Amphenol Telaire Chipcap 2 User guide

AAS-916-127 Rev. J
February 2018
®
A
mphenol
Advanced Sensors
ChipCap® 2
Application Guide

Application Guide iii
ChipCap® 2 Humidity and Temperature Sensor Contents
1. Sensor Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Relative Humidity (RH%) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Typical %RH Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Temperature (°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.4 Typical Temperature Accuracy. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.5 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.5.1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.5.2 Supply Current (IDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.5.3 Sleep Current (Isleep) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.6 Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.6.1 Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.6.2 Operating RH Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.7 Absolute Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.8 Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.9 Package Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.10 Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Important Safety Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Preliminary Consideration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.4 Heating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.5 Soldering Instruction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.6 Storage and Handling Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.7 Reconditioning Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.8 Material Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.9 Traceability Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.10 Shipping Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3. Interface Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Digital Output (I²C Interface). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.1 Power Pads (5.VCORE, 6.VSS, 7.VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1.2 Serial Clock & Data Pads (3. SDA, 4. SCL). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Contents ChipCap® 2 Humidity and Temperature Sensor
iv Application Guide
3.1.3 Alarm Pads (1. Alarm Low, 8. Alarm High) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
3.2 Analog Output (PDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.2.1 Power Pads (5.VCORE, 6.VSS, 7.VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
3.2.2 PDM Output Pads (1.PDM_T, 2.PDM_H) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
3.2.3 Alarm Pads (8.Alarm_High, 1.Alarm_Low [optional]) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
3.2.4 Serial Clock & Data Pads (3.SDA, 4.SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
3.2.5 Typical Circuit Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
4. Electrical Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1 Absolute Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.2 Electrical Specification and Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . 14
4.3 Output Pad Drive Strength . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.4 ESD/Latch-Up-Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5. Communicating with ChipCap 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.1 Power–On Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.2 I2C Features and Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.3 Measurement Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.3.1 Data Fetch in Update Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
5.3.2 Data Fetch in Sleep Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
5.4 Status Bits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.5 I2C Commands. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.6 Data Fetch (DF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.7 Measurement Request (MR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.8 Ready Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.9 Command Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.10 Command Encodings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.11 Command Response and Data Fetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.12 EEPROM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6. Converting PDM to Analog Signal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6.1 PDM (Pulse Density Modulation) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6.2 Low Pass Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6.3 Analog Output Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.3.1 Polynomial Equation Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

Application Guide v
ChipCap® 2 Humidity and Temperature Sensor Contents
6.3.2 Polynomial Equation Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
7. Alarm Function (Optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.1 Alarm Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.2 Alarm Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.3 Alarm Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.4 Alarm Output Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
7.5 Alarm Polarity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
8. Part Number List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Contents ChipCap® 2 Humidity and Temperature Sensor
vi Application Guide

Application Guide 1
ChipCap® 2 Humidity and Temperature Sensor
1. Sensor Performance
1.1 Relative Humidity (RH%)
1.2 Typical %RH Accuracy
Resolution 14 bit (0.01%RH)
Accuracy ±2.0%RH (20~80%RH)
(Accuracies measured at 25°C, 5.0V)
(Custom accuracy tolerance available.)
Repeatability ±0.2%RH
Hysteresis +/- 1.0% RH
Linearity <2.0%RH
Response Time 4.0 sec (τ63%)
(Measured at 25°C, 1 m/sec airflow for achieving 63%
of step from 33%RH to 90%RH)
Temperature Coefficient
Max 0.05%RH/°C @50%RH and 0.15%RH/°C
@90%RH (both 10-60°C)
Operating Range 0 ~ 100%RH (Non-Condensing)
Long Term Drift <0.5%RH/yr (Normal condition)

ChipCap® 2 Humidity and Temperature Sensor
2Application Guide
1.3 Temperature (°C)
1.4 Typical Temperature Accuracy
1.5 Electrical Specifications
1.5.1 Supply Voltage
min 2.3V to max 5.5V
1.5.2 Supply Current (IDD)
750 µA (typical)
1.5.3 Sleep Current (Isleep)
0.6 µA (typical)
Resolution 14 bit (0.01°C)
Accuracy
±0.3°C
(Accuracies measured at 25°C, 5.0V)
Repeatability ±0.1°C
Response Time
5.0 sec (63%)
(min. 5.0 sec, max. 20 sec)
Operating Range - 40 to 125°C
Long Term Drift <0.05°C/yr (Normal condition)

Application Guide 3
ChipCap® 2 Humidity and Temperature Sensor
1.6 Environmental
1.6.1 Operating Temperature Range
- 40 to 125°C
1.6.2 Operating RH Range
0 to 100% RH (non-condensing)
1.7 Absolute Maximum Rating
1.8 Soldering Information
Standard or IR Solder Reflow
Tp: 240°C, tp: 40 sec. (qualify Pb free profile)
Note: After soldering reconditioning will be required. Details for this process can be found on page 8.
1.9 Package Contents
Capacitive polymer RH Sensor, PTA (Proportional to Absolute) Temperature sensor integrated ASIC chip in LCC
(Leadless Chip Carrier) package, SMD, RoHS compliant
Parameter Min Max
Supply Voltage (VDD) -0.3V 6.0V
Storage Temp (Tstrg) -55°C 150°C
Junction Temp (Tj) -55°C 150°C

ChipCap® 2 Humidity and Temperature Sensor
4Application Guide
1.10 Dimensions (all measurements in mm (inches))

Application Guide 5
ChipCap® 2 Humidity and Temperature Sensor
2. General Information
2.1 Important Safety Information
Amphenol Advanced Sensors makes no warranty, representation or guarantee regarding the suitability of this product
for any particular application, including safety critical applications. Nor does Amphenol Advanced Sensors assume any
liability arising out of the application or use in any product or circuit. Amphenol Advanced Sensors specifically
disclaims all liability without limitation consequential or incidental damages. No statuary or fitness for particular
purpose shall be implied.
WARNING! Before installing the product, review the product data sheet and this application guide.
The product shall be used only within power supply and electrical input and output limits as
specified by the datasheet and application guide.
Improper use of the product may result in product damage and property loss and/or personal
injury.
2.2 Preliminary Consideration
To maximize the performance of ChipCap®2, it is important to plan an appropriate location of the sensor at the design
stage. Airflow and proper exposure to ambient air must be secured for ChipCap 2 to ensure expected performance.
Airflow holes must NOT be blocked. Any heat generating parts near ChipCap 2 will distort the proper measurement of
relative humidity and temperature reading, and heat generating parts should be avoided or measures should be taken to
prevent heat transfer.
2.3 Operating Conditions
Figure 1 below shows ChipCap 2‘s maximum and recommended normal operating condition. Within the normal range,
ChipCap 2 performs in a stable manner. Prolonged exposures to conditions outside normal range, especially at
humidity over 90%RH, may temporarily offset the RH signal up to ±3%RH. When it returns to the normal range, it will
gradually recover back to the calibration state.
The re-conditioning procedure in section 2.7 on page 8 will help reduce this recovery time. Long term exposure to
extreme conditions may also accelerate aging of the sensor.

ChipCap® 2 Humidity and Temperature Sensor
6Application Guide
Figure 1: Operating Conditions
2.4 Heating
Relative humidity is a function of temperature. Therefore, sensor placement and self-heating need to be carefully
understood and managed. It is crucial to keep the temperature of the humidity sensing element the same as actual
environment where the RH measurement is desired to be made. Please see the following recommendations for accurate
RH measurement.
•Sensor should be kept isolated from all sources of heat generation.
•Sensor should be installed on an efficient heat sink so there is no heat buildup on the sensor element and to buffer
thermal effects from the power electronics, microcontrollers, displays and other heat sources.
•Telaire recommends that the sensor is operated in pulse mode. Keep the active state of the part to a minimum. A
typical sampling time is in the range from 0.5-1s. (The minimum is 0.2s, and a maximum 10% duty cycle sampling
time is recommended).
•Sensor operating voltage should be regulated within 3.3 ±0.5V or 5.0 ±0.5V depending on part number.
2.5 Soldering Instruction
ChipCap 2 is designed for a mass production reflow soldering process. It is qualified for soldering profile according to
IPC/JEDEC J-STD-020D (see Figure 2 below) for Pb-free assembly in standard reflow soldering ovens or
IR/Convection reflow ovens to withstand peak temperature at 240°C and peak time up to 40 sec. For soldering in Vapor
Phase Reflow (VPR) ovens, the peak conditions are limited to TP< 240°C with tP<40sec and ramp-up/down speeds
shall be limited to 10°C/sec. For manual soldering, contact time should be limited to 4 seconds at up to 350°C.
No-Clean solder flux should be used. Do not wash the part post solder unless the sensor element has been protected.

Application Guide 7
ChipCap® 2 Humidity and Temperature Sensor
Figure 2: Soldering Profile
IPC/JEDEC standard
TP ≤240°C, tP < 40sec, TL<200°C, tL<150sec.
Ramp-up/down speed < 5°C/sec.
IMPORTANT:Test or measurement right after reflow soldering may read an offset as the sensor needs time for
re-hydration. The recovery time may vary depending on reflow soldering profile and ambient storage
condition.
2.5 Soldering Instruction (cont.)
For most of the standard reflow soldering, the following rehydration process will bring the sensor back to less than
±1%RH of the original calibration state.
For most standard reflow soldering profile allow minimum 24 hours of stabilization under room environment (23±3
°C, 55±5 % RH)
Note: We are testing if both hydration process 32±2 °C 85±5 %RH, Duration: 45±5 hours (Non-Baking, Max time (50
hours) and stabilization in ambient room environment) can be used.
Contact Amphenol Advanced Sensors customer support for customized recovery measures specific to your reflow
soldering process.
For Land Pattern drawing and dimensions, see Figure 4 on page 9.
2.6 Storage and Handling Information
ChipCap 2 contains a polymer based capacitive humidity sensor sensitive to environment, and should NOT be handled
as an ordinary electronic component.
Chemical vapors at high concentration may interface with the polymer layers, and, coupled, with long exposure time,
may cause a shift in both offset and sensitivity of the sensor. A detailed Chemical exposure test report is available upon
request.

ChipCap® 2 Humidity and Temperature Sensor
8Application Guide
Although the sensor endures the extreme conditions of -50°C~150°C, 0%~100%RH (non condensing), long term
exposure in such an environment may also offset the sensor reading. Hence, once the package is opened, it is
recommended to store it in a clean environment with temperature at 5°C~55°C and humidity at 10%~70%RH.
ChipCap 2 is ESD protected up to 4000V and has Latchup of ±100mA or (up to +8V / down to -4V) relative to
VSS/VSSA, and is also packed in ESD protected shipping material. Normal ESD precautions are required when
handling in the assembly process.
2.7 Reconditioning Procedure
If ChipCap 2 is exposed to extreme conditions or contaminated with chemical vapors, the following reconditioning
procedure will recover the sensor back to calibration state.
Baking: 120°C for 6 hours and
Re-Hydration: 30°C at >80%RH for 24 hours
2.8 Material Contents
ChipCap 2 consists of a sensor cell and IC (polymer /glass and silicon substrate) packaged in a surface mountable LCC
(Leadless Chip Carrier) type package. The sensor housing consists of a PPS (Poly Phenylene Sulfide) cap with epoxy
glob top on a standard FR4 substrate. Pads are made of Au plated Cu. The device is free of Pb, Cd and Hg.
A RoHS compliant / REACH report is available.

Application Guide 9
ChipCap® 2 Humidity and Temperature Sensor
2.9 Traceability Information
ChipCap 2 is laser marked with product type and lot identification. Further information about an individual sensor is
electronically stored on the chip.
The first line denotes the sensor type: CC2-A for PDM output, CC2-D for I²C output.
Lot identification is printed on the second line with a 5 digit alphanumeric code.
An electronic identification code stored on the chip can be decoded and allows for tracking on a batch level through
production, calibration and testing.
Figure 3: Laser Marking
2.10 Shipping Package
ChipCap 2 is provided in tape and reel shipment packaging, sealed into antistatic ESD trays. Standard packaging sizes
are 2,500 or 500 units per reel. The drawing of the packaging tapes with sensor orientation and packing box dimensions
are shown in Figure 4 below and Figure 5 on the next page.
Figure 4: Packaging Tapes (all measurements in mm (inches)
CC2 CC2
Land Pattern (a) Packing Reel and Tape (b)

ChipCap® 2 Humidity and Temperature Sensor
10 Application Guide
2.10 Shipping Package (cont.)
Figure 5: Packing (Box)
Dimension: 215 x 210 x 30 mm
Inbox: 500 ea Inbox: 2,500 each
Dimension: 360 x 355 x 50 mm
Outbox: 5,000 each (5 x Inbox 500)
Dimension: 320 x 225 x 235 mm
Outbox: 20,000 each (8 x Inbox 2500)
Dimensions: 645 x 360 x 310 mm

Application Guide 11
ChipCap® 2 Humidity and Temperature Sensor
3. Interface Specification
3.1 Digital Output (I² C Interface)
Figure 6: Pin Assignments
3.1.1 Power Pads (5.VCORE, 6.VSS, 7.VDD)
ChipCap 2 is capable of operating on a wide range of power supply voltages from 2.3V to 5.5V.
The recommended supply voltage is either 3.3 ±0.5V or 5.0 ±0.5V. The power supply should be connected to VDD
(power supply pad 7). VDD and VSS (Ground pad 6) should be decoupled with a 220nF capacitor.
IMPORTANT: Vcore must not be connected to VDD, and it must always be connected to an external 100nF capacitor to
ground. (see Figure 7, “Typical Application Circuit (I2C),” on page 12).
Table 1: Pin Assignments
Pin-No Name Description
1 Alarm_Low Low alarm output
2 Ready Ready signal (conversion complete output)
3 SDA I2C data
4 SCL I2C clock
5 VCORE Core voltage
6 VSS Ground supply
7 VDD Supply voltage (2.3-5.5V)
8 Alarm_High High alarm output

ChipCap® 2 Humidity and Temperature Sensor
12 Application Guide
3.1.2 Serial Clock & Data Pads (3. SDA, 4. SCL)
The sensor’s data is transferred in and out through the SDA pad, while the communication between ChipCap 2 and the
microcontroller (MCU) is synchronized through the SCL pad.
ChipCap 2 has an internal temperature compensated oscillator that provides time base for all operation, and uses an
I²C-compatible communication protocol with support for 20 KHz to 400 KHz bit rates.
External pull-up resistors are required to pull the drive signal high; they can be included in the I/O circuits of
microcontroller.
Further information about timing and communication between the sensor and microcontroller is explained in Section 5,
“Communicating with ChipCap 2” on page 18.
3.1.3 Alarm Pads (1. Alarm Low, 8. Alarm High)
The alarm output can be used to monitor whether the sensor reading has exceeded or fallen below pre-programmed
values. The alarm can be used to drive an open-drain load connected to VDD, or it can function as a full push-pull
driver. If a high voltage application is required, external devices can be controlled with the Alarm pins, as demonstrated
in Figure 22 on page 36.
The two alarm outputs can be used simultaneously, and these alarms can be used in combination with the I2C. Further
information about alarm control is explained in Section 7.
•VDD and Ground is decoupled by a 220nF capacitor.
•Vcore (Not Used) and Ground is decoupled by 100nF capacitor.
•Pull-up resistors should be included between ChipCap 2 and MCU.
Figure 7: Typical Application Circuit (I2C)
VDD VDD
SCL
SDA
CC2 D
(slave)
uC
(master)
GND
VDD
ALARM_HIGH
READY
ALARM_LOW
RPU > 1k:
2.3V < VDD < 5.5V

Application Guide 13
ChipCap® 2 Humidity and Temperature Sensor
3.2 Analog Output (PDM)
Figure 8: Pin Assignments
3.2.1 Power Pads (5.VCORE, 6.VSS, 7.VDD)
ChipCap 2 is capable of operating on a wide range of power supply voltages from 2.3V to 5.5V. The recommended
supply voltage is either 3.3 ±0.5V or 5.0 ±0.5V.
The power supply should be connected to VDD (power supply pad 7). VDD and VSS (Ground pad 6) should be
decoupled with a 220 nF capacitor.
IMPORTANT:Vcore must not be connected to VDD, and it must always be connected to an external 100 nF capacitor to
ground (see Figure 9 on page 14).
Table 2: Pin Assignments for Analog Output
Pin-No Name Description
1 PDM_T Temperature PDM
2 PDM_H Humidity PDM
3SDA I2C data (Not Used)
4SCL I2C clock (Not Used)
5V
CORE Core voltage
6 VSS Ground supply
7 VDD Supply voltage (2.3-5.5V)
8 Alarm_High High Alarm output

ChipCap® 2 Humidity and Temperature Sensor
14 Application Guide
3.2.2 PDM Output Pads (1.PDM_T, 2.PDM_H)
Temperature PDM (Pulse Density Modulation) appears on the PDM_T/Alarm_Low pad (1) and corrected Humidity
PDM appears on the PDM_H pad (2).
When pad (1) is selected for Temperature PDM, the Alarm_Low function is disabled and only one Alarm function
(Alarm_High: pad 8) is usable.
Note: The ChipCap 2 PDM output is pre-programmed in the factory for Humidity and Temperature output mode.
3.2.3 Alarm Pads (8.Alarm_High, 1.Alarm_Low [optional])
As ChipCap 2 PDM is factory set for Humidity and Temperature output mode, only the High Alarm output can be used
in combination with ChipCap 2 PDM.
If both high and low alarm functions are required, pads 1 and 8 will be programmed at factory to use as Alarm_Low
and Alarm_High respectively with required high and low humidity values. In such a case, ChipCap 2 will output the
corrected humidity PDM only, See Section 7 for the alarm function.
3.2.4 Serial Clock & Data Pads (3.SDA, 4.SCL)
For ChipCap 2 PDM output, both SDA and SCL pads are not used and must be connected to VDD.
3.2.5 Typical Circuit Connection
VDD and Ground are decoupled by a 220nF capacitor. Vcore (Not Used) and Ground are also decoupled by a 100nF
capacitor. SCL and SDL (not used) are connected to VDD.
Between ChipCap 2 and MCU (µC), Low Pass Filtering (see Section 6.2 on “Low Pass Filtering” on page 32 for more
information) with 10 kΩresistors and 6,400 nF capacitors is added to create an analog signal.
Figure 9: Typical Application Circuit (PDM)
uC
(master)
6400nF
6400nF
2.3V < VDD < 5.5 V
SCL
VDD
CC2 A
VCORE
GND
VDD
ALARM_HIGH
R
R
SDA
PDM_H
PDM_T
100nF
220nF

Application Guide 15
ChipCap® 2 Humidity and Temperature Sensor
4. Electrical Specification
4.1 Absolute Maximum Rating
Table 3 below shows the Absolute Maximum Ratings for ChipCap 2. Exposure to these extreme condition for extended
period may deteriorate the sensor performance and accelerate aging. Functional operation is not implied at these
conditions.
4.2 Electrical Specification and Recommended Operating Conditions
The operating conditions recommended for ChipCap 2 are given in Table 4 and the electrical specification is shown in
Table 5 on the next page.
Table 3: Absolute Maximum Rating
Parameter Symbol Min Max Unit
Supply Voltage (VDD)VDD -0.3 6.0 V
Supply Voltage at I/O pads VIO -0.3 VDD+0.3 V
Storage Temperature Range TSTOR -55 150 °C
Junction Temperature Tj-55 150 °C
Table 4: Recommended Operating Conditions
Parameter Symbol Min Typ Max Unit
Supply Voltage to Gnd VSUPPLY 2.3 5.5 V
Ambient Temperature Range TAMB -40 125 C
External Capacitance between VDD pin and Gnd CVSUPPLY 100 220 470 nF
External Capacitance between Vcore and Gnd - Sleep CVCORE_SM 10 110 nF
External Capacitance between Vcore and Gnd - Ground CVCORE_SM 90 330 nF
Pull-up on SDA and SCL RPU 12.2 k