Acromag ACPS3310 User manual

ACPS3310 CompactPCI-Serial AcroPack Carrier Board
USER’S MANUAL
ACROMAG INCORPORATED
30765 South Wixom Road
Wixom, MI 48393-2417 U.S.A.
Tel: [phone]
Email: [e-mail]
Copyright 2019, Acromag, Inc., Printed in the USA.
Data and specifications are subject to change without notice.
8501136A

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Table of Contents
1. GENERAL INFORMATION......................................................................................................................... 4
Intended Audience .................................................................................................................................. 4
Preface..................................................................................................................................................... 4
Trademark, Trade Name and Copyright Information.............................................................................. 4
Radio Frequency Interference Statement............................................................................................... 4
Environmental Protection Statement ..................................................................................................... 4
ACPS3310 Overview ................................................................................................................................ 4
KEY ACPS3310 FEATURES ........................................................................................................................ 5
SIGNAL INTERFACE PRODUCTS................................................................................................................ 5
Cable................................................................................................................................................... 5
Termination Panel .............................................................................................................................. 6
Software Support..................................................................................................................................... 6
Windows......................................................................................................................................... 6
VxWorks.......................................................................................................................................... 6
Linux................................................................................................................................................ 6
2. PREPARATION FOR USE ........................................................................................................................... 7
UNPACKING AND INSPECTION ................................................................................................................ 7
BOARD CONFIGURATION ........................................................................................................................ 7
Power and Cooling Considerations .................................................................................................... 8
Carrier Fuses....................................................................................................................................... 9
Isolation Considerations..................................................................................................................... 9
Isolated Power.................................................................................................................................... 9
ACROPACK MODULE INSTALLATION ..................................................................................................... 10
FIELD GROUNDING CONSIDERATIONS .................................................................................................. 10
CONNECTORS ........................................................................................................................................ 11
Front Panel Field I/O Connectors ..................................................................................................... 11
AcroPack Field I/O Connectors......................................................................................................... 11
Mini-PCIe Connectors....................................................................................................................... 14
CompactPCI-Serial Backplane Connections...................................................................................... 15
JTAG Programming/Debug Connector ............................................................................................. 16
3. THEORY OF OPERATION ........................................................................................................................ 17
PCIe Switch....................................................................................................................................... 18
DC/DC Converter.............................................................................................................................. 18
Slot Addressing................................................................................................................................. 18
JTAG.................................................................................................................................................. 19

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Power Supply Fuses.......................................................................................................................... 19
4. SERVICE AND REPAIR............................................................................................................................. 19
PRELIMINARY SERVICE PROCEDURE ................................................................................................ 19
WHERE TO GET HELP........................................................................................................................ 19
5. SPECIFICATIONS..................................................................................................................................... 20
PHYSICAL................................................................................................................................................ 20
Physical Configuration...................................................................................................................... 20
Connectors ....................................................................................................................................... 20
Isolation............................................................................................................................................ 20
Isolated Power.................................................................................................................................. 21
Power ............................................................................................................................................... 21
Fuses................................................................................................................................................. 21
CPCI-S COMPLIANCE.............................................................................................................................. 21
ENVIRONMENTAL .................................................................................................................................. 21
EMC Compliance .............................................................................................................................. 22
Vibration and Shock Standard.......................................................................................................... 22
Reliability Prediction ........................................................................................................................ 22
6. CERTIFICATE OF VOLATILITY .................................................................................................................. 23
7. REVISION HISTORY................................................................................................................................. 24

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1. GENERAL INFORMATION
Intended Audience
This users’ manual was written for technically qualified personnel who will be
working with I/O devices using the AcroPack module.
Preface
The information contained in this manual is subject to change without notice,
and Acromag, Inc. (Acromag) does not guarantee its accuracy. Acromag
makes no warranty of any kind with regard to this material, including, but not
limited to, the implied warranties of merchantability and fitness for a
particular purpose. Further, Acromag assumes no responsibility for any errors
that may appear in this manual and makes no commitment to update, or keep
current, the information contained in this manual. No part of this manual may
be copied or reproduced in any form, without the prior written consent of
Acromag.
Trademark, Trade Name and Copyright Information
© 2019 by Acromag Incorporated.
All rights reserved. Acromag and Xembedded are registered trademarks of
Acromag Incorporated. All other trademarks, registered trademarks, trade
names, and service marks are the property of their respective owners.
Radio Frequency Interference Statement
This is a Class A product. In a domestic environment this product may cause
radio interference, in which case the user may find it necessary to take
adequate corrective measures.
Environmental Protection Statement
This product has been manufactured to satisfy environmental protection
requirements where possible. Many components used (structural parts,
circuit boards, connectors, etc.) are capable of being recycled. Final
disposition of this product after its service life must be conducted in
accordance with applicable country, state, or local laws or regulations.
ACPS3310 Overview
The ACPS3310 is a Compact Peripheral Component Interconnect –Serial
(CPCI-S) card and is a carrier for mini-PCIe or AcroPack mezzanine modules.
This carrier board provides a modular approach to system assembly, since
each carrier can be populated with any combination of analog input/output,
digital input/output, communication, etc. AcroPack modules. Thus, the user
can create a board which is customized to the application. This saves money
and space - a single carrier board populated with AcroPack modules may

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replace several dedicated function PCI or PCIe bus boards. The ACPS3310 non-
intelligent carrier board provides impressive functionality at low cost.
Model
Input/Output
AcroPack Slots
Operating Temperature
Range
ACPS3310
Front I/O
2 (A, B)
-40 to +85C
(with 200 LFM airflow)
KEY ACPS3310 FEATURES
Interface for AcroPack modules –The ACPS3310 provides an electrical and
mechanical interface for up to two industry standard mini-PCIe or AcroPack
modules. AcroPack modules are available from Acromag. Mini-PCIe cards are
available from other vendors in a wide variety of input/output configurations
to meet the needs of varied applications.
PCI Express Version 2.1 Compliant Carrier: - Includes a PCIe switch to allow
two PCIe devices (AcroPack or mini-PCIe) to share a single 4HP peripheral
board slot in a CPCI-S chassis.
Board Identification –A unique carrier and site number is determined from
geographical addressing signals GA0-GA3 from the backplane. This feature
provides the capability to distinguish a particular carrier and AcroPack module
from others when multiple instances of the same carrier and/or module are
used in a system.
JTAG Programming Header –A standard 14-pin Xilinx JTAG programming
header is provided for programming and debugging the FPGA on some
AcroPack modules. The JTAG ports of the two AcroPack modules are daisy-
chained.
Individually Fused Power - Fused +1.5V, +3.3V, +5V, +12V, and -12V DC
power is provided. A fuse is present on each supply line serving each AcroPack
module. Fuses F1-F3 and F7-F9 are user replaceable. Fuses F4-F6 and F10-F12
are not user replaceable, you must return the board to Acromag to replace
these fuses.
SIGNAL INTERFACE PRODUCTS
This AcroPack carrier board will mate directly to all industry standard mini-
PCIe and AcroPack modules. Acromag provides the following interface
products (all connections to field signals are made through the carrier board
which passes them to the individual AcroPack modules):
Cable
Model 5028-420 Round cable, shielded, 34 twisted pairs, male SCSI-3
connector to 68-pin CHAMP 0.8mm, 2 meters long.
Model 5028-615 Cable, 68-pin CHAMP to pigtail, 36 inches long.
Model 5028-616 Cable, 68-pin CHAMP to pigtail, 70 inches long.

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Termination Panel
Model 5025-288 DIN-rail mountable panel provides 68 screw terminals for
universal field I/O termination, SCSI-3 connector.
Software Support
The AcroPack series products require support drivers specific to your
operating system. Supported operating systems include: Linux, Windows,
and VxWorks.
Windows
Acromag provides software products (sold separately) to facilitate the
development of Windowsapplications interfacing with AcroPack modules.
This software (model APSW-API-WIN) consists of low-level drivers and
Dynamic Link Libraries (DLLs) that are compatible with a number of
programming environments. The DLL functions provide a high-level interface
to boards eliminating the need to perform low-level reads/writes of registers,
and the writing of interrupt handlers.
VxWorks
Acromag provides a software product (sold separately) consisting of
VxWorkssoftware. This software (Model APSW-API-VXW) is composed of
VxWorks(real time operating system) libraries for all AcroPack modules,
VPX I/O board products, and PCIe I/O Cards. The software is implemented as a
library of “C” functions which link with existing user code to make possible
simple control of all Acromag AcroPack modules.
Linux
Acromag provides a software product consisting of Linuxsoftware. This
software (Model APSW-API-LNX) is composed of Linuxlibraries for all
AcroPack modules, VPX I/O board products, and PCIe I/O Cards. The software
is implemented as a library of “C” functions which link with existing user code
to make possible simple control of all Acromag AcroPack modules.

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2. PREPARATION FOR USE
IMPORTANT PERSONAL AND PRODUCT SAFETY CONSIDERATIONS
It is very important for the user to consider the possible safety implications of
power, wiring, component, sensor, or software failures in designing any type
of control or monitoring system. This is especially important where personal
injury or the loss of economic property or human life is possible. It is
important that the user employ satisfactory overall system design. It is
understood and agreed by the Buyer and Acromag that this is the Buyer's
responsibility.
WARNING: This board utilizes static sensitive components and should only
be handled at a static-safe workstation. This product is an electrostatic
sensitive device and is packaged accordingly. Do not open or handle this
product except at an electrostatic-free workstation. Additionally, do not ship
or store this product near strong electrostatic, electromagnetic, magnetic, or
radioactive fields unless the device is contained within its original
manufacturer’s packaging. Be aware that failure to comply with these
guidelines will void the Acromag Limited Warranty.
UNPACKING AND INSPECTION
Upon receipt of this product, inspect the shipping carton for evidence of
mishandling during transit. If the shipping carton is badly damaged or water
stained, request that the carrier's agent be present when the carton is
opened. If the carrier's agent is absent when the carton is opened, and the
contents of the carton are damaged, keep the carton and packing material for
the agent's inspection.
For repairs to a product damaged in shipment, refer to the Acromag Service
Policy to obtain return instructions. It is suggested that salvageable shipping
cartons and packing material be saved for future use in the event the product
must be shipped.
This board is physically protected with packing material and electrically
protected with an anti-static bag during shipment. It is recommended that the
board be visually inspected for evidence of mishandling prior to applying
power.
The board utilizes static sensitive components and should only be handled at
a static-safe workstation.
BOARD CONFIGURATION
Power should be removed from the carrier board when installing AcroPack
modules, cables, termination panels, and field wiring.

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Figure 1 Connector and Fuse Locations
Power and Cooling Considerations
Refer to the specifications for loading and power requirements. Be sure that
the system power supplies are able to accommodate the power requirements
of the carrier board, plus the installed AcroPack modules within the voltage
tolerances specified.
IMPORTANT: Adequate air circulation must be provided to prevent a temperature rise above the maximum
operating temperature.
The lack of air circulation within some CPCI-S chassis could be a cause for
some concern. The dense packing of the AcroPack modules to the carrier
board alone results in elevated module and carrier board temperatures, and
the restricted air flow within the chassis aggravates this problem. Adequate
air circulation must be provided to prevent a temperature rise above the
maximum operating temperature and to prolong the life of the electronics. If
the installation is in an industrial environment and the board is exposed to
environmental air, careful consideration should be given to air-filtering.

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Carrier Fuses
CAUTION: Acromag has used pins labeled as reserved in the Mini-PCIe specification for additional power
connections. If you are installing a Mini-PCIe card from another manufacturer in slot A remove fuses F1(+12V),
F2(+5V) and F3 (-12V). When installing a Mini-PCIe card in from another manufacturer in slot B remove fuses
F7(+12V), F8(+5V) and F9 (-12V). Fuse locations are shown in Figure 1.
Other fuses present on the board include +1.5V Fuses F6 (slot A) and F12 (slot
B). Also present on the board are +3.3V Fuses F4 (slot A) and F10 (slot B).
These fuses are not user replaceable. Return the carrier board to Acromag to
replace these fuses. Both Mini-PCIe cards from other manufacturers and the
AcroPack modules can use +1.5V and +3.3V power.
Fuses not present on the board include +3.3V Aux Fuses F5 (slot A), F11 (slot
B). Some standard Mini PCIe cards may require +3.3V Aux to power the
module. For a site using such a module the +3.3V fuse will need to be
removed and the +3.3 Aux fuse will need to be installed, along with a
regulator to convert +5V standby from the CPCI-S backplane to +3.3V Aux.
Return the carrier board to Acromag to remove and install these parts.
Isolation Considerations
WARNING: This AcroPack carrier is designed to provide isolation between the
AcroPack Field I/O signals and the host. The AcroPack module must also be
an isolated AcroPack module to maintain the isolation between the logic and
field I/O signals. Unless isolation is provided on the AcroPack module itself,
the field I/O connections are not isolated from the PCIe bus.
When this carrier is used with isolated AcroPack modules, both AcroPacks in
slots A and B should be isolated. Non-isolated AcroPacks sharing the same
Connector will compromise the isolation integrity of the other AcroPack.
Isolated Power
The use of an optional isolated DC/DC Converter is required for use with a few
of Acromag’s isolated AcroPack modules. See Figure 1 for carrier board
location allocated for the isolated DC/DC converter corresponding to each
slot.
The power supplies of one AcroPack site must be isolated from the power
supplies of other AcroPack sites. The two separate isolated DC/DC converters
make this possible. The DC/DC converted should only be populated on the
carrier for AcroPacks needing the isolated power. Each isolated AcroPack
module will list the requirement of the external DC/DC converter if needed.
The isolated DC/DC converter provide dual +12V and -12V power to the
AcroPack module on field I/O pins 49 and 50 as listed in the Table below.
Table 1 Carrier Isolated Power
Supply Voltage
Current (Min)
Field I/O Pin
+12V +/- 8% (max)
0.16 A
501

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Supply Voltage
Current (Min)
Field I/O Pin
-12V +/- 8% (max)
0.16 A
491
Return (GND)
1 A
481
Note 1: AcroPack carriers without provisions for the isolated power supplies
can provide external power from the field power to the AcroPack module on
pins 48, 49 and 50.
ACROPACK MODULE INSTALLATION
Power should be removed from the carrier board when installing AcroPack
modules, cables, termination panels, and field wiring. Refer to Figure 2 while
reading this section. To install, first insert the edge of the AcroPack module
into the carrier connector at an angle similar to that shown in the figure. Next,
using a rocking motion while gently applying force to keep the edge of the
board against the back of the carrier connector, position the module such that
the field I/O connector is just above the mating connector. Verify that the two
connectors are properly aligned. Once alignment is achieved, you can fully
seat the connector. It will snap into place. Install two M2.5 screws as shown.
Figure 2 AcroPack Module Installation
FIELD GROUNDING CONSIDERATIONS
The Field I/O signals are isolated from chassis and system ground on the
carrier. However, some AcroPack modules connect Field I/O ground to system
ground. Care should be taken in designing installations without isolation to
avoid ground loops and noise pickup. This is particularly important for analog
I/O applications when a high level of accuracy/resolution is needed (12-bits or
more). Contact your Acromag representative for information on our many
isolated signal conditioning products that could be used to interface to the
AcroPack input/output modules.

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CONNECTORS
The ACPS3310 carrier uses two AcroPack module field I/O connectors, two
mini-PCIe connectors, two field I/O Champ connectors and one CompactPCI-
Serial backplane connector. These are discussed in the following sections.
Front Panel Field I/O Connectors
Field I/O connections are made via one 68 pin, stacked, 0.8 mm Champ cable
connector mounted on the front panel. The AcroPack module identifier (A
and B) is marked on the front panel for easy identification. Cables and
termination panels (or user defined terminations) can be quickly mated to the
field I/O connectors. Pin assignments are defined by the installed AcroPack
module.
AcroPack Field I/O Connectors
The field side connector of AcroPack modules mate to Samtec
SS5-50-3.00-L-D-K-TR socket connectors on the carrier board.
This provides excellent connection integrity due to the gold plating in the
mating area. M2.5 screws and spacers provide additional stability for harsh
environments.
The functions of each of the Field I/O signals are defined by the installed
AcroPack model.
Table 2 Field I/O Pin Assignments
Carrier
J3 and
Termination
Panel
Carrier
P7, P8
Module Pin
Number
Field I/O Signal
1
2
2
Field I/O 1
35
1
1
Field I/O 2
4
4
Reserved/isolation
3
3
Reserved/isolation
2
6
6
Field I/O 3
36
5
5
Field I/O 4
8
8
Reserved/isolation
7
7
Reserved/isolation
3
10
10
Field I/O 5
37
9
9
Field I/O 6
12
12
Reserved/isolation
11
11
Reserved/isolation
4
14
14
Field I/O 7
38
13
13
Field I/O 8
16
16
Reserved/isolation
15
15
Reserved/isolation

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Carrier
J3 and
Termination
Panel
Carrier
P7, P8
Module Pin
Number
Field I/O Signal
5
18
18
Field I/O 9
39
17
17
Field I/O 10
20
20
Reserved/isolation
19
19
Reserved/isolation
6
22
22
Field I/O 11
40
21
21
Field I/O 12
24
24
Reserved/isolation
23
23
Reserved/isolation
7
26
26
Field I/O 13
41
25
25
Field I/O 14
28
28
Reserved/isolation
27
27
Reserved/isolation
8
30
30
Field I/O 15
42
29
29
Field I/O 16
32
32
Reserved/isolation
31
31
Reserved/isolation
9
34
34
Field I/O 17
43
33
33
Field I/O 18
36
36
Reserved/isolation
35
35
Reserved/isolation
10
38
38
Field I/O 19
44
37
37
Field I/O 20
40
40
Reserved/isolation
39
39
Reserved/isolation
11
42
42
Field I/O 21
45
41
41
Field I/O 22
44
44
Reserved/isolation
43
43
Reserved/isolation
12
46
46
Field I/O 23
46
45
45
Field I/O 24
48
48
Reserved/isolation
47
47
Reserved/isolation
13
50
50
Field I/O 25
47
49
49
Field I/O 26
52
52
Reserved/isolation

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Carrier
J3 and
Termination
Panel
Carrier
P7, P8
Module Pin
Number
Field I/O Signal
51
51
Reserved/isolation
14
54
54
Field I/O 27
48
53
53
Field I/O 28
56
56
Reserved/isolation
55
55
Reserved/isolation
15
58
58
Field I/O 29
49
57
57
Field I/O 30
60
60
Reserved/isolation
59
59
Reserved/isolation
16
62
62
Field I/O 31
50
61
61
Field I/O 32
64
64
Reserved/isolation
63
63
Reserved/isolation
17
66
66
Field I/O 33
51
65
65
Field I/O 34
68
68
Reserved/isolation
67
67
Reserved/isolation
18
70
70
Field I/O 35
52
69
69
Field I/O 36
72
72
Reserved/isolation
71
71
Reserved/isolation
19
74
74
Field I/O 37
53
73
73
Field I/O 38
76
76
Reserved/isolation
75
75
Reserved/isolation
20
78
78
Field I/O 39
54
77
77
Field I/O 40
80
80
Reserved/isolation
79
79
Reserved/isolation
21
82
82
Field I/O 41
55
81
81
Field I/O 42
84
84
Reserved/isolation
83
83
Reserved/isolation
22
86
86
Field I/O 43
56
85
85
Field I/O 44

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Carrier
J3 and
Termination
Panel
Carrier
P7, P8
Module Pin
Number
Field I/O Signal
88
88
Reserved/isolation
87
87
Reserved/isolation
23
90
90
Field I/O 45
57
89
89
Field I/O 46
92
92
Reserved/isolation
91
91
Reserved/isolation
24
94
94
Field I/O 47
58
93
93
Field I/O 48
96
96
Reserved/isolation
95
95
Reserved/isolation
25
98
98
Field I/O 49
59
97
97
Field I/O 50
100
100
Reserved/isolation
99
99
Reserved/isolation
Mini-PCIe Connectors
The AcroPack Mini-PCIe connectors mate to TE Connectivity 1759457-1
connectors on the carrier board. AcroPack locations are labeled on the board
for easy identification.
Pin assignments for these connectors are based on the Mini-PCIe specification
with the exceptions noted in Table 3.

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Table 3 Mini-PCIe Connectors J1 and J2 Pin Assignments
Pin #
Name
Pin #
Name
51
+5V3
52
+3.3V4
49
+12V3
50
GND
47
-12V3
48
+1.5V
45
Present
46
N.C. (LED_WPAN#)1
43
GND
44
N.C. (LED_WLAN#)1
41
+3.3V4
42
N.C. (LED_WWAN#)1
39
+3.3V4
40
GND
37
GND
38
USB_D+6
35
GND
36
USB_D-6
33
PETp0
34
GND
31
PETn0
32
SMB_DATA5
29
GND
30
SMB_CLK5
27
GND
28
+1.5V
25
PERp0
26
GND
23
PERn0
24
+3.3V4
21
GND
22
PERST#
19
TDI (UIM_C4)1,2
20
N.C. (W_DISABLE#)1
17
TDO (UIM_C8)1,2
18
GND
15
GND
16
UIM_VPP1
13
RECLK+
14
UIM_RESET1
11
REFCLK-
12
UIM_CLK1
9
GND
10
UIM_DATA1
7
CLKREQ#
8
UIM_PWR1
5
TCK (COEX2)1
6
+1.5V
3
TMS (COEX1)1
4
GND
1
N.C. (WAKE#)1
2
+3.3V4
Notes:
1. The following mini-PCIe signals are not supported: WAKE#, LED_WPAN#,
LED_WLAN#, LED_WWAN#, W_DISABLE#, COEX1, COEX2, UIM_C4, UIM_C8,
UIM_VPP, UIM_RESET, UIM_CLK, UIM_DATA, UIM_PWR.
2. TDI is tied to TDO on modules that do not use JTAG.
3. +5, +12, and -12 Volt power supplies have been assigned to pins that are
reserved in the mini-PCIe specification. Remove the fuses on these power
supplies for mini-PCIe cards from other vendors that cannot tolerate power
applied to these reserved pins.
4. All +3.3Vaux power pins are changed to system +3.3V power.
5. The SM bus signals SMB_CLK and SMB_DATA are used to communicate with a
CPLD on the carrier that reports slot ID. These signals will be under the control of
the AcroPack module.
6. USB_D+ and USB_D- is N.C. on AcroPack/mini-PCIe site A and connected to CPCI-
S connector P1 to support USB-based mPCIe cards in AcroPack/mini-PCIe site B.
CompactPCI-Serial Backplane Connections
Table 4 indicates the pin assignments for the CPCI-S signals on the backplane
connector P1.

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Refer to the PICMG CPCI-S specification for additional information on the
CPCI-S signals.
Table 4 CPCI-S P1 CONNECTIONS
Pin
A
B
C
01
+12V
STANDBY
GND
02
GND
I2C_SCL
I2C_SDA
03
1_USB3_Tx+
1_USB3_Tx-
GA0
04
GND
1_USB2+
1_USB2-
05
1_PE_Tx00+
1_PE_Tx00-
GND
06
GND
1_PE_Tx02+
1_PE_Tx02-
D
E
F
01
+12V
+12V
GND
02
GND
reserved
reserved
03
1_USB3_Rx+
1_USB3_Rx-
GA1
04
GND
PE_CLKIN+
PE_CLKIN-
05
1_PE_Rx00+
1_PE_Rx00-
GND
06
GND
1_PE_Rx02+
1_PE_Rx02-
G
H
I
01
+12V
+12V
GND
02
GND
RST#
WAKE_OUT#
03
SATA_SDI
SATA_SDO
GA2
04
GND
1_SATA_Tx+
1_SATA_Tx-
05
1_PE_Tx01+
1_PE_Tx01-
GND
06
GND
1_PE_Tx03+
1_PE_Tx03-
J
K
L
01
+12V
+12V
GND
02
GND
PCIE_EN#
SYSEN#
03
SATA_SCL
SATA_SL
GA3
04
GND
1_SATA_Rx+
1_SATA_Rx-
05
1_PE_Rx01+
1_PE_Rx01-
GND
06
GND
1_PE_Rx03+
1_PE_Rx03-
Notes (Table 4):
1. Hash (#) is used to indicate an active-low signal.
2. BOLD ITALIC Logic Lines are NOT USED by the carrier board.

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JTAG Programming/Debug Connector
A JTAG programming/debug connector is provided for developing applications
that use Acromag’s FPGA AcroPack modules. See reference designator P9 in
Figure 1. This is a standard 14-pin Xilinx programming header for connecting a
Xilinx Platform USB II programming device (or equivalent). The pin assignment
for P9 is shown in Table 5. A bypass circuit is included that will detect a vacant
AcroPack site and close a switch to bypass the TDI and TDO signals. A CPLD on
the carrier is included in the JTAG chain. The Xilinx Vivado tools can detect the
presence of the CPLD in the JTAG chain and skip it when accessing the FPGAs
on the AcroPack modules.
Table 5 JTAG Programming/Debug Connector Pin Assignment
Signal
Pin
Pin
Signal
N.C.1
1
2
_+3.3V
GND
3
4
TMS
GND
5
6
TCK
GND
7
8
TDO
GND
9
10
TDI
GND
11
12
N.C. 1
N.C. 1
13
14
N.C. 1
Notes:
1. N.C. –not connected

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TMS –JTAG Test Mode Select. This pin is the JTAG mode signal establishing
appropriate TAP state transitions for target ISP devices sharing the
same data stream.
TCK –JTAG Test Clock. This pin is the clock signal for JTAG operations and
should be connected to the TCK pin on all target ISP devices sharing the
same data stream.
TDO –JTAG Test Data Out. This pin is the serial data stream received from the
TDO pin on the last device in a JTAG chain.
TDI –JTAG Test Data In. This pin outputs the serial data stream transmitted to
the TDI pin on the first device in a JTAG chain.
+3.3V –The target reference voltage VREF is 3.3 Volts
GND - Ground.
3. THEORY OF OPERATION
This section describes the functionality of the circuitry used on the carrier
board. Refer to Figure 3 as you read this section.

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Figure 3 ACPS3310 AcroPack Carrier Block Diagram
PCIe Switch
The PCIe switch is a 6 port 8 lane PCIe Gen 2 switch. It expands the single host
PCIe port to two ports, one for each AcroPack site. The host port consists of
four PCIe lanes or one PCIe lane (depending on CPCI-S slot), each of the
AcroPack sites have one lane each.
Important Note: The ACPS3310 board is not hot-swappable.
DC/DC Converter
The ACPS3310 has four DC/DC converters to provide the power supply
voltages to the AcroPack modules that are not present on the CPCI-S
backplane. The +3.3 Volt, +5 Volt and -12 Volt supplies are sourced from +12
Volt power. The +1.5 Volt supply is sourced from the +3.3 Volt supply. Also, if
the regulator is populated, +5V standby from the backplane will be converted
to +3.3V Aux. This part is not populated by default.
Slot Addressing
The ACPS3310 carrier unique slot address is dependent upon the geographical
addressing signals (GA0-GA3) from the backplane. The slot address is 5 bits
long and consists of 1 bit to identify the site on the carrier where the
AcroPack modules is installed and 4 bits that are determined by the GA
signals. The CPLD will serialize the slot address and transmit the address to
the AcroPack module as requested by the AcroPack module. The process of
reading the slot address is typically initiated by host software.
JTAG
A JTAG interface is provided for programming and debugging FPGAs on
AcroPack modules. It is intended to be used with a Xilinx Platform USB II
programming device. A bypass circuit is included that will detect a vacant
AcroPack site and close a switch to complete the JTAG chain. When two
AcroPack modules with Xilinx FPGAs are installed on the carrier the module in
slot B appears first in the chain followed by the module in slot A. The slot
address CPLD is also included in the JTAG chain for factory programming.
Power Supply Fuses
The power supplies to each AcroPack module are individually fused. A blown
fuse can be identified by visible inspection or by use of an ohm meter. The

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fuse locations are shown in
Figure 1. The current rating for each of the fuses is listed in the Fuses
paragraph in section 5.
4. SERVICE AND REPAIR
Surface-Mounted Technology (SMT) boards are generally difficult to repair. It
is highly recommended that a non-functioning board be returned to Acromag
for repair. The board can be damaged unless special SMT repair and service
tools are used. Further, Acromag has automated test equipment that
thoroughly checks the performance of each board.
Please refer to Acromag's Service Policy Bulletin or contact Acromag for
complete details on how to obtain parts and repair.
PRELIMINARY SERVICE PROCEDURE
Before beginning repair, be sure that all the procedures in Section 2,
Preparation for Use, have been followed. Also, refer to the documentation of
your carrier board to verify that it is correctly configured. Replacement of the
module with one that is known to work correctly is a good technique to
isolate a faulty module.