YASKAWA SLIO User manual

IM | 053-1EC01 | Manual
HB300 | IM | 053-1EC01 | en | 22-30
System SLIO
Interface module EtherCAT - IM 053EC

053-1EC01_000_IM 053EC,7,EN - © 2022
YASKAWA Europe GmbH
Hauptstraße 185
65760 Eschborn
Germany
Tel.: +49 6196 569-300
Fax: +49 6196 569-398
Email: [email protected]
Internet: www.yaskawa.eu.com

Table of contents
1 General.................................................................................................................... 5
1.1 Copyright © YASKAWA Europe GmbH............................................................ 5
1.2 About this manual............................................................................................. 6
1.3 Safety information............................................................................................. 7
2 Basics and mounting............................................................................................. 8
2.1 Safety information for users.............................................................................. 8
2.2 System conception........................................................................................... 9
2.2.1 Overview........................................................................................................ 9
2.2.2 Components................................................................................................ 10
2.2.3 Accessories................................................................................................. 13
2.2.4 Hardware revision........................................................................................ 15
2.3 Dimensions..................................................................................................... 15
2.4 Mounting bus coupler..................................................................................... 18
2.5 Wiring............................................................................................................. 20
2.5.1 Wiring bus coupler....................................................................................... 20
2.5.2 Wiring 8x periphery modules....................................................................... 23
2.5.3 Wiring 16x periphery modules..................................................................... 25
2.5.4 Wiring power modules................................................................................. 26
2.6 Demounting.................................................................................................... 30
2.6.1 Demounting bus coupler.............................................................................. 30
2.6.2 Demounting 8x periphery modules.............................................................. 32
2.6.3 Demounting 16x periphery modules............................................................ 35
2.7 Trouble shooting - LEDs................................................................................. 38
2.8 Industrial security and installation guidelines................................................. 39
2.8.1 Industrial security in information technology................................................ 39
2.8.2 Installation guidelines.................................................................................. 41
2.9 General data for the System SLIO................................................................. 43
2.9.1 Use in difficult operating conditions............................................................. 45
3 Hardware description........................................................................................... 46
3.1 Properties....................................................................................................... 46
3.2 Structure......................................................................................................... 47
3.2.1 Interfaces..................................................................................................... 47
3.2.2 Address switch............................................................................................ 49
3.2.3 LEDs............................................................................................................ 49
3.3 Address area.................................................................................................. 50
3.4 Technical data................................................................................................. 51
4 Deployment........................................................................................................... 53
4.1 Basics EtherCAT............................................................................................ 53
4.1.1 General........................................................................................................ 53
4.1.2 EtherCAT State Machine............................................................................. 55
4.1.3 CoE - CANopen over Ethernet.................................................................... 56
4.1.4 EoE - Ethernet over EtherCAT.................................................................... 56
4.1.5 ESI files....................................................................................................... 56
4.2 Setting the HotConnect address..................................................................... 57
4.2.1 HotConnect via Explicit Device ID............................................................... 57
4.2.2 HotConnect via Configured Station Alias.................................................... 58
4.3 Operating Mode - Normal/Enhanced mode.................................................... 58
System SLIO Table of contents
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4.4 Synchronization modes.................................................................................. 59
4.5 Accessing the System SLIO........................................................................... 60
4.5.1 General........................................................................................................ 60
4.5.2 Accessing the I/O area in the master system.............................................. 60
4.5.3 Accessing the I/O area................................................................................ 61
4.5.4 Accessing parameter data........................................................................... 65
4.5.5 FMM - Free module mapping...................................................................... 66
4.5.6 Easy Maintenance....................................................................................... 72
4.5.7 Access to module information..................................................................... 74
4.5.8 Accessing diagnostics data......................................................................... 75
4.6 Accessing the web server via Ethernet ......................................................... 78
4.6.1 Web server.................................................................................................. 78
4.7 Data transfer via PDO and SDO..................................................................... 81
4.8 Variable PDO mapping via SDO..................................................................... 81
4.9 Object Dictionary............................................................................................ 82
4.10 Error handling............................................................................................. 105
4.10.1 Overview.................................................................................................. 105
4.10.2 Emergency error message...................................................................... 106
4.10.3 Standard error messages ....................................................................... 106
4.10.4 SDO error code....................................................................................... 108
4.11 Firmware update......................................................................................... 110
4.12 Replace EtherCAT slave 053-1EC00 with 053-1EC01............................... 111
Appendix............................................................................................................. 114
A History of changes........................................................................................... 116
System SLIO
Table of contents
HB300 | IM | 053-1EC01 | en | 22-30 4

1 General
1.1 Copyright © YASKAWA Europe GmbH
This document contains proprietary information of Yaskawa and is not to be disclosed or
used except in accordance with applicable agreements.
This material is protected by copyright laws. It may not be reproduced, distributed, or
altered in any fashion by any entity (either internal or external to Yaskawa) except in
accordance with applicable agreements, contracts or licensing, without the express
written consent of Yaskawa and the business management owner of the material.
For permission to reproduce or distribute, please contact: YASKAWA Europe GmbH,
European Headquarters, Hauptstraße 185, 65760 Eschborn, Germany
Tel.: +49 6196 569 300
Fax.: +49 6196 569 398
Email: [email protected]
Internet: www.yaskawa.eu.com
Hereby, YASKAWA Europe GmbH declares that the products and systems are in compli-
ance with the essential requirements and other relevant provisions. Conformity is indi-
cated by the CE marking affixed to the product.
For more information regarding CE marking and Declaration of Conformity (DoC), please
contact your local representative of YASKAWA Europe GmbH.
SLIO and SPEED7 are registered trademarks of YASKAWA Europe GmbH.
EtherCAT is a registered trademark of Beckhoff Automation GmbH.
S7 is a registered trademark of Siemens AG.
All other trademarks, logos and service or product marks specified herein are owned by
their respective companies.
Every effort has been made to ensure that the information contained in this document
was complete and accurate at the time of publishing. We cannot guarantee that the infor-
mation is free of errors, and we reserve the right to change the information at any time.
There is no obligation to inform the customer about any changes. The customer is
requested to actively keep his documents up to date. The customer is always responsible
for the deployment of the products with the associated documentation, taking into
account the applicable directives and standards.
This documentation describes all hardware and software units and functions known
today. It is possible that units are described that do not exist at the customer. The exact
scope of delivery is described in the respective purchase contract.
Contact your local representative of YASKAWA Europe GmbH if you have errors or ques-
tions regarding the content of this document. You can reach YASKAWA Europe GmbH via
the following contact:
Email: [email protected]
All Rights Reserved
EC conformity declaration
Conformity Information
Trademarks
General terms of use
Document support
System SLIO General
Copyright © YASKAWA Europe GmbH
HB300 | IM | 053-1EC01 | en | 22-30 5

Contact your local representative of YASKAWA Europe GmbH if you encounter problems
or have questions regarding the product. If such a location is not available, you can reach
the Yaskawa customer service via the following contact:
YASKAWA Europe GmbH,
European Headquarters, Hauptstraße 185, 65760 Eschborn, Germany
Tel.: +49 6196 569 500 (hotline)
Email: [email protected]
1.2 About this manual
This manual describes the IM 053EC of the System SLIO.
nIt describes the structure, configuration and application.
nThe manual is targeted at users who have a background in automation technology.
nThe manual consists of chapters. Each chapter describes a completed topic.
nFor guidance, the manual provides:
– An overall table of contents at the beginning of the manual.
– References with pages numbers.
Validity of the documentation
Product Order no. as of state:
IM 053EC 053-1EC01 HW: 01 FW: V2.0.0
Important passages in the text are highlighted by following icons and headings:
DANGER!
Immediate or likely danger. Personal injury is possible.
CAUTION!
Damages to property is likely if these warnings are not heeded.
Supplementary information and useful tips.
Technical support
Objective and contents
Icons Headings
System SLIO
General
About this manual
HB300 | IM | 053-1EC01 | en | 22-30 6

1.3 Safety information
The system is constructed and produced for:
ncommunication and process control
ngeneral control and automation tasks
nindustrial applications
noperation within the environmental conditions specified in the technical data
ninstallation into a cubicle
DANGER!
This device is not certified for applications in
–in explosive environments (EX-zone)
The manual must be available to all personnel in the
nproject design department
ninstallation department
ncommissioning
noperation
CAUTION!
The following conditions must be met before using or commis-
sioning the components described in this manual:
– Hardware modifications to the process control system should only be
carried out when the system has been disconnected from power!
– Installation and hardware modifications only by properly trained per-
sonnel.
– The national rules and regulations of the respective country must be
satisfied (installation, safety, EMC ...)
National rules and regulations apply to the disposal of the unit!
Applications conforming
with specifications
Documentation
Disposal
System SLIO General
Safety information
HB300 | IM | 053-1EC01 | en | 22-30 7

2 Basics and mounting
2.1 Safety information for users
The modules make use of highly integrated components in MOS-Technology. These com-
ponents are extremely sensitive to over-voltages that can occur during electrostatic dis-
charges. The following symbol is attached to modules that can be destroyed by electro-
static discharges.
The Symbol is located on the module, the module rack or on packing material and it indi-
cates the presence of electrostatic sensitive equipment. It is possible that electrostatic
sensitive equipment is destroyed by energies and voltages that are far less than the
human threshold of perception. These voltages can occur where persons do not dis-
charge themselves before handling electrostatic sensitive modules and they can damage
components thereby, causing the module to become inoperable or unusable. Modules
that have been damaged by electrostatic discharges can fail after a temperature change,
mechanical shock or changes in the electrical load. Only the consequent implementation
of protection devices and meticulous attention to the applicable rules and regulations for
handling the respective equipment can prevent failures of electrostatic sensitive modules.
Modules must be shipped in the original packing material.
When you are conducting measurements on electrostatic sensitive modules you should
take the following precautions:
nFloating instruments must be discharged before use.
nInstruments must be grounded.
Modifying electrostatic sensitive modules you should only use soldering irons with
grounded tips.
CAUTION!
Personnel and instruments should be grounded when working on electro-
static sensitive modules.
Handling of electrostatic
sensitive modules
Shipping of modules
Measurements and altera-
tions on electrostatic sen-
sitive modules
System SLIO
Basics and mounting
Safety information for users
HB300 | IM | 053-1EC01 | en | 22-30 8

2.2 System conception
2.2.1 Overview
The System SLIO is a modular automation system for assembly on a 35mm mounting
rail. By means of the periphery modules with 2, 4, 8 and 16 channels this system may
properly be adapted matching to your automation tasks. The wiring complexity is low,
because the supply of the DC 24V power section supply is integrated to the backplane
bus and defective modules may be replaced with standing wiring. By deployment of the
power modules in contrasting colors within the system, further isolated areas may be
defined for the DC 24V power section supply, respectively the electronic power supply
may be extended with 2A.
System SLIO Basics and mounting
System conception > Overview
HB300 | IM | 053-1EC01 | en | 22-30 9

2.2.2 Components
nCPU (head module)
nBus coupler (head module)
nLine extension
n8x periphery modules
n16x periphery modules
nPower modules
nAccessories
CAUTION!
Only Yaskawa modules may be combined. A mixed operation with third-
party modules is not allowed!
With the CPU 01xC electronic, input/output components and power supply are integrated
to one casing. In addition, up to 64 periphery modules of the System SLIO can be con-
nected to the backplane bus. As head module via the integrated power module for power
supply CPU electronic and the I/O components are supplied as well as the electronic of
the periphery modules, which are connected via backplane bus. To connect the power
supply of the I/O components and for DC 24V power section supply of via backplane bus
connected periphery modules, the CPU has removable connectors. By installing of up to
64 periphery modules at the backplane bus, these are electrically connected, this means
these are assigned to the backplane bus, the electronic modules are power supplied and
each periphery module is connected to the DC 24V power section supply.
With this CPU 01x, CPU electronic and power supply are integrated to one casing. As
head module, via the integrated power module for power supply, CPU electronic and the
electronic of the connected periphery modules are supplied. The DC 24V power section
supply for the linked periphery modules is established via a further connection of the
power module. By installing of up to 64 periphery modules at the backplane bus, these
are electrically connected, this means these are assigned to the backplane bus, the elec-
tronic modules are power supplied and each periphery module is connected to the DC
24V power section supply.
CAUTION!
CPU part and power module may not be separated!
Here you may only exchange the electronic module!
CPU 01xC
CPU 01x
System SLIO
Basics and mounting
System conception > Components
HB300 | IM | 053-1EC01 | en | 22-30 10

With a bus coupler bus interface and power module is integrated to one casing. With the
bus interface you get access to a subordinated bus system. As head module, via the inte-
grated power module for power supply, bus interface and the electronic of the connected
periphery modules are supplied. The DC 24V power section supply for the linked
periphery modules is established via a further connection of the power module. By instal-
ling of up to 64 periphery modules at the bus coupler, these are electrically connected,
this means these are assigned to the backplane bus, the electronic modules are power
supplied and each periphery module is connected to the DC 24V power section supply.
CAUTION!
Bus interface and power module may not be separated!
Here you may only exchange the electronic module!
In the System SLIO there is the possibility to place up to 64 modules in on line. By means
of the line extension you can divide this line into several lines. Here you have to place a
line extension master at each end of a line and the subsequent line has to start with a line
extension slave. Master and slave are to be connected via a special connecting cable. In
this way, you can divide a line on up to 5 lines. For each line extension the maximum
number of pluggable modules at the System SLIO bus is decreased by 1. To use the line
extension no special configuration is required.
Please note that some modules do not support line extensions due to the
system. For more information, see the ‘System SLIO - Compatibility List’
at www.yaskawa.eu.com
The periphery modules are available in the following 2 versions, whereby of each the
electronic part can be replaced with standing wiring:
n8x periphery module for a maximum of 8 channels.
n16x periphery module for a maximum of 16 channels.
Bus coupler
Line extension
Periphery modules
System SLIO Basics and mounting
System conception > Components
HB300 | IM | 053-1EC01 | en | 22-30 11

Each 8x periphery module consists of a terminal and an electronic module.
1 Terminal module
2 Electronic module
The terminal module serves to carry the electronic module, contains the backplane bus
with power supply for the electronic, the DC 24V power section supply and the staircase-
shaped terminal for wiring. Additionally the terminal module has a locking system for
fixing at a mounting rail. By means of this locking system your system may be assembled
outside of your switchgear cabinet to be later mounted there as whole system.
The functionality of a periphery module is defined by the electronic module, which is
mounted to the terminal module by a sliding mechanism. With an error the defective elec-
tronic module may be exchanged for a functional module with standing installation. At the
front side there are LEDs for status indication. For simple wiring each module shows cor-
responding connection information at the front and at the side.
Each 16x periphery module consists of an electronic unit and a terminal block.
1
2
1 Electronic unit
2 Terminal block
8x periphery modules
Terminal module
Electronic module
16x periphery modules
System SLIO
Basics and mounting
System conception > Components
HB300 | IM | 053-1EC01 | en | 22-30 12

The functionality of a 16x periphery module is defined via the terminal block, which is
connected to the electronic unit via a secure flap mechanism. In the case of an error you
can exchange the defective electronic unit for a functional unit with standing wiring. At the
front side there are LEDs for status indication. For easy wiring each electronic unit shows
corresponding connection information at the side. The electronic unit provides the slot for
the terminal block for the wiring and contains the backplane bus with power supply for the
electronic and the connection to the DC 24V power section supply. Additionally the elec-
tronic unit has a locking system for fixing it at a mounting rail. By means of this locking
system your system may be assembled outside of your switchgear cabinet to be later
mounted there as whole system.
The terminal block provides the electrical interface for the signalling and supplies lines of
the module. When mounting the terminal block, it is attached to the bottom of the elec-
tronic unit and turned towards the electronic unit until it clicks into place. With the wiring a
"push-in" spring-clip technique is used. This allows a quick and easy connection of your
signal and supply lines. The clamping off takes place by means of a screwdriver.
In the System SLIO the power supply is established by power modules. These are either
integrated to the head module or may be installed between the periphery modules.
Depending on the power module isolated areas of the DC 24V power section supply may
be defined respectively the electronic power supply may be extended with 2A. For better
recognition the colour of the power modules are contrasting to the periphery modules.
2.2.3 Accessories
Please note that a shield bus carrier cannot be mounted on a 16x
periphery module!
The shield bus carrier (order no.: 000-0AB00) serves to carry the shield bus (10mm x
3mm) to connect cable shields. Shield bus carriers, shield bus and shield fixings are not
in the scope of delivery. They are only available as accessories. The shield bus carrier is
mounted underneath the terminal of the terminal module. With a flat mounting rail for
adaptation to a flat mounting rail you may remove the spacer of the shield bus carrier.
Electronic unit
Terminal block
Power module
Shield bus carrier
System SLIO Basics and mounting
System conception > Accessories
HB300 | IM | 053-1EC01 | en | 22-30 13

With each head module, to protect the backplane bus connectors, there is a mounted bus
cover in the scope of delivery. You have to remove the bus cover of the head module
before mounting a System SLIO module. For the protection of the backplane bus con-
nector you always have to mount the bus cover at the last module of your system again.
The bus cover has the order no. 000-0AA00.
Please note that a coding pin cannot be installed on a 16x periphery
module! Here you have to make sure that the associated terminal block is
plugged again when the electronics unit is replaced.
There is the possibility to fix the assignment of electronic and terminal module. Here
coding pins (order number 000-0AC00) can be used. The coding pin consists of a coding
jack and a coding plug. By combining electronic and terminal module with coding pin, the
coding jack remains in the electronic module and the coding plug in the terminal module.
This ensures that after replacing the electronic module just another electronic module can
be plugged with the same encoding.
Bus cover
Coding pins
System SLIO
Basics and mounting
System conception > Accessories
HB300 | IM | 053-1EC01 | en | 22-30 14

2.2.4 Hardware revision
nThe hardware revision is printed on every System SLIO module.
nSince a System SLIO 8x periphery module consists of a terminal and electronic
module, you will find a hardware revision printed on each of them.
nAuthoritative for the hardware revision of a System SLIO module is the hardware revi-
sion of the electronic module. This is located under the labeling strip of the corre-
sponding electronic module.
nDepending on the module type, there are the following 2 variants e.g. to indicate
hardware revision 1:
–Current modules have a
1
on the front.
–With earlier modules, the 1 is marked with ‘X’ on a number grid.
X 2
43 X 2
43
X 2
43
X 2
43
X2
43
11
1
1
On the CPUs and some bus couplers, you can check the hardware revision ‘HW
Revision’ via the integrated web server.
2.3 Dimensions
All dimensions are in mm.
Hardware revision on the
front
Hardware revision via web
server
CPU 01xC
System SLIO Basics and mounting
Dimensions
HB300 | IM | 053-1EC01 | en | 22-30 15

CPU 01x
Bus coupler and line
extension slave
Line extension master
System SLIO
Basics and mounting
Dimensions
HB300 | IM | 053-1EC01 | en | 22-30 16

104
109
76.5 15
12.9
8x periphery module
Electronic module
16x periphery module
System SLIO Basics and mounting
Dimensions
HB300 | IM | 053-1EC01 | en | 22-30 17

2.4 Mounting bus coupler
Requirements for UL compliance use
–Use for power supply exclusively SELV/PELV power supplies.
–The System SLIO must be installed and operated in a housing
according to IEC 61010-1 9.3.2 c).
There are locking lever at the top side of the bus coupler. For mounting and demounting
these locking lever are to be turned upwards until these engage. Place the bus coupler at
the mounting rail. The bus coupler is fixed to the mounting rail by pushing downward the
locking levers. The bus coupler is directly mounted at a mounting rail. Up to 64 modules
may be mounted. The electronic and power section supply are connected via the back-
plane bus. Please consider here that the sum current of the electronic power supply does
not exceed the maximum value of 3A. By means of the power module 007-1AB10 the
current of the electronic power supply may be expanded accordingly.
Clack
80mm80mm
60mm 65mm
1. Mount the mounting rail! Please consider that a clearance from the middle of the
mounting rail of at least 80mm above and 60mm below, respectively 80mm by
deployment of shield bus carriers, exist.
Proceeding
System SLIO
Basics and mounting
Mounting bus coupler
HB300 | IM | 053-1EC01 | en | 22-30 18

2. Turn the locking lever upwards, place the bus coupler at the mounting rail and turn
the lever downward.
The procedure is identical for 8x and 16x periphery modules.
1. Before mounting the periphery modules you have to remove the bus cover at the
right side of the bus coupler by pulling it forward. Keep the cover for later mounting.
Clack
2. Mount the periphery modules you want.
Mounting periphery
modules
System SLIO Basics and mounting
Mounting bus coupler
HB300 | IM | 053-1EC01 | en | 22-30 19

3. After mounting the whole system, to protect the backplane bus connectors at the
last module you have to mount the bus cover, now. If the last module is a clamp
module, for adaptation the upper part of the bus cover is to be removed.
2.5 Wiring
CAUTION!
Consider temperature for external cables!
Cables may experience temperature increase due to system heat dissi-
pation. Thus the cabling specification must be chosen 5°C above ambient
temperature!
CAUTION!
Separate insulation areas!
The system is specified for SELV/PELV environment. Devices, which are
attached to the system must meet theses specifications. Installation and
cable routing other than SELV/PELV specification must be separated
from the system’s equipment!
2.5.1 Wiring bus coupler
The System SLIO bus coupler have a power module integrated. Terminals with spring
clamp technology are used for wiring. The spring clamp technology allows quick and easy
connection of your signal and supply lines. In contrast to screw terminal connections this
type of connection is vibration proof.
Umax 30V DC
Imax 10A
Cross section 0.08 ... 1.5mm2 (AWG 28 ... 16)
Stripping length 10mm
Terminal module terminals
Data
System SLIO
Basics and mounting
Wiring > Wiring bus coupler
HB300 | IM | 053-1EC01 | en | 22-30 20
Table of contents
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