Tdk Ev mod ch101-01-02 User manual

AN-000260

Chirp Microsystems reserves the right to change

specifications and information herein without notice.

Chirp Microsystems

2560 Ninth Street, Ste 200, Berkeley, CA 94710 U.S.A

+1(510) 640–8155

www.chirpmicro.com

Document Number: AN-000260

Revision: 1.0

Release Date: 01/27/2021

EV_MOD_CH101-01-02

Evaluation Module User Guide

 
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Revision: 1.0 
Table of Contents 
1SCOPE AND PURPOSE ................................................................................................................................................................3 
2EV_MOD_CH101 EVALUATION MODULE BOARD .......................................................................................................................4 
2.1 PIN ASSIGNMENTS ..........................................................................................................................................................................4 
2.2 ELECTRICAL SPECIFICATIONS..............................................................................................................................................................4 
2.3 SCHEMATIC....................................................................................................................................................................................4 
2.4 BILL OF MATERIALS .........................................................................................................................................................................5 
3CONFIGURATION, PROGRAMMING, AND OPERATION...............................................................................................................6 
3.1 CONFIGURATION AND PROGRAMMING................................................................................................................................................6 
3.2 OPERATION....................................................................................................................................................................................6 
4MECHANICAL SPECIFICATIONS...................................................................................................................................................7 
5APPLICATIONS ...........................................................................................................................................................................8 
5.1 OBJECT DETECTION .........................................................................................................................................................................8 
5.2 BEAM PATTERNS.............................................................................................................................................................................8 
 Sensor Mounting ................................................................................................................................................................8 
 Beam Pattern ..................................................................................................................................................................... 9 
6REVISION HISTORY...................................................................................................................................................................10 
 
Table of Figures 
 
Figure 1-1. View of EV_MOD_CH101-01-02 evaluation module with a particle ingress filter and 45° field-of-view acoustic housing ....3 
Figure 2-1. EV_MOD_CH101 Schematic ....................................................................................................................................................4 
Figure 2-2. EV_MOD_CH101 Module Connection (EV_MOD_CH101 acoustic port is facing down).........................................................5 
Figure 4-1. Dimensions of the EV_MOD_CH101-01-02 assembly .............................................................................................................7 
Figure 5-1. Recommended EV_MOD_CH101 module mounting...............................................................................................................8 
Figure 5-2. Mount Gap Tolerance..............................................................................................................................................................8 
Figure 5-3. EV_MOD_CH101-01-02 Beam pattern ....................................................................................................................................9 
 
List of Tables 
 
Table 1. EV_MOD_CH101 ZIF Connector Pin-Out......................................................................................................................................4 
Table 2. Recommended Flat Flex Cable and Connector ............................................................................................................................5 
Table 3. Bill of Material..............................................................................................................................................................................5 
Table 4. Geometric Dimensions for EV_MOD_CH101-01-02.....................................................................................................................7 
 

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1SCOPE AND PURPOSE

This document details the specification, programming, and operation of an EV_MOD_CH101-01-02 (also referred to as the

EV_MOD_CH101 in the remainder of this document) ultrasonic sensor evaluation module. The module board incorporates a CH101

Ultrasonic Sensor device with an 45° field-of-view acoustic housing assembly, a capacitor and an FPC/FFC connector. This evaluation

module can perform pitch-catch and pulse-echo range-finding at distances from 4 cm to 1.2m. Several programming options are

available for medium and short-range applications.

Figure 1-1. View of EV_MOD_CH101-01-02 evaluation module with a particle ingress filter and 45° field-of-view acoustic housing

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2EV_MOD_CH101 EVALUATION MODULE BOARD

2.1 PIN ASSIGNMENTS

Table 1. EV_MOD_CH101 ZIF Connector Pin-Out

NAME

DESCRIPTION

INT

Interrupt output. Can be switched to input for triggering and calibration functions

SCL

SCL Input. I2C clock input. This pin must be pulled up to VDD externally.

SDA

SDA Input/Output. I2C data I/O. This pin must be pulled up to VDD externally.

PROG

Program Enable. This pin must be pulled down to ground externally.

RESET_N

Active-low reset. This pin must be pulled up to VDD externally.

VSS

Power return.

VSS

Power return.

VDD

Power supply input. Connect to externally regulated 1.8V supply

2.2 ELECTRICAL SPECIFICATIONS

Please refer to DS-000331 CH101 Datasheet for information on the device’s electrical characteristics. Please note that the datasheet

covers CH101 part numbers with different suffixes. Regardless, the electrical specifications in the datasheet still apply.

2.3 SCHEMATIC

Electrical connection to the EV_MOD_CH101 module is via an 8-pin 0.5 mm pitch flat flex cable (FFC) connector. Part numbers of the

FFC connectors on the module PCB and the recommended FFC cables are shown in Table 2. The electrical schematic of the module,

including the connector pinout and the connections to the EV_MOD_CH101 module, are shown in Figure 2-1. Note that the 0.1 μF

decoupling capacitor, as recommended in the CH101 datasheet, is included in the module. Consult the CH101 datasheet and

application notes for additional information on the electrical connections and operation.

Figure 2-1. EV_MOD_CH101 Schematic

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Each EV_MOD_CH101 requires its own PROG and INT lines, the remaining connections can be shared. Refer to the CH101 datasheet

for additional information.

Module connections using a flat flex cable (FFC) are shown in Figure 2-2.

Figure 2-2. EV_MOD_CH101 Module Connection (EV_MOD_CH101 acoustic port is facing down)

TABLE 2. RECOMMENDED FLAT FLEX CABLE AND CONNECTOR

FLAT CABLE CONNECTOR TYPE

Molex 503480-0800

RECOMMENDED FLAT CABLE

Molex 151660073...151660094

2.4 BILL OF MATERIALS

TABLE 3. BILL OF MATERIAL

QUANTITY

REFERENCE

PART

PCB FOOTPRINT

MANUFACTURER

PART NUMBER

PCB

CH101-01

Custom –8 Pin

TDK

CH101-01

100n 6.3V 20% X7R 0402

0402

TDK

CGA2B1X7R1C104K050BC

Connector, FPC-FFC, 8-Pin

8Pin, 0.5 mm Pitch

Molex

503480-0800

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3CONFIGURATION, PROGRAMMING, AND OPERATION

Please refer to DS-000331 CH101 Datasheet for information on the device’s electrical characteristics.

3.1 CONFIGURATION AND PROGRAMMING

Please refer to the following documents for configuration and programming information:

•AN-000154 SmartSonic Hello Chirp Hands-On Document

•AN-000175 SonicLib Programmers Guide

3.2 OPERATION

Please refer to the following documents for operating information:

•AN-000155 CHx01 SonicLink Software Quick Start Guide

•AN-000180 CH101 and CH201 SmartSonic Evaluation Kit Users Guide

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4MECHANICAL SPECIFICATIONS

TABLE 4. GEOMETRIC DIMENSIONS FOR EV_MOD_CH101-01-02

DIMENSION

EV_MOD_CH101-01-02

UNIT

Acoustic port hole

0.75

Maximum width

8.15

Module height

5.05

The outer dimensions of the EV_MOD_CH101-01-02 assembly are shown in Figure 4-1. The acoustic port hole has a diameter of

0.75 mm and is in the center of the front face. During transducer operation, the port cannot be occluded or covered.

Figure 4-1. Dimensions of the EV_MOD_CH101-01-02 assembly

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5APPLICATIONS

5.1 OBJECT DETECTION

Detecting the presence of objects or people can be optimized via software by setting the sensor’s full-scale range (FSR). The user

may set the maximum distance at which the sensor will detect an object. FSR values refer to the one-way distance to a detected

object.

In practice, the FSR setting controls the amount of time that the sensor spends in the listening (receiving) period during a

measurement cycle. Therefore, the FSR setting affects the time required to complete a measurement. Longer full-scale range values

will require more time for a measurement to complete.

Ultrasonic signal processing using the CH101’s General Purpose Rangefinder (GPR) Firmware will detect echoes that bounce off the

first target in the Field-of-View. The size, position, and material composition of the target will affect the maximum range at which

the sensor can detect the target. Large targets, such as walls, are much easier to detect than smaller targets. Thus, the associated

operating range for smaller targets will be shorter. The range to detect people will be affected by a variety of factors such as a

person’s size, clothing, orientation to the sensor, and the sensor’s field-of-view. In general, given these factors, people can be

detected at a maximum distance of 1.1m away from the EV_MOD_CH101-01-02 sensor.

5.2 BEAM PATTERNS

Sensor Mounting

To achieve the best acoustic performance, users are recommended to mount the EV_MOD_CH101 module in a flat mounting plate.

An example mounting plate is shown in Figure 5-1, where the sensor has been inserted flush into a drilled hole of a 150mm square

plastic sheet. In Figure 5-2, the allowable mount gap tolerance between the acoustic interface and device enclosure’s hole is shown.

Please refer to AN-000158 CH101 Mechanical Integration Guide for detailed module and module integration information.

Figure 5-1. Recommended EV_MOD_CH101 module mounting

Figure 5-2. Mount Gap Tolerance

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Beam Pattern

Beam-pattern plots of the EV_MOD_CH101-01-02 with a 45° FoV acoustic housing module are shown in Figure 5-3. This beam-

pattern was measured by placing a 1m2flat target at a 30 cm distance from the EV_MOD_CH101 module and recording the ToF

amplitude as the sensor is rotated 180°. The plots are shown in both raw LSB units and normalized dB units, where 0 dB corresponds

to the peak amplitude recorded on-axis. Chirp defines the field-of-view (FoV) as the full-width at half-maximum (FWHM) of the

beam pattern; in other words, the FoV is the range of angles over which the amplitude remains above half the peak amplitude (or -6

dB). When mounted in the recommended plate, the sensor’s FoV is approximately 45°.

Figure 5-3. EV_MOD_CH101-01-02 Beam pattern

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6REVISION HISTORY

Revision Date

Revision

Description

01/27/2021

1.0

Initial Release

This information furnished by Chirp Microsystems, Inc. (“Chirp Microsystems”) is believed to be accurate and reliable. However, no responsibility is assumed by Chirp

Microsystems for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without

notice. Chirp Microsystems reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or performance,

without prior notice. Chirp Microsystems makes no warranties, neither expressed nor implied, regarding the information and specifications contained in this document.

Chirp Microsystems assumes no responsibility for any claims or damages arising from information contained in this document, or from the use of products and services

detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property

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Certain intellectual property owned by Chirp Microsystems and described in this document is patent protected. No license is granted by implication or otherwise under

any patent or patent rights of Chirp Microsystems. This publication supersedes and replaces all information previously supplied. Trademarks that are registered

trademarks are the property of their respective companies. Chirp Microsystems sensors should not be used or sold in the development, storage, production or utilization

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