VIA Technologies Mobile360 L900 User manual

USER MANUAL
VIA Mobile360 L900
Fanless ultra-compact in-vehicle system
1.00-04122020

Copyright
Copyright © 2019-2020 VIA Technologies Incorporated. All rights reserved.
No part of this document may be reproduced, transmied, transcribed, stored in a retrieval system, or translated into any language, in any
form or by any means, electronic, mechanical, magnec, opcal, chemical, manual or otherwise without the prior wrien permission of
VIA Technologies, Incorporated.
Trademarks
All trademarks are the property of their respecve holders.
Disclaimer
No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no warranes,
implied or otherwise, in regard to this document and to the products described in this document. The informaon provided in this
document is believed to be accurate and reliable as of the publicaon date of this document. However, VIA Technologies assumes no
responsibility for the use or misuse of the informaon (including use or connecon of extra device/equipment/add-on card) in this
document and for any patent infringements that may arise from the use of this document. The informaon and product specicaons
within this document are subject to change at any me, without noce and without obligaon to nofy any person of such change.
VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any me without prior noce.
Regulatory Compliance
FCC-A Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC rules.
These limits are designed to provide reasonable protecon against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instrucon manual, may cause harmful interference to radio communicaons. Operaon of this equipment in a residenal area is likely to
cause harmful interference, in which case the user will be required to correct the interference at his personal expense.
Noce 1
The changes or modicaons not expressly approved by the party responsible for compliance could void the user's authority to operate
the equipment.
Noce 2
Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.
Noce 3
The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conicts or
damages arising from incompability of the product. Check compability issue with your local sales representaves before placing an
order.
ii

Baery Recycling and Disposal
• Only use the appropriate baery specied for this product.
• Do not re-use, recharge, or reheat an old baery.
• Do not aempt to force open the baery.
• Do not discard used baeries with regular trash.
• Discard used baeries according to local regulaons.
Safety Precauons
• Always read the safety instrucons carefully.
• Keep this User’s Manual for future reference.
• All cauons and warnings on the equipment should be noted.
• Keep this equipment away from humidity.
• Put this equipment on a reliable at surface before seng it up.
• Check the voltage of the power source and adjust to 110/220V before connecng the equipment to
the power inlet.
• Do not place the power cord where people will step on it.
• Always unplug the power cord before inserng any add-on card or module.
• If any of the following situaons arise, get the equipment checked by authorized service personnel:
− The power cord or plug is damaged.
− Liquid has entered into the equipment.
− The equipment has been exposed to moisture.
− The equipment is faulty or you cannot get it work according to User’s Manual.
− The equipment has been dropped and damaged.
− The equipment has an obvious sign of breakage.
• Do not leave this equipment in extreme temperatures or in a storage temperature above 70°C (158°F).
The equipment may be damaged.
• Do not leave this equipment in direct sunlight.
• Never pour any liquid into the opening. Liquid can cause damage or electrical shock.
• Do not place anything over the power cord.
• Do not cover the venlaon holes. The openings on the enclosure protect the equipment from
overheang.
iii

VIA Mobile360 L900 User Manual
iv
Box Contents
• 1 x VIA Mobile360 L900 system
• 2 x Phoenix plug to DC jacks (DC-in & DC-out)
• 1 x COM cable (for debugging)
• 1 x GPS antenna
• 2 x Wi-Fi/BT antennas
Ordering Informaon
Part Number Descripon
M360-900-1Q20A1
Fanless mobile system with NVIDIA Dual-Core Denver 2 and Quad-Core ARM
A57 Processor, 8GB LPDDR4 RAM, HDMI, 2 USB 3.0, Micro USB 2.0 (debugging),
DIO, COM, CAN bus, Gigabit Ethernet, 9 FAKRA connectors for camera-in, Wi-Fi,
Bluetooth 4.1, GPS, SIM card slot, Micro SD card slot, 2 M.2 slots, 2 2.5" SSD/
HDD bays ,12V DC-out, 9V~36V DC-in with IGN
Oponal Accessories
Cameras and Accessories
Part Number Descripon
99G40-08121Z 1.0MP FOV-40 720p CMOS automove-grade camera
99G40-08140Z 1.0MP FOV-190 720p CMOS automove-grade camera
99G33-230396 10M FAKRA cable
99G33-230406 15M FAKRA cable
Mounng Opons
Part Number Descripon
M360-SBKT-00A1 Mounng bracket kit (337.2mm x 185mm x 62mm)
Display Accessories
Part Number Descripon
99G73-01030C 7” Resisve touch monitor (1280 x 800)
99G73-01034C 10.1" Resisve touch monitor (1280 x 800)
Wireless Modules
Part Number Descripon
M360-LTE2-Q1USA1 4G LTE/DC-HSPA+/EGPRS Mobile broadband full-size miniPCIe module
(For North America Regions)

VIA Mobile360 L900 User Manual
v
Table of Contents
1. Product Overview........................................................................................................................................... 1
1.1 Key Features ......................................................................................................................................... 1
1.1.1 High-Performance.......................................................................................................................... 1
1.1.2 Fanless, Compact, Ruggedized Chassis .......................................................................................... 1
1.1.3 Opmized Integraon with Mulple I/O Access ........................................................................... 1
1.1.4 Camera Support............................................................................................................................. 1
1.1.5 Support for a Wide Range of Power Sources ................................................................................ 2
1.1.6 Storage Expansion.......................................................................................................................... 2
1.1.7 Networking Support ...................................................................................................................... 2
1.1.8 Mulple Mounng Soluon........................................................................................................... 2
1.1.9 Operang System........................................................................................................................... 2
1.2 Product Specicaons ......................................................................................................................... 2
1.3 Layout Diagram..................................................................................................................................... 4
1.4 Product Dimensions ............................................................................................................................. 5
2. External I/O Pin Descripons and Funconality............................................................................................. 7
2.1 HDMI® Port........................................................................................................................................... 7
2.2 USB 3.0 Port.......................................................................................................................................... 7
2.3 Micro USB 2.0 Port ............................................................................................................................... 8
2.4 Gigabit Ethernet Port............................................................................................................................ 8
2.5 Micro SD Card Slot................................................................................................................................ 9
2.6 SIM Card Slot ........................................................................................................................................ 9
2.7 DIO Port .............................................................................................................................................. 10
2.8 Headphone and Mic-in Port ............................................................................................................... 10
2.9 COM Port ............................................................................................................................................ 10
2.10 CAN Bus Port ...................................................................................................................................... 11
2.11 FAKRA Connectors .............................................................................................................................. 11
2.12 Power Buon...................................................................................................................................... 11
2.13 DC-In Jack ........................................................................................................................................... 12
2.14 DC-Out Jack ........................................................................................................................................ 12
2.15 Antenna Connectors........................................................................................................................... 12
3. Onboard I/O ................................................................................................................................................ 14
3.1 MiniPCIe Slot ...................................................................................................................................... 14
4. Hardware Installaon ................................................................................................................................... 15
4.1 Installing the 2.5" SATA HDD/SSD ....................................................................................................... 15
4.2 Installing the Wi-Fi/BT Antennas ........................................................................................................ 17
4.3 Installing the GPS Antenna ................................................................................................................. 17
4.4 Installing the FOV Cameras and FAKRA Cables ................................................................................... 18
4.5 Unplugging the FAKRA Cable.............................................................................................................. 19
4.6 Connecng VIA Mobile360 L900 to the Vehicle's Ignion (IGN) ........................................................ 20
4.7 Installing the Phoenix Plug to DC Jack ................................................................................................ 21
5. Soware and Technical Support................................................................................................................... 22
5.1 Linux Support...................................................................................................................................... 22
5.2 Technical Support and Assistance....................................................................................................... 22

VIA Mobile360 L900 User Manual
vi
Appendix A Installing Wireless Accessories ..................................................................................................... 23
A.1 Installing the Mobile Broadband MiniPCIe Module ........................................................................... 23
Appendix B Installing Mounng Bracket.......................................................................................................... 26
Appendix C Wi-Fi Support Channel Maps........................................................................................................ 29
C.1 Jetson TX1........................................................................................................................................... 29
C.2 Jetson TX2........................................................................................................................................... 30
Appendix D CAN/COM Conversion Cable......................................................................................................... 31

VIA Mobile360 L900 User Manual
vii
List of Figures
Figure 01: Front panel I/O layout ......................................................................................................................... 4
Figure 02: Back panel I/O layout .......................................................................................................................... 4
Figure 03: Dimensions of the VIA Mobile360 L900 (front view) .......................................................................... 5
Figure 04: Dimensions of the VIA Mobile360 L900 (side view)............................................................................ 5
Figure 05: Dimensions of the VIA Mobile360 L900 (boom view) ...................................................................... 5
Figure 06: USB 3.0 port diagram .......................................................................................................................... 6
Figure 07: Micro USB 2.0 port ............................................................................................................................. 7
Figure 08: Gigabit Ethernet port diagram ............................................................................................................ 7
Figure 09: Micro SD card slot diagram ................................................................................................................. 8
Figure 10: SIM card slot diagram.......................................................................................................................... 8
Figure 11: SDIO port diagram............................................................................................................................... 9
Figure 12: Headphone and Mic-in port diagram .................................................................................................. 9
Figure 13: COM port diagram............................................................................................................................... 9
Figure 16: Power buon diagram....................................................................................................................... 10
Figure 14: CAN bus port diagram ....................................................................................................................... 10
Figure 15: FAKRA connector diagram................................................................................................................. 10
Figure 19: Wi-Fi /BT antenna connectors diagram............................................................................................. 11
Figure 17: DC-in jack diagram............................................................................................................................. 11
Figure 18: DC-out jack diagram .......................................................................................................................... 11
Figure 20: 4G and GPS antenna connectors diagram ......................................................................................... 12
Figure 21: MiniPCIe slot diagram ....................................................................................................................... 13
Figure 22: Unlocking the SATA HDD/SSD bay .................................................................................................... 14
Figure 23: Removing the SATA HDD/SSD bays.................................................................................................... 14
Figure 24: Installing the 2.5" SATA HDD/SSD ..................................................................................................... 15
Figure 25: Reinstalling the SATA HDD/SSD bays ................................................................................................. 15
Figure 26: Installing the Wi-Fi/BT antennas ....................................................................................................... 16
Figure 27: Installing the GPS antenna ................................................................................................................ 16
Figure 28: Connecng the FOV camera to the FAKRA cable............................................................................... 17
Figure 29: Connecng the FAKRA cable to the FAKRA connector ...................................................................... 17
Figure 30: Uplugging the FAKRA cable ............................................................................................................... 18
Figure 31: DIO port's pin 8 ................................................................................................................................. 19
Figure 32: VIA Mobile360 L900 and IGN connecon method diagram.............................................................. 19
Figure 33: Connecng the baery cables onto the Phoenix plug to DC jack ..................................................... 20
Figure 34: Connecng the Phoenix plug to DC jack............................................................................................ 20
Figure 35: Unscrewing the boom plate cover .................................................................................................. 22
Figure 36: Removing the boom plate cover..................................................................................................... 23
Figure 37: Installing the mobile broadband module .......................................................................................... 23
Figure 38: Connecng the 4G antenna cable to the micro-RF connector on the module.................................. 24
Figure 39: Installing the 4G antenna .................................................................................................................. 24
Figure 40: Installing the rubber dampers ........................................................................................................... 25
Figure 41: Installing the mounng bracket......................................................................................................... 26
Figure 42: Securing the mounng bracket ......................................................................................................... 27
Figure 43: Mounng the VIA Mobile360 L900 ................................................................................................... 28
Figure 44: CAN/COM conversion cable diagram ................................................................................................ 31

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viii
List of Tables
Table 01: HDMI port pinouts .............................................................................................................................. 6
Table 02: USB 3.0 ports pinouts.......................................................................................................................... 6
Table 03: Micro USB 2.0 port pinouts ................................................................................................................. 7
Table 04: Gigabit Ethernet port pinouts ............................................................................................................. 7
Table 05: Gigabit Ethernet port LED color denion .......................................................................................... 7
Table 06: Micro SD card slot pinouts .................................................................................................................. 8
Table 07: SIM card slot pinouts........................................................................................................................... 8
Table 08: DIO port pinouts.................................................................................................................................. 9
Table 09: Headphone and Mic-in port pinouts................................................................................................... 9
Table 10: COM port pinouts................................................................................................................................ 9
Table 11: CAN bus port pinouts ........................................................................................................................ 10
Table 12: FAKRA connector pinouts.................................................................................................................. 10
Table 13: Power buon behavior descripon................................................................................................... 11
Table 14: DC-in jack pinouts.............................................................................................................................. 11
Table 15: DC-out jack pinouts........................................................................................................................... 11
Table 16: MiniPCIe slot pinouts ........................................................................................................................ 13
Table 17: Jetson TX1 World Wide safe channel map ........................................................................................ 29
Table 18: Jetson TX2 World Wide safe channel map ........................................................................................ 30
Table 19: P2 (COM debug port) pinouts ........................................................................................................... 31
Table 20: P3 (CAN bus port) pinouts................................................................................................................. 31

VIA Mobile360 L900 User Manual
1
1. Product Overview
Accelerate me-to-market for cung-edge autonomous vehicle and driver assistance systems with the VIA
Mobile360 L900. Featuring a compact ruggedized form factor, advanced real-me video capture and processing
capabilies, and support for up to nine automove-grade cameras, this powerful and scalable system provides
the ulmate soluon for the most demanding on-road and o-road use cases and environments.
Powered by the NVIDIA Dual-Core Denver 2 64-bit CPU, ARM® Cortex®-A57 MPCore, and 256-core NVIDA
Pascal™ GPU architecture with 256 NVIDIA CUDA cores, the VIA Mobile360 L900 delivers advanced compute,
graphics, and AI processing performance.
Measuring just 240mm (W) x 53mm (H) x 180mm (D), this ultra-compact fanless system integrates a rich set
of I/O features through the front and back panels of its chassis, including nine FAKRA connectors for camera-
in, one HDMI port, two USB 3.0 ports, one CAN bus port, DIO and COM ports, and a Micro SD card slot. With
integrated Wi-Fi, GPS, and BT 4.1, plus a Gigabit Ethernet port, SIM card slot, and oponal 4G LTE module, the
system delivers extensive connecvity opons. Other features include 8GB LPDDR4 memory onboard, 32GB
eMMC ash memory, two 2.5” SATA HDD/SSD bays, anda Headphone & Mic-in port.
The VIA Mobile360 L900 supports high compung power operaon with low power consumpon, and it has a
built-in power management system that protects from power surges. With its power management system, it is
capable of handling a wide range of DC power inputs from 9V~36V.
1.1 Key Features
1.1.1 High-Performance
The VIA Mobile360 L900 features a power-ecient NVIDIA TX2 embedded module powered by the NVIDIA
Dual-Core Denver 2 64-bit CPU, ARM® Cortex®-A57 MPCore, and 256-core NVIDA Pascal™ GPU architecture
with 256 NVIDIA CUDA cores. In addion to a rich feature set, the system delivers superb mul-tasking
performance for a host of demanding in-vehicle safety applicaons.
1.1.2 Fanless, Compact, Ruggedized Chassis
The VIA Mobile360 L900 delivers fanless operaon in a sealed aluminum alloy chassis that also acts as a
thermal soluon. The compact chassis design makes it suitable for installaons in space-crical environments,
while also ensuring maximum reliability.
1.1.3 Opmized Integraon with Mulple I/O Access
With front and back panel I/O access, the VIA Mobile360 L900 can be easily congured to support a wide
variety of applicaons with easy integraon and quick setup.
1.1.4 Camera Support
The VIA Mobile360 L900 supports up to nine automove-grade cameras through its FAKRA connectors. IP cams
can also be supported.

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2
1.1.5 Support for a Wide Range of Power Sources
The VIA Mobile360 L900 supports a wide range of power inputs from 9V to 36V DC. The system's exible power
input enables deployment in a broad variety of in-vehicle environments.
1.1.6 Storage Expansion
The VIA Mobile360 L900 has 32GB of eMMC ash storage onboard, two M.2 slots for oponal extra storage of
up to 512MB each. In addion, it features a Micro SD card slot supporng an addional 32GB as well as two
HDD/SSD bays for 2.5" SATA HDD/SSD.
1.1.7 Networking Support
The VIA Mobile360 L900 is equipped with Wi-Fi/BT, GPS, and an RJ-45 port that provides high-speed Gigabit
Ethernet. 4G connecvity can be added through the miniPCIe slot using the oponal mobile broadband
miniPCIe module. Please note that this opon is available for the North America reigion only.
1.1.8 Mulple Mounng Soluon
The VIA Mobile360 L900 supports mulple methods for secure chassis mounng. The rugged VIA Mobile360
L900 can be mounted on the side-panel of a vehicle, oor bed, or any at surface.
1.1.9 Operang System
The VIA Mobile360 L900 features a complete soware evaluaon image based on Linux kernel 4.9.
1.2 Product Specicaons
Processor
• NVIDIA Dual-Core Denver 2 64-bit CPU and ARM® Cortex®-A57 MPCore
System Memory
• 8GB LPDDR4 SDRAM
Storage
• 32GB eMMC ash memory
• 2 x M.2 slots (PCIe NVMe)
• 2 x 2.5 SATA HDD/SSD storage bays
Graphics
• NVIDIA Pascal™ GPU with 256 NVIDIA CUDA Cores
Camera-in Interface
• 3 x DS90UB964-Q1 Quad FPD-Link III deserializer hub
Wireless Connecvity
• Wi-Fi 802.11a/b/g/n/ac + BT 4.1 combo LGA GPS module
• MAX-7C-0 u-blox 7 GNSS module

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Audio
• Realtek ALC5658 Audio Codec
HDMI
• Integrated HDMI 2.0 transmier supports 4K display
Expansion I/O
• 1 miniPCIe slot (USB only)
Front Panel I/O
• 2 USB 3.0 ports
• 1 Micro USB 2.0 port (for debugging)
• 1 Micro SD card slot
• 1 SIM card slot
• 2 2.5" HDD/SSD bays
• 1 Power buon
Back Panel I/O
• 1 HDMI port
• 1 DIO port
• 1 COM port
• 1 CAN bus port
• 1 Gigabit Ethernet port
• 9 FAKRA connectors for camera-in
• 1 Headphone and Mic-in
• 4 Antenna connectors for Wi-Fi/BT, 4G, GPS
• 1 4-pole Phoenix 9V~36V DC-in
• 1 2-pole Phoenix 12V DC-out
Power Supply
• 9V~36V DC-in with IGN
• 12V DC-out
Operang System
• Linux kernel 4.9
Operang Temperature
• -20°C ~ 60°C
Storage Temperature
• -40°C ~ 85°C
Operang Humidity
• 40°C @ 0% ~ 95% (non-condensing)
Mechanical Construcon
• Aluminum top cover
• Metal chassis housing

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Dimensions
• 240mm (W) x 53mm (H) x 180mm (D) (9.45" x 2.09" x 7.09")
Weight
• 3.0kg (6.61lbs)
Compliance
• FCC
Notes:
1. As the operang temperature provided in the specicaons is a result of tesng performed in a tesng chamber, a
number of variables can inuence this result. Please note that the working temperature may vary depending on the
actual situaon and environment. It is highly recommended to execute a solid tesng program and take all variables
into consideraon when building the system. Please ensure that the system is stable at the required operang
temperature in terms of applicaon.
2. Please note that the lifespan of the onboard eMMC/UFS memory chip may vary depending on the amount of
access. More frequent and larger data access on the eMMC memory will shorten lifespan. Therefore, it is highly
recommended to use replaceable external storage (e.g., SD card) for large data access.
1.3 Layout Diagram
Figure 01: Front panel I/O layout

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Figure 02: Back panel I/O layout
1.4 Product Dimensions
Figure 03: Dimensions of the VIA Mobile360 L900 (front view)
Figure 04: Dimensions of the VIA Mobile360 L900 (side view)

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Figure 05: Dimensions of the VIA Mobile360 L900 (boom view)

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7
2. External I/O Pin Descripons and
Funconality
The VIA Mobile360 L900 has a wide selecon of interfaces, and includes a selecon of frequently-used ports as
part of the external I/O coastline.
2.1 HDMI® Port
The VIA Mobile360 L900 is equipped with one HDMI port on the back panel. An HDMI port Type A receptacle
connector provides a connecon to High Denion video and digital audio using a single cable. The pinouts of
the HDMI port are shown below.
Pin Signal Pin Signal
1D2+ 11 GND
2GND 12 CLK-
3D2- 13 CEC
4D1+ 14 NC
5 GND 15 DDC_CLK
6D1- 16 DDC_DATA
7 D0+ 17 GND
8 GND 18 HDMI_5V
9D0- 19 PLUG_DET
10 CLK+
Figure 06: HDMI port diagram
Table 01: HDMI port pinouts
2.2 USB 3.0 Port
The VIA Mobile360 L900 is equipped with two USB 3.0 ports on the front panel. Each USB 3.0 port has a
maximum data transfer rate of up to 5Gbps and is backwards compable with the USB 2.0 specicaon. The
USB ports provides complete Plug and Play and hot swap capabilies for external devices. The pinouts of the
USB 3.0 ports are shown below.
Pin Signal
1 VBUS
2D-
3D+
4GND
5RX-
6RX+
7 GND
8TX-
9TX+
Figure 07: USB 3.0 port diagram
Table 02: USB 3.0 port pinouts

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2.3 Micro USB 2.0 Port
The VIA Mobile360 L900 is equipped with one Micro USB 2.0 port located on the front panel. The Micro USB
2.0 port supports OTG (On-The-Go) for debugging. The pinouts of the Micro USB 2.0 port are shown below.
Pin Signal
1 VBUS
2D-
3D+
4ID
5 GND
Figure 08: Micro USB 2.0 port
Table 03: Micro USB 2.0 port pinouts
2.4 Gigabit Ethernet Port
The VIA Mobile360 L900 comes with one Gigabit Ethernet port on the back panel which uses an 8 Posion
and 8 Contact (8P8C) receptacle connector commonly known as RJ-45. It is fully compliant with the IEEE 802.3
(10BASE-T), 802.3u (100BASE-TX), and 802.3ab (1000BASE-T) standards. The pinouts of the Gigabit Ethernet
port are shown below.
Pin Signal
1TX1+
2TX1-
3TX2+
4TX2-
5 TX3+
6TX3-
7 TX4+
8 TX4- Figure 09: Gigabit Ethernet port diagram
Table 04: Gigabit Ethernet port pinouts
The Gigabit Ethernet port (RJ-45) is equipped with two LED indicators on the front side to show its Acve/Link
status and Speed status.
Orange
(Le LED)
Green
(Right LED)
Link o LED is o LED is o
Speed_100Mbit LED is on LED is o
Speed_1000Mbit LED is o LED is on
Table 05: Gigabit Ethernet port LED color denion

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2.5 Micro SD Card Slot
The VIA Mobile360 L900 comes with a Micro SD card slot located on the front panel with support for a
maximum storage capacity of 32GB. The pinouts of the Micro SD card slot are shown below.
Pin Signal
1SD_DAT2
2SD_DAT3
3SD_CMD
4VDD
5 SD_CLK
6GND
7 SD_DAT0
8 SD_DAT1
9SD_CD-
Figure 10: Micro SD card slot diagram
Table 06: Micro SD card slot pinouts
2.6 SIM Card Slot
The VIA Mobile360 L900 comes with a SIM card slot located on the front panel that supports 4G SIM cards.
SIM card usage on the VIA Mobile360 L900 requires that a 4G module is installed in the miniPCIe slot, enabling
the 4G funconality, otherwise the SIM card slot will be disabled. The SIM card slot is designed for use with 4G
modules that do not support built-in SIM card slots. The pinouts of the SIM card slot are shown below.
Pin Signal
1USIM_VCC
2GND
3USIM_RST_ESD
4GND
5 USIM_CLK_ESD
6USIM_DATA_ESD
7 GND
8 SIM_DET
Figure 11: SIM card slot diagram
Table 07: SIM card slot pinouts

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2.7 DIO Port
The VIA Mobile360 L900 is equipped with a DIO port located on the back panel. The DIO port oers a Digital
I/O communicaon interface to support 8-bit GPIO. The pinouts of the DIO port are shown below.
Pin Signal
1GPO0
2GPO1
3GPO2
4GPO3
5 GPI0
6GPI1
7 GPI2
8 INPUT_IGN
9GND
Figure 12: SDIO port diagram
Table 08: DIO port pinouts
2.8 Headphone and Mic-in Port
The VIA Mobile360 L900 is equipped with a Headphone and Mic-in port located on the back panel. The
Headphone and Mic-in port is for connecng external speakers such as a headphone or a microphone. The
pinouts of the Headphone and Mic-in port are shown below.
Pin Signal
1IN1P
2IN2P (oponal)
3CPVREF
4HPOR
5 HPOL
Figure 13: Headphone and Mic-in port diagram
Table 09: Headphone and Mic-in port pinouts
2.9 COM Port
The VIA Mobile360 L900 is equipped with a COM port located on the back panel which supports TX/RX for
RS-232. The pinouts of the COM port are shown below.
Pin Signal
1TX
2RX
3GND
4+5V
5 +12V
Figure 14: COM port diagram
Table 10: COM port pinouts

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2.10 CAN Bus Port
The VIA Mobile360 L900 is equipped with a CAN bus port located on the back panel. The CAN bus port
supports one CAN bus and one debug COM (TX/RX) using a CAN/COM conversion cable. The CAN bus supports
protocol specicaon Version 2.0 B. The pinouts of the CAN bus port are show below.
Pin Signal
1TXD
2 CANL
3GND
4GND
5 GND
6GND
7 CANH
8 RXD
9VDD12V1_CAN
Figure 15: CAN bus port diagram
Table 11: CAN bus port pinouts
Note:
For the pinouts of the CAN/COM conversion cable, please refer to Appendix E.
2.11 FAKRA Connectors
The VIA Mobile360 L900 is equipped with nine FAKRA connectors located on the back panel. The FAKRA
connectors are for automove-grade cameras. The pinouts of the FAKRA connectors are shown below.
Pin Signal
1RIN_P
2GND
Figure 16: FAKRA connector diagram
Table 12: FAKRA connector pinouts
2.12 Power Buon
The VIA Mobile360 L900 comes with a power buon that supports Power On/O. The diagram of the power
buon is shown below.
Figure 17: Power buon diagram

VIA Mobile360 L900 User Manual
12
Power Buon behavior
Power On/O Occurs when the power buon is pressed for longer than 3
seconds.
Table 13: Power buon behavior descripon
2.13 DC-In Jack
The VIA Mobile360 L900 integrates a 4-pole Phoenix DC-in jack that carries a 9V~36V DC external power input.
The pinouts of the 4-pole Phoenix DC-in jack are shown below.
Pin Signal
1DC_IN
2DC_IN
3GND
4GND Figure 18: DC-in jack diagram
Table 14: DC-in jack pinouts
2.14 DC-Out Jack
The VIA Mobile360 L900 integrates a 2-pole Phoenix DC-out jack that provides 12V DC power output. The
pinouts of the 2-pole Phoenix DC-out jack are shown below.
Pin Signal
1DC_OUT1
2GND
Figure 19: DC-out jack diagram
Table 15: DC-out jack pinouts
2.15 Antenna Connectors
The VIA Mobile360 L900 is equipped with four antenna connectors located on the back panel. Two antenna
connectors are for Wi-Fi/BT antennas, while the other two antenna connectors are for 4G and GPS antennas.
The Wi-Fi/BT, 4G and GPS antenna connectors diagrams are shown below.
Figure 20: Wi-Fi /BT antenna connectors diagram