TAG SV-4103-X4 User manual

4U Single Quad Core Xeon PICMG Server
SV-4103-X4
Operations Manual
TAG
22355 TAG Way
Dulles, VA 20166

Operations Manual
SV-4103-X4
Part Number: 1007610 Page 2 of 80
Version 1.1. 09/29/2009
1 Copyright © 2008 Technology Advancement Group®, Inc.
(TAG®)
All rights reserved. This publication and its contents are proprietary to TAG. No part of
this publication may be reproduced in any form or by any means without the written
permission of TAG, 22355 TAG Way, Dulles, Virginia 20166-9310.
TAG has made every effort to ensure the correctness and completeness of the material
in this document. TAG shall not be liable for errors contained herein. The information in
this document is subject to change without notice. TAG makes no warranty of any kind
with regard to this material, including, but not limited to, the implied warranties of
merchantability and fitness for a particular purpose.
1.1 Trademarks
All trademarks, marks, names, or product names referenced in this publication are the
property of respective owners, and TAG neither endorses nor otherwise sponsors any
such products or services referred to herein.

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2 About TAG
2.1 Summary of Qualifications
TAG has served as a leading provider of IT solutions to DoD customers over the past
20+ years and has a long-standing and respected history of providing Systems
Engineering, Electronic Equipment and Program Management support to US Military
warfighters. Headquartered in Dulles, Virginia, TAG’s state-of-the-art 35,000 sq. ft.
engineering and manufacturing facility provides all the infrastructure, equipment, and
manpower necessary to engineer, design, test, manufacture, and certify products to the
rugged requirements of the tactical combat theater. Our facilities in Dulles, VA, San
Diego, CA, and St. Louis, MO, allow for rapid deployment of products and support
across the globe.
TAG quickly, efficiently, and cost-effectively tailors rugged solutions for large DoD
programs with specific MIL-STD requirements. TAG’s comprehensive Quality
Assurance (QA) policy –enforced through application of our UL-registered ISO
9001:2000 certified processes –enables TAG to rapidly deploy systems and solutions
that reliably withstand the stresses of the tactical environment. Today, there are over
20,000 TAG systems deployed across various weapons platforms throughout the US
Military. TAG effectively balances all corporate assets –our people, expertise,
infrastructure, and experience –to consistently and successfully execute and deliver to
the DoD.
TAG’s success lies in focusing on the
corporate Mission Statement and leveraging
the tenets of our business model to ensure
the customer’s expectations are exceeded
throughout lengthy program lifecycles.
TAG’s Mission is to resolve our customers’ IT
challenges with World-Class:
Engineering;
Manufacturing and Integration; and
Lifecycle Management
TAG has a proven track record in
implementing these tenets to serve as a trusted advisor to our Government customers.
TAG uses this foundation to ensure risk is mitigated, expectations are exceeded, and
the customer can consistently rely on the company, our equipment, and our services.

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Version 1.1. 09/29/2009
2.2 Core Competences
2.2.1 Engineering
TAG’s engineering methodology is built upon Multi-Disciplinary Optimization (MDO) and
rigorous design reviews. Although PMs drive the schedule at TAG, Engineering
leverages Computer-Aided Design (CAD) tools, Computational Fluid Dynamics (CFD)
modeling, rapid prototyping processes, and diverse test equipment and facilities to
ensure requirements are being met at every step of the design. TAG Engineering
follows a proven design-review process, ensuring all entrance and exit criteria are met
at each stage. Rigorous documentation is compiled to demonstrate requirement
compliance, risks are mitigated, and decisions are prudent –throughout the design
process.
TAG prides itself on its engineering
laboratories and facilities. Over the past
three years, TAG has invested in several
pieces of equipment that allow TAG to test
and certify products directly onsite to the
harshest environmental requirements of
military standards –including the MIL-STD-
810F and DO 160D.
TAG’s onsite test equipment currently
includes a Highly Accelerated Lifecycle
Testing (HALT) Chamber, an
Electromagnetic Interference (EMI) test chamber, and a high-/low-temperature thermal
test chamber. TAG’s facility also provides:
A floor plan designed to support a cellular manufacturing model with modular
assembly lines
A dedicated 24-hour system burn-in room
A modern production status tracking and Enterprise Resource Planning (ERP)
system with external web collaboration capabilities
Dedicated Quality Assurance workstations for system compliance and validation
inspection
2.2.2 Manufacturing and Integration
TAG implements Cellular Manufacturing processes through our compartmentalized,
state-of-the-art production facility to minimize waste byproducts and maximize
production efficiency. TAG’s manufacturing facility is physically partitioned to model the
major philosophies of Lean Manufacturing. Consistent with the model, each of TAG’s
production cells are capable of operating in isolation; however personnel and tools are

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shared across all cells to streamline manufacturing operations, costs, and the
production/integration scheduling. TAG’s floor technicians are cross-trained in multiple
disciplines so they can be redistributed to any cell that encounters production
bottlenecks, which ensures optimal efficiency.
2.2.3 Lifecycle Management
TAG’s world-class Program Management discipline models the renowned
methodologies of the Project Management Institute (PMI) to ensure successful
completion of the task at hand. Our Program Managers (PMs) serve as the voice of the
customer –driving requirements to which the rest of TAG’s organization answers. As
an explicit tenet of TAG’s corporate mission statement, the PMs not only track cost,
schedule, and technical compliance throughout a project’s period of performance, but
also ensure the customer is supported well beyond it.

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Version 1.1. 09/29/2009
Document Revision History
Date
Version
Number
Updated By
Description of
Changes
07/09/2008
1.0
Alan Huckerby
Author
09/29/2009
1.1
Alan Huckerby
Author

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3 About This Manual
3.1 Scope and Audience
This Manual provides an introductory overview
of the SV-4103-X4. Designed to endure the
rigors of harsh environments, this device can
withstand shock and vibration, high and low
temperatures. All of our devices are based on
the latest Intel and AMD technology. Also, this
device doesn't use Intel Core Due or Pentium
M technology (only THS servers).
. Configuration options include extended
memory and enhanced video optimization. All
of our servers are backed by our world-class
lifecycle management and post sales support.
3.1.1 Organization:
This manual is divided into the following
chapters:
Chapter 1 Provides Cautions and Warnings.
Chapter 2 Provides operational information.
Chapter 3 Contains all relevant Procedures.

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Table of Contents
Contents
1Copyright © 2008 Technology Advancement Group®, Inc. (TAG®)............................2
1.1 Trademarks ............................................................................................................ 2
2About TAG................................................................................................................... 3
2.1 Summary of Qualifications......................................................................................3
2.2 Core Competences................................................................................................. 4
2.2.1 Engineering....................................................................................................... 4
2.2.2 Manufacturing and Integration...........................................................................4
2.2.3 Lifecycle Management ......................................................................................5
3About This Manual.......................................................................................................7
3.1 Scope and Audience ..............................................................................................7
3.1.1 Organization:..................................................................................................... 7
4Safety Instructions ....................................................................................................... 13
4.1 Types of Warnings used in this Manual.................................................................. 13
4.1.1 Safety Symbols and Labels............................................................................... 13
4.1.2 Conventions...................................................................................................... 13
5SV-4103-X4 Overview .................................................................................................16
5.1 Product Information................................................................................................16
6SV-4103-X4 ................................................................................................................. 17
6.1.1 SV-4103-X4‖ Specifications ..............................................................................17
6.1.2 SV-4103-X4 Components .................................................................................20
6.1.3 Trenton 6680 Sys/Host Board...........................................................................20
6.1.4 Trenton 6680 Sys/Host Board Components......................................................22
6.1.5 PCI X Bus Frame Grabber................................................................................22
6.1.6 PCI X Bus Frame Grabber Board Components ................................................24
6.1.7 MCG-Series PICMG 1.3 PCI System Host Board............................................. 27
6.1.8 PCI Express System Host Board Components ................................................. 28
6.1.9 PCI Analog Frame Grabber Board.................................................................... 29
6.1.10 PCI Analog Frame Grabber Board Components............................................. 30
6.1.11 PCI X Digital Frame Grabber ..........................................................................31
6.1.12 PCI X Digital Frame Grabber Components..................................................... 33
6.1.13 PCI/Express Graphics Card............................................................................35
6.1.14 PCI Graphics Card Components..................................................................... 36
6.1.15 Non Rotating Solid State Memory...................................................................37
6.2 Power Management ...............................................................................................39
6.2.1 Power Supply....................................................................................................39
6.2.2 Power Supply Components...............................................................................39
6.3 COTS 28 Vin Filter ................................................................................................. 41
6.3.1 Vin Filter Features.............................................................................................41
7Procedures ..................................................................................................................43

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7.1 SV-4103-X4 Startup ...............................................................................................43
7.2 SV-4103-X4 Shutdown...........................................................................................43
8Identifying Server Components Using Device Manager...............................................44
8.1 Working with Device Properties.............................................................................. 47
8.2 Installing and Removing Hardware in Windows...................................................... 49
8.2.1 Using the Add New Hardware Wizard...............................................................50
8.3 Installing Legacy Peripherals..................................................................................51
8.3.1 Removing Legacy Peripherals ..........................................................................51
8.4 TAG Approved BIOS..............................................................................................54
8.4.1 BIOS Configuration for Nightvision....................................................................54
8.4.2 80

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List of Figures
Figure 5-1 SV-4103-X4 .................................................................................................16
Figure 6-1 SV-4103-X4 .................................................................................................17
Figure 6-4 Trenton 6680 Sys/Host Board......................................................................21
Figure 6-5 Trenton 6680 Sys/Host Board (Block Diagram) ...........................................22
Figure 6-6 PCI X Bus Frame Grabber...........................................................................23
Figure 6-7 PCI X Bus Frame Grabber Block Diagram...................................................24
Figure 8-1 Control Panel...............................................................................................44
Figure 8-2 System Properties........................................................................................45
Figure 8-3 Device Manger.............................................................................................45
Figure 8-4 Device Manager...........................................................................................47
Figure 8-5 Properties Dialog Box..................................................................................48
Figure 8-6 Control Panel...............................................................................................50
Figure 8-7 Add Hardware Wizard..................................................................................50
Figure 8-8 Control Panel...............................................................................................51
Figure 8-9 System Properties........................................................................................52
Figure 8-10 Device Manager.........................................................................................52
Figure 8-11 System Overview.......................................................................................55
Figure 8-12 CPU Configuration Screen.........................................................................55
Figure 8-13 Advanced CPU Settings.............................................................................56
Figure 8-14 IDE Configuration.......................................................................................56
Figure 8-15 IDE Configuration.......................................................................................57
Figure 8-16 Floppy Configuration Page.........................................................................57
Figure 8-17 IDE Configuration Page .............................................................................58
Figure 8-18 IDE Configuration Page .............................................................................58
Figure 8-19 Floppy Configuration Page.........................................................................59
Figure 8-20 Floppy Configuration Page.........................................................................59
Figure 8-21 Super IO Configuration Page.....................................................................60
Figure 8-22 Super IO Configuration Page.....................................................................60
Figure 8-23 ACPI Configuration Page...........................................................................61
Figure 8-24 ACPI Configuration Page...........................................................................61
Figure 8-25 South Bridge ACPI Configuration Page .....................................................62
Figure 8-26 ACHI Configuration Page...........................................................................62
Figure 8-27 ACHI Configuration Page...........................................................................63
Figure 8-28 SMBIOS Configuration Page .....................................................................63
Figure 8-29 SMBIOS Configuration Page .....................................................................64
Figure 8-30 Remote Access Configuration Page ..........................................................64
Figure 8-31 Remote Access Configuration Page ..........................................................65
Figure 8-32 Trusted Computing Page...........................................................................66
Figure 8-33 Trusted Computing Page...........................................................................66
Figure 8-34 MPS Configuration Page............................................................................67
Figure 8-35 MPS Configuration Page............................................................................67
Figure 8-36 MPS Configuration Page............................................................................68