NINA-W1 series - System Integration Manual
UBX-17005730 - R07 Page 4 of 47
3.1 Overview......................................................................................................................................................27
3.2 Supply interfaces ......................................................................................................................................27
3.2.1 Module supply (VCC) design...........................................................................................................27
3.2.2 Digital I/O interfaces reference voltage (VCC_IO) ......................................................................27
3.3 Antenna interface .....................................................................................................................................28
3.3.1 RF transmission line design (NINA-W101/W131/W151) ........................................................28
3.3.2 Antenna design (NINA-W101/W131/W151) ..............................................................................30
3.3.3 On-board antenna design (NINA-W102/W132/W152 only)....................................................33
3.4 Data communication interfaces ............................................................................................................34
3.4.1 Asynchronous serial interface (UART) design............................................................................34
3.4.2 Ethernet (RMII+SMI) ........................................................................................................................34
3.5 General High Speed layout guidelines ..................................................................................................34
3.5.1 General considerations for schematic design and PCB floor-planning .................................34
3.5.2 Module placement ............................................................................................................................35
3.5.3 Layout and manufacturing.............................................................................................................35
3.6 Module footprint and paste mask .........................................................................................................35
3.7 Thermal guidelines ...................................................................................................................................36
3.8 ESD guidelines ...........................................................................................................................................36
Handling and soldering ......................................................................................................................37
4.1 Packaging, shipping, storage and moisture preconditioning ..........................................................37
4.2 Handling ......................................................................................................................................................37
4.3 Soldering .....................................................................................................................................................37
4.3.1 Reflow soldering process ................................................................................................................37
4.3.2 Cleaning ..............................................................................................................................................38
4.3.3 Other remarks ...................................................................................................................................39
Approvals............................................................................................................................................... 40
5.1 General requirements ..............................................................................................................................40
5.2 FCC/IC End-product regulatory compliance........................................................................................40
5.2.1 NINA-W10 series FCC ID and IC certification number ..............................................................40
5.2.2 NINA-W13/W15 series FCC ID and IC certification number....................................................40
5.2.3 Antenna requirements ....................................................................................................................41
Product testing ................................................................................................................................... 42
6.1 u-blox In-Series production test.............................................................................................................42
6.2 OEM manufacturer production test .....................................................................................................42
6.2.1 “Go/No go” tests for integrated devices ......................................................................................43
Appendix ....................................................................................................................................................... 44
AGlossary ................................................................................................................................................. 44
Related documents ................................................................................................................................... 46
Revision history.......................................................................................................................................... 46
Contact...........................................................................................................................................................47
