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Contents
1INTRODUCTION .............................................................................. 1
1.1 OVERVIEW.................................................................................................................................. 1
1.2 KEY FEATURES ........................................................................................................................... 2
1.3 INTERFACE ................................................................................................................................. 3
2PRODUCT INSTALLATION............................................................... 3
2.1 INSTALLATION PREPARATION....................................................................................................... 3
2.2 HARDWARE INSTALLATION .......................................................................................................... 4
3TECHNICAL SPECIFICATIONS......................................................... 5
3.1 ELECTRICAL SPECIFICATIONS....................................................................................................... 5
3.2 OPERATION CONDITION............................................................................................................... 5
3.3 DIMENSIONS .............................................................................................................................. 5
3.4 PIN DEFINITION(TOP VIEW).................................................................................................... 6
3.5 PCB PACKAGING........................................................................................................................ 7
4HARDWARE DESIGN........................................................................ 8
4.1 DESIGN IN CONSIDERATIONS........................................................................................................ 8
4.2 AVOID POWER CONNECTION ........................................................................................................ 9
4.3 ANTENNA................................................................................................................................... 9
4.4 SERIAL PORT ...........................................................................................................................10
5DISASSEMBLY .............................................................................. 10
6PACKAGE ..................................................................................... 11
6.1 PRODUCT LABEL DESCRIPTION ..................................................................................................11
6.2 PACKAGE DESCRIPTION.............................................................................................................11
7CLEAN .......................................................................................... 12
8REFLOW SOLDERING .................................................................... 13