Unicomp Labs Echo236F User manual
USER
Manual
USER
Manual
1.1.0 Edition 20161125
Quad Core Intel®Core™i7/i5/i3 w/C236 Fanless Embedded System
High Performance, Rugged, -40°C to 75°C Extended Temp.
Echo236F
ii
Version Date Page Description Remark
1.0 11/25/2016 All Ofcial Release
Record of Revision
iii
This manual is released by Unicomp Labs, Inc. for reference purpose only. All
product offerings and specications are subject to change without prior notice.
It does not represent commitment of Unicomp Labs, Inc. Unicomp shall not be liable
for direct, indirect, special, incidental, or consequential damages arising out of
the use of the product or documentation or any infringements upon the rights of
third parties, which may result from such use.
This equipment has been tested and found to comply with the limits for a Class
A digital device, pursuant to part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference when the
equipment is operated in a commercial environment. This equipment generates,
uses, and can radiate radio frequency energy, and if it is not installed and used
in accordance with the instruction manual, it may cause harmful interference to
radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference in which case the user will be required to correct
the interference at his own expense.
FCC
The products described in this manual complies with all applicable European
Union (CE) directives if it has a CE marking. For computer systems to
remain CE compliant, only CE-compliant parts may be used. Maintaining CE
compliance also requires proper cable and cabling techniques.
CE
This document contains proprietary information protected by copyright. No part
of this publication may be reproduced in any form or by any means, electric,
photocopying, recording or otherwise, without prior written authorization
by Unicomp Labs, Inc. The rights of all the brand names, product names, and
trademarks belong to their respective owners.
Disclaimer
Declaration of Conformity
Copyright and Trademarks
iv
Part Number Description
Echo-236F-G9 Echo-236F, 9 GigE LAN with 4 PoE+, M2DOM, 6 USB 3.0,
4 COM, 3 SIM, 16 Isolated DIO
Echo-236F-G9REcho-236F, 9 GigE LAN with 4 PoE+, 2 Front-access SSD Tray,
M2DOM, 6 USB 3.0, 4 COM, 3 SIM, Isolated DIO
Echo-236F-PoER Echo-236F, 6 GigE LAN with 4 PoE+, 2 Front-access SSD Tray,
M2DOM, 6 USB 3.0, 4 COM, 3 SIM, Isolated DIO
Echo-236F-PoE Echo-236F, 6 GigE LAN with 4 PoE+, M2DOM, 6 USB 3.0,
4 COM, 3 SIM, Isolated DIO
Echo-236F-G6 Echo-236F, 6 GigE LAN with 2 SFP, M2DOM, 6 USB 3.0,
4 COM, 3 SIM, 16 GPIO
Echo-236F-G6R Echo-236F, 6 GigE LAN with 2 SFP, 2 Front-access SSD Tray,
M2DOM, 6 USB 3.0, 4 COM, 3 SIM, 16 GPIO
Echo-236F-G4Echo-236F, 4 GigE LAN, M2DOM, 6 USB 3.0, 4 COM, 3 SIM,
16 GPIO
Echo-236F-G4R Echo-236F, 4 GigE LAN, 2 Front-access SSD Tray, M2DOM,
6 USB 3.0, 4 COM, 3 SIM, 16 GPIO
Echo-236F Echo-236F, 2 GigE LAN, M2DOM, 6 USB 3.0, 4 COM, 3 SIM,
16 GPIO
Echo-236FREcho-236F, 2 GigE LAN, 2 Front-access SSD Tray, M2DOM,
6 USB 3.0, 4 COM, 3 SIM, 16 GPIO
Order Information
v
Part Number Description
i7-6700 6th Gen Intel® Core™ i7-6700 Processor
(8M Cache, up to 4.00 GHz)
i7-6700TE 6th Gen Intel® Core™ i7-6700TE Processor
(8M Cache, up to 3.40 GHz)
i5-6500 6th Gen Intel® Core™ i5-6500 Processor
(6M Cache, up to 3.60 GHz)
i5-6500TE 6th Gen Intel® Core™ i5-6500TE Processor
(6M Cache, up to 3.30 GHz)
i3-6100 6th Gen Intel® Core™ i3-6100 Processor
(3M Cache, 3.70 GHz)
i3-6100TE 6th Gen Intel® Core™ i3-6100TE Processor
(4M Cache, 2.70 GHz)
DDR4 16G Certied DDR4 16GB 2133MHz RAM
DDR4 8G Certied DDR4 8GB 2133MHz RAM
DDR4 4G Certied DDR4 4GB 2133MHz RAM
PS-280W-WT 280W, 24V, 85V AC to 264V AC Power Adaptor with 3-pin
Terminal Block, Wide Temperature -30°C to +70°C
PS-160W-WT 160W, 24V, 85V AC to 264V AC Power Adaptor with 3-pin
Terminal Block, Wide Temperature -30°C to +70°C
PS-120W 120W, 24V, 90V AC to 264V AC Power Adapter with 4-pin
Mini-DIN Connector
VESA Mount VESA Mounting Kit
DIN-RAIL DIN Rail Kit
Rack Mount 2U Rackmount Kit
TB-20P-100 Terminal Block 20-pin to Terminal Block 20-pin Cable, 100cm
TB-20P-500 Terminal Block 20-pin to Terminal Block 20-pin Cable, 500cm
TB-TMBK-20P Terminal Board with One 20-pin Terminal Block Connector
and DIN-Rail Mounting
3G Module Mini PCIe 3G/GPS Module with Antenna
4G Module Mini PCIe 4G/GPS Module with Antenna
WiFi & Bluetooth
Module Intel® Mini PCIe WiFi & Bluetooth Module with Antenna
Order Accessories
vi
Table of Contents
CHAPTER 1 GENERAL INTRODUCTION 1
1.1 Overview 1
1.2 Features 2
1.3 Product Specication 2
1.3.1 Specications of Echo-236F-G9 2
1.3.2 Specications of Echo-236F-G9R 4
1.3.3 Specications of Echo-236F-PoER 7
1.3.4 Specications of Echo-236F-PoE 9
1.3.5 Specications of Echo-236F-G6 11
1.3.6 Specications of Echo-236F-G6R 13
1.3.7 Specications of Echo-236F-G4 16
1.3.8 Specications of Echo-236F-G4R 18
1.3.9 Specications of Echo-236F 20
1.3.10 Specications of Echo-236FR 22
1.4 Supported CPU List 24
1.5 Mechanical Dimension 24
1.5.1 Dimensions of Echo-236F-G9 24
1.5.2 Dimensions of Echo-236F-G9R 24
1.5.3 Dimensions of Echo-236F-PoER 25
1.5.4 Dimensions of Echo-236F-PoE 25
1.5.5 Dimensions of Echo-236F-G6 25
1.5.6 Dimensions of Echo-236F-G6R 26
1.5.7 Dimensions of Echo-236F-G4 26
1.5.8 Dimensions of Echo-236F-G4R 26
1.5.9 Dimensions of Echo-236F 27
1.5.10 Dimensions of Echo-236FR 27
CHAPTER 2 GETTING TO KNOW YOUR Echo-236F 28
2.1 Packing List 28
2.2 Front Panel I/O Functions 29
2.3 Rear Panel I/O and Functions 36
2.4 Main Board Expansion Connectors 41
vii
2.5 Main Board Jumper & Deep Switch Settings 53
2.6 Ignition Control 56
CHAPTER 3 SYSTEM SETUP 59
3.1 How to Open Your Echo-236F 59
3.2 Installing CPU 63
3.3 Installing DDR4 SO-DIMM Modules 66
3.4 Installing Mini PCIe Card 67
3.5 Installing Antenna Cable 68
3.6 Installing CFast Card 69
3.7 Installing SIM Card 71
3.8 Installing SSD/ HDD 73
3.9 Installing M2DOM 77
3.10Mounting Your Echo-236F 79
CHAPTER 4 BIOS SETUP 85
4.1 BIOS Settings 85
4.2 Main 86
4.3 Advanced 86
4.4 Chipset 95
4.5 Security 100
4.6 Boot 101
4.7 Save & Exit 102
APPENDIX A : Isolated DIO Guide 103
APPENDIX B : GPIO-WDT Functions 108
APPENDIX C : RAID Functions 109
APPENDIX D : Power Consumption 113
APPENDIX E : Supported Memory & Storage List 117
1
GENERAL INTRODUCTION
1
GENERAL INTRODUCTION
EFKR) Series is an all-in-one integrated Fanless Embedded
Workstation System. LGA1151 Socket supports Quad Core 6th Generation
Intel® Xeon®/ Core™ i7/i5/i3 processor (Skylake-S) running with workstation-
grade Intel® C236 chipset, dual channel DDR4 2133MHz up to 32GB ECC
memory, advanced Intel® HD Graphics 530 supporting DirectX 12, OpenGL 4.4
and OpenCL 2.0 API, onboard DVI-I, DVI-D and DisplayPort display interface
for Ultra HD 4K resolution, Echo-236F offers new generation CPU performance,
power efciency, and graphics performance; PCIe 3.0 (8GT/s), Multiple SATA III
(6Gbps), USB 3.0 (5Gbps), PoE (1Gbps) LAN and multiple wireless connections
make seamless high-speed data conveying possible. Echo-236F Series
Fanless Embedded System delivers outstanding system performance and
power productivity for demanding workloads in real-time mission critical
embedded computing applications.
All-in-one and cable-less designs, fanless -40°C to 75°C operating temperature,
6 GigE LAN ports with 4 IEEE 802.3at (25.5W/ 48V) PoE+ without additional
power connections, 2 Front-access 2.5” SSD/ HDD trays, up to 6 SIM card
sockets for 3G/ 4G/ LTE/ WiFi/ GPRS/ UMTS, 1 M2DOM socket for up to 8GT
per second data transfer, 1 Front-access CFast socket, 2 SATA III supports
software RAID function, 6 external USB 3.0, 4 COM RS-232/ 422/ 485, up to
6 Mini PCIe expansions, 16 Isolated DIO, 6V to 36V wide range power input
with 80V surge protection, configurable ignition power control, smart remote
management features, remote power switch, EN50155 and EN50121-3-2
compliant, optional supports full function SUMIT A, B expansion for multiple
10G LAN/ 10G SPF+ Fiber connections, Echo-236F Series Fanless
Embedded System serves new-generation integration for rugged embedded
applications.
With outstanding system performance, leading integrated features, smart
manageability, flexible expandability, excellent mobile availability, secure
power protection and more rugged reliability, Echo-236F Series Fanless
Embedded System is your superb solution for Machine Vision, Intelligent
Automation, Smart Manufacturing, Embedded Cloud, Intelligent Surveillance,
Vehicle Computing, Mobile Robot Control, and any performance-driven real-time
Industry 4.0 applications in harsh environments.
1.1 Overview
2
GENERAL INTRODUCTION
©Echo-236F User Manual
1.2 Features
• LGA 1151 Socket supports Quad Core 6th Generation
Intel® Core™ i7/i5/i3 Processor (Skylake-S) with Intel® C236 Chipset
• Fanless, -40°C to 75°C Operating Temperature
• 2 DDR4 2133MHz Memory, up to 32GB
• Up to 9 GigE LAN with 4 IEEE 802.3at PoE+, iAMT 11.0 supported (Optional)
• 6 Independent GigE LAN with 2 SFP, iAMT 11.0 supported (Optional)
• DVI-I, DVI-D and DisplayPort display interface, up to 4K display
• 3 Mini PCIe Slot, 4 COM, 6 USB 3.0
• 3 External SIM Card Socket support 3G/ 4G/ LTE/ WiFi/ GPRS/ UMTS
• M2DOM supports up to 8GT/s data rate
• Up to 2 Front-access 2.5" HDD/ SSD Tray, 1 Front-access CFast Socket
• Full function SUMIT A, B expansion (Optional)
• 16 Isolated DIO (Optional)
• 6V to 36V DC Power Input with 80V Surge Protection
• Configurable Ignition Power Control
1.3 Product Specication
1.3.1 Specications of Echo-236F-G9
System
Processor Intel® Core™ i7-6700/ i7-6700TE/ i5-6500/ i5-6500TE/
i3-6100/ i3-6100TE Processor (Skylake-S)
Chipset Intel® C236
BIOS AMI
SIO IT8786E
Memory • DDR4 2133MHz
• Up to 32GB
• 2 260-pin SO-DIMM Socket
I/O Interface
Serial 4 COM RS-232/ 422/ 485 w/ auto flow control
USB • 6 USB 3.0 (External)
• 1 USB 2.0 (Internal)
Isolated DIO 16 Isolated DIO (8 DI, 8 DO)
LED Power, HDD, Wireless, PoE
SIM Card 3 SIM Card Socket (External)
3
GENERAL INTRODUCTION
Expansion
Mini PCIe 3 Mini PCIe Socket :
• 2 Full-size for PCIe/ USB/ External SIM Card/ mSATA
• 1 Half-size for PCIe/ USB 3.0/ External SIM Card
Graphics
Graphics Processor Intel® HD Graphics 530
Interface • DVI-I : Up to 1920 x 1200 @ 60Hz
• DVI-D : Up to 1920 x 1200 @ 60Hz
• DisplayPort : Up to 4096 x 2304 @ 60Hz
Storage
SATA 2 SATA III (6Gbps)
mSATA 2 SATA III (Mini PCIe Type, 6Gbps)
SATA DOM 1 SATA II (3Gbps)
M2DOM 1 PCIe 3.0 (8GT/s)/ SATA III (6Gbps)
Storage Device • 1 CFast Socket, Push-in/ Push-out Ejector
• 2 2.5” SSD/ HDD Bracket (Internal)
Audio
Audio Codec Realtek ALC892, 5.1 Channel HD Audio
Audio Interface 1 Mic-in, 1 Line-out
Ethernet
LAN 1 Intel® I219LM GigE LAN supports iAMT 11.0
LAN 2 Intel® I210 GigE LAN
LAN 3 Intel® I210 GigE LAN
LAN 4 Intel® I210 GigE LAN
LAN 5 Intel® I210 GigE LAN
LAN 6 Intel® I210 GigE LAN
PoE
LAN 3 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
LAN 4 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
LAN 5 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
LAN 6 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
Power
Input Voltage 6V to 36V, DC-in
Power Interface • 3-pin Terminal Block : V+, V-, Frame Ground
• Mini-DIN 4-pin
Ignition Control 16 Mode (Internal)
Remote Switch 3-pin Terminal Block : On, Off, IGN
Surge Protection Up to 80V/1ms Transient Power
4
GENERAL INTRODUCTION
©Echo-236F User Manual
Others
TPM Optional Inneon SLB9665 supports TPM 2.0, LPC
interface
Watchdog Timer Reset : 1 to 255 sec./min. per step
Smart Management Wake on LAN, PXE supported
HW Monitor Monitoring temperature, voltages. Auto throttling control
when CPU overheats.
Software Support
OS Windows 10, Windows 8.1, Windows 7, Linux
Mechanical
Dimensions (WxDxH) 260mm x 175mm x 79mm (10.24" x 6.89" x 3.11")
Weight 3.8 kg (8.38 lb)
Mounting • Wallmount by mounting bracket
• DIN Rail Mount (Optional)
• 2U Rackmount (Optional)
Environment
Operating Temperature • 35W TDP CPU (i7-6700TE, i5-6500TE, i3-6100TE) :
-40°C to 75°C (-40°F to 167°F)
• 65W TDP CPU (i7-6700/ i5-6500/ i3-6100) :
-40°C to 55°C (-40°F to 131°F)
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% at 70°C
Shock • IEC 60068-2-27
• SSD : 50G @ Wallmount, Half-sine, 11ms
Vibration • IEC 60068-2-64
• SSD : 5Grms, 5Hz to 500Hz, 3 Axis
EMC CE, FCC, EN50155, EN50121-3-2
1.3.2 Specications of Echo-236F-G9R
System
Processor Intel® Core™ i7-6700/ i7-6700TE/ i5-6500/ i5-6500TE/
i3-6100/ i3-6100TE Processor (Skylake-S)
Chipset Intel® C236
BIOS AMI
SIO IT8786E
5
GENERAL INTRODUCTION
Memory • DDR4 2133MHz
• Up to 32GB
• 2 260-pin SO-DIMM Socket
I/O Interface
Serial 4 COM RS-232/ 422/ 485 w/ auto flow control
USB • 6 USB 3.0 (External)
• 1 USB 2.0 (Internal)
Isolated DIO 16 Isolated DIO (8 DI, 8 DO)
LED Power, HDD, Wireless, PoE
SIM Card 3 SIM Card Socket (External)
Expansion
Mini PCIe 3 Mini PCIe Socket :
• 2 Full-size for PCIe/ USB/ External SIM Card/ mSATA
• 1 Half-size for PCIe/ USB 3.0/ External SIM Card
Graphics
Graphics Processor Intel® HD Graphics 530
Interface • DVI-I : Up to 1920 x 1200 @ 60Hz
• DVI-D : Up to 1920 x 1200 @ 60Hz
• DisplayPort : Up to 4096 x 2304 @ 60Hz
Storage
SATA 2 SATA III (6Gbps)
mSATA 2 SATA III (Mini PCIe Type, 6Gbps)
SATA DOM 1 SATA II (3Gbps)
M2DOM 1 PCIe 3.0 (8GT/s)/ SATA III (6Gbps)
Storage Device • 1 CFast Socket, Push-in/ Push-out Ejector
• 2 Front-access 2.5" SSD/ HDD Tray
Audio
Audio Codec Realtek ALC892, 5.1 Channel HD Audio
Audio Interface 1 Mic-in, 1 Line-out
Ethernet
LAN 1 Intel® I219LM GigE LAN supports iAMT 11.0
LAN 2 Intel® I210 GigE LAN
LAN 7 Intel® 82574L GigE LAN
LAN 8 Intel® 82574L GigE LAN
LAN 9 Intel® 82574L GigE LAN
PoE
LAN 3 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
LAN 4 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
6
GENERAL INTRODUCTION
©Echo-236F User Manual
LAN 5 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
LAN 6 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
Power
Input Voltage 6V to 36V, DC-in
Power Interface • 3-pin Terminal Block : V+, V-, Frame Ground
• Mini-DIN 4-pin
Ignition Control 16 Mode (Internal)
Remote Switch 3-pin Terminal Block : On, Off, IGN
Surge Protection Up to 80V/1ms Transient Power
Others
TPM Optional Inneon SLB9665 supports TPM 2.0, LPC
interface
Watchdog Timer Reset : 1 to 255 sec./min. per step
Smart Management Wake on LAN, PXE supported
HW Monitor Monitoring temperature, voltages. Auto throttling control
when CPU overheats.
Software Support
OS Windows 10, Windows 8.1, Windows 7, Linux
Mechanical
Dimensions (WxDxH) 260mm x 175mm x 79mm (10.24" x 6.89" x 3.11")
Weight 3.8 kg (8.38 lb)
Mounting • Wallmount by mounting bracket
• DIN Rail Mount (Optional)
• 2U Rackmount (Optional)
Environment
Operating Temperature • 35W TDP CPU (i7-6700TE, i5-6500TE, i3-6100TE) :
-40°C to 75°C (-40°F to 167°F)
• 65W TDP CPU (i7-6700/ i5-6500/ i3-6100) :
-40°C to 55°C (-40°F to 131°F)
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% at 70°C
Shock • IEC 60068-2-27
• SSD : 50G @ Wallmount, Half-sine, 11ms
Vibration • IEC 60068-2-64
• SSD : 5Grms, 5Hz to 500Hz, 3 Axis
EMC CE, FCC, EN50155, EN50121-3-2
7
GENERAL INTRODUCTION
1.3.3 Specications of Echo-236F-PoER
System
Processor Intel® Core™ i7-6700/ i7-6700TE/ i5-6500/ i5-6500TE/
i3-6100/ i3-6100TE Processor (Skylake-S)
Chipset Intel® C236
BIOS AMI
SIO IT8786E
Memory • DDR4 2133MHz
• Up to 32GB
• 2 260-pin SO-DIMM Socket
I/O Interface
Serial 4 COM RS-232/ 422/ 485 w/ auto flow control
USB • 6 USB 3.0 (External)
• 1 USB 2.0 (Internal)
Isolated DIO 16 Isolated DIO (8 DI, 8 DO)
LED Power, HDD, Wireless, PoE
SIM Card 3 SIM Card Socket (External)
Expansion
Mini PCIe 3 Mini PCIe Socket :
• 2 Full-size for PCIe/ USB/ External SIM Card/ mSATA
• 1 Half-size for PCIe/ USB 3.0/ External SIM Card
SUMIT A, B 2 SUMIT Slot (Optional)
Graphics
Graphics Processor Intel® HD Graphics 530
Interface • DVI-I : Up to 1920 x 1200 @ 60Hz
• DVI-D : Up to 1920 x 1200 @ 60Hz
• DisplayPort : Up to 4096 x 2304 @ 60Hz
Storage
SATA 2 SATA III (6Gbps)
mSATA 2 SATA III (Mini PCIe Type, 6Gbps)
SATA DOM 1 SATA II (3Gbps)
M2DOM 1 PCIe 3.0 (8GT/s)/ SATA III (6Gbps)
Storage Device • 1 CFast Socket, Push-in/ Push-out Ejector
• 2 Front-access 2.5" SSD/ HDD Tray
Audio
Audio Codec Realtek ALC892, 5.1 Channel HD Audio
Audio Interface 1 Mic-in, 1 Line-out
8
GENERAL INTRODUCTION
©Echo-236F User Manual
Ethernet
LAN 1 Intel® I219LM GigE LAN supports iAMT 11.0
LAN 2 Intel® I210 GigE LAN
PoE
LAN 3 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
LAN 4 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
LAN 5 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
LAN 6 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
Power
Input Voltage 6V to 36V, DC-in
Power Interface • 3-pin Terminal Block : V+, V-, Frame Ground
• Mini-DIN 4-pin
Ignition Control 16 Mode (Internal)
Remote Switch 3-pin Terminal Block : On, Off, IGN
Surge Protection Up to 80V/1ms Transient Power
Others
TPM Optional Inneon SLB9665 supports TPM 2.0, LPC
interface
Watchdog Timer Reset : 1 to 255 sec./min. per step
Smart Management Wake on LAN, PXE supported
HW Monitor Monitoring temperature, voltages. Auto throttling control
when CPU overheats.
Software Support
OS Windows 10, Windows 8.1, Windows 7, Linux
Mechanical
Dimensions (WxDxH) 260mm x 175mm x 79mm (10.24" x 6.89" x 3.11")
Weight 3.8 kg (8.38 lb)
Mounting • Wallmount by mounting bracket
• DIN Rail Mount (Optional)
• 2U Rackmount (Optional)
Environment
Operating Temperature • 35W TDP CPU (i7-6700TE, i5-6500TE, i3-6100TE) :
-40°C to 75°C (-40°F to 167°F)
• 65W TDP CPU (i7-6700/ i5-6500/ i3-6100) :
-40°C to 55°C (-40°F to 131°F)
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% at 70°C
9
GENERAL INTRODUCTION
Shock • IEC 60068-2-27
• SSD : 50G @ Wallmount, Half-sine, 11ms
Vibration • IEC 60068-2-64
• SSD : 5Grms, 5Hz to 500Hz, 3 Axis
EMC CE, FCC, EN50155, EN50121-3-2
1.3.4 Specications of Echo-236F-PoE
System
Processor Intel® Core™ i7-6700/ i7-6700TE/ i5-6500/ i5-6500TE/
i3-6100/ i3-6100TE Processor (Skylake-S)
Chipset Intel® C236
BIOS AMI
SIO IT8786E
Memory • DDR4 2133MHz
• Up to 32GB
• 2 260-pin SO-DIMM Socket
I/O Interface
Serial 4 COM RS-232/ 422/ 485 w/ auto flow control
USB • 6 USB 3.0 (External)
• 1 USB 2.0 (Internal)
Isolated DIO 16 Isolated DIO (8 DI, 8 DO)
LED Power, HDD, Wireless, PoE
SIM Card 3 SIM Card Socket (External)
Expansion
Mini PCIe 3 Mini PCIe Socket :
• 2 Full-size for PCIe/ USB/ External SIM Card/ mSATA
• 1 Half-size for PCIe/ USB 3.0/ External SIM Card
SUMIT A, B 2 SUMIT Slot (Optional)
Graphics
Graphics Processor Intel® HD Graphics 530
Interface • DVI-I : Up to 1920 x 1200 @ 60Hz
• DVI-D : Up to 1920 x 1200 @ 60Hz
• DisplayPort : Up to 4096 x 2304 @ 60Hz
Storage
SATA 2 SATA III (6Gbps)
mSATA 2 SATA III (Mini PCIe Type, 6Gbps)
SATA DOM 1 SATA II (3Gbps)
10
GENERAL INTRODUCTION
©Echo-236F User Manual
M2DOM 1 PCIe 3.0 (8GT/s)/ SATA III (6Gbps)
Storage Device • 1 CFast Socket, Push-in/ Push-out Ejector
• 2 2.5" SSD/ HDD Bracket (Internal)
Audio
Audio Codec Realtek ALC892, 5.1 Channel HD Audio
Audio Interface 1 Mic-in, 1 Line-out
Ethernet
LAN 1 Intel® I219LM GigE LAN supports iAMT 11.0
LAN 2 Intel® I210 GigE LAN
PoE
LAN 3 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
LAN 4 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
LAN 5 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
LAN 6 GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I210
Power
Input Voltage 6V to 36V, DC-in
Power Interface • 3-pin Terminal Block : V+, V-, Frame Ground
• Mini-DIN 4-pin
Ignition Control 16 Mode (Internal)
Remote Switch 3-pin Terminal Block : On, Off, IGN
Surge Protection Up to 80V/1ms Transient Power
Others
TPM Optional Inneon SLB9665 supports TPM 2.0, LPC
interface
Watchdog Timer Reset : 1 to 255 sec./min. per step
Smart Management Wake on LAN, PXE supported
HW Monitor Monitoring temperature, voltages. Auto throttling control
when CPU overheats.
Software Support
OS Windows 10, Windows 8.1, Windows 7, Linux
Mechanical
Dimensions (WxDxH) 260mm x 175mm x 79mm (10.24" x 6.89" x 3.11")
Weight 3.8 kg (8.38 lb)
Mounting • Wallmount by mounting bracket
• DIN Rail Mount (Optional)
• 2U Rackmount (Optional)
11
GENERAL INTRODUCTION
Environment
Operating Temperature • 35W TDP CPU (i7-6700TE, i5-6500TE, i3-6100TE) :
-40°C to 75°C (-40°F to 167°F)
• 65W TDP CPU (i7-6700/ i5-6500/ i3-6100) :
-40°C to 55°C (-40°F to 131°F)
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% at 70°C
Shock • IEC 60068-2-27
• SSD : 50G @ Wallmount, Half-sine, 11ms
Vibration • IEC 60068-2-64
• SSD : 5Grms, 5Hz to 500Hz, 3 Axis
EMC CE, FCC, EN50155, EN50121-3-2
1.3.5 Specications of Echo-236F-G6
System
Processor Intel® Core™ i7-6700/ i7-6700TE/ i5-6500/ i5-6500TE/
i3-6100/ i3-6100TE Processor (Skylake-S)
Chipset Intel® C236
BIOS AMI
SIO IT8786E
Memory • DDR4 2133MHz
• Up to 32GB
• 2 260-pin SO-DIMM Socket
I/O Interface
Serial 4 COM RS-232/ 422/ 485 w/ auto flow control
USB • 6 USB 3.0 (External)
• 1 USB 2.0 (Internal)
Isolated DIO 16 Isolated DIO (8 DI, 8 DO)
LED Power, HDD, Wireless
SIM Card 3 SIM Card Socket (External)
Expansion
Mini PCIe 3 Mini PCIe Socket :
• 2 Full-size for PCIe/ USB/ External SIM Card/ mSATA
• 1 Half-size for PCIe/ USB 3.0/ External SIM Card
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GENERAL INTRODUCTION
©Echo-236F User Manual
Graphics
Graphics Processor Intel® HD Graphics 530
Interface • DVI-I : Up to 1920 x 1200 @ 60Hz
• DVI-D : Up to 1920 x 1200 @ 60Hz
• DisplayPort : Up to 4096 x 2304 @ 60Hz
Storage
SATA 2 SATA III (6Gbps)
mSATA 2 SATA III (Mini PCIe Type, 6Gbps)
SATA DOM 1 SATA II (3Gbps)
M2DOM 1 PCIe 3.0 (8GT/s)/ SATA III (6Gbps)
Storage Device • 1 CFast Socket, Push-in/ Push-out Ejector
• 2 2.5" SSD/ HDD Bracket (Internal)
Audio
Audio Codec Realtek ALC892, 5.1 Channel HD Audio
Audio Interface 1 Mic-in, 1 Line-out
Ethernet
LAN 1 Intel® I219LM GigE LAN supports iAMT 11.0
LAN 2 Intel® I210 GigE LAN
LAN 3 Intel® I210 GigE LAN
LAN 4 Intel® I210 GigE LAN
LAN 5 Intel® I350 GigE LAN supports SFP+
LAN 6 Intel® I350 GigE LAN supports SFP+
Power
Input Voltage 6V to 36V, DC-in
Power Interface • 3-pin Terminal Block : V+, V-, Frame Ground
• Mini-DIN 4-pin
Ignition Control 16 Mode (Internal)
Remote Switch 3-pin Terminal Block : On, Off, IGN
Surge Protection Up to 80V/1ms Transient Power
Others
TPM Optional Inneon SLB9665 supports TPM 2.0, LPC
interface
Watchdog Timer Reset : 1 to 255 sec./min. per step
Smart Management Wake on LAN, PXE supported
HW Monitor Monitoring temperature, voltages. Auto throttling control
when CPU overheats.
13
GENERAL INTRODUCTION
Software Support
OS Windows 10, Windows 8.1, Windows 7, Linux
Mechanical
Dimensions (WxDxH) 260mm x 175mm x 79mm (10.24" x 6.89" x 3.11")
Weight 3.8 kg (8.38 lb)
Mounting • Wallmount by mounting bracket
• DIN Rail Mount (Optional)
• 2U Rackmount (Optional)
Environment
Operating Temperature • 35W TDP CPU (i7-6700TE, i5-6500TE, i3-6100TE) :
-40°C to 75°C (-40°F to 167°F)
• 65W TDP CPU (i7-6700/ i5-6500/ i3-6100) :
-40°C to 55°C (-40°F to 131°F)
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% at 70°C
Shock • IEC 60068-2-27
• SSD : 50G @ Wallmount, Half-sine, 11ms
Vibration • IEC 60068-2-64
• SSD : 5Grms, 5Hz to 500Hz, 3 Axis
EMC CE, FCC, EN50155, EN50121-3-2
1.3.6 Specications of Echo-236F-G6R
System
Processor Intel® Core™ i7-6700/ i7-6700TE/ i5-6500/ i5-6500TE/
i3-6100/ i3-6100TE Processor (Skylake-S)
Chipset Intel® C236
BIOS AMI
SIO IT8786E
Memory • DDR4 2133MHz
• Up to 32GB
• 2 260-pin SO-DIMM Socket
This manual suits for next models
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Table of contents
