262
R103
C109
C204
C101
C202
C203
R202
R201
C308
C303
C401 C402
R107 R108
C105 R109
D103
R203
R204
R207 R208
C205 R209
C310 C309
C209
R162
C404
C403
L404
L403
10mH
10mH
C502 R535
R534
R537
R533
R532
R536
R531
C206
C544
C545
R527 R525
R526
C255
C155
R157R158
R159 C153
C301
C152 R153
R155
C540
C541 C539
C538 R524
C536
C537
R522 R523
C532
C533
R516
C531 C529
C530 C528
R519
C527 C526
C523
R518
R517
C522
C525
C524
C501 C503
C504
R505
R504
C510
C509
C513
C514
C515 C208
R216
R215
C207
C108
R116
R115
C107
C520
C521
C306
C617
S603
C618
C106
TP301
TP201
TP203
TP202
C201
C307
R104
X501
L102
L101
L201
L202
47mH
47mH
47mH
47mH
IC303
IC302
TP409
CN302
TP408
S602
TP622
C517
C516
Q201
R521
R520
IC301
1SS380
1SS380
1SS380
CXD9952GR
10P
4.7
0.1
2SD2654
2.2
16
16
1k 10
1k 10 0 0.0047
22k 220p 0
22k47k
2.7k
33k
10
4.7k
10k
100p
2.2
0.0047
0.1
4.7
47k
2.7k
10
0.01
0.01 22
33k 68k
220p 0
FB406
0
1SS380
10k
47k
33k 68k
220p 0
10 0.01
100p
4.7k
10
10
10 10k
10k
10k
10k
10k
10k
100
10
0.01
1
10k 10k
100
10
10
22k33k
0 220p
0.1
0.0047 0
22k
0.01
10 10
0.01 220
3p
3p
01M
0.01
10
10k
4.7 10
0.047 0.01
2.2
2.2 0.047
10
22k
47k
0.01
4.7
0.047
0.01 0.01
10
100
100
10
0.01
0.01
10
10.22
2.2
2.2
0.22
0.22
2.2
2.2
0.22
0.01
100
6.3V
0.01
0.001
0.001
10
0.0047
10
47k
49.152MHz
IC304 TK63714
TK63714
TK63714
20P
10
0.01
2SD2654
0
0
NJM2734SCC
A_PWR 1.5
A_PRI 1.5
A_2.8
D-2.8
RESET
I2C_SCL
I2C_SDA
STANBY
GPIO0
GPIO1
GPIO2
D_CORE 1.5
D_CORE 1.5
MOVIE
MONITOR
AUDIO IN L
AUDIO IN R
AUDIO IN GND
MDD L-P
MDD L-N
MIC L SIG
MIC GND
MDD R-N
MDD R-P
MIC R SIG
VDD
VDD
A-GND
A-GND
D-GND
VDD28ADD
AINMAINL
AINMAINR
VMIDADC
AINSUBL
AINSUBR
TMS
DATAI1
XFSIIN
BCK
VDD28X
VSS28ADD
VSS28ADA
VDD28ADA
TEST1
TRST
RESET_N
DATAI2
VSS28D
VDD28D
XfsoOUT
OSCEN
STANDBY_N
TEST2
TEST3
TCK
TDI
TDO
VSS15D
VDD15D
MCKSEL
I2CADDR
LRCK
X256fsoOUT
GPIO0
DATAO
SCL SDA
GPIO2
GPIO1 GPIO3
GPIO4
VDD15D
VMIDDHP
VDD28PWM
VCONTIVSS28PWM
VREGO
VDD15DVDD15X
VSS15D
VCONTO
VSS28X
XfsoIN VDD15PRI
SHUTDOWN_N
VSS15PRI
PROTMON
AHPINL
AHPINR
LINEINL
VSS28D
VDD28D VDD28LINE
VSS28LINE
LINEINR
LINEOUTL
VDD28AHP
AHPOUTL
VSS15POR
VDD15POR
VDD15POL
VSS15POL OUTNL
OUTPL
OUTPR
OUTNR
VSS28AHP
AHPOUTR
PREOUTL
PREOUTR
LINEOUTR
VMIDHPL
SUB
SUB
ASSY
HEADPHONE
MIC BIAS
LINE AMP,
MIC AMP
+1.4V REGULATOR
+1.4V REGULATOR
REGULATOR+1.4V
CSP
(Chip Size Package)
CSP
(Chip Size Package)
CSP
(Chip Size Package)
CSP
(Chip Size Package)
CSP
(Chip Size Package)
DSP
MIC BIAS
A1
A2
B1
A1
A2
B1
A1
A2
B1
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION R03)
1PC. 1.5V
MONITOR SOUND MODE
B2
B2
B2
Note 1: CN302, IC301, IC302, IC303, IC304 and IC501 on the MAIN board cannot exchange
with single. When these parts are damaged, exchange the entire mounted board.
Note 2: When the MAIN board or headphone assy are replaced, execute the adjustment referring to
“NOISE CANCEL VOLUME ADJUSTMENT” (page 7) on the electrical adjustment.

MDR-NC300D
MDR-NC300D
1212
5-4. PRINTED WIRING BOARD - SUB Board - • : Uses unleaded solder.
TP602 TP605 TP606TP603 TP608
TP604
TP601
TP411 TP613
C435
C433
C423
IC403
IC404
C428 C427
C426
IC405
Q404
R635
C419
R637
R636
R638
R425
IC406
IC407
R420
Q601
R421
Q602
CN301
R426
C418
C431
L406
C430
IC409
S606
D602
S605
C429
C424
L601
CN601
C601
C621
C620
C432
S607
C437
R603
R604
R605
R609
C604
C425
R626
R625
R624
R623
IC602
C422
C439
R616
C613
C602
C434
TP406 TP401
TP405
TP403
TP404
TP609
TP611
TP402
TP610
TP612
TP410
TP407
TP614
TP615
TP616
TP617
TP618
TP620
TP619
TP621
C605
R424
R620
R621
IC601
C662
C661
C660
R645
L405
R644
R646
C417
R417
R418
C420
C416
IC408
R652
R651
C659
C658
C628
C655
C654
C653
C652
C651
C436
CN651
C619
S604
C656
R629
C622
R639
C438
R606
R607
R631 C606
R622
R649
C607
C421
R612
R648
R647
R650
R613
R614
R615
R617
R618
R601
C609
C610
C611
C612
C614
C615
C657
15
10 6
1
5
10
6
A
MAIN BOARD
CN302
1-879-158-
11
(11)
SUB BOARD (SIDE A)
1-879-158-
11
(11)
SUB BOARD (SIDE B)
(NC)
VOLUME – VOLUME +
A1
A2 B1 B2
A1A2
B1B2
A1
A2 B1 B2
KK K
AA A
HOLD (NEUTRAL) POWER
NC OPTIMIZE
A8
A7
A6
A5
A4
A3
A2
A1
B8
B7
B6
B5
B4
B3
B2
B1
C8
C7
C6
C5
C4
C3
C2
C1
D8
D7
D6
D5
D4
D3
D2
D1
E8
E7
E6
E5
E4
E3
E2
E1
F8
F7
F6
F5
F4
F3
F2
F1
G8
G7
G6
G5
G4
G3
G2
G1
H8
H7
H6
H5
H4
H3
H2
H1
LIQUID CRYSTAL
DISPLAY PANEL


A
B
C
D
1 2 3 4 5
Note 1: CN301, IC403, IC404, IC405, IC406, IC407, IC601, IC602 and Q404 on the SUB board cannot
exchange with single. When these parts are damaged, exchange the entire mounted board.
Note 2: When the SUB board is replaced, execute the adjustment referring to “NOISE
CANCEL VOLUME ADJUSTMENT” (page 7) on the electrical adjustment.

MDR-NC300D
MDR-NC300D
1313
5-5. SCHEMATIC DIAGRAM - SUB Board - • See page 9 for IC Block Diagrams. • See page 14 for IC Pin Function Description.
TP406
TP407
TP405
TP404
TP403
TP402
TP401
TP605
TP606
TP608
TP602
TP604
TP601
TP603
TP609
TP610
TP611
TP612
TP410
TP613
TP411
TP614
TP615
TP616
TP617
TP618
TP619
TP620
TP621
L405
L406
4.7mH
4.7mH
D602
CN301
C434C435
R425
R426
C439
C422 C423
R421
C419 R420
CN601
C651
C652
C653
C654
C655
R651
C661
C656
C657
C658
R646
R644
R645
C628
C433
R609
C432
C427
C607
R650
R607 R606
R649
C606
C605
R648
L601
R604
R605
C604
R603
R601
R636 R637
R635 R638
R626
R625
R624
C621
R623 C620
R622 C619
R620R612
R614
R615
R617
R618
R639
R616
R629
R631
C622
C615 C614 C613 C612 C611 C610 C609
CN651
C437
C418
C416 C436
R424
R647
S604
S605
C438
C420
C421
C417
R417
R418
C601
C602
R621
IC408
IC409
C428
IC405
C430
C425
IC403
C429
IC601
C431
C426
IC406
Q602
Q601
R613
S606
IC404
C424
IC407
IC602
Q404
S607
C660 R652
C662
C659
RB531XN
20P
100.01
470k
100k
0.01
22 10
47k
12p 270k
8P
1.0
1.0
1.0
1.0
1.0
470k
1000p
2.2
2.2
2.2
100
100
100
0.01
0.01
0
0.01
0.01
0.01
4.7k
47k 1k
0
0.01
1
4.7k
10k
1k
0.01
100
1k
4.7k 470k
1k 47k
100
100
100
0.001
100 0.001
100 0.001
10047k
47k
47k
47k
1k
470
47k
10k
100
0.01
0.01 0.01 0.01 0.01 0.01 0.01 0.01
18P
0.01
10
10 0.01
470k
0
0.01
22
10
10p
300k
100k
0.01
10
100
XC9128D45CDR
XC9128D45CDR
0.01
TK63728AB6
0.01
0.01
TK63715AB6
0.01
AFC-AA1-A
PPD78F0537
0.01
0.01
TK63715AB6
2SA2030
2SA2030
47k
TK63728AB6
0.01
TK63715AB6
XC61FN2512MR
EMH2301
1000p 470k
0.01
2.2
A_PWR 1.5
A_PRI 1.5
A_GND
A_2.8
D-2.8
D-GND
STANBY
RESET
I2C_SCL
I2C_SDA
GPIO0
GPIO1
GPIO2
D_CORE 1.5
D_CORE 1.5
MOVIE
MONITOR
V0
V1
V3
V4
CAP2N
CAP2P
CAP1P
CAP1N
VOUT
VSS
VDD
SI
SCL
A0
/RES
/CS1
CAP3P
V2
VDD
VDD
A-GND
_RESET
FLMD0
P121/X1
REGC
VSS
VDD
AVREF
AVSS
P62
EVSS
EVDD
P43
P42
P06
P51
P50
SO11
INTP4
KR7
SI11
ANI0
P130
INTP7
INTP0
XT2/EXCLKS
X2/EXCLK
SSI11
RXD6
ANI6
ANI5
INTP5
TXD6
SI10/RXD0
ANI4
ANI3
INTP2
ANI1
ANI2
_SCK11
DC/DC
CONVERTER
DC/DC
CONVERTER
DC/DC
CONVERTER
LIQUID
CRYSTAL
DISPLAY
PANEL
(NC)
A1B1
A2B2
B2
B1 A1
A2
B2
B1 A1
A2
B2
B1 A1
A2
B2
B1 A1
A2
CSP
(Chip Size Package)
CSP
(Chip Size Package)
CSP
(Chip Size Package)
CSP
(Chip Size Package)
CSP
(Chip Size Package)
SYSTEM CONTROLLER
CSP
(Chip Size Package)
REGULATOR
+2.8V
REGULATOR
+1.5V
REGULATOR
+2.8V
REGULATOR
+1.5V
REGULATOR
+1.5V
*

RESET SIGNAL
GENERATOR
DETECT
POWER ON
DETECT
BATTERY
VOLUME
-
VOLUME
+
NC
OPTIMIZE
POWER
HOLD
(NEUTRAL)BATTCHK
_EN
I2C_SCL
MAINPWR_EN
REG15_EN
KM_STANDBY
FACTORYMODE
KEY_MONITOR
KEY_NCOPTIMIZE
KEY_-
KEY_SOUND
KEY_HOLD
KEY_POWER
KEY_+
KM_IO1
KM_IO0
LCD_SCL
VBATT_CHECK
KM_RESET
I2C_SDA
SELFPGM
LCD_/RES
KM_IO2
LCD_SI
LCD_A0
LCD_/CS1
Note 1: CN301, IC403, IC404, IC405, IC406, IC407, IC601, IC602 and Q404 on the SUB board cannot
exchange with single. When these parts are damaged, exchange the entire mounted board.
Note 2: When the SUB board is replaced, execute the adjustment referring to “NOISE
CANCEL VOLUME ADJUSTMENT” (page 7) on the electrical adjustment.

MDR-NC300D
MDR-NC300D
1414
• IC Pin Function Description
MAIN BOARD IC501 CXD9952GR (DSP)
Pin No. Pin Name I/O Description
1 BCK - Not used
2 XFSIIN - Not used
3 DATAI1 - Not used
4 TMS - Not used
5 AINSUBR I Microphone audio data (R-ch) input terminal
6 AINSUBL I Microphone audio data (L-ch) input terminal
7 VMIDADC - Not used
8 AINMAINR I Serial audio data (R-ch) input terminal
9 AINMAINL I Serial audio data (L-ch) input terminal
10 VDD28ADD - Power supply terminal (+2.8V)
11 VDD28D - Power supply terminal (+2.8V)
12 VSS28D - Ground terminal
13 DATAI2 - Not used
14 RESET_N I Reset signal input from the system controller
15 TRST - Not used
16 TEST1 - Not used
17 VDD28ADA - Power supply terminal (+2.8V)
18, 19 VSS28ADA, VS-
S28ADD - Ground terminal
20 VDD28X - Power supply terminal (+2.8V)
21 VDD15D - Power supply terminal (+1.5V)
22 VSS15D - Ground terminal
23 TDO - Not used
24 TDI - Not used
25 TCK - Not used
26, 27 TEST3, TEST2 - Not used
28 STANDBY_N I Standby signal input from the system controller
29 OSCEN I Master clock oscillation stop setting terminal “L”: oscillation stop Fixed at “H” in this set
30 XfsoOUT O System clock output terminal (49.152 MHz)
31 VSS28X - Ground terminal
32 SUB - Not used
33 XfsoIN I System clock input terminal (49.152 MHz)
34 VCONTO O Control PWM signal output terminal for the PWM volume
35 VSS15D - Ground terminal
36 VDD15X - Power supply terminal (+1.5V)
37 VSS28PWM - Ground terminal
38 VREGO O Control DC voltage output terminal for the PWM volume
39 VDD15D - Power supply terminal (+1.5V)
40 VCONTI I Control DC voltage input terminal for the PWM volume
41 VDD28PWM - Power supply terminal (+2.8V)
42 VMIDDHP - Not used
43 X256fsoOUT - Not used
44 LRCK - Not used
45 I2CADDR - Not used
46 MCKSEL I Master clock setting terminal “L”: 1024 Fso, “H”: 512 Fso Fixed at “L” in this set
47 SCL I/O Serial data transfer clock signal input/output with the system controller
48 DATAO - Not used
49 GPIO0 I Communication control signal input terminal Not used
50 SDA I/O Serial data input/output with the system controller
51 GPIO2 O Error detection signal output to the system controller
52 GPIO1 O Communication control signal output to the system controller
53 VDD15D - Power supply terminal (+1.5V)
54, 55 GPIO4, GPIO3 - Not used
56 VDD28D - Power supply terminal (+2.8V)
57 VSS28D - Ground terminal
58 SUB - Not used
59 LINEINL I Serial audio data (L-ch) input terminal
Pin No. Pin Name I/O Description
60 AHPINR I Serial audio data (R-ch) input terminal
61 AHPINL I Serial audio data (L-ch) input terminal
62 PROTMON - Not used
63 VSS15PRI - Ground terminal
64 SHUTDOWN_N I Protection control signal input terminal “L”: protect on
65 VDD15PRI - Power supply terminal (+1.5V)
66 VDD28LINE - Power supply terminal (+2.8V)
67 VSS28LINE - Ground terminal
68 LINEINR I Serial audio data (R-ch) input terminal
69 LINEOUTL O Serial audio data (L-ch) output terminal
70 VDD28AHP - Power supply terminal (+2.8V)
71 AHPOUTL O Serial audio data (L-ch) output terminal
72 VSS15POR - Ground terminal
73, 74 VDD15POR,
VDD15POL - Power supply terminal (+1.5V)
75 VSS15POL - Ground terminal
76 VMIDHPL - Not used
77 LINEOUTR O Serial audio data (R-ch) output terminal
78, 79 PREOUTR,
PREOUTL - Not used
80 AHPOUTR O Serial audio data (R-ch) output terminal
81 VSS28AHP - Ground terminal
82, 83 OUTNR, OUTPR O Serial audio data (R-ch) output terminal
84, 85 OUTPL, OUTNL O Serial audio data (L-ch) output terminal

MDR-NC300D
15
SUB BOARD IC601 μPD78F0537AFC-AA1-A (SYSTEM CONTROLLER)
Pin No. Pin Name I/O Description
A1 AVSS - Ground terminal
A2 AVREF I Reference voltage (+2.8V) input terminal
A3 SI10/RXD0 - Not used
A4 TXD6 - Not used
A5 INTP5 - Not used
A6 LCD_/RES O Reset signal output to the liquid crystal display panel
A7 P51 - Not used
A8 KM_IO2 I Error detection signal input from the DSP
B1, B2 ANI5, ANI6 - Not used
B3 LCD_SI O Serial data output to the liquid crystal display panel
B4 LCD_A0 O Address signal output to the liquid crystal display panel
B5 RXD6 - Not used
B6 LCD_/CS1 O Chip select signal output to the liquid crystal display panel
B7 P50 - Not used
B8 SSI11 - Not used
C1, C2 ANI4, ANI3 - Not used
C3 VBATT_CHECK I Battery voltage detection signal input terminal
C4 LCD_SCL O Serial data transfer clock signal output to the liquid crystal display panel
C5 KM_IO0 O Communication control signal output terminal Not used
C6 KM_IO1 I Communication control signal input from the DSP
C7 INTP2 - Not used
C8 P06 - Not used
D1, D2 ANI1, ANI2 - Not used
D3 _SCKI1 - Not used
D4 KEY_+ I Key input terminal for the VOLUME + key
D5 KEY_POWER I Key input terminal for the POWER switch
D6 KEY_HOLD I Key input terminal for the HOLD switch
D7 KEY_SOUND I Key input terminal for the SOUND MODE key
D8 KEY_- I Key input terminal for the VOLUME - key
E1 P130 - Not used
E2 ANI0 - Not used
E3 SI11 - Not used
E4 P42 - Not used
E5 KR7 - Not used
E6 INTP4 - Not used
E7 KEY_NCOPTIMIZE I Key input terminal for the NC OPTIMIZE key
E8 KEY_MONITOR I Key input terminal for the MONITOR key
F1 FACTORYMODE - Not used
F2 KM_STANDBY - Not used
F3 SDI1 - Not used
F4 REG15_EN O Power on/off control signal output terminal for the DSP
F5 MAINPWR_EN O Power on/off control signal output terminal for main power
F6 I2C_SCL I/O Serial data transfer clock signal input/output with the DSP
F7 P62 - Not used
F8 BATTCHK_EN O Battery voltage detection enable signal output terminal
G1 INTP7 - Not used
G2 KM_RESET O Reset signal output to the DSP
G3 P43 - Not used
G4 _RESET I Reset signal input from the reset signal generator
G5 REGC - Not used
G6 VSS - Ground terminal
G7 VDD - Power supply terminal (+2.8V)
G8 I2C_SDA I/O Serial data input/output with the DSP
H1 INTP0 - Not used
H2 XT2/EXCLKS - Not used
H3 SELFPGM - Not used
H4 FLMDO - Not used
H5 X2/EXCLK - Not used

MDR-NC300D
16
Pin No. Pin Name I/O Description
H6 P121/X1 - Not used
H7 EVSS - Ground terminal
H8 EVDD - Power supply terminal (+2.8V)

17
MDR-NC300D
SECTION 6
EXPLODED VIEWS
1 X-2514-279-2 LID BATTERY ASSY
2 3-254-014-01 SCREW
3 2-655-579-01 SCREW 0+P2 M1.4 NEWTRU-STAR
4 X-2515-754-1 HINGE ASSY
5 4-142-701-01 KNOB (POWER&HOLD)
6 X-2514-376-2 CASE ASSY (SVX) (Tourist)
6 X-2514-377-2 CASE ASSY (SVX) (US, AEP, UK)
6 X-2514-378-2 CASE ASSY (SVX) (E, Chinese)
7 4-145-459-01 SCREW, SPECIAL HEAD
8 4-144-832-01 SPRING (LOCK, BATTERY)
9 4-142-626-02 LOCK (BATTERY)
10 4-142-619-01 COVER (BOTTOM)
11 4-142-624-01 COVER, FRAME (REAR)
12 X-2514-374-1 HEADPHONE ASSY (SVX) (EXCEPT US)
12 X-2541-754-1 HEADPHONE ASSY (SVX) (US)
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
Note:
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
• The mechanical parts with no reference
number in the exploded views are not sup-
plied.
• Color Indication of Appearance Parts Ex-
ample:
KNOB, BALANCE (WHITE) . . . (RED)
↑↑
Parts Color Cabinet’s Color
6-1. CASE SECTION
not supplied
chassis section
10
2
8
7
6
5
3
21
911 12
4
Ver. 1.2

18
MDR-NC300D
6-2. CHASSIS SECTION
51 4-142-623-04 COVER, FRAME (FRONT)
52 4-142-617-02 CASE, SHIELD (LCD)
53 X-2541-589-1 LCD SUB ASSY (SVX)
54 4-142-622-01 TERMINAL, BATTERY (+)
55 3-254-003-11 SCREW
56 4-142-621-01 TERMINAL, BATTERY (–)
57 A-1711-795-A MAIN BOARD, COMPLETE
58 4-142-620-01 CHASSIS, FRAME
59 A-1711-796-A SUB BOARD, COMPLETE
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
not supplied
not supplied
not supplied
not supplied
58
59
55
54
55
57
56
53
52
51
Ver. 1.2

19
MDR-NC300D
SECTION 7
ELECTRICAL PARTS LIST
A-1711-795-A MAIN BOARD, COMPLETE
********************
< CAPACITOR >
C101 1-128-630-91 CERAMIC CHIP 0.0047uF 10% 6.3V
C102 1-112-716-11 CERAMIC CHIP 0.1uF 10% 6.3V
C103 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V
C104 1-125-838-11 CERAMIC CHIP 2.2uF 10% 6.3V
C105 1-164-882-11 CERAMIC CHIP 220PF 5% 16V
C106 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C107 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C108 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C109 1-128-617-91 CERAMIC CHIP 100PF 5% 25V
C151 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C152 1-164-941-11 CERAMIC CHIP 0.0047uF 10% 16V
C153 1-164-882-11 CERAMIC CHIP 220PF 5% 16V
C155 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C201 1-128-630-91 CERAMIC CHIP 0.0047uF 10% 6.3V
C202 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C203 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V
C204 1-125-838-11 CERAMIC CHIP 2.2uF 10% 6.3V
C205 1-164-882-11 CERAMIC CHIP 220PF 5% 16V
C206 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C207 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C208 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V
C209 1-128-617-91 CERAMIC CHIP 100PF 5% 25V
C251 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C252 1-164-941-11 CERAMIC CHIP 0.0047uF 10% 16V
C253 1-164-882-11 CERAMIC CHIP 220PF 5% 16V
C255 1-165-989-11 CERAMIC CHIP 10uF 10% 6.3V
C301 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C302 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C303 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C306 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C307 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C308 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C309 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C310 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C401 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C402 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C403 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C404 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C501 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C502 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C503 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C504 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C509 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C510 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C513 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C514 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C515 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C516 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C517 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C520 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C521 1-114-782-91 TANTAL. CHIP 100uF 20% 6.3V
C522 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C523 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C524 1-119-923-11 CERAMIC CHIP 0.047uF 10% 10V
C525 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V
C526 1-119-923-11 CERAMIC CHIP 0.047uF 10% 10V
C527 1-165-884-11 CERAMIC CHIP 2.2uF 10% 6.3V
C528 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C529 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C530 1-119-923-11 CERAMIC CHIP 0.047uF 10% 10V
C531 1-112-746-11 CERAMIC CHIP 4.7uF 10% 6.3V
C532 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C533 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C536 1-164-843-11 CERAMIC CHIP 3PF 0.25PF 50V
C537 1-164-843-11 CERAMIC CHIP 3PF 0.25PF 50V
C538 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C539 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C540 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C541 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C544 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C545 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
C617 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C618 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
< CONNECTOR >
CN302 (Not supplied) CONNECTOR, B TO B 20PIN (PLUG)
CN303 1-770-627-21 PIN, CONNECTOR 10P
< DIODE >
D101 6-501-099-01 DIODE 1SS380TE-17
D103 6-501-099-01 DIODE 1SS380TE-17
D201 6-501-099-01 DIODE 1SS380TE-17
D203 6-501-099-01 DIODE 1SS380TE-17
< JUMPER RESISTOR >
FB406 1-216-864-11 SHORT CHIP 0
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
MAIN
When indicating parts by reference num-
ber, please include the board name.
Note:
• Due to standardization, replacements in
the parts list may be different from the
parts specified in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
• RESISTORS
All resistors are in ohms.
METAL: Metal-film resistor.
METAL OXIDE: Metal oxide-film resistor.
F: nonflammable
• CAPACITORS
uF: μF
• COILS
uH: μH
• SEMICONDUCTORS
In each case, u: μ, for example:
uA. . : μA. . , uPA. . , μPA. . ,
uPB. . : μPB. . , uPC. . , μPC. . ,
uPD. . : μPD. .
Note 2: When the MAIN board is replaced, execute the adjust-
ment referring to “NOISE CANCEL VOLUME ADJUST-
MENT” (page 7) on the electrical adjustment.
Note 1: CN302 on the MAIN board cannot exchange with single.
When these parts are damaged, exchange the entire
mounted board.

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
MDR-NC300D
20
< IC >
IC301 (Not supplied) IC NJM2734SCC (TE2)
IC302 (Not supplied) IC TK63714AB6GHB-C
IC303 (Not supplied) IC TK63714AB6GHB-C
IC304 (Not supplied) IC TK63714AB6GHB-C
IC501 (Not supplied) IC CXD9952GR
< COIL >
L101 1-481-538-11 INDUCTOR 47uH
L102 1-481-538-11 INDUCTOR 47uH
L201 1-481-538-11 INDUCTOR 47uH
L202 1-481-538-11 INDUCTOR 47uH
L403 1-481-447-11 INDUCTOR 10uH
L404 1-481-447-11 INDUCTOR 10uH
< TRANSISTOR >
Q101 6-551-411-01 TRANSISTOR 2SD2654TLV
Q201 6-551-411-01 TRANSISTOR 2SD2654TLV
< RESISTOR >
R101 1-218-958-11 METAL CHIP 2.7K 5% 1/16W
R102 1-240-714-91 METAL CHIP 47K 5% 1/20W
R103 1-240-707-91 METAL CHIP 10K 5% 1/20W
R104 1-218-973-11 METAL CHIP 47K 5% 1/16W
R107 1-218-971-11 METAL CHIP 33K 5% 1/16W
R108 1-218-975-11 METAL CHIP 68K 5% 1/16W
R109 1-218-990-81 SHORT CHIP 0
R115 1-244-161-81 METAL CHIP 2.2 5% 1/16W
R116 1-244-161-81 METAL CHIP 2.2 5% 1/16W
R151 1-211-974-11 METAL CHIP 16 0.5% 1/10W
R152 1-218-953-11 METAL CHIP 1K 5% 1/16W
R153 1-218-990-81 SHORT CHIP 0
R155 1-218-969-11 METAL CHIP 22K 5% 1/16W
R157 1-218-969-11 METAL CHIP 22K 5% 1/16W
R158 1-218-971-11 METAL CHIP 33K 5% 1/16W
R159 1-218-990-81 SHORT CHIP 0
R162 1-240-703-91 METAL CHIP 4.7K 5% 1/20W
R201 1-218-958-11 METAL CHIP 2.7K 5% 1/16W
R202 1-240-714-91 METAL CHIP 47K 5% 1/20W
R203 1-240-707-91 METAL CHIP 10K 5% 1/20W
R204 1-218-973-11 METAL CHIP 47K 5% 1/16W
R207 1-218-971-11 METAL CHIP 33K 5% 1/16W
R208 1-218-975-11 METAL CHIP 68K 5% 1/16W
R209 1-218-990-81 SHORT CHIP 0
R215 1-244-161-81 METAL CHIP 2.2 5% 1/16W
R216 1-244-161-81 METAL CHIP 2.2 5% 1/16W
R251 1-211-974-11 METAL CHIP 16 0.5% 1/10W
R252 1-218-953-11 METAL CHIP 1K 5% 1/16W
R253 1-218-990-81 SHORT CHIP 0
R255 1-218-969-11 METAL CHIP 22K 5% 1/16W
R257 1-218-969-11 METAL CHIP 22K 5% 1/16W
R258 1-218-971-11 METAL CHIP 33K 5% 1/16W
R259 1-218-990-81 SHORT CHIP 0
R262 1-240-703-91 METAL CHIP 4.7K 5% 1/20W
R504 1-218-941-81 METAL CHIP 100 5% 1/16W
R505 1-218-941-81 METAL CHIP 100 5% 1/16W
R516 1-218-965-11 METAL CHIP 10K 5% 1/16W
MAIN SUB
R517 1-218-973-11 METAL CHIP 47K 5% 1/16W
R518 1-218-969-11 METAL CHIP 22K 5% 1/16W
R519 1-244-161-81 METAL CHIP 2.2 5% 1/16W
R520 1-218-990-81 SHORT CHIP 0
R521 1-218-990-81 SHORT CHIP 0
R522 1-218-990-81 SHORT CHIP 0
R523 1-218-989-11 METAL CHIP 1M 5% 1/16W
R524 1-218-945-11 METAL CHIP 220 5% 1/16W
R525 1-218-965-11 METAL CHIP 10K 5% 1/16W
R526 1-218-941-81 METAL CHIP 100 5% 1/16W
R527 1-218-965-11 METAL CHIP 10K 5% 1/16W
R531 1-218-941-81 METAL CHIP 100 5% 1/16W
R532 1-218-965-11 METAL CHIP 10K 5% 1/16W
R533 1-218-965-11 METAL CHIP 10K 5% 1/16W
R534 1-218-965-11 METAL CHIP 10K 5% 1/16W
R535 1-218-965-11 METAL CHIP 10K 5% 1/16W
R536 1-218-965-11 METAL CHIP 10K 5% 1/16W
R537 1-218-965-11 METAL CHIP 10K 5% 1/16W
< SWITCH >
S602 1-786-700-11 SWITCH, TACTILE (MONITOR)
S603 1-798-263-11 SWITCH, TACTILE (SOUND MODE)
< VIBRATOR >
X501 1-813-720-21 VIBRATOR, CRYSTAL (49.152MHz)
************************************************************
A-1711-796-A SUB BOARD, COMPLETE
********************
< CAPACITOR >
C416 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C417 1-164-850-11 CERAMIC CHIP 10PF 0.5PF 50V
C418 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C419 1-164-852-11 CERAMIC CHIP 12PF 5% 50V
C420 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C421 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C422 1-100-611-91 CERAMIC CHIP 22uF 20% 6.3V
C423 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C424 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C425 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C426 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C427 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C428 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C429 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C430 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C431 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C432 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C433 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C434 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C435 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C436 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C437 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C438 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C439 1-128-632-91 CERAMIC CHIP 0.01uF 10% 6.3V
C601 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C602 1-112-815-91 CERAMIC CHIP 10uF 20% 6.3V
C604 1-164-943-81 CERAMIC CHIP 0.01uF 10% 16V
C605 1-100-506-91 CERAMIC CHIP 1uF 20% 6.3V
Note 2: When the SUB board is replaced, execute the adjustment
referring to “NOISE CANCEL VOLUME ADJUSTMENT”
(page 7) on the electrical adjustment.
Note 1: IC301, IC302, IC303, IC304 and IC501 on the MAIN
board cannot exchange with single. When these parts are
damaged, exchange the entire mounted board.