SUSS MJB4 User manual

MJB4
Manual High End Mask Aligner
Rev 02/01-06
www.suss.com
Mask Aligners
USER MANUAL

CONTENTS
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CONTENTS
1. Warnings and Safety Precautions ......................................................................1
1.1. Guidelines on Safety at Work .........................................................................1
1.2. Definition of Danger Advice and Warnings .....................................................1
1.3. Intended Use of this Machine .........................................................................1
1.4. Main Switch with Emergency Off Function .....................................................1
1.5. Dangers ..........................................................................................................2
1.5.1. Physical Dangers ..................................................................................2
1.5.2. Thermal Dangers ..................................................................................2
1.5.3. Electrical Dangers .................................................................................2
1.5.4. Radiation Danger ..................................................................................2
1.5.5. Danger of Poisoning ..............................................................................3
1.6. Working with the MJB4 Mask Aligner .............................................................3
1.6.1. Fitting, Changing and Cooling the Exposure Lamp ...............................3
1.6.2. Preparing the Machine for Working .......................................................5
1.6.3. Safety Checks .......................................................................................5
2. Installation and Transport ...................................................................................7
2.1. Prerequisites for Installation............................................................................ 7
2.1.1. Ambient Requirements ..........................................................................7
2.2. Transporting the Mask Aligner ......................................................................10
2.2.1. Warranty and Restrictions ...................................................................10
2.2.2. Receiving and Unloading the Machine ................................................10
2.2.3. Opening the Shipping Containers .......................................................10
2.2.4. Transport without a Pallet ...................................................................10
2.2.5. Transport Safeguards .........................................................................12
2.2.6. Taking the Machine out of Service ......................................................13
3. Operation of the MJB4 .......................................................................................15
3.1. Definitions .....................................................................................................16
3.1.1. Notations .............................................................................................16
3.2. Controls and Displays ...................................................................................16
3.2.1. Adjusting Table ...................................................................................16
3.2.2. Display/Touch Screen .........................................................................17
3.2.3. TSA Microscope Manipulator ..............................................................18
3.2.4. TSA Microscope ..................................................................................18
3.2.5. Microscope Lighting ............................................................................19
3.2.6. Lamp Housing .....................................................................................20
3.2.7. Buttons in the Display / Touch Screen ................................................20

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3.2.8. Basic Pneumatic Settings ....................................................................21
3.3. Operating Sequences ...................................................................................22
3.3.1. Switching the Machine On/Off .............................................................22
3.3.2. Switching On and Calibrating the Exposure Lamp ..............................23
3.3.3. Setting Exposure Values .....................................................................24
3.3.4. Saving and Loading Programs ............................................................25
3.3.5. Loading the Mask ................................................................................26
3.3.6. Loading the Substrate .........................................................................26
3.3.7. Setting the Mask Substrate Thickness ................................................26
3.3.8. Wedge Error Compensation Pressure ................................................27
3.3.9. Wedge Error Compensation (WEC) ....................................................27
3.4. First Exposure of Substrate ...........................................................................28
3.4.1. Set the Exposure Values .....................................................................28
3.4.2. Loading the Mask ................................................................................28
3.4.3. Loading the Substrate .........................................................................28
3.5. Adjusting the Substrate with the Upper Microscope .....................................29
3.5.1. Setting the Exposure Values ...............................................................29
3.5.2. Loading the Mask ................................................................................29
3.5.3. Loading the Substrate .........................................................................29
3.5.4. Adjusting the Microscope ....................................................................29
3.5.5. Adjusting the Substrate .......................................................................29
3.5.6. Exposure .............................................................................................30
3.5.7. Unloading the Mask .............................................................................30
3.6. Adjusting the Substrate with IR Lighting .......................................................30
3.6.1. Incident Light .......................................................................................30
3.6.2. Transmitted Light .................................................................................32
3.7. Advanced Techniques ...................................................................................33
3.7.1. Exposure Programs .............................................................................33
3.7.2. Multiple Exposure ................................................................................34
3.8. Step-by-step Machine Operation ..................................................................35
3.8.1. Selecting exposure program, e.g., soft contact ...................................35
3.8.2. Programs .............................................................................................36
3.8.3. Loading, Adjusting and Exposing the Substrate ..................................37
4. Appendix .............................................................................................................39
4.1. Parameter Ranges and Default Settings .......................................................39
4.2. List of Abbreviations .....................................................................................40
4.3. Index ............................................................................................................. 42
4.4. Spare Parts List (extract) ..............................................................................43
4.5. Service Information .......................................................................................48
4.5.1. Overview .............................................................................................49

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4.6. Schematics of the Pneumatic System MJB4 ................................................53
4.7. Schematics of the Electronic System MJB4 ................................................. 63
4.8. International Chemical Safety Cards Mercury ............................................149
4.9. Lock-Out / Tag-Out Checklist ......................................................................152

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Foreword
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Foreword
The MJB4 Mask Aligner is a precision instrument for high-resolution photolithography
and is intended for use in research laboratories, small-series production and pilot
projects.
The flexibility of the MJB4 is unsurpassed when exposing standard wafers and
substrates and irregularly shaped substrates with a diameter of up to 100 mm or 4"x 4"
and various thicknesses.
The MJB4 Mask Aligner is a state-of-the-art instrument. The MJB4 combines proven
and newly developed technology for adjusting wafers, fragments of wafers and
substrates.
Different versions of the aligner are available.
A single-field microscope and a split-field microscope, which can also be equipped with
an optional video system, are available for adjusting the top side. IR adjustment is
available for both microscopes.
These microscopes were developed from the successful SUSS MJB3 Mask Aligners,
which were the international leaders among these types of instruments for over 3
decades.

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MJB4 - Attention ! Rev02 01-06 c
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Attention !
It is strongly recommended to read this
user manual before starting the mask
aligner the first time.

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