Vertex V100 series User manual

...
"V!OO
SERIES
OEM/MAINTENANCE
MANUAL
.~
VERTEX
QUIETLYBUILDING THE BEST
Copyright ©1984 Venex Peripherals

-

TABLE OF CONTENTS
PAGE
1INTRODUCTION
1.1 GENERAL DESCRIPTION " 1
1.2 SPECIFICATION SUMMARY 2
1.2.1 Physical Specifications 2
1.2.2 Functional Specifications 3
1.2.3 Reliability Specifications 4
1.2.4 Disk Defects 4
2FUNCTIONAL CHARACTERISTICS/OVERVIEW
~.2.1
GENERAL OPERATION 5
2.2 READ/WRITE, SERVO
AND
CONTROL ELECTRONICS " 5
2.3 DRIVE MECHANISM 6
2.4 AIR FILTRATION SYSTEM ....
..
..
. .
..
..
..
. .
.. ..
..
..
. .
..
.
....
.
....
..
..
6
2.5 POSITIONING MECHANISM 7
2.6 READ/WRITE HEADS
AND
DISKS " 8
2.7 SERVO SYSTEM 8
3FUNCTIONAL OPERATIONS
3.1 POWER SEQUENCING 9
3.2 DRIVE SELECTION
10
3.3 TRACK ACCESSING
10
3.4 HEAD SELECTION
10
3.5 READ OPERATION
10
3.6 WRITE OPERATIONS .
.. ..
...
..
.......
....
. . . . . .
..
..
.
.. ..
. .
..
. .
..
.
..
. .
11
3.7 SYSTEM INTEGRATION CONSIDERATIONS
11
iii

4THEORY OF OPERATION
4.1 OVERVIEW "
12
4.2 HEAD-DISK ASSEMBLY
12
4.2.1 Actuator
13_
4.2.2 Recording Media
13
4.2.3 Read/Write Heads
_.
........................................
..
13
4.2.4 Read Preamplifier/Write Driver IC
14
4.2.5 Servo Head
14
4.2.6 Servo Preamplifier IC
15
4.2.7 Spindle Motor
15
4.2.8 Air Filtration Components
15
4.3 SERVO PCB
15
4.3.1 Actuator Lock Driver
15
4.3.2 Clock Generator
15
4.3.3 Spindle Speed Control
16
4.3.4 Spindle Speed Checker
16
4.3.5 Spindle Motor Brake Relay and Relay Driver
16
4.3.6 Actuator Servo Control
16
4.3.7 Demodulator
17
4.3.8 Mode Select Switch
18
4.3.9 Seek Mode "
18
4.3.10 Velocity DAC
18
4.3.11 Tachometer
18
4.3.12 Slope Selector
18
4.3.13 Current Inverter
18
4.3.14 On-Peak Detector -
..
19
4.3.15 Power Amplifier
19
4.3.16 Inverter
19
4.3.17 Track Follow Mode
..
,
19
4.3.18 Off-Track Detector
19
4.3.19 Seek Operation
19
4.3.20 Restore to Track 0Operation 20
4.3.21 Power On Reset 20
4.4
DATA
PCB 20
4.4.1 Microprocessor and PLA
21
4.4.2 Microprocessor/PLA Control Signals
21
4.4.3 Disk Drive Control Functions
21
4.4.4 Input Buffers
22
4.4.5 Output Drivers .................................................
..
22
4.4.6 Disk Drive Data Functions
22
4.4.7 Read/Write Data Channel ........................................
..
22
4.4.8 Head Select and Control Logic
22
4.4.9 Read Chain
23
4.4.10 Amplifier/Signal Conditioner
23
jv
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- I
./

4.5
4.6
4.7
404.11
Differential Line Driver
23
4.4.12 Write Chain ,
23
404.13 Line Receiver 24
404.14
Transition Generator
24
404.15
Write Current Source 24
4.4.16 Write Fault Detector
:.
24
OPERATIONAL SEQUENCE . . . .
..
24
4.5.1 Power On Reset '
•....
25
4.5.2 Motor Start
25
4.5.3 Actuator Lock 26
4.5.4 Servo Restore to Track 026
4.5.5 Seek Operation
26
4.5.6 Track Format
28
4.5.6.1 Gap 1
28
4.5.6.2 Gap 2
28
4.5.6.3 Gap 329
4.5.6.4 Gap 4
29
4.5.6.5 Sector Interleaving 29
4.5.7 Read Operation/Head Select
31
4.5.8 Write Operation/Fault Detection 32
ERROR
DEFINITION 34
4.6.1 Soft (Recoverable) Errors 34
4.6.2 Hard (Non-Recoverable) Errors 34
4.6.3 Seek (Access Position) Errors 34
DRIVE OPERATION
FLOW
CHART
35
5ELECTRICAL INTERFACE
5.1 ELECTRICAL INTERFACE OVERVIEW 39
5.2 CONTROL INPUT LINES 44
5.2.1 Write Gate 44
5.2.2 Head Select 2°,
2',
and 22
••••••••••••••••••••••••••••••••••••••
45
5.2.3 Direction In
45
5.2.4 Step 45
5.2.5 Drive Select
1-4
46
5.3 CONTROL OUTPUT LINES 46
5.3.1 Seek Complete 47
5.3.2 Track 047
5.3.3 Write Fault 47
5.3.4 Index 48
5.3.5 Ready 49
5.4
DATA
TRANSFER LINES ;49
504.1
MFM
Write Data 50
504.2
MFM Read Data 50
504.3
Read/Write Timing "50
v

5.5
DRIVE SELECTED
51
5.6
CUS'fOMER OP'fIONS
51
5.6.1Radial
and
Select
51
5.6.2 Auto Access
52
5.6.3 Power Sequencing (PS)
52
5.6.4 Non-Multiplexed Index (NMI)
52
5.6.5 Write Protect (WP)
52
5.6.6 Radial Seek Complete (SC)
52
5.6.7 Grounding ' , ,
53
6PHYSICAL INTERFACE
6.1 PHYSICAL INTERFACE OVERVIEW 54
6.2
JlIPI
CONNEC'fOR-CONTROL
SIGNALS
55
6.3
J2/P2
CONNEC'fOR-DATA
SIGNALS
55
6.4
J3/P3
CONNEC'fOR-DC
POWER 56
6.5
J4/P4
FRAME GROUND CONNEC'fOR
57
6.6 DRIVE PHYSICAL CABLING
58
-'
7PHYSICAL SPECIFICATIONS
7.1 OVERVIEW
59
7.2 MOUNTING ORIENTATION
59
7.3 MOUNTING HOLES
59
7-.4
PHYSICAL DIMENSIONS
59
7.5 FACEPLATE
61
7.6 SHIPPING REQUIREMENT
61
-
8
DATA
PCB BLOCK DIAGRAM
63
9SERVO PCB BLOCK DIAGRAM
66
10
MAINTENANCE/REPAIR
10.1 OVERVIEW
69
10.2 REMOVAL
OF
PARTS NOT REQUIRING ACLEAN ROOM ENVIRONMENT
.,
69
10.2.1 Front Cover
69
10.2.2 Side Frames
70
10.2.3 Data
PCB
70
10.2.4 Servo
PCB
70
10.3 REPAIR AND ADJUSTMENTS
71
10.3.1 Data
PCB
, ,
71
10.3.2 Servo
PCB
,
71
10.4 SPARE PARTS LIST (MLC
l.X)
72
10.5 SPARE PARTS LIST (MLC 2.X)
73
vi
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11
VI00 TEST POINTS (MLC
l.X)
11.1
DATA
PCB TEST POINTS
74
11.2 SERVO PCB TEST POINTS
78
12
Vl00 TEST POINTS (MLC 2.X)
12.1
DATA
PCB TEST POINTS -
'"
83
12.2 SERVO PCB TEST POINTS
87
vii

LIST
OF
TABLES
PAGE
LIST
OF
TABLES
5-1
JIIPI
CONNECTOR PIN ASSIGNMENT
39
5-2 J2IP2 CONNECTOR PIN ASSIGNMENT
40
5-3 P3-DC CONNECTOR PIN ASSIGNMENTS 40
6-1
DC
POWER REQUIREMENTS
56
FIGURES
2-1
AIR FILTRATION SYSTEM 6
2-2
'.
READIWRITE HEAD POSITIONING MECHANISM 7
3-1
POWER
UP
SEQUENCE 9
4-1
POWER RESET
25
4-2 GENERAL SEEK TIMING
27
4-3
"AI"
ADDRESS MARK BYTE ........
..
...............................
..
29
4-4 TYPICAL TRACK FORMAT
..
:
30
4-5 TYPICAL READ TIMING
31
4-6 WRITE
DATA
TIMING
33
5-1
CONTROL SIGNALS
41
5-2
DATA
SIGNALS
42
5-3 TYPICAL CONNECTION 4-DRIVE SYSTEM
43
5-4 CONTROL SIGNAL DRIVERIRECEIVER COMBINATION
44
5-5 BUFFERED STEP
46
5-6 INDEX TIMING ......................................................
..
48
5-7
DATA
LINE DRIVERIRECEIVER COMBINATION
49
5-8 READIWRITE
DATA
TIMING
50
5-9 OPTION SHUNT BLOCK (J6)
51
5-10 PCB OPTION
PADS
(JI2)
53
viii
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6-1
6-2
6-3
6-4
6-5
6-6
7-1
7-2
8-1
9-1
10-1
10-2
11-1
11-2
11-3
11-4
11-5
11-6
12-1
12-2
12-3
12-4
12-5~
12-6
.
INTERFACE
CONNECTOR
PHYSICAL
LOCATIONS 54
Jl
CONNECTOR
DIMENSIONS 55
J2
CONNECTOR
DIMENSIONS 56
J3
CONNECTOR-INNER
PCB
SOLDER
SIDE
56
TYPICAL
&
MAXIMUM
12V
CURRENT
REQUIREMENTS
57
DRIVE
INTERNAL
AND
EXTERNAL
CABLING 58
MOUNTING
PHYSICAL
DIMENSIONS 60
OVERALL
PHYSICAL
DIMENSIONS
61
DATA
PCB
BLOCK
DIAGRAM
63
SERVO
PCB
BLOCK
DIAGRAM
66
SPARE
PARTS LIST/ASSEMBLY
(MLC-l.X)
72
SPARE
PARTS LIST/ASSEMBLY (MLC-2.X)
73
DATA
PCB
TEST
POINT
DESCRIPTIONS
74
TEST
POINT
OUTPUTS 75
MLC
l.X
TEST
POINT
LOCATIONS DATA PCB
77
SERVO
PCB
TEST
POINT
DESCRIPTIONS
78
TEST
POINT
OUTPUT
78
.
MLC
l.X
TEST
POINT
LOCATIONS
SERVO
PCB
82
DATA
PCB
TEST
POINT
DESCRIPTIONS
83
TEST
POINT
OUTPUTS 84
MCL
2.X
TEST
POINT
LOCATIONS 86
SERVO
PCB
TEST
POINT
LOCATIONS 87
TEST
POINT
OUTPUTS 87
MLC
2.X
TEST
POINT
LOCATIONS
91
ix

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-
-

INTRODUCTION
1INTRODUCTION
1.1 General Description
The Vertex VI
00
Family
of
Disk Drives
is
aseries
of
random access storage devices using
2.
3.
or
4
nonremovable
51f4
inch disks. Each disk surface employs one movable head to service up to 1166
tracks. Total unfonnatted capacities
of
four models are 30.8
(VI30).
51.4 (VI50). 72.0
(VI70).
and
85.0
(VI85)
megabytes.
Fast access time and high track density are achieved through the use
of
arotary voice coil head
positioner
in
conjunction with adedicated servo surface.
Th~
inherent simplicity
of
mechanical construction allows maintenance free operation throughout the
life
of
the drive. Both electronic boards are mounted outside the sealed head disk assembly. allowing
field serviceability.
Mechanical and contamination protection for the heads. actuator and disks
is
provided by an impact
resistant metal cover. Aself contained re-circulating system supplies clean air through a
0.3
micron
filter. Aseparate filter allows for ambient pressure equalization without introduction
of
contami-
nants. Adequate air flow and unifonn temperature distribution throughout the head and disk area are
assured.
The track following servo system allows the heads to continuously follow the recorded track. and
reduces
off
track due to non-repetitive spindle run-out. vibration. and environmental temperature
changes: Read and write operations can be perfonned after power up with no thennal stabilization
delay.
Superior data integrity results from the use
of
shock isolators. metal
film
media. ahead landing/
shipping zone. and automatic actuator lock.
The
electrical/physical interface
is
compatible with other available ST412/506 interfaced products.
and includes the same data transfer rate. connectors. DC power. mechanical mounting holes and
package size.

INTRODUCTION
Customer options include:
I. Radial
operation-Outputs
active without drive selected.
2. Power On sequencing for multiple drive applications.
3. Non-Multiplexed Index.
4. Write Protect.
5. Radial Seek Complete.
1.2 Specification Summary
1.2.1 Physical Specifications
Power requirements
12
VDC ±10%.
Maximum Ripple 120 mV P-P (a 11.0 VDC Minimum.
P~ak
Current 4.5 Amp-Motor Start For
10
Seconds.
Running Current
2.0
Amp avg. (Track Following).
Peak Running Current 2.8 Amp
(~eeking).
Maximum Power Dissipation 54 Watts Peak for
10
Seconds during motor start.
Average Power Dissipation
27
Watts
(\2
Volts).
5·VDC ±5%
Maximum Ripple 120
mV
P-P @4.88 VDC Minimum.
1.5 Amp avg.lmax.
Average Power Dissipation 7.5 Watts (5 Volts).
Dimensions
and
Weight
Height* 3.25
in
(8.26 cm)
Width* 5.75
in
(\4.61 cm)
Depth* 8.00
in
(20.32 cm)
Weight 6
Ib
(2.72 kg)
*Does not include Faceplate
Environmental Limits
Ambient Temperature
Operating 4°C to 50°C (40°F to 122°F)
Nonoperating
-40°C
to
60°C
(-40°F
to 140°F)
Gradient Less than
10°C
(\
8°F)/hour
2
)
-'
-
-J

INTRODUCfION
Relative Humidity
Operating ......................................
..
8%
to
80% (noncondensing)
Operating Maximum Wet Bulb 85°F
Nonoperating ...................................
..
5% to 95% (noncondensing)
Nonoperating Maximum Wet Bulb
85°F-
Shock
and
Vibration
Operating -2G max,
II
ms. Half Sine Wave
.010" dA, 2-22 Hz; .25G, 22-6ooHz
Nonoperating 20G max,
II
ms. Half Sine Wave
.040" dA, 2-22 Hz; I.OG, 22-6ooHz
Transport 25G's into HDA,
42"
Packaged Drop.
Altitude
Operating
-305
m(1000
ft
)to
+3,000
m
(+
10,000
ft
)
Nonoperating
-305
m(1000
ft)
to +12,000 m
(+40,000
ft)
Acoustical Noise 50 dBa, one meter from cover
1.2.2. Functional Specifications
Storage capacity
VI30 VI50
V
170
VI85
Unformatted* 30.8MB 51.4MB 72.0MB 85.0MB
Formatted (typical sector formats)
:--'(32
x256 bytes) 24.3MB 40.4MB 56.6MB 66.9MB
(17 x512 bytes) 25.8MB 43.0MB 60.1MB 71.0MB
Data tracks
2961
4935 6909 8162
Data Cylinders 987 987 987 1166
Disks 2 3 44
Data Surfaces 35 7 7
Heads, Read/Write 3 5 7 7
Head, Servo I1 1 1
Bytes per Track
Unformatted 10,416
Formatted (typical sector formats)
32 x256 byte sectors 8,192
17
x512 byte sectors 8,704
Maximum Bit Density (bits/inch) 9,897 9,897 9,897 10,526
Maximum Flux Density (flux reversals/inch) 9,897 9,897 9,897 10,526
Track Density (tracks/inch) 960 960 960 1,047
Access time (including settling and transmission
of
step pulses)
Track-to-track: 5milliseconds Maximum
Average: 30 milliseconds ±
10%
Maximum:
65
milliseconds
Maximum Average Latency Time: 8.33 milliseconds
3

INTRODUCTION
Rotational Speed: 3600 rotations/minute ±0.1%
Data Transfer Rate: 5megabits/second (625 kilobytes/second)
*Recording Code: Modified Frequency Modulation (MFM)
Interface:
ST4
I
2/506
Compatible
Start Time: Less than
25
seconds
Stop Time: Less than
25
seconds
*NOTE: All models support the use
of
2.7 RLL encoding
in
addition to MFM. When used with a
controller utilizing RLL encoding. drive capacity may
be
expected to increase up to 50%
over the values stated above. Note that error rate criteria may vary depending upon the type
of
RLL encoding scheme used.
1.2.3 Reliability Specifications
Mean-time-between-failures (MTBF)
Mean-time-to-repair
(MTIR)
Compdnent life
Error rate
Recoverable Errors
Unrecoverable Errors
,-Seek Errors
1.2.4 Disk Defects
More than 15.000 power on hours
less than 30 minutes
Syears
Iper
10
10 bits read
Iper
10
12
bits read
Iper
lOt>
seeks
Disk defects are imperfections
in
the media surface. No unit will be shipped
if
surface analysis
identifies more than 30. 50. 70.
or
85 total defective tracks/drive for the V130. VISO. V170. and
V185 respectively. Note that even at these maximum values. only I%
of
the drive capacity
is
unavailable. Additionally. no defects will be present on cylinder
O.
heads
O.
Iand 2.
Testing for defects involves an analysis
of
the total media surface under marginalized test conditions.
Defect information is included on the test data sheet shipped with the drive. and on alabel affixed to
the drive. Format
is
cylinder number. head number and bytes from index. Location accuracy
is
±
10
bytes.
In
asingle format operation.
it
is
probable that errors will not
be
detected on all
of
the locations
defined. However. all should
be
considered defects and flagged by the using system to ensure long
term data reliability.
The use
of
an error correction code (ECC) rather than cyclic redundancy check (CRC) is recom-
mended for best data integrity.
4

FUNCfIONAL CHARACTERISTICS
2FUNCTIONAL CHARACTERISTICS/OVERVIEW
2.1 General Operation
The
Vl00
Series drives consist
of
read/write, head positioning and control electronics, rotary voice
coil actuator, media, air filtration system, and disk spin motor.
These components perform the following functions:
1. Interpret and generate control signals.
2. Position and maintain the heads over the desired track.
3. Maintain precise disk rotation speed.
4.
Read and write data.
5. Provide acontamination-free environment.
2.2 Read/Write, Servo
and
Control Electronics
Electronics are packaged on two printed circuit boards. The outennost board, to which control and
data signals are connected, includes:
1.
R/W
circuits.
2. Interface drivers and receivers.
3. Microprocessor and associated logic.
4.
Write fault detection.
5. Drive selection.
6. Optional interface functions.
7.
Index circuit.
The second PCB, mounted under the top board, accepts the required
DC
voltages and performs the
following functions:
1. Disk spin motor control.
2. Head actuator positioning.
3. Track 0detection.
4.
-10
voltage regulator.
5. Power monitoring.
5

AJNCTIONAL
CHARACTERISTICS
2.3 Drive Mechanism
Abrushless 3phase DC drive motor rotates the spindle disk assembly at 3600 rpm. The spindle is
driven directly with no belt
or
pulley being used. Acrystal controlled phase lock loop maintains
precise speed regulation. The motor and spindle are dynamically balanced to ensure alow vibration
level. Dynamic braking is used to quickly stop the motor when power is removed. The base plate
assembly is shock mounted to the side mounting frames to minimize transmission
of
vibration
through the chassis
or
frame. Index signal.is derived from atransducer inside the drive motor.
2.4 Air Filtration System (Figure2·1)
The disks, read/write heads and actuator are fully enclosed in amodule using an integral re-
circulation air system and absolutel:1ter to maintain aclean environment. Aseparate filter permits
ambient pressure equalization without entry
of
contaminants.
-.
ACTUATOR
ASSY DISC
Figure
2-1
Air Filtration System
6
-)

FUNCfIONAL CHARACTERISTICS
2.5 Positioning Mechanism (Figure 2-2)
The read/write heads and servo head are mounted onto arotary actuator supported by precision ball
bearings. Abobbin-type voice coil mounted between two permanent magnets provides the driving
force required to rotate the actuator for head positioning. Crash stops are provided to protect the head
assemblies should amalfunction cause the actuator to lose control. When the drive is powered down,
the actuator
is
driven to ahead landing zone on the inner diameter
of
the disk. Simultaneously, the
actuator is automatically locked over the landing zone to prevent possible head/media damage when
the drive is subjected to transport shock
or
movement around the office.
VOICE
COIL
MOTOR
ASSEMBLY
ACTUATOR
YOKE. SPINDLE.
&CRASH STOP ASSEMBLY
Figure 2-2
Read/Write Head Positioning Mechanism
7

RJNCI10NAL
CHARACTERISTICS
2.6 Read/Write Heads and Disks
Winchester technology heads and media are used in the VI00 Series disk drives. Maximum record-
ing density is 10,526
flux
changes per inch. The heads are connected to the external electronics via a
flat flexible printed circuit cable. Three integrated circuits are mounted on the cable adjacent to the
heads. The circuits provide write curreQt, head selection, and read signal amplification.
Amplification
of
the low level rearl signal prior to its leaving the sealed unit provides superior
signal-to-noise ratio and less sensitivity to noise
in
the ground system and mounting frame.
2.7 Servo System
Actuator positioning and head track following
is
accomplished on aclosed loop basis using a
dedicated servo surface. During seek operations, track crossing information is used to optimize
actuator deceleration. A"dual frequency" technique is used. This technique is based on amplitude
differen~es
between alternating servo tracks written at two different frequencies. On-track for adata
head is realized when the servo head is positioned exactly between the two servo tracks. Essentially,
the servo head continuously samples the two frequencies, sums and averages the signals, then
positions the head at the point where this averaged signal is
strongest-exactly
between the two
tracks. The resultant errorsignal is linearly proportional to the error (off-track) size, and indicates the
off-track direction.
The dual-frequency servo offers several advantages relative to classical di-bit and tri-bit methods:
I. It is relatively insensitive to servo surface media defects. The di-bit/tri-bit methods generally
require an "error-free" servo surface. This reduces manufacturing yields (particularly for high
track density media) and increases the cost
of
the servo disk. Since the dual-frequency servo
continuously samples
fA
and
fB
amplitudes, media defects are averaged out and not sensed by the
servo.
2. Because the dual-frequency method uses arelative amplitude difference
of
fA
and
fB
frequency,
servo head azimuth alignment is not critical. This alignment is critical in di-bit and tri-bit
methods, however, again raising production costs and increasing service requirements.
3. Since
fA
and mfrequencies are recorded well below data frequencies, write data noise is easily
filtered out in the event it is injected into the servo read channel via read/write head to servo head
cross talk.
Track 0is derived from the servo surface information, eliminating the need for aseparate sensor for
this purpose.
8
-)

FUNCTIONAL OPERATION
3FUNCTIONAL OPERATIONS
3.1 Power Sequencing (Figure 3-1)
Plus 5and +
12
volts may be applied in any order; however, both voltages must be applied to start the
spindle drive motor. Aspeed sense circuit ensures the spindle is up to speed before recalibrating the
heads to track 0. TRACK 0, SEEK COMPLETE and READY signals on the interface will become
true
~equentially.
The drive will not perform read, write or seek functions until READY becomes
true. No commands should be attempted until READY is true. STEP pulses will be ignored, and
WRITE GATE will cause aWRITE
FAULT.
DCON
l~
--.,
I+-
25
SEC. MAX.
DISC
UP
TO
SPEED ] :
. .
\l
AUTO RECAUBRATE
PER'OD
II
'
-TRACK
f6
.
I I
-----.1
~+-
3ms
MAXIMUM
-:":SE::-:E-K-::"C-=-OM-P=-L--:"E=-:T
E=--------1H
;
I
I~I------
III
~~--------.L.I~~!
I~
200 USEC MAX
-READY
II
I
'-------
I
Figure 3-1
Power Up Sequence
9

RJNCfIONAL
OPERATION
3.2 Drive Selection
Drive selection occurs when one
of
the DRIVE
SELECf
lines
is
activated. Only the selected drive
will respond to the input signals, and only that drive's output signals are then gated to the controller
interface (see Section 5.6.1 for exception).
3.3 Track Accessing
Read/write head positioning is accomplished by:
A) Deactivating WRITE GATE.
B) Activating the appropriate DRIVE
SELECf
line.
C) Being in the READY condition with SEEK COMPLETE true.
D) Selecting the appropriate
DIRECflON
IN state.
E) Pulsing the STEP line.
Each step pulse will cause the heads to move either 1track in or 1track out, depending on the level
of
the
DIRECflON
line. Alow level on the
DIRECflON
line will cause aseek inward toward the
spindle; ahigh, outward toward track 0.
3.4 Head Selection
Any
of
the heads can be selected by placing the head's binary address on the three (3) HEAD
SELECf
lines:
.......
\
)
DRIVE
V130
VI50
VI70
VI85
NUMBER
OF
DATA
HEADS
3
5
7
7
HEAD
ADDRESSES
0,
1,2
0,
I,
2, 3, 4
0,
I,
2. 3, 4, 5, 6
0,
I,
2,
3,4,5,
6
3.5 Read Operation
Reading data is from the disk and is accomplished by:
A) Deactivating the WRITE GATE line.
B) Activating the appropriate DRIVE
SELECf
line.
C) Assuring the drive is READY.
D) Selecting the appropriate HEAD
SELECf
levels.
10
-)
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