TYAN S7082 User manual

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1
S7082
Version 1.0
Copyright
Copyright © 2015 MiTAC International Corporation. All rights reserved. No part of
this manual may be reproduced or translated without prior written consent from
MiTAC International Corporation.
Trademark
All registered and unregistered trademarks and company names contained in this
manual are property of their respective owners including, but not limited to the
following.
TYAN®is a trademark of MiTAC International Corporation.
Intel®is a trademark of Intel®Corporation.
AMI, AMI BIOS are trademarks of AMI Technologies.
Microsoft®, Windows®are trademarks of Microsoft Corporation.
Winbond®is a trademark of Winbond Electronics Corporation.
Notice
Information contained in this document is furnished by MiTAC International
Corporation and has been reviewed for accuracy and reliability prior to printing.
MiTAC assumes no liability whatsoever, and disclaims any express or implied
warranty, relating to sale and/or use of TYAN®products including liability or
warranties relating to fitness for a particular purpose or merchantability. MiTAC
retains the right to make changes to product descriptions and/or specifications at
any time, without notice. In no event will MiTAC be held liable for any direct or
indirect, incidental or consequential damage, loss of use, loss of data or other
malady resulting from errors or inaccuracies of information contained in this
document.

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2
Contents
S7082............................................................................................................ 1
Before you begin….................................................................................... 3
Chapter 1: Instruction ................................................................................ 4
1.1 Congratulations ................................................................................. 4
1.2 Hardware Specifications.................................................................... 4
1.3 Software Specifications ..................................................................... 8
Chapter 2: Board Installation..................................................................... 9
2.1 Board Image .................................................................................... 10
2.2 Block Diagram ................................................................................. 11
2.3 Motherboard Mechanical Drawing................................................... 12
2.4Board Parts, Jumpers and Connectors ........................................... 13
2.5Installing the Processor and Heatsink ............................................. 20
2.6Thermal Interface Material............................................................... 24
2.7Tips on Installing Motherboard in Chassis ...................................... 25
2.8Installing the Memory ...................................................................... 27
2.9Attaching Drive Cables.................................................................... 32
2.10 Installing Add-In Cards .................................................................. 33
2.11 Connecting External Devices ........................................................ 34
2.12 Installing the Power Supply ........................................................... 35
2.13 Finishing Up................................................................................... 36
Chapter 3: BIOS Setup ............................................................................. 37
3.1 About the BIOS................................................................................ 37
3.2 Main Menu....................................................................................... 39
3.3 Advanced Menu............................................................................... 40
3.4 Intel RCSetup Menu ........................................................................ 67
3.5Server Management ........................................................................ 98
3.6 Security.......................................................................................... 101
3.7Boot ............................................................................................... 106
3.8Save & Exit .................................................................................... 108
Chapter 4: Diagnostics........................................................................... 110
4.1 Flash Utility .................................................................................... 110
4.2 AMIBIOS Post Code (Aptio) .......................................................... 111
Appendix I: Fan and Temp Sensors ..................................................... 118
Glossary................................................................................................... 123
Technical Support .................................................................................. 129

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Before you begin…
Check the box contents!
The retail motherboard package should contain the following:
1 x S7082 Motherboard
2 x SATA Single Cable
1 x Rear IO shielding
1 x S7082 Quick Installation Guide
1 x TYAN®Driver CD
IMPORTANT NOTE:
Sales samples may not come with any of the accessories listed above.
If you have ordered a sales sample and you are missing any of the above items,
please contact your sales representative to help order accessories.

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Chapter 1: Instruction
1.1 Congratulations
You have purchased the powerful TYAN® S7082 motherboard, based on the Intel®
C612 Wellsburg chipset. The S7082 is designed to support dual Intel®Xeon E5-
2600 v3 (Haswell-EP) Series processors, and Up to 64GB RDIMM/ 128GB
LRDIMM/ 256GB LRDIMM 3DS* DDR4 memory for each DIMM slot. Leveraging
advanced technology from Intel®, the S7082 is capable of offering scalable 32 and
64-bit computing, high-bandwidth memory design, and lightning-fast PCI-E bus
implementation.
The S7082 not only empowers you in today‟s demanding IT environment but also
offers a smooth path for future application upgradeability. All of these rich feature
sets provide the S7082 with the power and flexibility to meet demanding
requirements for today‟s IT environments.
Remember to visit the TYAN® website at http://www.tyan.com. There you can find
all the information on all TYAN®products as well as all the supporting documentation,
FAQs, Drivers and BIOS upgrades.
1.2 Hardware Specifications
TYAN S7082 (S7082GM2NR)
Processor
Supported CPU
Series
Intel Xeon Processor E5-2600 v3 series
processors
Socket Type / Q'ty
LGA2011 / (2)
Thermal Design
Power (TDP) wattage
Max up to 145W
System Bus
Up to 9.6/ 8.0/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support
Chipset
PCH
Intel C612
Memory
Supported DIMM Qty
(12)+(12) DIMM slots
DIMM Type / Speed
RDIMM DDR4 2133/1866/1600 / LRDIMM DDR4
2133/1600 / LRDIMM 3DS DDR4 2133/1600
Capacity
Up to 768GB RDIMM/ 1,536GB LRDIMM/
3,072GB LRDIMM 3DS *Follow latest Intel
DDR4 Memory POR
Memory channel
4 Channels per CPU
Memory voltage
1.2V
Expansion Slots
PCI-E
(1) PCI-E Gen3 x16 slot / (3) PCI-E Gen3 x8
slots
Note:
(1) PCI-E Gen3 x 8 slot for Mezz Card

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Recommended TYAN
Mezzanine Card
M7094-8074-8I, PCI-E Gen3 x8, PMC SAS 12G
Mezz Card
Recommended TYAN
OCP Card
M7076-3108-8I, PCI-E Gen3 x8, LSI SAS 12G
Mezz Card / M7094-2308G-8I, PCI-E Gen3 x8,
LSI SAS 6G Mezz Card / M7076-3008-8I, PCI-E
Gen3 x8, LSI SAS 12G Mezz Card
Recommended
Barebone /
Chassis
Mechanical
Compliant
KFT48
LAN
Port Q'ty
(2) GbE ports (1 port shared with IPMI)
Controller
Intel I350-AM2
Storage
sSATA
Connector
(1) Mini-SAS (4-ports)
Controller
Intel C612
Speed
6.0 Gb/s
RAID
RAID 0/1/10/5 (Intel RST) only for 4 SATA
devices
SATA
Connector
(1) Mini-SAS (4-ports) + (2) SATA (totally
support 6 ports)
Controller
Intel C612
Speed
6.0 Gb/s
RAID
RAID 0/1/10/5 (Intel RST)
Graphic
Connector type
D-Sub 15-pin
Resolution
Up to 1920x1200
Chipset
Aspeed AST2400
Input /Output
USB
(4) USB3.0 ports (2 at rear, 2 via cable) / (1)
Type-A USB3.0 port
COM
(2) ports (1 at rear, 1 via cable)
VGA
(1) D-Sub 15-pin VGA port
RJ-45
Total (2) GbE ports, (1) shared with IPMI
Power
SSI 24-pin + 8-pin + 8-pin + 4-pin power
connectors
PSMI
(1) 1x5-pin header
SATA
(2) SATA-III connectors + (2) Mini-SAS (4-in-1)
connectors
System Monitoring
Chipset
Aspeed AST2400
Voltage
Monitors voltage for CPU, memory, chipset &
power supply
Temperature
Monitors temperature for CPU & system
environment
LED
Over temperature warning indicator / Fan & PSU
fail LED indicator
Others
Watchdog timer support
Server
Management
Onboard Chipset
Onboard Aspeed AST2400
AST2400 IPMI
Feature
IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and

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remote platform-flash / USB 2.0 virtual hub
AST2400 iKVM
Feature
24-bit high quality video compression / 10/100
Mb/s MAC interface
BIOS
Brand / ROM size
AMI / 16MB
Feature
User-configurable H/W monitoring / SMBIOS
2.7/PnP/Wake on LAN / PXE boot support /
ACPI 3.0/ACPI sleeping states S4,S5
Physical
Dimension
Form Factor
SSI EEB
Board Dimension
12"x13" (305x330mm)
Operating System
OS supported list
Please refer to our Intel OS supported list.
Regulation
FCC (DoC)
Class A
CE (DoC)
Yes
Operating
Environment
Operating Temp.
10°C ~ 35°C (50°F~ 95°F)
Non-operating Temp.
- 40°C ~ 70°C (-40°F ~ 158°F)
In/Non-operating
Humidity
90%, non-condensing at 35°C
RoHS
RoHS 6/6 Compliant
Yes
Package Contains
Motherboard
(1) S7082 Motherboard
Manual
(1) Quick Installation Guide
Installation CD
(1) TYAN installation CD
TYAN S7082 (S7082GM4NR)
Processor
Supported CPU
Series
Intel Xeon Processor E5-2600 v3 series
processors
Socket Type / Q'ty
LGA2011 / (2)
Thermal Design
Power (TDP) wattage
Max up to 145W
System Bus
Up to 9.6/ 8.0/ 6.4 GT/s with Intel QuickPath
Interconnect (QPI) support
Chipset
PCH
Intel C612
Memory
Supported DIMM Qty
(12)+(12) DIMM slots
DIMM Type / Speed
RDIMM DDR4 2133/1866/1600 / LRDIMM DDR4
2133/1600 / LRDIMM 3DS DDR4 2133/1600
Capacity
Up to 768GB RDIMM/ 1,536GB LRDIMM/
3,072GB LRDIMM 3DS *Follow latest Intel
DDR4 Memory POR
Memory channel
4 Channels per CPU
Memory voltage
1.2V
Expansion Slots
PCI-E
(1) PCI-E Gen3 x16 slot / (3) PCI-E Gen3 x8
slots
Note:
(1) PCI-E Gen3 x8 slot for Mezz Card
Recommended TYAN
Mezzanine Card
M7094-8074-8I, PCI-E Gen3 x8, PMC SAS 12G
Mezz Card
Recommended TYAN
OCP Card
M7076-3108-8I, PCI-E Gen3 x8, LSI SAS 12G
Mezz Card / M7094-2308G-8I, PCI-E Gen3 x8,

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LSI SAS 6G Mezz Card / M7076-3008-8I, PCI-E
Gen3 x8, LSI SAS 12G Mezz Card
Recommended
Barebone /
Chassis
Mechanical
Compliant
KFT48
LAN
Port Q'ty
Total (4) ports, (1) shared with IPMI
Controller
Intel I350-AM4
Storage
sSATA
Connector
(1) Mini-SAS (4-ports)
Controller
Intel C612
Speed
6.0 Gb/s
RAID
RAID 0/1/10/5 (Intel RST) only for 4 SATA
devices
SATA
Connector
(1) Mini-SAS (4-ports) + (2) SATA (totally
support 6 ports)
Controller
Intel C612
Speed
6.0 Gb/s
RAID
RAID 0/1/10/5 (Intel RST)
Graphic
Connector type
D-Sub 15-pin
Resolution
Up to 1920x1200
Chipset
Aspeed AST2400
Input /Output
USB
(4) USB3.0 ports (2 at rear, 2 via cable) / (1)
Type-A USB3.0 port
COM
(2) ports (1 at rear, 1 via cable)
VGA
(1) D-Sub 15-pin VGA port
RJ-45
Total (4) GbE ports, (1) shared with IPMI
Power
SSI 24-pin + 8-pin + 8-pin + 4-pin power
connectors
PSMI
(1) 1x5-pin header
SATA
(2) SATA-III connectors + (2) Mini-SAS (4-in-1)
connectors
System Monitoring
Chipset
Aspeed AST2400
Voltage
Monitors voltage for CPU, memory, chipset &
power supply
Temperature
Monitors temperature for CPU & system
environment
LED
Over temperature warning indicator / Fan & PSU
fail LED indicator
Others
Watchdog timer support
Server
Management
Onboard Chipset
Onboard Aspeed AST2400
AST2400 IPMI
Feature
IPMI 2.0 compliant baseboard management
controller (BMC) / Supports storage over IP and
remote platform-flash / USB 2.0 virtual hub
AST2400 iKVM
Feature
24-bit high quality video compression / 10/100
Mb/s MAC interface

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BIOS
Brand / ROM size
AMI / 16MB
Feature
User-configurable H/W monitoring / SMBIOS
2.7/PnP/Wake on LAN / PXE boot support /
ACPI 3.0/ACPI sleeping states S4,S5
Physical
Dimension
Form Factor
SSI EEB
Board Dimension
12"x13" (305x330mm)
Operating System
OS supported list
Please refer to our Intel OS supported list.
Regulation
FCC (DoC)
Class A
CE (DoC)
Yes
Operating
Environment
Operating Temp.
10°C ~ 35°C (50°F~ 95°F)
Non-operating Temp.
- 40°C ~ 70°C (-40°F ~ 158°F)
In/Non-operating
Humidity
90%, non-condensing at 35°C
RoHS
RoHS 6/6 Compliant
Yes
Package Contains
Motherboard
(1) S7082 Motherboard
Manual
(1) Quick Installation Guide
Installation CD
(1) TYAN installation CD
1.3 Software Specifications
For the latest AST2400 User‟s Guide and OS (operation system) support, please
visit the Tyan‟s Web site at http://www.tyan.com for the latest information

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Chapter 2: Board Installation
You are now ready to install your motherboard.
How to install our products right… the first time
The first thing you should do is read this user‟s manual. It contains important
information that will make configuration and setup much easier. Here are some
precautions you should take when installing your motherboard:
(1) Ground yourself properly before removing your motherboard from the
antistatic bag. Unplug the power from your computer power supply and
then touch a safely grounded object to release static charge (i.e. power
supply case). For the safest conditions, MiTAC recommends wearing a
static safety wrist strap.
(2) Hold the motherboard by its edges and do not touch the bottom of the
board, or flex the board in any way.
(3) Avoid touching the motherboard components, IC chips, connectors,
memory modules, and leads.
(4) Place the motherboard on a grounded antistatic surface or on the antistatic
bag that the board was shipped in.
(5) Inspect the board for damage.
The following pages include details on how to install your motherboard into your
chassis, as well as installing the processor, memory, disk drives and cables.
Caution!
1. To avoid damaging the motherboard and associated
components, do not use torque force greater than
7kgf/cm (6.09 lb/in) on each mounting screw for
motherboard installation.
2. Do not apply power to the board if it has been
damaged.

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2.1 Board Image
S7082
This picture is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above picture.

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2.2 Block Diagram
S7082 Block Diagram

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2.3 Motherboard Mechanical Drawing

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2.4 Board Parts, Jumpers and Connectors
This diagram is representative of the latest board revision available at the time of
publishing. The board you receive may not look exactly like the above diagram. The
DIMM slot numbers shown above can be used as a reference when reviewing the
DIMM population guidelines shown later in the manual. For the latest board revision,
please visit our web site at http://www.tyan.com.

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Motherboard Components
Connectors
1. COM Port
20. DOM_PWR1
2. VGA Port
21. PCH_SATA2(SATA DOM1)
3. 8-pin Power Connector(PW3)
22. Clear Button(Clear_BTN1)
4. LAN port#4 (IPMI) and USB 3.0 ports
23. Power Button(PWR BTN1)
5. LAN Port#2(LAN2)&LAN Port#3(LAN3)
24. 4-in-1 Mini SAS Connector(SATA0,1,4,5)
6. LAN Port#0(LAN0)&LAN Port#1 (LAN1)
25.Front Fan Connector (FAN_HD1)
7. ID Button(SW2)
26. Micro SD Card Connector
8. ID LED
27. COM2 Header
9. 4-pin Fan Connector(CPU1_FAN)
28. TYAN Module Header
10. 4-pin Fan Connector(SYS_FAN5)
29.Front Panel Connector(FPIO)
11. 4-pin Fan Connector(SYS_FAN4)
30. RJ45 LED header(LED_HD1)
12. 4-pin Power Connector(PW4)
31. 8-pin Power Connector(PW2)
13. IPMB Connector(IPMB1)
32. 4-pin Fan Connector (CPU0_FAN)
14. USB 3.0 Header(USB3_HD1)
33. 4-pin Fan Connector (SYS_FAN3)
15. VGA2 Header
34. 4-pin Fan Connector(SYS_FAN2)
16. DOM_PWR2
35. 4-pin Fan Connector(SYS_FAN1)
17. Vertical (Type_A) USB3.0 Connector
(TYPEA_USB3)
36. 24-pin Power Connector(PW1)
18. PCH_SATA3(SATA DOM2)
37. PSMI Connector(PSMI_HD1)
19. 4-in-1 Mini SAS Connector (SSATA0-3)
Headers/Jumpers
a. ME Recovery Mode Jumper (3PHD_7)
d. ID_LED Button Header (2PHD_2)
b. Chassis Intrusion Header (2PHD_1)
e. PSU Alert Disable Jumper (3PHD_10)
c. System Reset Jumper (3PHD_1)
f. CPU Power FW Update Header(3PHD_6)
g. BUZZER Disable Jumper(4PHD_1)
Slots
A.Slot #5: PCI-E G3 x8 slot (x8 link)
(f/ CPU0)
F. CPU0 DIMM A/B
B. Slot #4: PCI-E G3 x16 slot (x16 link) (f/CPU0)
G.CPU0 DIMM D/C
C.Slot #3: PCI-E G3 x8 slot (x8 link)
(f/ CPU1,open-type)
H. CPU1 DIMM C/D
D.Slot #2: PCI-E G3 x8 slot (x8 link)
(f/ CPU1,open-type)
I. CPU1 DIMM B/A
E. Slot #Mezz: PCI-E G3 x8 slot (x8 link) (f/ CPU0)

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SYS_FAN1/2/3/4/5/CPU0/1_FAN: 4-Pin FAN Connector
Pin
1
2
3
4
Signal
GND
+12V
FAN_TACH
FAN_PWM
Use this header to connect the cooling fan to your motherboard to keep the
system stable and reliable.
Note: A 4-pin fan is required for fan speed control.
FPIO: Front Panel Connector
Signal
Pin
Pin
Signal
PWRLED+
1
2
V3P3_AUX
KEY
3
4
ID_LED+
PWRLED-
5
6
ID_LED-
HDDLED+
7
8
HWM_FAULT_LED-
HDDLED-
9
10
SYS_FAULT_LED-
PWR_SW#
11
12
LAN0_ACTLE+
GND
13
14
LAN0_ACTLED-
RST_SW#
15
16
SMBDATA
GND
17
18
SMBCLK
FP_IDLED_BTN_N
19
20
INTRUSION#
FPIO_TEMP_IN
21
22
LAN1_ACTLED+
NMI_SW#
23
24
LAN1_ACTLED-
PSMI_HD1: PSMI Connector
Pin
1
2
3
4
5
Signal
SMB_CLK
SMB_DAT
SMB_ALERT#
GND
V3P3
USB3_HD1: Front USB3.0 Header
Signal
Pin
Pin
Signal
+5V
1
2
P0_RX_N
P0_RX_P
3
4
GND
P0_TX_N
5
6
P0_TX_P
GND
7
8
P0_N
P0_P
9
10
OC_N
P1_P
11
12
P1_N
GND
13
14
P1_TX_P
P1_TX_N
15
16
GND
P1_RX_P
17
18
P1_RX_N
+5V
19
20
Key

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TYPEA_USB3: Vertical (Type_A) USB3.0 Connector
Signal
Pin
Pin
Signal
+5V
1
2
USB2.0_DATA_N
USB2.0_DATA_P
3
4
GND
USB3.0_RX_N
5
6
USB3.0_RX_P
GND
7
8
USB3.0_TX_N
USB3.0_TX_P
9
FAN_HD1: Front Fan Connector (Reserved for Barebone)
Signal
Pin
Pin
Signal
TACH1
1
2
TACH6
TACH2
3
4
TACH7
TACH3
5
6
TACH8
TACH4
7
8
TACH9
TACH5
9
10
TACH10
GND
11
12
KEY
PWM2
13
14
PWM1
TACH11
15
16
SMB_DATA
TACH12
17
18
SMB_CLK
VCC3_AUX
19
20
PWM3
SATA DOM1/2: 7-pin vertical SATA3.0 Connector(White)
7
1
Name
TYPE
Description
S1
GND
Gound
S2
TX+
+Different Tranmit Signal
S3
TX-
-Different Transmit Signal
S4
GND
Gound
S5
RX-
-Differential Transmit Signal
S6
RX+
+Differential Transmit Signal
S7
GND
Gound
P1
Power
Vcc
P2
GND
GND
DOM_PWR1/ DOM_PWR2:SATA DOM Power Connector
1
Signal
Pin
Pin
Signal
GND
1
2
VCC5
LED_HD1: RJ45 LED Header
1
Signal
Pin
Pin
Signal
LAN2_Link_P
1
2
LAN2_ACT_N
LAN3_Link_P
3
4
LAN3_ACT_N

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DBG_HD1: TYAN Module Header
Signal
Pin
Pin
Signal
P3V3
1
2
FRAME_N
LAD0
3
4
KEY
LAD1
5
6
PLT_RST_N
LAD2
7
8
GND
LAD3
9
10
CLK_33M
DBG_SERIRQ
11
12
GND
DBG_PRES_N
13
14
VCC3_AUX
ADDR_MB
15
16
PCH_PP_EN
VGA2 Header: VGA Header
Signal
Pin
Pin
Signal
GND
1
2
VGA2_5V
GND
3
4
VGA_R
GND
5
6
VGA_G
GND
7
8
VGA_B
GND
9
10
VGA_DAT
VGA_HS
11
12
Key
VGA_CLK
13
14
VGA_VS
COM2: COM Header
Signal
Pin
Pin
Signal
DCD
1
2
DSR
SIN
3
4
RTS
SOUT
5
6
CTS
DTR
7
8
RI
GND
9
10
KEY
IPMB_HD1: IPMB Connector
Signal
Pin
Pin
Signal
BMC_SMB_DATA
1
2
GND
BMC_SMB_CLK
3
4
NC
Caution:
The jumpers are only using for engineering debug. We don‟t
suggest customers change the jumpers‟position, which may
cause unable to boot device.

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INTRUDER_HD1: Chassis Intrusion Header
Open
Short (Default)
Pin
1
2
Signal
INTRUDER#
GND
Open: Use this header to trigger the system chassis
intrusion alarm.
Short: Use this header to disable the system chassis
intrusion alarm.
2PHD_2: ID LED Button Header
Pin
1
2
Signal
FP_IDLED_BTN_N
GND
3PHD_1: System Reset Jumper
Pin
1
2
3
Signal
FP_RST_BT
N_N
FP_RST_BTN_R_
N
FP_BMC_RST_
BTN_N
Pin 1-2 Closed: Normal Mode (Default)
Pin 2-3 Closed: BMC Reset Mode
3PHD_6: CPU Power FW Update Header
Pin
1
2
3
Signal
IR_VR_3V3_
SMB_CLK
IR_VR_3V3_SMB
_DAT
GND
3PHD_7: ME Recovery Mode Jumper
Pin
1
2
3
Signal
NC
FM_ME_RCVR_N
GND
Pin 1-2 Closed: Normal Mode (Default)
Pin 2-3 Closed: ME Recovery Mode

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3PHD_10: PSU Alert Disable Jumper
Pin
1
2
3
Signal
PSU_SMB_AL
ERT_BMC_N
PSU_SMB_ALERT
_BMC_N_R
NC
Pin 1-2 Closed: Normal Mode (Default)
Pin 2-3 Closed: Disable PSU Alert
4PHD_1: BUZZER Disable Jumper
Pin
1
2
3
4
Signal
VCC5
NA
BUZ_1
BUZ_2
Pin 3-4 Closed: Normal Mode (Default)
Pin 2-3 Closed: Disable PC Beep
Pin 1-4 Closed: Use the External Speaker
SW2: ID LED Switch Button
Signal
Pin
Pin
Signal
FP_IDLED_BTN_N
1
2
GND
Clear_BTN1: Clear CMOS Reset Button
You can reset the CMOS settings by using this button, if you have
forgotten your system/setup password or need to clear system BIOS
setting.
1. Power off the system and disconnect power connectors from the
motherboard.
2. Press the button (Clear CMOS).
3. Reconnect power & power on the system.
NOTE: After flashing new BIOS, do the following steps:
a. Clear CMOS
b. Enter BIOS setup menu and load Default Settings. Then do a Save
and Exit from setup.
ID LED: ID LED
LED1
Rear
ID_LED
Pin
Signal
+
P3V3_AUX
-
ID_SW_L
State
Color
Description
On
Blue
System identified
Off
Off
System not identified
NOTE: The ID LED can be activated remotely using IPMI.
Please visit the TYAN Web Site at http://www.tyan.com to
download the latest IPMI Configuration Guide for more details.

http://www.tyan.com
20
2.5 Installing the Processor and Heatsink
The types of processors supported by the S7082 are listed in the 1.2 Hardware
Specifications section on page 4. Check our website at http://www.tyan.com for
the latest list of validated Intel®processors for this specific motherboard.
NOTE: MiTAC is not liable for damage as a result of operating an
unsupported configuration.
Processor Installation (Socket R3 for Intel Haswell CPU)
Follow the steps described later to install the processors and heat sinks.
The following pictures illustrate how to install the Intel®Haswell-EP processor on
the Socket R3. Please note that the motherboard may not look exactly like the one
you purchased. Therefore, the illustrations should be held for your reference only.
NOTE: Please save and replace the CPU protection cap when returning for service.
1. Locate the CPU socket.
2. Open the one side socket lever.
3. Open the other side of the lever.