LILY-W1 series - System integration manual
UBX-15027600 - R09 Contents Page 4 of 64
C1 - Public
2.6.3 Layout and manufacturing.............................................................................................................26
2.7 Module footprint and paste mask .........................................................................................................26
2.8 Thermal guidelines ...................................................................................................................................27
2.9 ESD guidelines ...........................................................................................................................................28
2.10 Design-in checklist....................................................................................................................................29
2.10.1 Schematic checklist.........................................................................................................................29
2.10.2 Layout checklist................................................................................................................................29
3Software ................................................................................................................................................ 30
3.1 Driver versions ...........................................................................................................................................30
3.2 Supported kernel versions ......................................................................................................................30
3.3 Driver and firmware architecture...........................................................................................................31
3.4 Compiling the drivers ...............................................................................................................................32
3.4.1 Prerequisites......................................................................................................................................32
3.4.2 Extracting the package content....................................................................................................32
3.4.3 Compile-time configuration............................................................................................................33
3.4.4 Building ...............................................................................................................................................33
3.5 Deploying the software ............................................................................................................................34
3.5.1 Blacklisting the mwifiex driver .......................................................................................................34
3.5.2 Additional software requirements ................................................................................................35
3.6 Loading the drivers ...................................................................................................................................35
3.6.1 SDIO driver .........................................................................................................................................35
3.6.2 USB driver...........................................................................................................................................36
3.6.3 Unloading the drivers.......................................................................................................................37
3.7 Reserving MAC addresses ......................................................................................................................37
3.8 Prevent high current in deep sleep........................................................................................................38
3.9 Configuration of transmit power limits................................................................................................38
3.9.1 Purpose ...............................................................................................................................................38
3.9.2 Transmit power limit configuration file format..........................................................................38
3.9.3 Applying the transmit power limit configuration.......................................................................39
3.10 Adaptivity configuration (Energy Detection) ......................................................................................40
3.11 Usage examples ........................................................................................................................................40
3.11.1 Wi-Fi access point mode .................................................................................................................40
3.11.2 Wi-Fi station mode ...........................................................................................................................41
3.12 The “iwconfig mlan0” command can be used to display parameters and statistics of the
wireless network interface.Driver debugging ..............................................................................................41
3.12.1 Compile-time debug options ..........................................................................................................42
3.12.2 Runtime debug options ...................................................................................................................42
4Handling and soldering ..................................................................................................................... 43
4.1 Packaging, shipping, storage and moisture preconditioning ..........................................................43
4.2 ESD handling precautions.......................................................................................................................43
4.3 Reflow soldering process.........................................................................................................................43
4.3.1 Cleaning ..............................................................................................................................................44
4.3.2 Other notes ........................................................................................................................................45
