NINA-W1 series - System integration manual
UBX-17005730 - R11 Contents Page 4 of 55
C1 - Public
2.8.3 Downloading the toolchain .............................................................................................................25
2.9Output power configuration ...................................................................................................................29
2.9.1 NINA-W10 series ..............................................................................................................................29
2.9.2 NINA-W13/W15 series ....................................................................................................................31
Design-in............................................................................................................................................. 32
3.1 Overview......................................................................................................................................................32
3.2 Supply interfaces ......................................................................................................................................32
3.2.1 Module supply (VCC) design...........................................................................................................32
3.2.2 Digital I/O interfaces reference voltage (VCC_IO)......................................................................32
3.3 Antenna interface.....................................................................................................................................33
3.3.1 RF transmission line design (NINA-W1x1)..................................................................................33
3.3.2 Antenna design (NINA-W1x1)........................................................................................................35
3.3.3 On-board antenna design ...............................................................................................................38
3.4 Data communication interfaces ............................................................................................................40
3.4.1 Asynchronous serial interface (UART) design............................................................................40
3.4.2 Ethernet (RMII+SMI) ........................................................................................................................40
3.5 General high-speed layout guidelines ..................................................................................................40
3.5.1 General considerations for schematic design and PCB floor-planning.................................41
3.5.2 Module placement ............................................................................................................................41
3.5.3 Layout and manufacturing.............................................................................................................41
3.6 Module footprint and paste mask .........................................................................................................41
3.7 Thermal guidelines ...................................................................................................................................42
3.8 ESD guidelines...........................................................................................................................................42
Handling and soldering................................................................................................................... 44
4.1 Packaging, shipping, storage and moisture preconditioning ..........................................................44
4.2 Handling......................................................................................................................................................44
4.3 Soldering .....................................................................................................................................................44
4.3.1 Reflow soldering process ................................................................................................................44
4.3.2 Cleaning ..............................................................................................................................................45
4.3.3 Other remarks ...................................................................................................................................46
Approvals............................................................................................................................................ 47
5.1 General requirements ..............................................................................................................................47
5.2 FCC/IC End-product regulatory compliance........................................................................................47
5.2.1 NINA-W10 series FCC ID and IC certification number..............................................................47
5.2.2 NINA-W13/W15 series FCC ID and IC certification number....................................................47
5.2.3 Antenna requirements ....................................................................................................................48
Product testing................................................................................................................................. 49
6.1 u-blox In-Series production test.............................................................................................................49
6.2 OEM manufacturer production test .....................................................................................................49
6.2.1 “Go/No go” tests for integrated devices ......................................................................................50
Appendix .................................................................................................................................................... 51
AGlossary .............................................................................................................................................. 51
Related documents ................................................................................................................................ 53
