308 Service
LIST FILLUSTRATI S
(cont)
Figure
No.
8-1
8-2
8-3
8-4
8-5
8-6
8-7
8-8
8-9
NOTE
The following illustrations appear
in
the Diagrams
foldout section.
Semiconductor lead configurations
A1Data
input
boardcomponentlocations
A2
Trigger
board component locations
A3 Serial &signature data acquisition
board component locations
A5 Key board component locations
A4 MPU board component locations
A6
CRT
board component locations
A7 Primary power
supply
board
component locations
A8 Secondary power
supply
board
component locations
Figure
No.
8-10
8-11
8-12
8-13
8-14
8-15
8-17
A1
Data
input
board test point and
adjustment locations
A2 Trigger board test point and
adjustment locations
A3 Serial &signature data
acquisition
board test point and adjustment
locations
A4 MPU board test point and adjustment
locations
A6 CRT board test point and adjustment
locations
A8 Secondary power supply board test
point and adjustment locations
Controi Function Access Chart
LIST FTABLES NOTE
Table Table Thefollowingtables appear
in
the Diagramsfoldout
No. Page No. section.
1-1
Electrical Characteristics
...........
1-2
8-1
Troubleshooting Tree
to
Signature List
1-2 Environmental Characteristics
.......
1-12 Cross-Reference
1-3 Physical Characteristics .............
"""
..
1-13 8-2 Device Error List
8-3 308 Power-Up Diagnostic Errors
2-1
Power-up Error Codes
..................
"
....
2-9 8-4 Signature List and Setup
Conditions
for
2-2 ParalIei and Serial Acquisition Parameters 2-13 ROM Check
2-3 Signature List
....................................
2-21
8-5 Signature List and Setup
Conditions
for
Kernel Check
3-1
Truth
Table
for
Setting Parameters 8-6 Signature List and Setup
Conditions
for
...
3-11
Chip
Select Test
3-2
Truth
Table
for
the
Clock Gate ...... ".... 3-18 8-7 Signature List and Setup
Conditions
for
3-3 Sample Interval Selection
....................
3-19
Chip
Select Test (Write Only)
3-4 Programmable Bit-Rate Generator 8-8 Signature List and Setup
Conditions
for
Outputs
.......................
3-25 Address
Counter
3-5 Data Bus Buffer Controi
...........
3-27 8-9 Signature List and Setup
Conditions
for
3-6 USART Read/Write Contral
Logic
........ 3-29 Delay Counter
8-10 Signature List and Setup
Conditions
for
4-1
Test Equipment Required
..........
4-1
Data Paths
4-2 Serial Acquisition Data
............
4-21
8-11
Signature List and Setup
Conditions
for
4-3 Power Supply Tolerances
..........
4-24 Display
Column
Counter
8-12 Signature List and Setup
Conditions
for
Display Row-Line
Counter
5-1
Relative
Susceptibilityto
StaticDischarge 8-13 Signature List and Setup
Conditions
for
Damage
.......................
5-1
Display Character Row Counter
5-2 Externai Inspection Checklist
..............
5-3 8-14 Baud Rate Test
One
5-3
Intemal
Inspection Checklist
.•......
5-3 8-15 Baud Rate Test
Two
REV AAPR 1980