Telit Wireless Solutions HE910 Installation manual

HE910 Hardware User Guide
1vv03700925 Rev.27 – 2015-05-25

HE910 Hardware User Guide
1vv0300925 Rev.27 – 2015-05-25
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 2 of 98
Applicability Table
PRODUCT
HE910 (*)
HE910-D
HE910-GL
HE910-EUR
HE910-EUD
HE910-EUG
HE910-NAR
HE910-NAD
HE910-NAG
(*) HE910 is the “type name” of the products marketed as HE910-G & HE910-DG

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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit assumes
no liability resulting from any inaccuracies or omissions in this document, or from use of the
information obtained herein. The information in this document has been carefully checked and is
believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or
omissions. Telit reserves the right to make changes to any products described herein and
reserves the right to revise this document and to make changes from time to time in content
hereof with no obligation to notify any person of revisions or changes. Telit does not assume
any liability arising out of the application or use of any product, software, or circuit described
herein; neither does it convey license under its patent rights or the rights of others.
It is possible that this publication may contain references to, or information about Telit products
(machines and programs), programming, or services that are not announced in your country.
Such references or information must not be construed to mean that Telit intends to announce
such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and its licensors certain exclusive rights for copyrighted material, including the exclusive right
to copy, reproduce in any form, distribute and make derivative works of the copyrighted
material. Accordingly, any copyrighted material of Telit and its licensors contained herein or in
the Telit products described in this instruction manual may not be copied, reproduced,
distributed, merged or modified in any manner without the express written permission of Telit.
Furthermore, the purchase of Telit products shall not be deemed to grant either directly or by
implication, estoppel, or otherwise, any license under the copyrights, patents or patent
applications of Telit, as arises by operation of law in the sale of a product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for Telit
and other 3rd Party supplied SW certain exclusive rights for copyrighted computer programs,
including the exclusive right to copy or reproduce in any form the copyrighted computer
program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW computer programs
contained in the Telit products described in this instruction manual may not be copied (reverse
engineered) or reproduced in any manner without the express written permission of Telit or the
3rd Party SW supplier. Furthermore, the purchase of Telit products shall not be deemed to grant
either directly or by implication, estoppel, or otherwise, any license under the copyrights,
patents or patent applications of Telit or other 3rd Party supplied SW, except for the normal
non-exclusive, royalty free license to use that arises by operation of law in the sale of a product.

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Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is furnished
by express license agreement only and may be used only in accordance with the terms of such
an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT fault-
tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment
in the following hazardous environments requiring fail-safe controls: the operation of Nuclear
Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic Control, Life
Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s) specifically
disclaim any expressed or implied warranty of fitness for such High Risk Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or service
names are the property of their respective owners.
Copyright © Telit Communications S.p.A. 2011, 2013

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Contents
1INTRODUCTION .........................................................................................................................................................8
1.1 SCOPE ................................................................................................................................................................................8
1.2 AUDIENCE ...........................................................................................................................................................................8
1.3 CONTACT INFORMATION,SUPPORT..........................................................................................................................................8
1.4 DOCUMENT ORGANIZATION ...................................................................................................................................................9
1.5 TEXT CONVENTIONS ............................................................................................................................................................10
1.6 RELATED DOCUMENTS.........................................................................................................................................................10
1.7 DOCUMENT HISTORY ..........................................................................................................................................................11
2OVERVIEW .............................................................................................................................................................. 13
3HE910 MODULE CONNECTIONS...............................................................................................................................14
3.1 PIN-OUT .........................................................................................................................................................................14
3.1.1 LGA Pads Layout (HE910).......................................................................................................................................20
3.1.2 LGA Pads Layout (HE910-D) ...................................................................................................................................21
3.1.3 LGA Pads Layout (HE910-EUD/EUR, HE910-NAD/NAR and HE910-GL) ................................................................22
3.1.4 LGA Pads Layout (HE910-EUG and HE910-NAG)....................................................................................................23
4HARDWARE COMMANDS........................................................................................................................................24
4.1 TURNING ON THE HE910 ...................................................................................................................................................24
4.2 TURNING OFF THE HE910 ..................................................................................................................................................29
4.3 HE910 UNCONDITIONAL SHUTDOWN ....................................................................................................................................31
5POWER SUPPLY .......................................................................................................................................................34
5.1 POWER SUPPLY REQUIREMENTS ............................................................................................................................................34
5.2 POWER CONSUMPTION .......................................................................................................................................................35
5.3 GENERAL DESIGN RULES ......................................................................................................................................................36
5.3.1 Electrical Design Guidelines ...................................................................................................................................36
5.3.2 Thermal Design Guidelines.....................................................................................................................................40
5.3.3 Power Supply PCB layout Guidelines......................................................................................................................41
6GSM/WCDMA RADIO SECTION ............................................................................................................................... 43
6.1 HE910 PRODUCT VARIANTS ................................................................................................................................................43
6.2 TX OUTPUT POWER ............................................................................................................................................................43
6.3 SENSITIVITY .......................................................................................................................................................................44
6.4 GSM/WCDMA ANTENNA REQUIREMENTS............................................................................................................................44
6.5 GSM/WCDMA -PCB LINE GUIDELINES................................................................................................................................45
6.6 PCB GUIDELINES IN CASE OF FCC CERTIFICATION......................................................................................................................47
6.6.1 Transmission line design........................................................................................................................................47
6.6.2 Transmission line measurements ...........................................................................................................................48
6.7 GSM/WCDMA ANTENNA -INSTALLATION GUIDELINES ...........................................................................................................50
6.8 ANTENNA DIVERSITY REQUIREMENTS .....................................................................................................................................51
7GPS RECEIVER.......................................................................................................................................................... 52
7.1 GPS PERFORMANCES..........................................................................................................................................................52
7.2 GPS SIGNALS PINOUT .........................................................................................................................................................53
7.3 RF FRONT END DESIGN .......................................................................................................................................................53

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7.3.1 RF Signal Requirements..........................................................................................................................................53
7.3.2 GPS Antenna Polarization ......................................................................................................................................54
7.3.3 GPS Antenna Gain ..................................................................................................................................................55
7.3.4 Active versus Passive Antenna ...............................................................................................................................55
7.3.5 GPS Antenna - PCB Line Guidelines ........................................................................................................................56
7.3.6 RF Trace Losses.......................................................................................................................................................56
7.3.7 Implications of the Pre-select SAW Filter ...............................................................................................................57
7.3.8 External LNA Gain and Noise Figure.......................................................................................................................57
7.3.9 Powering the External LNA (active antenna) .........................................................................................................57
7.3.10 External LNA Enable .............................................................................................................................................58
7.3.11 Shielding...............................................................................................................................................................59
7.3.12 GPS Antenna - Installation ...................................................................................................................................59
8LOGIC LEVEL SPECIFICATIONS..................................................................................................................................60
8.1 UNCONDITIONAL SHUTDOWN ...............................................................................................................................................61
9USB PORT ................................................................................................................................................................62
9.1 USB 2.0 HS DESCRIPTION ...................................................................................................................................................62
10 SPI PORT .................................................................................................................................................................63
10.1 SPI CONNECTIONS............................................................................................................................................................64
11 USB HSIC .................................................................................................................................................................65
12 SERIAL PORTS..........................................................................................................................................................66
12.1 MODEM SERIAL PORT 1(USIF0) ...................................................................................................................................67
12.2 MODEM SERIAL PORT 2(USIF1) ...................................................................................................................................69
12.3 RS232 LEVEL TRANSLATION................................................................................................................................................70
13 AUDIO SECTION OVERVIEW ....................................................................................................................................72
13.1 ELECTRICAL CHARACTERISTICS .............................................................................................................................................72
13.1.1 CODEC Examples ..................................................................................................................................................72
14 GENERAL PURPOSE I/O ...........................................................................................................................................73
14.1 GPIO LOGIC LEVELS ..........................................................................................................................................................74
14.2 USING A GPIO PAD AS INPUT ...........................................................................................................................................75
14.3 USING A GPIO PAD AS OUTPUT........................................................................................................................................75
14.4 INDICATION OF NETWORK SERVICE AVAILABILITY .....................................................................................................................76
14.5 RTC BYPASS OUT .............................................................................................................................................................77
14.6 EXTERNAL SIM HOLDER IMPLEMENTATION ...........................................................................................................................77
14.7 VAUX POWER OUTPUT.....................................................................................................................................................77
14.8 ADC CONVERTER .............................................................................................................................................................78
14.8.1 Description ...........................................................................................................................................................78
14.8.2 Using ADC Converter ............................................................................................................................................78
15 MOUNTING THE HE910 ON THE APPLICATION ........................................................................................................ 79
15.1 GENERAL ........................................................................................................................................................................79
15.2 MODULE FINISHING &DIMENSIONS .....................................................................................................................................79
15.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION.................................................................................................................81
15.4 STENCIL ..........................................................................................................................................................................82

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15.5 PCB PAD DESIGN..............................................................................................................................................................82
15.6 PCB PAD DIMENSIONS.......................................................................................................................................................83
15.7 SOLDER PASTE..................................................................................................................................................................85
15.7.1 HE910 Solder reflow .............................................................................................................................................85
15.8 PACKING SYSTEM (TRAY)....................................................................................................................................................87
15.9 PACKING SYSTEM (REEL)....................................................................................................................................................89
15.9.1 Carrier Tape Detail ...............................................................................................................................................89
15.9.2 Reel Detail ............................................................................................................................................................90
15.9.3 Packaging Detail ..................................................................................................................................................91
15.10 MOISTURE SENSITIVITY ....................................................................................................................................................91
16 SAFETY RECOMMANDATIONS ................................................................................................................................. 92
17 CONFORMITY ASSESSMENT ISSUES.........................................................................................................................93
17.1 1999/5/EC DIRECTIVE .....................................................................................................................................................93
17.2 FCC/IC REGULATORY NOTICES............................................................................................................................................97

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1Introduction
1.1 Scope
The aim of this document is the description of some hardware solutions useful for developing a
product with the Telit HE910 module.
1.2 Audience
This document is intended for Telit customers, who are integrators, about to implement their
applications using our HE910 modules.
1.3 Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit’s Technical Support Center (TTSC) at:
[e-mail]
[e-mail]
[e-mail]
[e-mail]
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations on
accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users of our information.

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1.4 Document Organization
This document contains the following chapters:
Chapter 1: “Introduction” provides a scope for this document, target audience, contact and
support information, and text conventions.
Chapter 2: “Overview” provides an overview of the document.
Chapter3: “HE910 Module Connections” deals with the pin out configuration and layout.
Chapter 4: “Hardware Commands” How to operate on the module via hardware.
Chapter 5: “Power supply” Power supply requirements and general design rules.
Chapter 6: “GSM/WCDMA Radio” The antenna connection and board layout design are the
most important parts in the full product design.
Chapter 7: “GPS Receiver” This section describes the GPS receiver.
Chapter 8: “Logic Level specifications” Specific values adopted in the implementation of logic
levels for this module.
Chapter 9: “USB Port” The USB port on the Telit HE910 is the core of the interface between the
module and OEM hardware
Chapter 10: “SPI port” Refers to the SPI port of the Telit HE910
Chapter 11: “USB HSIC” Refers to the USB HSIC port of the Telit HE910
Chapter 12: “Serial ports” Refers to the serial ports of the Telit HE910
Chapter 13: “Audio Section overview” Refers to the audio blocks of the Base Band Chip of the
HE910 Telit Modules.
Chapter 14: “General Purpose I/O” How the general purpose I/O pads can be configured.
Chapter 15: “Mounting the HE910 on the application board” Mechanical dimensions and
recommendations on how to mount the module on the user’s board.
Chapter 16: “Safety Recommendations” Information related to the Safety topics.
Chapter 17: “Conformity Assessment Issues” Information related to the Conformity
Assessments.

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1.5 Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when integrating
the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6 Related Documents
•Digital Voice Interface Application Note 80000NT10050A
•SPI Port Application Note 80000NT10053A
•Product description 80378ST10085A
•SIM Holder Design Guides 80000NT10001A
•USB HSIC Port Application Note 80000NT10071A
•AT Commands Reference Guide 80378ST10091A
•Telit EVK2 User Guide 1vv0300704

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1.7 Document History
R
Re ev vi is si io on n
D
Da at te e
C
Ch ha an ng ge es s
0
2011-03-31
Preliminary Version
1
2011-05-19
Updated pinout on UART1
2
2011-05-25
Update chapter 13
3
2011-07-25
Added DVI app note references; chapter 4.1
4
2011-07-29
Updated audio, on_off/reset and digital sections
5
2011-10-18
Added STAT_LED info, Updated SPI pinout
6 2011-12-22
Pads A8, A9, D14, A14 now reserved
Power supply extended to 3.3 V
par 4.3 renamed as “unconditional shutdown”
USIF0 USIF1 names added to Main and AUX serial ports
Updated IO logic levels
Updated module’s mechanical drawing
IO levels selection 1.8/1.2 removed (now only 1.8)
7
2012-01-16
Added HE910-GA and –D; added Conformity assessment chapter
8
2012-02-03
Chapter 5.1 updated
9
2012-02-07
Chapter 4.2 updated
10 2012-03-16
Added ADC in pinout description; added GPS specification; updated Chapter
13 and 14;
11
2012-03-26
Chapter 2.1, 2.1.2, 3.3, 5.4, 14.9
12
2012-03-27
Added HE910-EU and NA products
13
2012-03-28
Updated paragraph 14.9
14 2012-05-08
Added EUR, EUD, NAR, NAD variants; added Sensitivity and TX Power
Class specifications. Updated par 14.7.1 and 14.3
15
2012-05-30
Updated Chapter 16.2; 7.3.8
16
2012-06-06
Pin R13 renamed as HW_SHUTDOWN*, Pin P11 renamed
17
2012-06-14
Updated RTT&E info on HE910-NAG, NAR, NAD
18
2012-06-15
Updated RTT&E info on HE910-NAG, NAR, NAD ; updated par 3.1;
19
2012-06-26
Pin P11 now reserved; updated par 3.1; par 4.2
20
2012-08-09
Updated par 9,1 5.3.2, 13.4, 3.1, 13.5
21
2013-04-29
Updated par 3.1, 5.1, 5.3.2, 6.4, 7, 9.1 ; added 14.8
22
2013-08-02
Updated Chapter 4, 13.4
23
2013-08-30
Updated Chapter 3.1, 4.1, 5.2, 5.3.3, 8, 9.1, 11, 13.1
24 2013-12-20
Updated Chapter 4.1, 4.2, 5.3.1.1, 5.3.1.2, 8; added USB_HSIC, Updated the
Stat Led schematic example; updated packaging tray drawing; added PCB
Guidelines for FCC.
25
2015-03-03
Add new product HE910-GL
26
2015-04-09
Removed product HE910-GA
27
2015-05-25
Updated Chapter 15.8 Packing system (Tray)

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2Overview
The aim of this document is the description of some hardware solutions useful for developing a
product with the Telit HE910 module.
In this document all the basic functions of a mobile phone will be taken into account; for each
one of them a proper hardware solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously this document cannot embrace
the whole hardware solutions and products that may be designed. The wrong solutions to be
avoided shall be considered as mandatory, while the suggested hardware configurations shall not
be considered mandatory, instead the information given shall be used as a guide and a starting
point for properly developing your product with the Telit HE910 module. For further hardware
details that may not be explained in this document refer to the Telit HE910 Product Description
document where all the hardware information is reported.
NOTICE:
(EN) The integration of the GSM/GPRS/WCDMA HE910 cellular module within user application shall
be done according to the design rules described in this manual.
(IT) L’integrazione del modulo cellulare GSM/GPRS/WCDMA HE910 all’interno dell’applicazione
dell’utente dovrà rispettare le indicazioni progettuali descritte in questo manuale.
(DE) Die Integration des HE910 GSM/GPRS/WCDMA Mobilfunk-Moduls in ein Gerät muß gemäß der
in diesem Dokument beschriebenen Kunstruktionsregeln erfolgen.
(SL) Integracija GSM/GPRS/WCDMA HE910 modula v uporabniški aplikaciji bo morala upoštevati
projektna navodila, opisana v tem priročniku.
(SP) La utilización del modulo GSM/GPRS/WCDMA HE910 debe ser conforme a los usos para los
cuales ha sido deseñado descritos en este manual del usuario.
(FR) L’intégration du module cellulaire GSM/GPRS/WCDMA HE910 dans l’application de l’utilisateur
sera faite selon les règles de conception décrites dans ce manuel.
(HE)
The information presented in this document is believed to be accurate and reliable. However, no
responsibility is assumed by Telit Communications S.p.A. for its use, nor any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent rights of Telit Communications S.p.A. other than for circuitry embodied in
Telit products. This document is subject to change without notice.
HE910

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3HE910 module connections
3.1 PIN-OUT
PAD Signal I/O Function Type COMMENT
USB HS 2.0 COMMUNICATION PORT
B15 USB_D+ I/O USB differential Data (+)
C15 USB_D- I/O USB differential Data (-)
A13 VUSB I
Power sense for the internal USB
transceiver.
Asynchronous Serial Port (USIF0) - Prog. / Data + HW Flow Control
N15 C103/TXD I Serial data input from DTE CMOS 1.8V
M15 C104/RXD O Serial data output to DTE CMOS 1.8V
M14 C108/DTR I Input for (DTR) from DTE CMOS 1.8V
L14 C105/RTS I
Input for Request to send signal
(RTS) from DTE
CMOS 1.8V
P15 C106/CTS O
Output for Clear to Send signal
(CTS) to DTE
CMOS 1.8V
N14 C109/DCD O Output for (DCD) to DTE CMOS 1.8V
P14 C107/DSR O Output for (DSR) to DTE CMOS 1.8V
R14 C125/RING O Output for Ring (RI) to DTE CMOS 1.8V
Asynchronous Auxiliary Serial Port (USIF1)
D15 TX_AUX O Auxiliary UART (TX Data to DTE) CMOS 1.8V
E15 RX_AUX I Auxiliary UART (RX Data from
DTE) CMOS 1.8V
USB HSIC
A12 HSIC_USB_DATA I/O USB HSIC data signal CMOS 1.2V
A11 HSIC_USB_STRB I/O USB HSIC strobe signal CMOS 1.2V
H15 HSIC_SLAVE_WAKEUP I Slave Wake Up CMOS 1.8V Shared with SPI_MRDY
F15 HSIC_HOST_WAKEUP O Host Wake Up CMOS 1.8V Shared with SPI CLK
K15 HSIC_SUSPEND_REQUEST O Slave Suspend Request CMOS 1.8V Shared with GPIO08
J15 HSIC_HOST_ACTIVE I Active Host Indication CMOS 1.8V Shared with SPI_SRDY
D13 VDD_IO1 I VDD_IO1 Input To be connected to E13
E13 1V8_SEL O 1V8 SEL for VDD_IO1 To be connected to D13
SIM card interface
A6 SIMCLK O External SIM signal – Clock 1.8 / 3V
A7 SIMRST O External SIM signal – Reset 1.8 / 3V
A5 SIMIO I/O External SIM signal – Data I/O 1.8 / 3V
A4 SIMIN I
External SIM signal – Presence
(active low)
CMOS 1.8

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A3 SIMVCC -
External SIM signal – Power supply
for the SIM
1.8 / 3V
Digital Voice Interface (DVI)
B9 DVI_WA0 I/O Digital Audio Interface (WA0) 1.8V
16K pull down (typical at 1.8V)
when in Input
B6 DVI_RX I Digital Audio Interface (RX) 1.8V
Input with 16K pull down (typical at
1.8V)
B7 DVI_TX I/O Digital Audio Interface (TX) 1.8V
16K pull down (typical at 1.8V)
when in Input
B8 DVI_CLK I/O Digital Audio Interface (CLK) 1.8V
Input with 16K pull down (typical at
1.8V)
SPI
D15 SPI_MOSI I SPI MOSI CMOS 1.8V Shared with TX_AUX
E15 SPI_MISO O SPI_MISO CMOS 1.8V Shared with RX_AUX
F15 SPI_CLK I SPI Clock CMOS 1.8V
Shared with
HSIC_HOST_WAKEUP
H15 SPI_MRDY I SPI_MRDY CMOS 1.8V
Shared with
HSIC_SLAVE_WAKEUP
J15 SPI_SRDY O SPI_SRDY CMOS 1.8V
Shared with
HSIC_HOST_ACTIVE
DIGITAL IO
C8 GPIO_01 I/O GPIO_01 /STAT LED CMOS 1.8V Alternate Function STAT LED
C9 GPIO_02 I/O GPIO_02 CMOS 1.8V
C10 GPIO_03 I/O GPIO_03 CMOS 1.8V
C11 GPIO_04 I/O GPIO_04 CMOS 1.8V
B14 GPIO_05 I/O GPIO_05 CMOS 1.8V
C12 GPIO_06 I/O GPIO_06 CMOS 1.8V
C13 GPIO_07 I/O GPIO_07 CMOS 1.8V
K15 GPIO_08 I/O GPIO_08 CMOS 1.8V
Shared with
HSIC_SUSPEND_REQUEST
L15 GPIO_09 I/O GPIO_09 CMOS 1.8V
G15 GPIO_10 I/O GPIO_10 CMOS 1.8V
ADC
B1 ADC_IN1 AI Analog / Digital converter input A/D Accepted values 0 to 1.2V DC
RF SECTION
K1 ANTENNA I/O
GSM/EDGE/UMTS Antenna
(50 ohm)
RF
F1 ANT_DIV I
Antenna Diversity Input
(50 ohm)
RF See NOTE 1
GPS SECTION (see NOTE1)
R9 ANT_GPS I GPS Antenna (50 ohm) RF
R7 GPS_LNA_EN O
Output enable for External LNA
supply
CMOS 1.8V
Miscellaneous Functions
R13 HW_SHUTDOWN* I HW Unconditional Shutdown 1.8V Active low
R12 ON_OFF* I Input command for power ON 1.8V Active low
C14 VRTC I VRTC Backup capacitor Power backup for the embedded RTC supply
(1.8V)

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R11 VAUX/PWRMON O Supply Output for external
accessories / Power ON Monitor 1.8V
Power Supply
M1 VBATT - Main power supply (Baseband) Power
M2 VBATT - Main power supply (Baseband) Power
N1 VBATT_PA - Main power supply (Radio PA) Power
N2 VBATT_PA - Main power supply (Radio PA) Power
P1 VBATT_PA - Main power supply (Radio PA) Power
P2 VBATT_PA - Main power supply (Radio PA) Power
E1 GND - Ground Power
G1 GND - Ground Power
H1 GND - Ground Power
J1 GND - Ground Power
L1 GND - Ground Power
A2 GND - Ground Power
E2 GND - Ground Power
F2 GND - Ground Power
G2 GND - Ground Power
H2 GND - Ground Power
J2 GND - Ground Power
K2 GND - Ground Power
L2 GND - Ground Power
R2 GND - Ground Power
M3 GND - Ground Power
N3 GND - Ground Power
P3 GND - Ground Power
R3 GND - Ground Power
D4 GND - Ground Power
M4 GND - Ground Power
N4 GND - Ground Power
P4 GND - Ground Power
R4 GND - Ground Power
N5 GND - Ground Power
P5 GND - Ground Power
R5 GND - Ground Power
N6 GND - Ground Power
P6 GND - Ground Power
R6 GND - Ground Power
P8 GND - Ground Power
R8 GND - Ground Power
P9 GND - Ground Power
P10 GND - Ground Power

HE910 Hardware User Guide
1vv0300925 Rev.27 – 2015-05-25
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 17 of 98
R10 GND - Ground Power
M12 GND - Ground Power
B13 GND - Ground Power
P13 GND - Ground Power
E14 GND - Ground Power
RESERVED
C1 RESERVED - RESERVED
D1 RESERVED - RESERVED
B2 RESERVED - RESERVED
C2 RESERVED - RESERVED
D2 RESERVED - RESERVED
B3 RESERVED - RESERVED
C3 RESERVED - RESERVED
D3 RESERVED - RESERVED
E3 RESERVED - RESERVED
F3 RESERVED - RESERVED
G3
RESERVED
-
RESERVED
H3 RESERVED - RESERVED
J3 RESERVED - RESERVED
K3 RESERVED - RESERVED
L3 RESERVED - RESERVED
B4 RESERVED - RESERVED
C4 RESERVED - RESERVED
B5 RESERVED - RESERVED
C5 RESERVED - RESERVED
C6 RESERVED - RESERVED
C7 RESERVED - RESERVED
N7 RESERVED - RESERVED
P7 RESERVED - RESERVED
N8 RESERVED - RESERVED
N9
RESERVED
-
RESERVED
A10 RESERVED - RESERVED
N10 RESERVED - RESERVED
N11 RESERVED - RESERVED
P11 RESERVED - RESERVED
B12 RESERVED - RESERVED
D12 RESERVED - RESERVED
N12 RESERVED - RESERVED
P12 RESERVED - RESERVED
F14 RESERVED - RESERVED
G14 RESERVED - RESERVED
H14 RESERVED - RESERVED

HE910 Hardware User Guide
1vv0300925 Rev.27 – 2015-05-25
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 18 of 98
J14 RESERVED - RESERVED
K14 RESERVED - RESERVED
N13 RESERVED - RESERVED
L13 RESERVED - RESERVED
J13 RESERVED - RESERVED
M13 RESERVED - RESERVED
K13 RESERVED - RESERVED
H13 RESERVED - RESERVED
G13 RESERVED - RESERVED
F13 RESERVED - RESERVED
B11 RESERVED - RESERVED
B10 RESERVED - RESERVED
A9 RESERVED - RESERVED
A8 RESERVED - RESERVED
D14 RESERVED - RESERVED
A14 RESERVED - RESERVED
WARNING:
Reserved pins must not be connected.
NOTE 1:
The following table is listing the main Pinout differences between the HE910 variants
Product GPS
Antenna
Diversity
Notes
HE910 (*)
YES
YES
HE910-D
NO
YES
Reserved Pads: R7, R9
HE910-GL
NO
NO
Reserved Pads:,F1, R7, R9
HE910-EUR
NO
NO
Reserved Pads:,F1, R7, R9
HE910-EUD
NO
NO
Reserved Pads:,F1, R7, R9
HE910-EUG
YES
NO
Reserved Pads: F1
HE910-NAR
NO
NO
Reserved Pads: F1, R7, R9
HE910-NAD
NO
NO
Reserved Pads: F1, R7, R9
HE910-NAG
YES
NO
Reserved Pads: F1
(*) HE910 is the “type name” of the products marketed as HE910-G & HE910-DG

HE910 Hardware User Guide
1vv0300925 Rev.27 – 2015-05-25
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 19 of 98
NOTE:
If not used, almost all pins should be left disconnected. The only exceptions are the following
pins:
RTS pin should be connected to the GND (on the module side) if flow control is not used.
The above pins are also necessary to debug the application when the module is assembled on it so we
recommend connecting them also to dedicated test point.
PAD
Signal
Notes
M1,M2,N1,N2,P1,P2
VBATT & VBATT_PA
E1,G1,H1,J1,L1,A2,E2,F2,G2,H2,
J2,K2,L2,R2,M3,N3,P3,R3,D4,M4,
N4,P4,R4,N5,P5,R5,N6,P6,R6,P8,
R8,P9,P10,R10,M12,B13,P13,E14
GND
R12
ON/OFF*
R13
HW_SHUTDOWN*
B15
USB_D+
If not used should be connected to a
Test Point or an USB connector
C15
USB_D-
If not used should be connected to a
Test Point or an USB connector
A13
VUSB
If not used should be connected to a
Test Point or an USB connector
N15
C103/TXD
If not used should be connected to a
Test Point
M15
C104/RXD
If not used should be connected to a
Test Point
L14
C105/RTS
If the flow control is not used it
should be connected to GND
P15
C106/CTS
If not used should be connected to a
Test Point
D15
TXD_AUX
If not used should be connected to a
Test Point
E15
RXD_AUX
If not used should be connected to a
Test Point
D13 VDD_IO1
It has always to be connected to
1V8_SEL
E13 1V8_SEL
It has always to be connected to
VDD_IO1
K1
MAIN ANTENNA
F1 ANT_DIV (if supported by the
product)
If not used it could left unconnected
but has to be disabled by the related
AT Command (AT#RXDIV);
please refer to the At User guide for
the related syntax
R9
ANT_GPS (if supported by the
product)
If the GPS is not used it could be
left unconnected

HE910 Hardware User Guide
1vv0300925 Rev.27 – 2015-05-25
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved page 20 of 98
3.1.1 LGA Pads Layout (HE910)
TOP VIEW
A B C D E F G H J K L M N P R
1 ADC_IN1 RES RES GND ANT_DIV GND GND GND ANT GND VBATT VBATT_
PA VBATT_ PA
2 GND RES RES RES GND GND GND GND GND GND GND VBATT VBATT_
PA VBATT_ PA GND
3 SIMVC
C RES RES RES RES RES RES RES RES RES RES GND GND GND GND
4 SIMIN RES RES GND GND GND GND GND
5 SIMIO RES RES GND GND GND
6 SIMCLK DVI_RX RES GND GND GND
7 SIMRS
T DVI_TX RES RES RES GPS_LN A_EN
8 RES DVI_CLK GPIO_01 RES GND GND
9 RES DVI_WA
0 GPIO_02 RES GND ANT_GP S
10 RES RES GPIO_03 RES GND GND
11 HSIC_U SB_ST
RB RES GPIO_04 RES RES VAUX/P
WRMON
12 HSIC_U SB_DA
TA RES GPIO_06 RES GND RES RES ON_OFF
*
13 VUSB GND GPIO_07 VDD_IO
1 1V8_SEL RES RES RES RES RES RES RES RES GND HW_SH
UTDOW
N*
14 RES GPIO_05 VRTC RES GND RES RES RES RES RES C105/RT
S C108/DT R C109/DC D C107/DS R C125/RI NG
15 USB_D+ USB_D- TX AUX RX AUX SPI_CLK GPIO_10 SPI_MR
DY SPI_SR DY GPIO_08 GPIO_09 C104/RX D C103/TX D C106/CT S
NOTE:
The pin defined as RES has to be considered RESERVED and not connected on any pin in the
application.
HE910 is the “type name” of the products marketed as HE910-G & HE910-DG.