ALTUS Nexto Series User manual

Nexto Series
User Manual
MU214600 Rev. H
June 5, 2020

General Supply Conditions
No part of this document may be copied or reproduced in any form without the prior written consent of Altus Sistemas de
Automação S.A. who reserves the right to carry out alterations without prior advice.
According to current legislation in Brazil, the Consumer Defense Code, we are giving the following information to clients
who use our products, regarding personal safety and premises.
The industrial automation equipment, manufactured by Altus, is strong and reliable due to the stringent quality control
it is subjected to. However, any electronic industrial control equipment (programmable controllers, numerical commands,
etc.) can damage machines or processes controlled by them when there are defective components and/or when a programming
or installation error occurs. This can even put human lives at risk. The user should consider the possible consequences of
the defects and should provide additional external installations for safety reasons. This concern is higher when in initial
commissioning and testing.
The equipment manufactured by Altus does not directly expose the environment to hazards, since they do not issue any kind
of pollutant during their use. However, concerning the disposal of equipment, it is important to point out that built-in electronics
may contain materials which are harmful to nature when improperly discarded. Therefore, it is recommended that whenever
discarding this type of product, it should be forwarded to recycling plants, which guarantee proper waste management.
It is essential to read and understand the product documentation, such as manuals and technical characteristics before its
installation or use. The examples and figures presented in this document are solely for illustrative purposes. Due to possible
upgrades and improvements that the products may present, Altus assumes no responsibility for the use of these examples and
figures in real applications. They should only be used to assist user trainings and improve experience with the products and
their features.
Altus warrants its equipment as described in General Conditions of Supply, attached to the commercial proposals.
Altus guarantees that their equipment works in accordance with the clear instructions contained in their manuals and/or
technical characteristics, not guaranteeing the success of any particular type of application of the equipment.
Altus does not acknowledge any other guarantee, directly or implied, mainly when end customers are dealing with third-
party suppliers. The requests for additional information about the supply, equipment features and/or any other Altus services
must be made in writing form. Altus is not responsible for supplying information about its equipment without formal request.
These products can use EtherCAT® technology (www.ethercat.org).
COPYRIGHTS
Nexto, MasterTool, Grano and WebPLC are the registered trademarks of Altus Sistemas de Automação S.A.
Windows, Windows NT and Windows Vista are registered trademarks of Microsoft Corporation.
OPEN SOURCE SOFTWARE NOTICE
To obtain the source code under GPL, LGPL, MPL and other open source licenses, that is contained in this product, please
contact [email protected]. In addition to the source code, all referred license terms, warranty disclaimers and copyright
notices may be disclosed under request.
I

CONTENTS
Contents
1. Introduction ..................................................... 1
1.1. Nexto Series Features .......................................... 1
1.1.1. Module List ........................................... 1
1.1.1.1. CPUs – Central Processing Units ........................... 1
1.1.1.2. Fieldbus Interfaces .................................. 1
1.1.1.3. Input Modules ..................................... 1
1.1.1.4. Mixed I/O Modules .................................. 2
1.1.1.5. Output Modules .................................... 2
1.1.1.6. Power Supply Modules ................................ 2
1.1.1.7. Racks ......................................... 2
1.1.1.8. Special Modules .................................... 2
1.1.1.9. Software ........................................ 2
1.1.1.10. Accessories ...................................... 3
1.1.2. Innovative Features ....................................... 3
1.1.3. Architecture ........................................... 4
1.1.3.1. CPU .......................................... 4
1.1.3.2. Power Supply Module (PSU) ............................. 4
1.1.3.3. Backplane Bus .................................... 4
1.1.3.4. Backplane Racks ................................... 4
1.1.3.5. I/O Modules ...................................... 5
1.1.3.6. Fieldbus Head ..................................... 5
1.1.3.7. Fieldbus Interface ................................... 5
1.1.4. Application Examples ...................................... 6
1.1.4.1. Compact CPU ..................................... 6
1.1.4.2. Single CPU ...................................... 6
1.1.4.3. Single CPU with Remote Rack Expansion ...................... 7
1.1.4.4. Single CPU with Remote Rack Expansion and Loopback .............. 8
1.1.4.5. Single CPU with Redundant Rack Expansion and Loopback ............ 9
1.1.4.6. Fieldbus Interfaces .................................. 10
1.1.4.7. Fieldbus Interfaces with Redundancy ......................... 11
1.1.4.8. MODBUS TCP Head ................................. 12
1.1.4.9. CPU Redundancy ................................... 13
1.1.4.10. Minimum Configuration of a Redundant PLC (Without PX2612 Panel Usage) . . . 13
1.1.4.11. CPU & Network Interface Modules Redundancy ................... 14
1.1.5. Main Features .......................................... 14
1.1.5.1. CPUs ......................................... 14
1.1.5.2. Modules ........................................ 14
1.1.5.3. High-Speed Backplane Bus .............................. 14
1.1.5.4. Terminal Block Insertion & Removal ......................... 15
II

CONTENTS
1.1.5.5. Robustness ...................................... 15
1.1.5.6. Hot-Swapping ..................................... 15
1.1.5.7. High Availability ................................... 15
1.1.5.8. Enhanced Diagnostics ................................. 15
1.1.5.9. Capacities ....................................... 15
1.1.5.10. CPU Programming & Firmware Update ....................... 15
1.1.6. MT8500 – MasterTool IEC XE ................................. 16
1.1.6.1. IEC 61131-3 Programming Languages ........................ 16
1.1.6.2. Editors for Project Configuration and Hardware Configuration ........... 17
1.1.6.3. Object-Oriented Programming ............................ 17
1.1.6.4. Online, Debugging and Commissioning Features .................. 17
1.1.6.5. Simulation ....................................... 18
1.1.6.6. Web page development ................................ 18
1.1.6.7. User Documentation & Help Files .......................... 19
1.1.6.8. Enhanced Diagnostics ................................. 20
1.1.6.9. Docking View ..................................... 20
1.1.7. I/O System ............................................ 20
1.1.8. Environmental Conditions .................................... 20
1.1.9. Standards and Certifications ................................... 21
1.2. Documents Related to this Manual ................................... 22
1.3. Visual Inspection ............................................. 23
1.4. Technical Support ............................................ 24
1.5. Warning Messages Used in this Manual ................................. 24
2. Configuration .................................................... 25
2.1. Configuration Steps ........................................... 25
2.1.1. Step 1 – Determine necessary I/O modules ........................... 25
2.1.2. Step 2 – Determine necessary special modules and network interfaces ............. 25
2.1.3. Step 3 – Determine CPU .................................... 25
2.1.4. Step 4 – Determine backplane rack quantity .......................... 26
2.1.5. Step 5 – Determine the backplane rack connector cover quantity ............... 26
2.1.6. Step 6 – Determine the power supply module quantity ..................... 26
2.1.7. Step 7 – Bus expansion modules and bus expansion cables ................... 26
2.1.8. Step 8 – External power supply ................................. 26
2.1.9. Step 9 – MasterTool IEC XE license choice .......................... 26
2.2. MasterTool IEC XE Graphic Editor ................................... 27
2.2.1. Compatible components tree .................................. 27
2.2.2. Module documentation access .................................. 27
2.2.3. Architecture verification ..................................... 27
2.2.4. Bill of materials ......................................... 27
2.2.5. Configuration and consumption ................................. 27
3. Panel Design .................................................... 28
3.1. Mechanic Design ............................................ 28
3.1.1. Dimensions ........................................... 28
3.1.1.1. 18 mm Nexto I/O Module ............................... 28
3.1.1.2. 18 mm Nexto Jet I/O Module ............................. 29
3.1.1.3. 36 mm Nexto I/O Module ............................... 30
3.1.1.4. CPU, Fieldbus Interfaces, Power Sources and Special Modules ........... 31
3.1.1.5. 2-Slot base for panel assembly ............................ 32
3.1.1.6. 8 Slot Backplane Rack (Without Hot Swap) ..................... 32
III

CONTENTS
3.1.1.7. 8 Slot Backplane Rack ................................ 33
3.1.1.8. 12-Slot Backplane Rack ................................ 33
3.1.1.9. 16-Slot Backplane Rack ................................ 34
3.1.1.10. 24-Slot Backplane Rack ................................ 34
3.1.2. Assembled module depth in the backplane rack ........................ 34
3.1.3. Spacing between modules and other equipment in the panel .................. 35
3.1.4. Chute Dimensioning ....................................... 36
3.1.5. Horizontal/ Vertical Assembly ................................. 36
3.2. Thermal Design ............................................. 36
3.2.1. Heat dissipation in an electrical panel .............................. 36
3.3. Electrical Design ............................................. 39
3.3.1. General Information ....................................... 39
3.3.2. Panel Supply ........................................... 39
3.3.3. Panel Cables Distribution .................................... 39
3.3.4. Panel Illumination ........................................ 40
3.3.5. Grounding ............................................ 40
3.3.6. Electromagnetic Interference .................................. 40
3.3.7. Shield .............................................. 40
3.3.8. Noise Suppressors ........................................ 40
3.3.8.1. Circuit with Diode .................................. 40
3.3.8.2. Circuit with Diode and Zener ............................. 41
3.3.8.3. Circuit with Varistor .................................. 41
3.3.8.4. RC Circuit ....................................... 41
3.3.8.5. Circuit with Capacitor ................................. 42
3.3.9. Supply Distribution outside the Panel .............................. 42
3.3.10. Lightning Protection ....................................... 43
4. Installation ..................................................... 44
4.1. Visual Inspection ............................................. 44
4.2. Mechanical Installation ......................................... 44
4.2.1. Backplane Rack Fixation .................................... 44
4.2.1.1. Drilling ........................................ 44
4.2.1.2. Assembly ....................................... 45
4.2.1.3. Removal ........................................ 47
4.2.2. Module Insertion ........................................ 47
4.2.3. Modules Removal ........................................ 49
4.2.4. I/O Modules ........................................... 50
4.2.4.1. Frontal cover ..................................... 51
4.2.4.2. I/O connector insertion for Nexto and Nexto Jet Modules .............. 52
4.2.4.3. I/O connector block removal for Nexto and Nexto Jet Modules ........... 55
4.2.4.4. I/O connector block .................................. 58
4.2.4.4.1. Identification ................................. 58
4.2.4.5. I/O module labels ................................... 58
4.2.4.5.1. Identification number and description .................... 58
4.2.4.5.2. Installation Diagram .............................. 59
4.2.4.5.3. Label insertion and removal .......................... 61
4.2.5. Rack Connector Cover ...................................... 63
4.2.5.1. Rack Connector Cover Insertion ........................... 63
4.2.5.2. Rack Connector Cover Removal ........................... 64
4.2.6. Electric Installation ....................................... 65
IV

CONTENTS
4.2.7. Spring-Connectors ........................................ 65
4.2.7.1. Cable Insertion .................................... 67
4.2.7.2. 6-Pin Connector Block – NX9401 .......................... 68
4.2.7.3. 10-Pin Connector Block – NX9402 .......................... 68
4.2.7.4. 20-Pin Connector Block - NX9403 .......................... 68
4.2.7.5. 6-Pin Connector Block with Fixation – NX9404 ................... 68
4.2.7.6. 12-Pin Connector Block with Fixation – NX9405 .................. 68
4.2.7.7. 18-Pin Connector Block with Fixation – NX9406 .................. 68
4.2.7.8. Cable assembly .................................... 69
4.2.7.9. Cable fixation and Identification ........................... 69
4.2.7.9.1. Nexto Solution ................................ 69
4.2.7.9.2. Nexto Jet Solution ............................... 70
4.2.7.10. Cable removal ..................................... 71
4.2.8. Connections ........................................... 72
4.2.9. Power Supply .......................................... 72
4.2.10. Fuses ............................................... 72
5. Maintenance ..................................................... 73
5.1. Module Diagnostics ........................................... 73
5.1.1. One Touch Diag (OTD) ..................................... 73
5.1.1.1. Diagnostics mode access ............................... 73
5.1.1.2. I/O points access ................................... 75
5.1.1.3. Module and I/O points description access ...................... 75
5.1.1.4. Short press and long press ............................... 76
5.2. Preventive Maintenance ......................................... 76
V

1. INTRODUCTION
1. Introduction
1.1. Nexto Series Features
Nexto Series is a powerful and complete Programmable Logic Controller (PLC) series with exclusive and innovative
features. Due to its flexibility, functional design, advanced diagnosis resources and modular architecture, Nexto PLC can be
used for control systems in small, medium and large applications.
Nexto Series architecture has a great variety of input and output modules. These modules combined with a powerful 32
bits processor and a high speed bus based on Ethernet, fit to several applications such as high speed control for small ma-
chines, complex distributed processes, redundant applications and systems with a large number of I/O as building automation.
Furthermore, Nexto Series has modules for motion control, communication and interface to the most popular field networks
among other features.
Nexto Series uses an advanced technology in its bus, which is based on a high speed Ethernet, allowing input and output
information and data to be shared among all modules of the system. The I/O modules can be easily divided and distributed
throughout the whole field, allowing the use of bus expansion with the same performance of a local module.
Furthermore Nexto Series presents a complete tool for user programming, configuring, simulation and debug: MasterTool
IEC XE. It’s flexible and easy-to-use software which offers six programming languages defined by IEC 61131-3 standard:
Structured Text (ST), Sequential Function Chart (SFC), Function Block Diagram (FBD), Ladder Diagram (LD), Instructions
List (IL) and Continuous Function Chart (CFC). MasterTool IEC XE allows the use of different languages in the same appli-
cation providing to the user a powerful way to organize the application and reuse codes from previous applications.
Other modules of Nexto Series made the Nexto Jet solution, which is an ideal set of inputs and outputs for small and
medium application size, beyond distributed systems. The solution presents high performance and compact modules that are
used together with the CPUs, racks, communication and fieldbus modules, besides MasterTool IEC XE software. The Nexto Jet
modules add more versatility and competitiveness to the consecrated Nexto Series, keeping the flexibility, modular architecture
and advanced diagnosis resources.
1.1.1. Module List
Following is the complete list of modules. Please contact your sales representative to check availability and lead times. For
further information, please refer to the product documentation of each module.
1.1.1.1. CPUs – Central Processing Units
NX3003: CPU with 1 Ethernet port, 1 serial channel, 14 digital inputs, 10 digital outputs, local I/O modules support and
integrated power supply
NX3004: CPU with 1 Ethernet port, 1 serial channel, remote rack expansion support and integrated power supply
NX3005: CPU with 1 Ethernet port, 1 serial channel, remote rack expansion support, integrated power supply and user
web pages support
NX3010: High-speed CPU, 1 Ethernet port, 2 serial channels, miniSD card interface and remote rack expansion support
NX3020: High-speed CPU, 2 Ethernet ports, 2 serial channels, miniSD card interface and remote rack expansion support
NX3030: High-speed CPU, 2 Ethernet ports, 2 serial channels, miniSD card interface, remote rack expansion and
redundancy support
1.1.1.2. Fieldbus Interfaces
NX5000: Ethernet Module
NX5001: PROFIBUS-DP Master Module
NX5100: MODBUS TCP Head
NX5101: MODBUS TCP Head without hot swap, with 14 digital inputs and 10 digital outputs
NX5110: PROFIBUS-DP Head
NX5210: PROFIBUS-DP Redundant Head
1.1.1.3. Input Modules
Nexto:
NX1001: 24 Vdc 16 DI Module
NX6000: 8 AI Voltage/Current Module 16 Bits
NX6010: 8 AI Thermocouple Module
NX6014: 8 AI Current Module with HART
NX6020: 8 AI RTD Module
1

1. INTRODUCTION
Nexto Jet:
NJ1001: 24 Vdc 16 DI Module
NJ6000: 8 AI Voltage/Current Module 16 Bits
NJ6001: 6 AI Voltage/Current Module 12 Bits
NJ6010: 8 AI Thermocouple Module
NJ6011: 4 AI Thermocouple Module
NJ6020: 8 AI RTD Module
1.1.1.4. Mixed I/O Modules
Nexto:
NX1005: 24 Vdc 8 DO Transistor / 8 DI Mixed Module
Nexto Jet:
NJ1005: 24 Vdc 8 DO Transistor / 8 DI Mixed Module
NJ6005: 6 AI & 4 AO Voltage/Current Mixed Module 12 Bits
1.1.1.5. Output Modules
Nexto:
NX2001: 24 Vdc 16 DO Transistor Module
NX2020: 16 DO Relay Module
NX6100: 4 AO Voltage/Current Module 16 Bits
Nexto Jet:
NJ2001: 24 Vdc 16 DO Transistor Module
NJ6100: 4 AO Voltage/Current Module 16 Bits
NJ6101: 4 AO Voltage/Current Module 12 Bits
1.1.1.6. Power Supply Modules
NX8000: 30 W 24 Vdc Power Supply Module
1.1.1.7. Racks
NX9000: 8-Slot Backplane Rack
NX9001: 12-Slot Backplane Rack
NX9002: 16-Slot Backplane Rack
NX9003: 24-Slot Backplane Rack
NX9010: 8-Slot Backplane Rack (Without Hot Swap)
NX9020: 2-Slot base for panel assembly
1.1.1.8. Special Modules
NX4000: Bus Expansion Module
NX4010: Redundancy Link Module
1.1.1.9. Software
MT8500 MasterTool IEC XE LITE
MT8500 MasterTool IEC XE BASIC
MT8500 MasterTool IEC XE PROFESSIONAL
MT8500 MasterTool IEC XE ADVANCED
MT8800 MasterTool Safety
2

1. INTRODUCTION
1.1.1.10. Accessories
NX9100: Left/Right Side Rack Ends
NX9101: 32 GB microSD memory card with miniSD and SD adapters
NX9102: Backplane Rack Connector Cover
NX9202: RJ45-RJ45 2 m Cable
NX9205: RJ45-RJ45 5 m Cable
NX9210: RJ45-RJ45 10 m Cable
NX9401: 6-Terminal Connector
NX9402: 10-Terminal Connector with guide for cables
NX9403: 20-Terminal Connector with guide for cables
NX9404: 6-Terminal Connector with Fixation
NX9405: 12-Terminal Connector with Fixation
NX9406: 18-Terminal Connector with Fixation
1.1.2. Innovative Features
Nexto Series brings to the user many innovations regarding utilization, supervision and system maintenance. These features
were developed focusing a new concept in industrial automation.
Battery Free Operation: Nexto Series does not require
any kind of battery for memory maintenance and real time
clock operation. This feature is extremely important because
it reduces the system maintenance needs and allows the use
in remote locations where maintenance can be difficult to be
performed. Besides, this feature is environmentally friendly.
Easy Plug System: Nexto Series has an exclusive method
to plug and unplug I/O terminal blocks. The terminal blocks
can be easily removed with a single movement and with no
special tools. In order to plug the terminal block back to the
module, the frontal cover assists the installation procedure, fit-
ting the terminal block to the module.
Multiple Block Storage: Several kinds of memories are
available to the user in Nexto Series CPUs, offering the best
option for any user needs. These memories are divided in
volatile memories and non-volatile memories. For volatile
memories, Nexto Series CPUs offer addressable input (%I),
addressable output (%Q), addressable memory (%M), data
memory and redundant data memory. For applications that
require non-volatile functionality, Nexto Series CPUs bring
retain addressable memory (%Q), retain data memory, persis-
tent addressable memory (%Q), persistent data memory, pro-
gram memory, source code memory, CPU file system (doc,
PDF, data) and memory card interface.
One Touch Diag: One Touch Diag is an exclusive fea-
ture that Nexto Series brings to PLCs. With this new con-
3

1. INTRODUCTION
cept, the user can check diagnostic information of any mod-
ule present in the system directly on CPU’s graphic display
with one single press in the diagnostic switch of the respective
module. OTD is a powerful diagnostic tool that can be used
offline (without supervisor or programmer), reducing mainte-
nance and commissioning times.
OFD – On Board Full Documentation: Nexto Series CPUs are capable of storing the complete project documentation in
its own memory. This feature can be very convenient for backup purposes and maintenance, since the complete information is
stored in a single and reliable place.
ETD – Electronic Tag on Display: Another exclusive feature that Nexto Series brings to PLCs is the Electronic Tag on
Display. This new functionality brings the process of checking the tag names of any I/O pin or module used in the system
directly to the CPU’s graphic display. Along with this information, the user can check the description, as well. This feature is
extremely useful during maintenance and troubleshooting procedures.
DHW – Double Hardware Width: Nexto Series modules were designed to save space in user cabinets or machines.
For this reason, Nexto Series delivers two different module widths: Double Width (two backplane rack slots are required)
and Single Width (only one backplane rack slot is required). This concept allows the use of compact I/O modules with a
high-density of I/O points along with complex modules, like CPUs, fieldbus masters and power supply modules.
UCP de Alta Velocidade: All Nexto Series CPUs were designed to provide an outstanding performance to the user, allow-
ing the coverage of a large range of applications requirements. For example: Nexto CPUs can execute a sum, multiplication
and subtraction instruction in less than 15 ns for integer type values and in less than 23 ns for real type values. Nexto CPUs
are able to perform 1,000 PID loops in less than 5 ms.
iF Product Design Award 2012: Nexto Series was the
winner of iF Product Design Award 2012 in industry + skilled
trades group. This award is recognized internationally as a
seal of quality and excellence, considered the Oscars of the
design in Europe.
1.1.3. Architecture
Nexto Series is capable of addressing many different applications ranging from small high-speed machinery automation to
large complex process automation. For this reason, the system is very flexible and modular enabling many different configura-
tions without compromising cost and performance.
The modules Nexto and Nexto Jet cannot be used together in the same bus, it means that, the usage of mixed modules in
the same bus local/remote is not valid, consequently the application will not be executed by the chosen CPU.
The architecture is divided in the following main components:
1.1.3.1. CPU
The CPU is responsible for the execution of all logic and control functions. The basic CPU cycle is composed by: reading
inputs, running application algorithms and logic, writing outputs and providing communication processes with the supervision
system and fieldbus networks.
1.1.3.2. Power Supply Module (PSU)
The power supply module provides power to the modules installed on the backplane racks. Each rack must have its own
power supply module. Application power requirements are shown in the configuration tool.
1.1.3.3. Backplane Bus
A typical system consists of a local rack (CPU and its local I/O modules) and remote racks (sets of remote I/O modules).
For the local rack, Nexto Series architecture delivers a state-of-the-art high-speed real-time 100 Mbps Ethernet backplane bus
technology. Since it is Ethernet based, the local rack bus can be easily extended to remote racks using standard Ethernet
cables (up to 100 m) and devices called bus expansion modules. These devices convert the internal signals to the standard
Ethernet 100BASE-TX media. Bus expansions can be used in redundant mode to obtain an extremely reliable architecture.
Each backplane rack can have up to 24 modules and the system can address up to 25 racks.
1.1.3.4. Backplane Racks
The backplane racks have special aluminum chassis with a printed circuit board where all modules are connected. They
are assembled directly to the panel and deliver high immunity against EMI and ESD (if the recommended grounding rules are
performed during installation phase).
4

1. INTRODUCTION
1.1.3.5. I/O Modules
The I/O modules are plugged into the racks for adapting the different types of field signals to the CPU or fieldbus heads.
Nexto Series supports a wide variety of I/O types and operating ranges, thus covering all the typical needs for an automation
system. The Nexto modules are hot-swappable, meaning that they can be unplugged without turning the system off or removing
the power and the modules that make part of Nexto Jet solution does not support this functionality. Due to isolation features,
some I/O modules must be supplied by external power supplies.
1.1.3.6. Fieldbus Head
The fieldbus heads connect Nexto Series modules to different fieldbus networks. They can communicate with CPUs from
different vendors, supporting several protocols like MODBUS, PROFIBUS-DP and others.
1.1.3.7. Fieldbus Interface
The fieldbus interfaces are fieldbus master nodes and allow the access to remote modules or other equipment based on
major industry fieldbus, like PROFIBUS-DP, MODBUS and others. The fieldbus interfaces are plugged into local racks and
use two I/O module slots.
5

1. INTRODUCTION
1.1.4. Application Examples
1.1.4.1. Compact CPU
This architecture explores the needs of compact applications. A CPU with integrated power supply (NX3003, NX3004 or
NX3005), 8 positions rack and input and output modules enable the reduction of space and cost in your project.
These architectures presented in Figure 1and Figure 2are the most indicated to be used in machinery automation. It is
important to note that the Nexto and Nexto Jet modules cannot be used simultaneously at the same bus, or the architecture is
formed with Nexto or Nexto Jet modules.
Figure 1: Compact CPU with Nexto Modules Figure 2: Compact CPU with Nexto Jet Modules
1.1.4.2. Single CPU
This architecture is based on a single rack, called base rack. This rack is populated with a CPU, a power supply module
(PSU) and the required I/O modules for the application, as shown on Figure 3. The modules order must follow the configuration
rules presented in the configuration tool.
This architecture is intended for use in small applications, like machinery automation.
The same architecture using Nexto Jet modules can be checked in Figure 4following.
Figure 3: Single CPU with Nexto Modules Figure 4: Single CPU with Nexto Jet Modules
6

1. INTRODUCTION
1.1.4.3. Single CPU with Remote Rack Expansion
This architecture is based on a base rack (where the CPU is placed) and remote racks. The communication between the
base rack and remote racks is done via the bus expansion module. Each remote rack needs its own power supply module
(PSU) and bus expansion module. Each expansion module can be located 100 m far from the other using standard shielded
CAT5 Ethernet cables. The expansion module has two RJ45 ports, where one port is for incoming data and another one for
outgoing data. In this application example, the base rack expansion module is connected using only one cable and leaving the
incoming data port open. The last remote rack has the outgoing data port open. The remote racks in between, will have both
ports connected: one port connected to previous rack and the other to the next rack. Each expansion module has a switch for
selecting the rack number. Each rack must have a unique address.
When this kind of architecture is used, it is important to remember that in case of Nexto modules usage, only this type
of module can be used in the local and/or expansion rack. The same is true in case of Nexto Jet modules usage. The next
architectures that follow in Figure 5and Figure 6are examples with Nexto and Nexto Jet modules.
This architecture is intended for medium to large applications, where the number of I/O points is high.
Figure 5: Single CPU with Remote Rack Expansion and
Nexto Modules
Figure 6: Single CPU with Remote Rack Expansion and
Nexto Jet Modules
7

1. INTRODUCTION
1.1.4.4. Single CPU with Remote Rack Expansion and Loopback
This architecture is based on the previous one with a base rack (where the CPU is placed) and remote racks. The commu-
nication between the base rack and remote racks is also made via the bus expansion module. The only difference is that the
outgoing data port in the last bus expansion module is connected to the base rack expansion module incoming data port. This
architecture allows the system to keep the I/O access even in the case of a single failure on extension cables. The CPU will
detect the damaged cable, re-route the internal data paths to override this failure and generate user diagnostics. This feature is
interesting for fast maintenance with the system powered on and it increases the overall system availability.
When this kind of architecture is used, it is important to remember that in case of Nexto modules usage, only this type
of module can be used in the local and/or expansion rack. The same is true in case of Nexto Jet modules usage. The next
architectures that follow in Figure 7and Figure 8are examples with Nexto and Nexto Jet modules.
This architecture is intended for medium to large applications, where the number of I/O points is high and there is the need
of higher availability.
Figure 7: Single CPU with Remote Rack Expansion,
Loopback and Nexto Modules
Figure 8: Single CPU with Remote Rack Expansion,
Loopback and Nexto Jet Modules
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1. INTRODUCTION
1.1.4.5. Single CPU with Redundant Rack Expansion and Loopback
This architecture is based on the use of two bus expansion modules in the racks. With more than one expansion module,
the system has an outstanding availability, because it supports single cable failure or expansion module failure. Just as the
previous architecture, this is intended for systems where maintenance is an issue and the system must be available for a longer
time. In this architecture, the racks must be mounted as the following diagram, where the expansion modules are located side
by side on the last slot positions. Besides, there are unused expansion module ports that must be left unconnected.
Figure 9: Single CPU with Redundant Rack Expansion and Loopback Bus
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1. INTRODUCTION
1.1.4.6. Fieldbus Interfaces
This architecture is based on the use of fieldbus interfaces to access networks for distributing remote I/Os and other third-
party devices.
Figure 10: Fieldbus Interfaces
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1. INTRODUCTION
1.1.4.7. Fieldbus Interfaces with Redundancy
This architecture is based on the previous one with the difference of using two fieldbus interfaces for accessing the same
network. Since it has two interfaces, the network is redundant, providing a system with higher availability.
Figure 11: Fieldbus Interfaces with Redundancy
ATTENTION:
The modules that comprise the solution Nexto Jet not support any kind of redundancy, so its
use is not allowed in architectures as described in this section.
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1. INTRODUCTION
1.1.4.8. MODBUS TCP Head
This architecture is based on the use of fieldbus MODBUS interfaces to access networks for distributing remote I/Os and
other third-party devices.
Figure 12: MODBUS TCP Head
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1. INTRODUCTION
1.1.4.9. CPU Redundancy
For very critical applications, Nexto Series is capable of having redundancy of CPUs. The only CPU model with this
feature is NX3030. These CPUs can be located in different racks (known as half clusters). In this architecture, the system
will have one controller running the control task (primary controller) and another one acting as the standby controller with all
current system status for automatic switchover in the event of a primary controller failure. This means that critical processes
are not affected by control system hardware failures. The results are: an increased productivity, a minimized downtime and
low maintenance times.
The communication between the controllers is established at the end of each CPU cycle through two high-speed redundancy
links.
Figure 13: CPU Redundancy
At the center of a two half cluster redundant system, there is a pair of redundant CPUs. The redundancy links – between
the two CPUs – have two channels, so single failures on each channel will not affect system performance.
The Active CPU executes the application program and controls the remote I/O. The Standby CPU is put as a background
resource, ready to take over if necessary. The standby CPU is connected to the active CPU via a high-speed link present on
a module called Redundancy Link Module. This module must be placed at right side of the CPU. The CPU and Redundancy
Link module must be placed in certain slots in the racks. For details, check the CPU user manual. In the event of an unexpected
failure affecting the active CPU, the standby system switches over automatically, changing execution of the application program
and control of the I/O over to the standby CPU, with an up-to-date data context. Once they had switched over, the standby
CPU becomes the active CPU.
Configuration of both systems shall be identical. CPU modules will be placed at identical slots in both systems. After
power on, one of the CPUs operates as active and another CPU enters standby mode. Active CPU will update the system status
of standby CPU at the end of every scan. So the standby CPU is always updated with latest I/O status and results of program
execution in the active CPU. This application is easy to set up, with no special programming or parameterization needed by
the user.
1.1.4.10. Minimum Configuration of a Redundant PLC (Without PX2612 Panel Usage)
The redundant PLC is composed at least by two half-clusters identically, where each half-cluster is formed of the following
modules:
rack where the modules are inserted, and can be NX9000, NX9001, NX9002 and NX9003
power supply NX8000
the CPU NX3030
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1. INTRODUCTION
the module NX4010
The Figure 14 shows an example of minimum configuration of a redundant PLC, that can be used with the NX9000 rack.
Figure 14: Minimum Configuration of a Redundant PLC
1.1.4.11. CPU & Network Interface Modules Redundancy
As shown in the previous diagram, this architecture has network modules with protocols based on Ethernet. There are two
network modules for each purpose: a control network for CPU to CPU communication and a supervision network for SCADA
and OPC usage. Both half clusters must have two interfaces for each network, forming a full redundant system with CPU,
network interface and physical layer redundancy.
1.1.5. Main Features
1.1.5.1. CPUs
The CPUs have many integrated functions, online programming, high memory capacity and many serial channels. These
devices are powered by latest 32-bit CPUs allowing outstanding performance and integration of many features. Even the
simplest CPU version has an Ethernet port for programming, use in MODBUS TCP networks and embedded web server. The
CPUs NX3010, NX3020 and NX3030 have two serial interfaces for connecting local HMIs and MODBUS networks, they also
have a storage card slot for hosting web pages, application source code and other user files. The CPUs NX3003, NX3004 and
NX3005 have one serial interface for connecting local HMI and MODBUS network and does not have memory card slot. All
CPUs have web pages with complete status and diagnostics list, firmware update, and other features.
1.1.5.2. Modules
The modules carry high density I/Os. Nexto Series delivers two module form factors – slim and full size modules – allowing
the best I/O combination for many applications where high-density and panel size can be an issue. Every I/O module has a
display for local diagnosis, where each I/O point state is presented. There is also multifunctional diagnosis about the module
status. All diagnostics information is also accessible remotely by CPU, fieldbus head or by MasterTool IEC XE configuration
tool.
The Nexto I/O modules with frontal cover have labels where the user can identify the modules and the terminal blocks.
1.1.5.3. High-Speed Backplane Bus
Nexto Series architecture has a state-of-the-art 100 Mbps Ethernet based backplane bus. This backplane bus has real-time
behavior, allowing predicted and cyclic data exchanges. The high throughput enables the update of large quantities of inputs
in a short time window. Besides, time critical applications like motion control are possible with this technology. The modules
are addressed and identified automatically, avoiding errors during application setup and field maintenance. The backplanes
NX9000, NX9001, NX9002 and NX9003 provide special features in order to allow CPU redundancy in the same rack or in
different racks using the Redundancy Link Modules:
Automatic module addressing and identification
Hot-swap (except NX9010)
100 Mbps Ethernet-based serial bus
Extremely accurate time synchronization for I/O update or time stamping
Single chip hardware solution
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