Supermicro SuperServer SYS-221BT-HNC8R Installation instructions

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Abstract
This document provides clear guidance for end-of-life recyclers on how to identify
and disassemble reportable materials in compliance with the Waste Electrical and
Electronic Equipment (WEEE) directive.
WEEE DISASSEMBLY INSTRUCTIONS
SUPERMICRO SYS-221BT-HNC8R ENCLOSURE

Table of Contents
1. Product Views............................................................................................................................................1
2. Reportable Materials on SYS-221BT-HNC8R.............................................................................................3
3. Disassemble Instructions ..........................................................................................................................4
3.3 Step-by-Step Disassembly Instructions ..............................................................................................7
1. Removing Cable and Chassis Top Cover ...........................................................................................7
2. Removing Hard Disk Drive ................................................................................................................8
3. Removing Power Supply ...................................................................................................................9
4. Removing Power Distributor...........................................................................................................10
5. Removing Backplane.......................................................................................................................11
6. Removing Fan ..................................................................................................................................11
7. Removing AIOM Card......................................................................................................................12
8. Removing Air shroud, Riser and Riser Bracket...............................................................................12
9. Removing Processor........................................................................................................................13
10. Removing DIMM..............................................................................................................................15
11. Removing M.2..................................................................................................................................15
12. Removing Motherboard..................................................................................................................15

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1. Product Views
Front view
Rear view
Product construct view
Backplane
FAN
Hard Disk Drive/
Solid State Drive

Node A, C
Node B, D
Node construct view
Power Supply

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2. Reportable Materials on SYS-221BT-HNC8R
According to Article 8(2) and Annex VII of WEEE directive 2012/19/EU, Below materials and components
should be selectively treated.
Description
Notes
No.
Quantity
Printed Circuit Boards (PCB) or
Printed Circuit Assemblies (PCA)
With a surface greater than 10 sq cm
(Depending on the product
configuration)
2.4, 3.5, 4.2, 5.1, 7.2, 8.2,
9.2,10.1, 11.1, 12.1
32
Batteries
All types, including standard alkaline
and lithium coin or button-style
batteries
12.2
4
Mercury-containing components
For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
Liquid Crystal Displays (LCD) with
a surface greater than 100 sq cm
Includes background illuminated
displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers
(Containing PCB/PCT)
Electrolytic Capacitors /
Condensers measuring greater
than 2.5 cm in diameter or height
Depending on the power supply
model
3.6
2
External electrical cables and
cords
1.1
2
Gas Discharge Lamps
Plastics containing Brominated
Flame Retardants weighing > 25
grams (not including PCBs or PCAs
already listed as a separate item
above)
Components and parts containing
toner and ink, including liquids,
semi-liquids (gel/paste), and toner
Include the cartridges, print heads,
tubes, vent chambers, and service
stations.
Components and waste containing
asbestos
Components, parts, and materials
containing refractory ceramic
fibers

Components, parts, and materials
containing radioactive substances
3. Disassemble Instructions
The intent of this document is to provide guidance to recyclers on the presence of materials and
components at the product / family level, as required by the EU WEEE Directive 2012/10/EU. This
document should also help direct recyclers to proper methods for removing parts and general
product disassembly instructions.
This chapter consists of three subsections:
Recommended disassembly tools, disassembled flowchart, step-by-step disassembly instructions to direct
recycler proper methods to treated.
3.1 Recommended Disassembly Tools
Disassembly tool
Cross screwdriver
Flathead screwdriver
3.2 Disassembled flowchart
Server
Chassis
Power Supply
Storage Card and CPU

Chassis
Chassis Enclosure
Fan Holder
Sponge
Fan
Screw, Stand-off
Motherboard
Add-on Card
Controller Card
Riser Card
Controller Card
Cable
Battery

Power Supply
Power Enclosure
Screw and Standoff
Power Supply Module
Power Cable
Storage Card and CPU
Heat Sink
Processor
Solid State Drive
AIOM Card
DIMM

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3.3 Step-by-Step Disassembly Instructions
1. Removing Cable and Chassis Top Cover
1. Use the operating system to power down the system.
2. After the system has completely shut-down, disconnect the power cords from the power supply
modules.
3. Remove all cables/ unit from the server IO port.
4. The chassis top cover can be lifted off after removing two screws.
No.
Description
No.
Description
1.1
Power Cable
1.6
Chassis
1.2
VGA Port
1.7
Top Cover
1.3
USB Port
1.4
BMC LAN
1.5
LAN Port
1.1
1.2
1.3
1.4
1.5
1.4
1.2
1.3
1.5
1.6
1.7

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2. Removing Hard Disk Drive
1. Push the release button on the drive carrier, which will extend the drive bay handle
2. Use the drive bay handle to pull the drive carrier out of the chassis
3. Remove the dummy tray insert by first removing two screws, then pull out the dummy tray
5. Use a cross screwdriver to remove the drive enclosure
2.1
1
.
2.2
2.3

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6. Use a cross screwdriver to remove the screws and lift off the PCB
No.
Description
2.1
Dummy Tray
2.2
Hard Drive
2.3
Hard Drive Enclosure
2.4
Hard Drive PCB
3. Removing Power Supply
1. Press the release tab on the failed power supply.
2. Use the handle to gently slide the power supply out the back of the chassis.
3. Remove the screw from the enclosure
2.4
3.2
3.1

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4. Cut the power leads connected to the fan and lift the main board from the chassis
No.
Description
3.1
Power Supply
3.2
Power Enclosure
3.3
Fan
3.4
Fan Cable
3.5
Power Module PCB
3.6
Capacitor
4. Removing Power Distributor
1. Disconnect the power cords from the power supply modules.
2. Remove screws and lift out the power distributor from the chassis
3.6
3.5
3.3
3.4
4.2
4.1

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No.
Description
4.1
Power Distributor
4.2
Power Distributor PCB
5. Removing Backplane
1. Remove the backplane 8 screws from the chassis
No.
Description
5.1
Backplane
6. Removing Fan
1. Disconnect the chassis fan from the motherboard Fan1-Fan4 connector
No.
Description
6.1
Cooling Fan
5.1
6.1

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7. Removing AIOM Card
1. Press the node holder, then hold the node and pull the node from the chassis
2. Press the release tab and loosen the thumbscrew on the AIOM card
3. Grasp the release tab and the thumbscrew and pull the AIOM out of the node tray
No.
Description
7.1
Node
7.2
AIOM Card
8. Removing the Air shroud, Riser, and the Riser Bracket
1. Lift the air shroud out of the chassis by hand
2. Remove screws each from the riser card bracket
3. Take the riser card and bracket away from the chassis
No.
Description
8.1
Air shroud
8.2
Riser Card
8.3
Riser Bracket
8.1
8.2
8.3
7.1
7.2

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9. Removing Processor
1. Removing the PHM (Processor Heatsink Module ) from the motherboard, first shut down the system and
unplug the AC power cord from all power supplies.
2. Use a T30-bit screwdriver to loosen the four peek nuts on the heatsink in the sequence of A, B, C, and D.
3. Once the peek nuts have been loosened from the CPU socket, press the rotating wires inward to unlatch
the PHM from the socket, as shown below.
4. Gently lift the PHM upward to remove it from the CPU socket.
To remove the processor carrier assembly from the PHM, please follow the steps below:
5. Use your hand to detach the four plastic clips (marked a, b, c, d) on the processor carrier assembly from
the four corners of the heatsink (marked A, B, C, D), as shown below.

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6. When all plastic clips have been detached from the heatsink, remove the processor carrier assembly
from the heatsink.
7. Unlock the lever from its locked position and push it upwards to disengage the processor from the
processor carrier, as shown below on the right.
8. Once the processor has been loosened from the carrier, carefully remove the processor from the carrier.
Note: Please handle the processor carefully to avoid damaging it or its pins.
No.
Description
9.1
Heat Sink
9.2
Processor
9.2
9.1

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10. Removing DIMM
1. Hand press both release tabs on the ends of the DIMM module to unlock it.
2. Once the DIMM module is loose, remove it from the memory slot.
No.
Description
10.1
DIMM
11. Removing M.2
1. Remove each screw from the bracket
2. Take the M.2 card and bracket away from the chassis
No.
Description
11.1
M.2
12. Removing Motherboard
1. Remove screws, lift out motherboard
2. Push aside the small clamp that covers the edge of the battery. When the battery is released, lift it out of
the holder
3. When the motherboard is removed, the node enclosure can be recycled
10.1
11.1

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No.
Description
12.1
Motherboard
12.2
Battery
Note: Repeat steps 1-12 of each node disassembled, then the chassis enclosure can be recycled.
12.1
12.2