TYANO TS70-B8056 Quick start guide

TS70-B8056
Service Engineer’s Manual

PREFACE
Copyright
This publication, including all photographs, illustrations, and software, is protected
under international copyright laws, with all rights reserved.
Neither this manual, nor any material contained herein, may be reproduced without
written consent of manufacturer.
Copyright 2023 MITAC COMPUTING TECHNOLOGY CORPORATION. All rights
reserved. TYAN®is a registered trademark of MITAC COMPUTING TECHNOLOGY
CORPORATION.
Version 1.0
Disclaimer
Information contained in this document is furnished by MITAC COMPUTING
TECHNOLOGY CORPORATION and has been reviewed for accuracy and reliability
prior to printing. MITAC assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of TYAN®products including liability
or warranties relating to fitness for a particular purpose or merchantability. MITAC
retains the right to make changes to produce descriptions and/or specifications at
any time, without notice. In no event will MITAC be held liable for any direct or
indirect, incidental or consequential damage, loss of use, loss of data or other
malady resulting from errors or inaccuracies of information contained in this
document.
Trademark Recognition
All registered and unregistered trademarks and company names contained in this
manual are property of their respective owners including, but not limited to the
following.
TYAN®is a trademark of MITAC COMPUTING TECHNOLOGY CORPORATION.
AMD®is a trademark of AMD® Corporation.
AMI®, AMIBIOS® and combinations thereof are trademarks of AMI Technologies.
Microsoft®, Windows®are trademarks of Microsoft Corporation.
IBM®, PC®, AT®and PS/2®are trademarks of IBM Corporation.
Winbond®is a trademark of Winbond Electronics Corporation.

●FCC Declaration
Notice for the USA
Compliance Information Statement (Declaration of Conformity Procedure) DoC FCC
Part 15: This device complies with part 15 of the FCC Rules.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following conditions:
‧This device may not cause harmful interference.
‧This device must accept any interference received, including interference that may
cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class A
digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful
interference in which case the user will be required to correct the interference at his
own expense.
Notice for Canada
This Class A digital apparatus complies with Canadian ICES-003. Cet appareil
numérique de la Classe A est conforme àla norme NMB-003 du Canada.
●Notice for Europe (CE Mark)
This product is in conformity with the Council Directive 2014/30/EU and 2014/35/EU.

Warning
This equipment is compliant with Class A of CISPR 32. In a residential environment
this equipment may cause radio interference.
CAUTION
Lithium battery included with this board. Do not puncture, mutilate, or dispose of
battery in fire. There will be danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by manufacturer.
Dispose of used battery according to manufacturer instructions and in accordance
with your local regulations.
●VCCI-A
この装置は、クラスＡ情報技術装置です。この装置を家庭環境で使用すると電波妨
害を引き起こすことがあります。この場合には使用者が適切な対策を講ずるよう要
求されることがあります。
●Safety: IEC/EN 62368-1
This equipment is compliant with CB/LVD of Safety: IEC/EN 62368-1.

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About this Manual
This manual is intended for trained service technician/personnel with hardware
knowledge of computers. Components inside the compartments should be serviced
only by a trained service technician/personnel. This manual is aimed to provide you
with instructions on installing your TYAN TS70-B8056.
How this guide is organized
This guide contains the following parts:
Chapter 1: Overview
This chapter provides an introduction to the TYAN TS70-B8056 barebones and
standard parts list, describes the external components, gives an overview of the
product from different angles.
Chapter 2: Setting Up
This chapter covers procedures on installing the memory modules, hard drivers and
other optional parts.
Chapter 3: Replacing the Pre-installed Components
This chapter covers the removal and replacement procedures for pre-installed
components.
Chapter 4: Motherboard Information
This chapter lists the hardware setup procedures that you need to abide by when
installing system components. It includes description of the jumpers and connectors
on the motherboard.
Chapter 5: BIOS Setup
This chapter tells how to change system settings through the BIOS setup menu.
Detailed descriptions of the BIOS parameters are also provided.
Chapter 6: Diagnostics
This chapter introduces some BIOS codes and technical terms to provide better
service for the customers.
Appendix:
This chapter provides the cable connection table, how to install IO plate for OCP
Card, the FRU parts list for reference of system setup, and technical support in case
a problem arises with your system.

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Safety and Compliance Information
Before installing and using TYAN TS70-B8056, take note of the following
precautions:
·Read all instructions carefully.
·Do not place the unit on an unstable surface, cart, or stand.
·Do not block the slots and opening on the unit, which are provided for
ventilation.
·Only use the power source indicated on the marking label. If you are not
sure, contact the power company.
·The unit uses a three-wire ground cable, which is equipped with a third pin to
ground the unit and prevent electric shock. Do not defeat the purpose of this
pin. If your outlet does not support this kind of plug, contact your electrician
to replace your obsolete outlet.
·Do not place anything on the power cord. Place the power cord where it will
not be in the way of foot traffic.
·Follow all warnings and cautions in this manual and on the unit case.
·Do not push objects in the ventilation slots as they may touch high voltage
components and result in shock and damage to the components.
·When replacing parts, ensure that you use parts specified by the
manufacturer.
·When service or repairs have been done, perform routine safety checks to
verify that the system is operating correctly.
·Avoid using the system near water, in direct sunlight, or near a heating
device.
·Cover the unit when not in use.

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Safety Information
Retain and follow all product safety and operating instructions provided with your
equipment. In the event of a conflict between the instructions in this guide and the
instructions in equipment documentation, follow the guidelines in the equipment
documentation.
Observe all warnings on the product and in the operating instructions. To reduce the
risk of bodily injury, electric shock, fire and damage to the equipment, observe all
precautions included in this guide.
You must become familiar with the safety information in this guide before you install,
operate, or service TYAN products.
Symbols on Equipment
Caution. This symbol indicates a potential hazard.
The potential for injury exists if cautions are not
observed. Consult equipment documentation for
specific details.
Caution. Slide-mounted equipment is not to be
used as a shelf or a work space.
Warning. This symbol indicates the presence of
hazardous energy circuits or electric shock
hazards. Refer all servicing to qualified personnel.
Warning. This symbol indicates the presence of a
hot surface or hot component. If this surface is
contacted, the potential for injury exists.
To reduce risk of injury from a hot component,
allow the surface to cool before touching.
General Precautions
·Follow all caution and warning instructions marked on the equipment and
explained in the accompanying equipment documentation.
Machine Room Environment
·This device is for use only in a machine room or IT room.

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 ·Make sure that the area in which you install the system is properly
ventilated and climate-controlled.
·Ensure that the voltage and frequency of your power source match the
voltage and frequency inscribed on the electrical rating label of the
equipment.
·Do not install the system in or near a plenum, air duct, radiator, or heat
register.
·Never use the product in a wet location.
Equipment Chassis
·Do not block or cover the openings to the system.
·Never push objects of any kind through openings in the equipment.
Dangerous voltages might be present.
·Conductive foreign objects can produce a short circuit and cause fire,
electric shock, or damage to your equipment.
·Lift equipment using both hands and with your knees bent.
Equipment Racks
To avoid injury or damage to the equipment:
·Observe local occupational health and safety requirements and guidelines
for manual materials handling.
·Do not attempt to move a rack by yourself; a minimum of two people are
needed to move a rack.
·Do not attempt to move a fully loaded rack. Remove equipment from the
rack before moving it.
·Do not attempt to move a rack on an incline that is greater than 10 degrees
from the horizontal.
·Make sure the rack is properly secured to the floor or ceiling.
·Make sure the stabilizing feet are attached to the rack if it is a single-rack
installation.
·Make sure racks are coupled together if it is a multiple-rack installation.
·Make sure the rack is level and stable before installing an appliance in the

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rack.
·Make sure the leveling jacks are extended to the floor.
·Make sure the full weight of the rack rests on the leveling jacks.
·Always load the rack from the bottom up. Load the heaviest component in
the rack first.
·Make sure the rack is level and stable before pulling a component out of the
rack.
·Make sure only one component is extended at a time. A rack might become
unstable if more than one component is extended.
To avoid damage to the equipment:
·The rack width and depth must allow for proper serviceability and cable
management.
·Ensure that there is adequate airflow in the rack. Improper installation or
restricted airflow can damage the equipment.
·The rack cannot have solid or restricted airflow doors. You must use a
mesh door on the front and back of the rack or remove the doors to ensure
adequate air flow to the system.
·If you install the Model in a rack, do not place equipment on top of the unit.
It will cause restricted airflow and might cause damage to the equipment.
·Make sure the product is properly matted with the rails. Products that are
improperly matted with the rails might be unstable.
·Verify that the AC power supply branch circuit that provides power to the
rack is not overloaded. This will reduce the risk of personal injury, fire, or
damage to the equipment. The total rack load should not exceed 80 percent
of the branch circuit rating. Consult the electrical authority having jurisdiction
over your facility wiring and installation requirements.
Equipment Power Cords
·Use only the power cords and power supply units provided with your
system. The system might have one or more power cords.
·Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.

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·In all European electrical environments, you must ground the Green/Yellow
tab on the power cord. If you do not ground the Green/Yellow tab, it can
cause an electrical shock due to high leakage currents.
·Do not place objects on AC power cords or cables. Arrange them so that no
one might accidentally step on or trip over them.
·Do not pull on a cord or cable. When unplugging from the electrical outlet,
grasp the cord by the plug.
·To reduce the risk of electrical shock, disconnect all power cords before
servicing the appliance.
Equipment Batteries
·The system battery contains lithium manganese dioxide. If the battery pack
is not handled properly, there is risk of fire and burns.
·Do not disassemble, crush, puncture, short external contacts, or dispose of
the battery in fire or water.
·Do not expose the battery to temperatures higher than 60°C (140°F).
·The system battery is not replaceable. If the battery is replaced by an
incorrect type, there is danger of explosion. Replace the battery only with a
spare designated for your product.
·Do not attempt to recharge the battery.
·Dispose of used batteries according to the instructions of the manufacturer.
Do not dispose of batteries with the general household waste. To forward
them to recycling or proper disposal, use the public collection system or return
them to TYAN, your authorized TYAN partner, or their agents.
Equipment Modifications
·Do not make mechanical modifications to the system. TYAN is not
responsible for the regulatory compliance of TYAN equipment that has been
modified.

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Equipment Repairs and Servicing
·The installation of internal options and routine maintenance and service of
this product should be performed by trained service technicians/personnel
who are knowledgeable about the procedures, precautions, and hazards
associated with equipment containing hazardous energy levels.
·Do not exceed the level of repair specified in the procedures in the product
documentation. Improper repairs can create a safety hazard.
·Allow the product to cool before removing covers and touching internal
components.
·Remove all watches, rings, or loose jewelry when working before removing
covers and touching internal components.
·Do not use conductive tools that could bridge live parts.
·Use gloves when you remove or replace system components; they can
become hot to the touch.
·If the product sustains damage requiring service, disconnect the product
from the AC electrical outlet and refer servicing to an authorized service
provider. Examples of damage requiring service include:
–The power cord, extension cord, or plug has been damaged.
–Liquid has been spilled on the product or an object has fallen into the
product.
–The product has been exposed to rain or water.
–The product has been dropped or damaged.
–The product does not operate normally when you follow the operating
instructions.
Therefore, as long as (a) the ITE will not be used in a home, school, or other
public area where the general population will not have access to it, and (b) the
manufacturer specifies that the thumbscrews normally should be tightened
with a screwdriver, use of thumbscrews is not considered to compromise the
basic principles of safety associated with the Standard.

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Table of Contents
Chapter 1: Overview ........................................................................15
1.1 About the TYAN TS70-B8056 ................................................ 15
1.2Product Model ........................................................................ 15
1.3 Features.................................................................................. 16
1.4 Standard Parts List................................................................. 21
1.4.1 Box Contents................................................................... 21
1.4.2 Accessories..................................................................... 21
1.5 About the Product................................................................... 22
1.5.1 System Front View .......................................................... 22
1.5.2 System Rear View........................................................... 24
1.5.3 System Top View............................................................. 26
Chapter 2: Setting Up ......................................................................28
2.0.1 Before you Begin............................................................. 28
2.0.2 Work Area........................................................................ 28
2.0.3 Tools................................................................................ 28
2.0.4 Precautions...................................................................... 29
2.1Installing Motherboard Components ...................................... 30
2.1.1 Removing the Chassis Cover.......................................... 30
2.1.2 Removing the Riser Bracket............................................ 31
2.1.3 Replacing the Chassis Cover ........................................ 32
2.1.4 Board Image.................................................................... 33
2.1.5 Block Diagram ................................................................. 34
2.1.6 Motherboard Mechanical Drawing................................... 35
2.1.7Installing the CPU and Heatsink...................................... 36
2.1.8 Installing the Airduct........................................................ 40
2.1.9 Installing the Memory ...................................................... 41
2.1.10 Installing the PCI-E Card............................................... 46
2.1.11 Installing Hard Drives .................................................... 47
2.1.12 Installing the M.2 Latch.................................................. 53
2.1.13 Installing IO Rail for OCP Card ..................................... 55
2.2 Rack Mounting........................................................................ 58
2.2.1 Installing the Server in a Rack......................................... 58
2.2.2 Rack mounting the Server ................................................... 62
3.1 Introduction............................................................................. 64
3.2 Disassembly Flowchart........................................................... 64
3.3 Removing the Cover............................................................... 65
3.4 Replacing Motherboard Components..................................... 65
3.4.1 Replacing the Riser Card ................................................ 65
3.4.2 PCI-E Riser Cards Specification ..................................... 66

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3.5Replacing the Front Panel Board ........................................... 67
3.5.1 Front Panel Board Specifications.................................... 69
3.5.2 FPB LED Definitions........................................................ 70
3.6 Replacing the USB Board....................................................... 71
3.6.1 USB Board Specifications ............................................... 72
3.7 Replacing the System Fan ..................................................... 73
3.8 Replacing the HDD Backplane Board .................................. 75
3.8.1 HDD Backplane Board Features..................................... 76
3.8.2 Connector Definition........................................................ 77
3.9 Replacing the Rear HDD BP Board ....................................... 78
3.9.1 HDD Backplane Features................................................ 78
3.9.2 HDD LED Definition......................................................... 79
3.10 Replacing the Power Distribution Board............................... 80
3.10.1 Power Distribution Board Features ............................... 81
3.10.2 Pin Definitions................................................................ 82
3.11 Replacing the Power Backplane Board................................ 83
3.12 Replacing the Power Supply ................................................ 85
3.13 Disconnecting All Motherboard Cables............................ 86
3.13.1 Removing the Motherboard........................................... 87
Chapter 4: BIOS Setup.....................................................................89
4.1 About the BIOS....................................................................... 89
4.2 Main Menu.............................................................................. 91
4.3 Advanced Menu...................................................................... 93
4.4 CPU Configuration................................................................ 144
4.5 Chipset Menu ....................................................................... 147
4.6 Server Management............................................................. 174
4.7 Security................................................................................. 183
4.8 Boot ...................................................................................... 188
4.9 Save & Exit........................................................................... 192
Chapter 5: Diagnostics..................................................................194
5.1 Flash Utility........................................................................... 194
5.2 AMIBIOS Post Code (Aptio)................................................. 195
Appendix I: Cable Connection Tables .........................................203
Appendix II: Fan and Temp Sensors............................................205
Appendix III: How to recover UEFI BIOS.....................................210
Appendix IV: FRU Parts Table......................................................212
Appendix V: Technical Support....................................................214

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NOTE

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15
Chapter 1: Overview
1.1 About the TYAN TS70-B8056
Congratulations on your purchase of the TYAN®TS70-B8056, a highly optimized
rack-mountable barebone system. The TS70-B8056 is designed to AMD®EPYC™
9004 series Processor, and up to 3,072GB RDIMM/3DS RDIMM DDR5
4800/4400/4000 MHz memory. Leveraging advanced technology from AMD®,
TS70-B8056 server system is capable of offering scalable 32 and 64-bit computing,
high bandwidth memory design, providing a rich feature set and incredible
performance, and lightning-fast PCI-E bus implementation. The TS70-B8056 not
only empowers your company in nowadays IT demand but also offers a smooth path
for future application usage.
TYAN®also offers the TS70-B8056 in a version that can support up to eight
hot-swap 2.5”/3.5”SATA HDDs/SSDs, four NVMe HDDs/SSDs and two hot-swap
2.5”SSDs. The TS70-B8056 uses TYAN®’s latest chassis, featuring a robust
structure and a solid mechanical enclosure. All of this provides TS70-B8056 the
power and flexibility to meet the needs of nowadays server application.
1.2Product Model
The system boards within the Tyan barebone systems contain different features and
chipsets, which are defined by the following models:
 B8056T70V8E6HR-2T: AMD-based platform, support (8) hot-swap
3.5”/2.5”SATA HDDs + (4) hot-swap NVMe SSDs (Front)+(2) 2.5’’ NVMe SSDs(Rear)
 B8056T70V8E6HR: AMD-based platform, support (8) hot-swap 3.5”/2.5”
SATA HDDs + (4) hot-swap NVMe SSDs (Front) + (2) 2.5’’ NVMe SSDs(Rear)

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1.3 Features
B8056T70V8E6HR-2T Specifications
System
Form Factor
2U Rackmount
Chassis Model
TS70
Dimension (D x W x
H)
27.56" x 17.26" x 3.42" (700 x 438.5 x 87mm)
Motherboard Name
S8056GM2NRE-2T
Board Dimension
Prop. 14.18" x 12.16" (360.2 x 308.8mm)
Front Panel
Buttons
(1) ID / (1) PWR w/ LED / (1) RST
LEDs
(1) HDD / (1) ID / (2) LAN / (1) System Event
I/O Ports
(2) USB 3.2 Gen.1 ports
External
Drive Bay
Q'ty / Type
(2) 2.5" Hot-Swap NVMe HDD/SSDs / (12) 3.5"/2.5"
Hot-Swap HDD/SSDs w/ (4) NVMe
Front Drive Bay
Interface
(12) SATA 6Gb/s with (4) NVMe ports
Front HDD
Backplane Support
NVMe / SATA 6Gb/s
Rear Drive Bay
Interface
(2) NVMe
Rear HDD Backplane
Support
NVMe
System
Cooling
Configuration
FAN
(3) hot-swap 8056 fans
Redundancy
Yes
Power Supply
Type
CRPS
Input Range
AC 100-127V/13A / AC 200-240V/7A
Frequency
50-60 Hz
Output Watts
1,000 Watts (100-127V AC input) /
1,200Watts (200-240V AC input)
Efficiency
80 plus Platinum
Redundancy
1+1
Processor
Q'ty / Socket Type
(1) AMD Socket SP5
Supported CPU
Series
(1) AMD EPYC™ 9004 Series Processor
Thermal Design
Power Wattage
Max up to 400W* (cTDP)
Memory
Supported DIMM Qty
(24) DIMM slots
DIMM Type / Speed
RDDR5 4800 w/ ECC (1.1V) when 2DPC/1DPC / 3DS
RDDR5 4800 w/ ECC (1.1V) when 2DPC/1DPC
Capacity
Up to 3,072GB RDIMM/3DS RDIMM DDR5
4800/4400/4000 memory
Memory channel
12 Channels per CPU

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Memory voltage
1.1V
Expansion
Slots
PCIe
(1) PCI-E Gen.5 x8 slot / (2) PCI-E Gen.5 x16 slot
Pre-installed TYAN
Riser Card (PCIe
Gen.5)
(1) M7136T70-R24-2F riser card for for
(2) FH/HL PCIe 5.0 x16 slots /
(1) M7136T70-L28-1F riser card for for
(1) FH/HL PCIe 5.0 x8 slot
Others
(1) PCI-E Gen.5 x16 OCP 3.0 mezzanine slot
LAN
Q'ty / Port
(2) 10GbE ports + (1) GbE dedicated for IPMI
Controller
Intel X710-AT2
PHY
Realtek RTL8211F
Storage SATA
Connector
(2) SFF-TA-1016
Controller
Direct from AMD EPYC CPU
Speed
6Gb/s
RAID
N/A
Storage
NVMe
Connector (M.2)
(2) 22110/2280 (by PCIe Gen.5 interface)
Connector (U.2)
(3) SFF-TA-1016 (MCIO 8x) for (6) front NVMe
Graphic
Connector type
D-Sub 15-pin
Resolution
Up to 1920x1200
Chipset
Aspeed AST2600
I/O Ports
USB
(1) USB3.2 Gen.1 conn. (Type-A) /
(1) USB3.2 Gen.1 header /
(2) USB3.2 Gen.1 ports (@ front) /
(2) USB3.2 Gen.1 ports (@ rear)
COM
(1) DB-9 COM port
VGA
(1) D-Sub 15-pin port
RJ-45
(2) 10 GbE ports + (1) dedicated GbE for IPMI
Button
ID Button / Power Button / Reset Button
TPM
(Optional)
TPM Support
Please refer to our TPM supported list.
Interface
SPI
System
Monitoring
Chipset
Aspeed AST2600
Temperature
Monitors temperature for CPU & system environment
Voltage
Monitors voltage for CPU, memory, chipset & power
supply
LED
Over temperature warning indicator / Fan & PSU fail
LED indicator / Over voltage warning indicator
Others
Watchdog timer support
Server
Management
Onboard Chipset
Onboard Aspeed AST2600
AST2600 iKVM
Feature
24-bit high quality video compression / Supports
storage over IP and remote platform-flash / USB 2.0
virtual hub
AST2600 IPMI
Feature
IPMI 2.0 compliant baseboard management controller
(BMC) / 10/100/1000 Mb/s MAC interface
BIOS
Brand / ROM size
AMI / 64MB

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Feature
Hardware Monitor / FAN speed control automatic / Boot
from USB device/PXE via LAN/Storage / Console
Redirection / SMBIOS 3.3/PnP/Wake on LAN / ACPI
6.2 / ACPI sleeping states S0, S5
Operating
System
OS supported list
Please refer to our AVL support lists.
Regulation
FCC (SDoC)
Class A
CE (DoC)
Class A
CB/LVD
Yes
VCCI
Class A
C-Tick
Class A
Operating
Environment
Operating Temp.
10°C ~ 35°C (50°F~ 95°F)
Non-operating Temp.
- 40°C ~ 70°C (-40°F ~ 158°F)
In/Non-operating
Humidity 90
90%, non-condensing at 35°C
Package
Contains
Barebone
(1) TS70-B8056 Barebone
Manual
(1) Quick Installation Guide
RoHS
RoHS 6/6 Compliant
Yes
B8056T70V8E6HR Specifications
System
Form Factor
2U Rackmount
Chassis Model
TS70
Dimension (D x W x H)
27.56" x 17.26" x 3.42" (700 x 438.5 x 87mm)
Motherboard Name
S8056GME
Board Dimension
Prop. 14.18" x 12.16" (360.2 x 308.8mm)
Front Panel
Buttons
(1) ID / (1) PWR w/ LED / (1) RST
LEDs
(1) HDD / (1) ID / (2) LAN / (1) System Event
I/O Ports
(2) USB 3.2 Gen.1 ports
External
Drive Bay
Q'ty / Type
(2) 2.5" Hot-Swap NVMe HDD/SSDs / (12) 3.5"/2.5"
Hot-Swap HDD/SSDs w/ (4) NVMe
Front Drive Bay
Interface
(12) SATA 6Gb/s with (4) NVMe ports
Front HDD Backplane
Support
NVMe / SATA 6Gb/s
Rear Drive Bay
Interface
(2) NVMe
Rear HDD Backplane
Support
NVMe
System
FAN
(3) hot-swap 8056 fans
Redundancy
Yes

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Cooling
Configuration
Power Supply
Type
CRPS
Input Range
AC 100-127V/13A / AC 200-240V/7A
Frequency
50-60 Hz
Output Watts
1,000 Watts (100-127V AC input) / 1,200Watts
(200-240V AC input)
Efficiency
80 plus Platinum
Redundancy
1+1
Processor
Q'ty / Socket Type
(1) AMD Socket SP5
Supported CPU Series
(1) AMD EPYC™ 9004 Series Processor
Thermal Design Power
Wattage
Max up to 400W* (cTDP)
Memory
Supported DIMM Qty
(24) DIMM slots
DIMM Type / Speed
RDDR5 4800 w/ ECC (1.1V) when 2DPC/1DPC /
3DS RDDR5 4800 w/ ECC (1.1V) when 2DPC/1DPC
Capacity
Up to 3,072GB RDIMM/3DS RDIMM DDR5
4800/4400/4000 memory
Memory channel
12 Channels per CPU
Memory voltage
1.1V
Expansion
Slots
PCIe
(1) PCI-E Gen.5 x8 slot / (2) PCI-E Gen.5 x16 slot
Pre-installed TYAN
Riser Card (PCIe
Gen.5)
(1) M7136T70-R24-2F riser card for for (2) FH/HL
PCIe 5.0 x16 slots / (1) M7136T70-L28-1F riser card
for for (1) FH/HL PCIe 5.0 x8 slot
Others
(1) PCI-E Gen.5 x16 OCP 3.0 mezzanine slot
LAN
Q'ty / Port
(1) GbE dedicated for IPMI
PHY
Realtek RTL8211F
Storage SATA
Connector
(2) SFF-TA-1016
Controller
Direct from AMD EPYC CPU
Speed
6Gb/s
RAID
N/A
Storage
NVMe
Connector (M.2)
(2) 22110/2280 (by PCIe Gen.5 interface)
Connector (U.2)
(3) SFF-TA-1016 (MCIO 8x) for (6) front NVMe
Graphic
Connector type
D-Sub 15-pin
Resolution
Up to 1920x1200
Chipset
Aspeed AST2600
I/O Ports
USB
(1) USB3.2 Gen.1 conn. (Type-A) /
(1) USB3.2 Gen.1 header /
(2) USB3.2 Gen.1 ports (@ front) /
(2) USB3.2 Gen.1 ports (@ rear)
COM
(1) DB-9 COM port
VGA
(1) D-Sub 15-pin port

20
http://www.tyan.com
RJ-45
(1) GbE port dedicated for IPMI
Button
ID Button / Power Button / Reset Button
TPM
(Optional)
TPM Support
Please refer to our TPM supported list.
Interface
SPI
System
Monitoring
Chipset
Aspeed AST2600
Temperature
Monitors temperature for CPU & system environment
Voltage
Monitors voltage for CPU, memory, chipset & power
supply
LED
Over temperature warning indicator / Fan & PSU fail
LED indicator / Over voltage warning indicator
Others
Watchdog timer support
Server
Management
Onboard Chipset
Onboard Aspeed AST2600
AST2600 iKVM Feature
24-bit high quality video compression / Supports
storage over IP and remote platform-flash / USB 2.0
virtual hub
AST2600 IPMI Feature
IPMI 2.0 compliant baseboard management
controller (BMC) / 10/100/1000 Mb/s MAC interface
BIOS
Brand / ROM size
AMI / 64MB
Feature
Hardware Monitor / FAN speed control automatic /
Boot from USB device/PXE via LAN/Storage /
Console Redirection / SMBIOS 3.3/PnP/Wake on
LAN / ACPI 6.2 / ACPI sleeping states S0, S5
Operating
System
OS supported list
Please refer to our AVL support lists.
Regulation
FCC (SDoC)
Class A
CE (DoC)
Class A
CB/LVD
Yes
VCCI
Class A
C-Tick
Class A
Operating
Environment
Operating Temp.
10°C ~ 35°C (50°F~ 95°F)
Non-operating Temp.
- 40°C ~ 70°C (-40°F ~ 158°F)
In/Non-operating
Humidity 90
90%, non-condensing at 35°C
Package
Contains
Barebone
(1) TS70-B8056 Barebone
Manual
(1) Quick Installation Guide
RoHS
RoHS 6/6 Compliant
Yes
NOTE:
1. The specifications are subject to change without prior notice.
2. Please visit our website for the latest specifications.