Viglen Vig770S User manual

Vig770S
Motherboard
Manual
C O M P U T E R S N E T W O R K S. S O L U T I O N S

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Viglen, EMC and the ‘CE’ mark
CE Marking
European standards are being harmonised across borders. If products comply with
the same standards in all European countries, product exporting and importing is
made simple - paving our way to a common market. If you buy a product with a 'CE'
mark on it (shown below), on the box, in the manual, or on the guarantee - it complies
with the currently enforced directive(s).
Introduction to EMC
EMC (Electromagnetic Compatibility) is the term used to describe certain issues with
RF (Radio Frequency) energy. Electrical items should not interfere with each other
through RF emissions. E.g. If you turn on your microwave, your television should not
display interference if both items are CE marked to the EMC directive.
If emitted RF energy is not low, it can interfere with other electrical circuitry - E.g. cars
automatic braking systems have become activated by themselves while in a strong
RF field. As this has, obvious repercussions ALL electrical products likely to cause
RF related problems have to be 'CE' marked from 1st January 1996 onwards.
If a product conforms to the EMC directive, not only should its RF emissions be very
low, but also its immunity to RF energy (and other types) should be high. The
apparatus has to resist many 'real world' phenomena such as static shocks and
mains voltage transients.

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Viglen’s Environment laboratory
To gain a 'CE' mark, the Viglen computer range has had to undergo many difficult
tests to ensure it is Electromagnetically Compatible. These are carried out in the in-
house 'Environment lab' at Viglen Headquarters. We have made every effort to
guarantee that each computer leaving our factory complies fully with the correct
standards. To ensure the computer system maintains compliance throughout its
functional life, it is essential you follow these guidelines.
Install the system according to Viglen’s instructions
If you open up your Viglen:
Keep internal cabling in place as supplied.
Ensure the lid is tightly secured afterwards
Do not remove drive bay shields unless installing a 'CE' marked peripheral inits
place
The clips or ‘bumps' around the lips of the case increase conductivity - do not
remove or damage.
Do not remove the ferrite ring from the L.E.Dcables.
Only use your Viglen computer with 'CE' marked peripherals
This system has undergo testing in accordance with European standards for use in
residential and light industrial areas-this specifies a 10-meter testing radius for
emissions and immunity. If you do experience any adverse effects, which you think is
due to your computer, try moving it at least 10 meters away from the affected item. If
you still experience problems, contact Viglen’s Technical Support department who will
put you straight through to an EMC engineer - s/he will do everything possible to help.
Any modifications made to your Viglen computer system, it might breach EMC
regulations. XMA take no responsibility (about EMC characteristics) of equipment that
has been altered or modified.
This symbol on the product or on its packaging indicates that the product
shall not be collection point for recycling of electrical and electronic
equipment. By ensuring this product is disposed of correctly, you will help
prevent potential negative consequences for the environment and human
health. Which must be treated the same household waste. Instead it
should be handed over to the applicable otherwise be caused by
inappropriate waste handling of this product. The recycling of materials
will help to conserve natural resources. For more information about
recycling of this product, please contact your local city office, your
household waste disposal service or XMA Ltd.
Copyrights and Trademarks
Please note - The material in this manual is subject to change without notice.

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Trademarks
Microsoft Windows 10 and MS-DOS are registered trademarks of Microsoft
Corporation. IBM PC, XT, AT and PS/2 are trademarks of International Business
Machines Corporation. Core i3/i5/i7TM and Pentium® are registered trademarks of Intel
® Corporation. Genie, Vig, Viglen, and Omnino are trademarks of XMA Limited.
Copyright and Patents
This manual and all accompanying software and documentation is a copyrighted versions
and all rights reserved. This product, including software and documentation, may not, in
whole or in part, be copied, photocopied, translated or reduced to any electronic or
machine- readable form, without prior written consent except for copies retained by the
purchaser for backup.
© Copyright 2017 XMA Limited
All Rights Reserved
Vig770S Manual Version 1.0
Liability
No warranty or representation, expressed or implied is complied with respect to either
the documentation, its quality, performance, merchantability or fitness for a particular
purpose. As a result, the documentation is licensed, and you, the licensee, are
assuming the entire risk as to its quality and performance. The vendor reserves the
right to revise this operation manual and all accompanying software and
documentation and to make changes in the content without obligation to notify any
person or organisation of the revision or change.
In no event will the vendor be liable for direct, indirect, special, incidental or
consequential damages arising out of the use or inability to use this product or
documentation, even if advised of the possibility of such damages. In particular, the
vendor shall not have liability for any hardware, software or data stored or used with
the product, including the costs of repairing, replacing or recovering such hardware,
software or data.

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Table of Contents
Contents
Viglen, EMC and the ‘CE’ mark ...............................................................................................2
CE Marking ................................................................................................................................2
Introduction to EMC .................................................................................................................2
Viglen’s Environment laboratory ..............................................................................................3
Copyrights and Trademarks....................................................................................................3
Trademarks ...............................................................................................................................4
Copyright and Patents...............................................................................................................4
Liability 4
Chapter 1 Motherboard Overview .................................................................................8
1.1 Introduction......................................................................................................................8
Chapter 2 Motherboard.......................................................................................................9
2.1 Feature Summary................................................................................................................9
2.1.1 Form factor:...........................................................................................................9
2.1.2 Processor: ..............................................................................................................9
2.1.3 Chipset...................................................................................................................9
2.1.4 Memory .................................................................................................................9
2.1.5 Graphics.................................................................................................................9
2.1.6 Audio .....................................................................................................................9
2.1.7 LAN ......................................................................................................................10
2.1.8 SATA ....................................................................................................................10
2.1.9 Expansion Capabilities.........................................................................................10
2.1.10 Rear I/O Ports......................................................................................................10
2.2 System Board Connectors.................................................................................................11
2.2.1 (1) CPU and chassis fan connectors (4-pin CPU_FAN, 4-pin CHA_FAN). ............12
2.2.2 (2) ATX power connectors (24-pin EATXPWR, 4-pin ATX12V) ............................12
2.2.3 (3) M.2 socket 3...................................................................................................12
2.2.4 (4) Intel® LGA1151 CPU socket............................................................................12
2.2.5 (5) DDR4 DIMM slots...........................................................................................12
2.2.6 (6) Intel® B250 Serial ATA .0 GB/s connectors (7-pin SATA6G 1~6). ...................12
2.2.7 (7) USB 3.0 connector (20-1 pin USB3_12 USB3 910) .........................................12
2.2.8 (8) System panel connector (10-1 pin Front Panel) ............................................12
2.2.9 (9) Speaker connector (4-1 pin SPEAKER)............................................................12
2.2.10 (10) Chassis intrusion header (4-1 pin CHASSIS) .................................................13
2.2.11 (11) Clear RTC RAM (2-pin CLRTC) ......................................................................13

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2.2.12 (12) USB 2.0 connector (10-1 pin USB78) ...........................................................13
2.2.13 (13) TPM Connector ............................................................................................13
2.2.1 (14) LPT connector (26-1 pin LPT)........................................................................13
2.2.1 (15) Serial port connectors (10-1 pin COM).........................................................13
2.2.1 (16) Front panel audio connector (10-1 pin AAFP)..............................................13
2.2.1 (17) PCI slot..........................................................................................................14
2.2.1 (18) Mono out header (2-pin MONO_OUT) ........................................................14
2.2.1 (19) PCI Express 3.0/2.0 x1 slots..........................................................................14
2.2.1 (20) PCI Express 3.0/2.0 x16 slot .........................................................................14
2.3 Rear panel connectors...............................................................................................15
2.2.1 (1) PS/2 mouse port (green) ................................................................................15
2.2.2 (2) Video Graphics Adapter (VGA) port. ..............................................................15
2.2.3 (3) Display Port ....................................................................................................15
2.2.4 (4) LAN (RJ-45) port. ............................................................................................15
2.2.5 (5) Line in port (light blue)...................................................................................16
2.2.6 (6) Line Out port (lime). .......................................................................................16
2.2.7 (7) Microphone port (pink). .................................................................................16
2.2.8 (8) USB 2.0 ports..................................................................................................16
2.2.9 (9) USB 3.0 ports..................................................................................................16
2.2.10 (10) HDMI port....................................................................................................17
2.2.11 (11) DVI-D port....................................................................................................17
2.2.12 (12) PS/2 keyboard port (purple). .......................................................................17
Chapter3 –SystemBoardOptions .......................................................................................... 18
3.1 Upgrades ...........................................................................................................................18
3.2 Upgrading the CPU............................................................................................................19
3.3 Connecting the Processor Fan Heat Sink Cable ................................................................23
3.4 Installing & Removing Memory Modules .........................................................................24
3.5 Removing Memory............................................................................................................25
3.6 PCI Express 3.0/2.0 x16 slots.............................................................................................25
3.6 Replacing the CMOS Battery.............................................................................................26
Chapter4 - Solving Problems ..................................................................................... 29
4.1 Technical Support ...........................................................................................................29
4.2 Troubleshooting Procedures...........................................................................................30
4.3 Problems & Suggestions..................................................................................................31
Chapter5 - System BIOS ....................................................................................... 33
5.1 What is the BIOS?..............................................................................................................33
5.2 The Power-On sequence .................................................................................................33
5.3 Managing and updating BIOS..........................................................................................34

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5.3.1 Introduction.............................................................................................................34
5.3.2 BIOS Update Instructions under DOS ......................................................................34
5.4 BIOS Setup Program ........................................................................................................36
5.4.1 Entering BIOS Setup.................................................................................................36
5.4.2 BIOS menu screen....................................................................................................37
5.4.3 BIOS Main Menu selection ......................................................................................38
5.4.4 Main menu ..............................................................................................................39
5.4.5 Air Tweaker menu....................................................................................................42
5.5.5 Advanced Menu Screen ...........................................................................................43
5.5.6 Monitor menu..........................................................................................................48
5.5.7 Boot menu ...............................................................................................................49
BIOS settings for Windows 7 and Windows 10 O/S .........................................................50
5.5.8 Configuring Raid 1 in Bios Program ........................................................................53
EU Declaration of Conformity............................................................................................... 56
Motherboard CE certification ............................................................................................... 56
..........................................................................................................................................57
Chapter6 ............................................................................................................................ 57
6.1Suggestions ......................................................................................................................57
6.2 Questionnaire.................................................................................................................57
6.3 Notes.................................................................................................................................59

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Chapter 1 Motherboard Overview
1.1 Introduction
This manual describes the Viglen Vig770S motherboard inside your computer.
The motherboard is the most important part of your computer. It contains the
CPU, memory and graphics circuitry that make the computer work in the correct
manner.
The Vig770S motherboard is an ATX form factor-offering legacy to premium
features. PS/2 mouse/keyboard combo port, integrated Graphics via VGA, DVI,
DisplayPort and HDMI, High Definition Audio via 3 flexible audio jacks and
integrated 10/100/1000 network connection, as well as 2 USB 2.0 and 4 USB
3.0 ports to enrich your multimedia creation experience.
The Vig770S Motherboard supports 7th generation Intel Core i3, i5, and i7
processors, and is backward compatible with 6th generation Intel Core i3, i5, and
i7 processors as well as being Microsoft Windows 7, 8.1 and Windows 10 WHQL
certified.
This manual contains technical information about the Viglen Vig770S
motherboard and other hardware components inside your computer. If you are
new to computers, we recommend that you read the user guide first. If you are
an experienced computer user, this manual should provide all the information
you will need to perform simple upgrades and maintenance.
We hope that this manual is both readable and informative. If you have any
comments for suggestions about how we could improve the format, then please
fill out the form at the back of the manual and send it to us.
Above all, we hope that you enjoy using your Viglen computer.

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Chapter 2 Motherboard
2.1 Feature Summary
2.1.1 Form factor:
MicroATX Form Factor 9.6 x 9.6 in (244 x 244 mm).
2.1.2 Processor:
Intel® for 7th Generation Core™ i7/Core™ i5/Core™
i3/Pentium®/Celeron® Processors
Intel® for 6th Generation Core™ i7/Core™ i5/Core™
i3/Pentium®/Celeron® Processors
Supports Intel® 14 nm CPU
Supports Intel® Turbo Boost Technology 2.0
The Intel® Turbo Boost Technology 2.0 support depends on the CPUtypes.
2.1.3 Chipset
Intel® B250 Chipset
2.1.4 Memory
4x DIMM, Max. 64GB, DDR4 2400/2133 MHz Non-ECC, Un-buffered
Memory
2.1.5 Graphics
Integrated Graphics Processor- Intel® HD Graphics support
Multi-VGA output support: HDMI/DVI-D/RGB ports
- Supports HDMI with max. resolution 4096 x 2160 @ 24 Hz /
2560 x 1600 @ 60 Hz
- Supports DVI-D with max. resolution 1920 x 1200 @ 60 Hz
- Supports DisplayPort with max. resolution 4096 x 2304 @ 60
Hz
- Supports RGB with max. resolution 1920 x 1200 @ 60 Hz
Maximum shared memory of 1024 MB
Supports Intel® InTru™ 3D, Quick Sync Video, Clear Video
HD Technology, Insider™
Supports up to 3 displays simultaneously
2.1.6 Audio
Realtek® ALC887 8-Channel High Definition Audio CODEC *1
Supports: Jack-detection, Front Panel Jack-re-tasking

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2.1.7 LAN
Intel® 1219LM 1 x Gigabit LAN Controller(s)
2.1.8 SATA
6 x SATA 6Gb/s connector(s)
Internal Connectors
1 x USB 3.0 connector(s) support(s) additional 4 USB 3.0 port(s)
2 x USB 2.0 connector(s) support(s) additional 2 USB 2.0 port(s)
2 x COM port(s) connector(s)
6 x SATA 6Gb/s connector(s)
1 x CPU Fan connector(s) (1 x 4 -pin)
2 x Chassis Fan connector(s) (1 x 4 -pin)
1 x 24-pin EATX Powerconnector(s)
1 x 8-pin ATX 12V Power connector(s)
1 x Front panel audio connector(s) (AAFP)
1 x Internal speaker connector(s)
1 x System panel(s)
1 x Clear CMOS jumper(s)
2.1.9 Expansion Capabilities
1 x PCI Express 3.0/2.0 x16
2.1.10 Rear I/O Ports
1 x PS/2 keyboard/mouse combo port(s)
1 x DVI-D
1 x Display port
1 x D-Sub
1 x HDMI
1 x LAN (RJ45) port(s)
4 x USB 3.0 (blue)
2 x USB 2.0
3 x Audio jack(s)

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2.2 System Board Connectors
Figure 1: System Board Components
1
CPU and chassis fan connectors (4-pin
CPU_FAN, 4-pin CHA_FAN1/2)
9
Speaker connector (4-pin SPEAKER)
2
ATX power connectors (24-pin EATXPWR,
8-pin ATX12V)
10
Chassis intrusion header (4-1 pin
CHASSIS)
3
M.2 socket 3
11
Clear RTC RAM (2-pin CLRTC)
4
Intel® LGA1151 CPU socket
12
USB 2.0 connector (10-1 pin USB78
5
DDR4 DIMM slots
13
TPM Connector
6
Intel® B250 Serial ATA 6.0Gb/s connectors
(7-pin SATA6G_1~6)
14
LPT connector (26-1 pin LPT)
7
USB 3.0 connectors (20-1 pin USB3_12,
USB3_910)
15
Serial port connectors (10-1 pin COM)
8
System panel connector (10-1 pin F_PANEL)
16
Front panel audio connector (10-1 pin
AAFP)
17
PCI slot
18
Mono out header (2-pin MONO_OUT)
19
PCI Express 3.0/2.0 x1 slots
20
PCI Express 3.0/2.0 x16 slot
Table 1: System Board Components

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2.2.1 (1) CPU and chassis fan connectors (4-pin CPU_FAN, 4-pin CHA_FAN).
Connect the fan cables to the fan connectors on the motherboard, ensuring that the
black wire of each cable matches the ground pin of the connector.
NOTE: Do not forget to connect the fan cables to the fan connectors. Insufficient airflow inside
the system may damage the motherboard components. These are not jumpers! Do not place
jumper caps on the fan connectors! The CPU_FAN connector supports a CPU fan of maximum
1A (12 W) fan power.
2.2.2 (2) ATX power connectors (24-pin EATXPWR, 4-pin ATX12V)
Correctly orient the ATX power supply plugs into these connectors and push down
firmly until the connectors completely fit.
NOTE: For a fully configured system, we recommend that you use a power supply unit (PSU) that
complies with ATX 12 V Specification 2.0 (or later version) and provides a minimum power of 350 W.
2.2.3 (3) M.2 socket 3
l These sockets allow you to install an M.2 (NGFF) SSD module.
2.2.4 (4) Intel® LGA1151 CPU socket
Install Intel® LGA1151 CPU into this surface mount LGA1151 socket, which is designed
for sixth Generation Intel® Core™ i7 / i5 / i3, Pentium®, and Celeron® processors.
2.2.5 (5) DDR4 DIMM slots
This motherboard comes with four Double Data Rate 4 (DDR4) Dual Inline Memory
Module (DIMM) sockets. A DDR4 module is notched different from a DDR, DDR2,
or DDR3 module. Install 2 GB, 4 GB, 8 GB, and 16 GB un-buffered non-ECC DDR4
DIMMs into these DIMM sockets.
2.2.6 (6) Intel® B250 Serial ATA .0 GB/s connectors (7-pin SATA6G 1~6).
These connectors connect to Serial ATA 6.0 Gb/s hard disk drives via Serial ATA 6.0
Gb/s signal cables
2.2.7 (7) USB 3.0 connector (20-1 pin USB3_12 USB3 910)
Connect a USB 3.0 module to any of these connectors for additional USB 3.0 front
or rear panel ports. These connectors comply with USB 3.0 specifications and
provide faster data transfer speeds of up to 5Gbps, faster charging time for USB-
chargeable devices, optimized power efficiency, and backward compatibility with
USB 2.0.
2.2.8 (8) System panel connector (10-1 pin Front Panel)
This connector supports several chassis-mounted functions.
2.2.9 (9) Speaker connector (4-1 pin SPEAKER)
The 4-pin connector is for the chassis-mounted system-warning speaker. The speaker
allows you to hear system warnings.

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2.2.10 (10) Chassis intrusion header (4-1 pin CHASSIS)
This header is for a chassis-mounted intrusion detection sensor or switch.
Connect one end of the chassis intrusion sensor or switch cable to this
connector. The chassis intrusion sensor or switch sends a high-level signal to this
connector when chassis components, are removed or replaced. The signal is,
generated as a chassis intrusion event.
2.2.11 (11) Clear RTC RAM (2-pin CLRTC)
This header allows you to dis-configure ME and clear the CMOS RTC RAM data of the
system setup information such as date, time, and system passwords.
To erase the RTC RAM:
1. Turn OFF the computer and unplug the power cord.
2. Use a metal object such as a screwdriver to short the two pins.
3. Plug the power cord and turn ON the computer.
4. Hold down the <Del> key during the boot process and enter BIOS setup to re-
enter data.
NB: If the steps above do not help, remove the on-board battery and short the two pins again to clear
the CMOS RTC RAM data. After clearing the CMOS, reinstall the battery.
2.2.12 (12) USB 2.0 connector (10-1 pin USB78)
Connect the USB module cable to this connector; install the module to a slot opening at
the back of the system chassis. This USB connector complies with USB 2.0
specifications and supports up to 480Mbps connection speed.
2.2.13 (13) TPM Connector
This header allows you to connect a Trusted Platform module.
2.2.1 (14) LPT connector (26-1 pin LPT)
The LPT (Line Printing Terminal) connector supports devices such as a printer.
LPT standardizes as IEEE 1284, which is the parallel port interface on IBM PC-
compatible computers.
2.2.1 (15) Serial port connectors (10-1 pin COM)
Connect the serial port module cable to these connectors, and then install the
module to a slot opening at the back of the system chassis.
2.2.1 (16) Front panel audio connector (10-1 pin AAFP)
This connector is for a chassis-mounted front panel audio I/O module that supports HD
Audio standard. Connect one end of the front panel audio I/O module cable to this
connector.
NB: We recommend that you connect a high-definition front panel audio module to this
connector to avail of the motherboard’s high-definition audio capability.

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2.2.1 (17) PCI slot.
The PCI slot supports cards such as a LAN card, SCSI card, USB card, and other cards
that comply with PCI specifications.
2.2.1 (18) Mono out header (2-pin MONO_OUT)
This internal mono out header allows connection to an internal, low power speaker for
basic system sound capability. The subsystem is capable of driving a speaker load of 2
Ohms at 2 Watts (rms).
2.2.1 (19) PCI Express 3.0/2.0 x1 slots
This motherboard supports two PCI Express x1 network cards, SCSI cards, and other
cards that comply with the PCI Express specifications.
2.2.1 (20) PCI Express 3.0/2.0 x16 slot
This motherboard has a PCI Express 3.0/2.0 x16 slot that supports PCI Express 3.0/2.0
x16 graphic cards complying with the PCI Express specifications.
IRQ assignments for this motherboard
When using PCI cards on shared slots, ensure that the drivers support “Share IRQ” or
that the cards do not need IRQ assignments. Otherwise, conflicts will arise between the
two PCI groups, making the system unstable and the card inoperable.
A
B
C
D
HD Audio
Shared
-
-
-
XHCI Controller
Shared
-
-
-
SATA Controller
Shared
-
-
-
LAN1 l219LM
Shared
-
-
-
PCIEx16
Shared
-
-
-
PCIEx1 1
-
-
Shared
-
PCIEx1 2
-
-
-
Shared
PCI1
-
Shared
-
-
M.2_1
Shared
-
-
-
M.2_2
Shared
-
-
-

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2.3 Rear panel connectors
Figure 2: Rear panel connectors
Table 3: Rear panel connectors
2.2.1 (1) PS/2 mouse port (green)
This port is for a PS/2 mouse.
2.2.2 (2) Video Graphics Adapter (VGA) port.
This 15-pin port is for a VGA monitor or other VGA-compatible devices
2.2.3 (3) Display Port
This port is for display compatible devices
2.2.4 (4) LAN (RJ-45) port.
LAN (RJ-45) port. This port allows Gigabit connection to a Local Area Network (LAN)
through a network hub.
LAN port LED indications
1
PS/2 mouse port (green).
7
Microphone port (pink)
2
Video Graphics Adapter (VGA) port.
8
USB 2.0 ports
3
Display port
9
USB 3.0 ports
4
LAN (RJ-45) port.
10
HDMI port.
5
Line In port (light blue).
11
DVI-D port
6
Line Out port (lime).
12
PS/2 keyboard port (purple).

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Activity/Link LED
Speed LED
Status
Description
Status
Description
Off
No link
OFF
10Mbps connection
Orange
Linked
ORANGE
100Mbps connection
Orange
Data activity
GREEN
1Gbps connection
(Blinking)
Orange (Blinking
then steady)
Ready to wake up
from S5 mode
_
_
2.2.5 (5) Line in port (light blue).
This port connects to the tape, CD, DVD player, or other audio sources.
2.2.6 (6) Line Out port (lime).
This port connects to a headphone or a speaker. In the 4.1, 5.1 and 7.1-channel
configurations, the function of this port becomes Front Speaker Out.
2.2.7 (7) Microphone port (pink).
This port connects to a microphone.
Refer to the audio configuration table for the function of the audio ports in 2.1, 4.1,
5.1, or 7.1-channel configuration.
Audio 2.1, 4.1, 5.1, or 7.1-channel configuration
Port
Headset
2.1-
channel
4.1-channel
5.1-channel
7.1-channel
Light Blue (Rear panel)
Line In
Rear Speaker
Out
Rear Speaker
Out
Rear Speaker
Out
Lime (Rear panel)
Line Out
Front
Speaker Out
Front Speaker
Out
Front Speaker
Out
Pink (Rear panel)
Mic In
Mic In
Bass/Center
Bass/Center
Lime (Front panel)
-
-
-
Side Speaker
To configure a 7.1-channel audio output:
Use a chassis with HD audio module in the front panel to support a 7.1-channel
audio output.
2.2.8 (8) USB 2.0 ports.
These 4-pin Universal Serial Bus (USB) ports are for USB 2.0, 1.1 devices.
2.2.9 (9) USB 3.0 ports.
These 9-pin Universal Serial Bus (USB) ports are for USB 3.0, 2.0 devices.

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NB:
USB 3.0 devices used for data storage.
We strongly recommend that you connect USB 3.0 devices to USB 3.0 ports for
faster and better performance from your USB 3.0 devices.
Due to the design of the Intel® 200 series chipset, the xHCI controller controls all
USB devices connected to the USB 2.0 and USB 3.0 ports. Some legacy USB
devices must update their firmware for better compatibility.
2.2.10 (10) HDMI port.
This port is for a High-Definition Multimedia Interface (HDMI) connector, and is HDCP
compliant allowing playback of HD DVD, Blu-Ray, and other protected content.
2.2.11 (11) DVI-D port.
This port is for any DVI-D compatible device.
NB: DVI-D cannot be converted to output from RGB Signal to CRT and is not
compatible with DVI-I.
2.2.12 (12) PS/2 keyboard port (purple).
This port is for a PS/2 keyboard.

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Chapter3 –SystemBoardOptions
3.1 Upgrades
The Vig770s motherboard is supports Intel® Core i3, i5, i7 and Pentium processors in the
LGA1151 socket. RAM support up to a maximum of 64GB using DDR4 2400/2133MHz Non
ECC Un-buffered DIMMs.
WARNING!
Unplug the system before carrying out the procedures described in this chapter.
Failure to disconnect power before you open the system can result in personal
injury or equipment damage. Hazardous voltage, current, and energy levels are
present in this product. Power switch terminals can have hazardous Voltages
present even when the power switch is off.
The procedures assume familiarity with the general terminology associated with
personal computers and with the safety practices and regulatory compliance
required for using and modifying electronic equipment.
Do not operate the system with the cover removed. Always replace the cover
before turning on the system.
As the colours of the wires in the mains, lead of this computer may not correspond with the
coloured markings identifying the terminals in your plug precede as follows:
The green-and-yellow wire must connect to the terminal. in the plug, which is marked by the
letter E or by the safety Earth symbol Q or coloured green or green- and-yellow.
The wire, which is coloured blue, connects to the terminal, which is marked with the letter N
or coloured black.
The wire, which is coloured brown, connects to the terminal, which is marked with the letter L
or coloured red.
CAUTION!
The Viglen Vig770S motherboard and
associated components are sensitive electronic
devices. A small static shock from your bodycan
cause expensive damage to yourequipment.

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Make sure you are earthed and free of static charge before you open the computer case.
If you are unsure about upgrading your computer, return it to Viglen so a qualified
engineer can perform the upgrade.
Steps to take to prevent static discharge:
The best way to prevent static discharge is to buy an anti-static strap from your local
electrical shop. While you are wearing the strap and is grounded. Static charge will be
harmlessly when grounded.
Do not remove the component from its anti-static protective packaging until you are
about to install it.
Hold boards by the edges - try not to touch components / interface stripsetc.
NOTE: We recommend that you return your computer to the service department for
upgrading. Person who is familiar with handling should only carry out upgrades. As
incorrect installation will invalidate the guarantee.
3.2 Upgrading the CPU
CAUTION!
Before installing or removing a processor, make sure the AC power is disconnected. By
unplugging the power, cord from the computer the standby power LED should not light
up. Failure to do so could damage the processor and the board. To install a processor,
follow these instructions:
Unlatch the processor socket lever by pushing it down and away from the socket.
Figure 4: Unlatch the socket lever

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Rotate the socket lever to lift the load plate away from the socket (Figure 5, A). Make
sure that the load plate is in the fully open position (Figure 5, B) while being careful not
to damage adjacent components. Do not touch the socket contacts.
Figure 5: Lift the load plate
Remove the processor from its protective cover. Hold the processor only at the edges,
being careful not to touch the bottom of the processor (see Figure 6).
Figure 6: Remove the processor from the protective cover Remove the processor from
the protective cover
Note: Do not discard the processor cover. Always replace the processor cover if you
remove the processor from the socket.