UM027 FC6301 User Manual r1.3
UM027 www.4dsp.com - 3 -
Table of Contents
1Acronyms and related documents ............................................................................. 5
1.1 Acronyms................................................................................................................ 5
1.2 Related Documents................................................................................................. 6
2General description..................................................................................................... 6
3Installation ................................................................................................................... 8
3.1 Requirements and handling instructions.................................................................. 8
3.2 Firmware and Software........................................................................................... 8
4Hardware Specification............................................................................................... 8
4.1 Phycisal specifications ............................................................................................ 8
4.1.1 Front panel layout ............................................................................................ 8
4.2 cPCI P0 connector .................................................................................................. 9
4.3 Front panel IO........................................................................................................11
4.3.1 Gigabit Ethernet..............................................................................................11
4.3.2 UART..............................................................................................................11
4.3.3 LED.................................................................................................................11
4.4 FPGA Mezzanine Card (FMC) ...............................................................................12
4.4.1 Bank A (LA, HA) connections..........................................................................12
4.4.2 Bank B (HB) connections ................................................................................15
4.4.3 Gigabit transceiver connections ......................................................................16
4.4.4 Miscellaneous FMC connections.....................................................................17
4.5 SPI flash.................................................................................................................18
4.6 Virtex-6 FPGA device.............................................................................................18
4.7 BLAST sites...........................................................................................................19
4.8 Clock tree...............................................................................................................19
4.8.1 FMC GTX Reference Clock.............................................................................20
4.8.2 FMC Clock connections ..................................................................................20
4.9 FPGA device configuration.....................................................................................21
4.9.1 Flash storage..................................................................................................21
4.9.2 CPLD device...................................................................................................21
4.9.3 DIP Switch ......................................................................................................21
4.9.4 CPLD LEDs and board status .........................................................................22
4.9.5 JTAG...............................................................................................................22
4.10 Power supply......................................................................................................23
4.11 Hotswap .............................................................................................................24
4.12 Power and temperature monitor..........................................................................24
5Environment................................................................................................................26
5.1 Temperature ..........................................................................................................26
5.2 Convection cooling.................................................................................................26
6Safety...........................................................................................................................26
7EMC .............................................................................................................................26
8Warranty......................................................................................................................26
