Arbor Technology EmQ-i2301 User manual

I
EmQ-i2301
Qseven®CPU Module
User’s Manual
Version 1.1
2017.05

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Revision History
Version Release Time Description
1.0 August, 2014 Initial release
1.1 May, 2017 Add notes on USB ports in “1.3
Specications” and remove SDIO related
information.

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Contents
Revision History .................................................................................i
Contents.............................................................................................ii
Preface...............................................................................................iv
Copyright Notice .................................................................................... iv
Declaration of Conformity ...................................................................... iv
CE................................................................................................... iv
FCC Class A .................................................................................... v
RoHS ............................................................................................... v
SVHC / REACH .............................................................................. vi
Warning.................................................................................................. vi
Replacing the Lithium Battery ................................................................ vi
Technical Support .................................................................................. vi
Warranty.................................................................................................vii
Chapter 1 - Introduction....................................................................1
1.1. The Product .....................................................................................2
1.2. About this Manual ............................................................................2
1.3. Specications...................................................................................3
1.4. Inside the Package ..........................................................................4
1.5. Ordering Information ........................................................................ 5
1.6. Driver Installation Note..................................................................... 6
Chapter 2 - Board Overview .............................................................9
2.1. Board Dimensions..........................................................................10
2.2. Block Diagram................................................................................ 11
2.3. Connector Pin Denition ................................................................12
Chapter 3 - BIOS..............................................................................15
3.1. Main ............................................................................................... 17
3.2. Advanced .......................................................................................18
3.2.1. Boot Conguration ............................................................... 20
3.2.2. PCI Express Conguration ..................................................20
3.2.3. USB Conguration ............................................................... 21
3.2.4. Audio Conguration .............................................................21
3.2.5. LPSS & SCC Conguration .................................................22
3.2.6. Miscellaneous Conguration................................................ 23
3.2.7. Security Conguration .........................................................23
3.2.8. Video Conguration .............................................................24
3.2.9. SATA Conguration..............................................................26
3.2.10. ACPI Table/Feature Control ...............................................26
3.2.11. LM90 Thermal Sensor .......................................................27
3.2.12. SIO FINTEK81866 ............................................................27
Contents

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Contents
3.3. Security .......................................................................................... 28
3.4. Power.............................................................................................29
3.4.1 Advanced CPU Control......................................................... 30
3.4. Boot................................................................................................32
3.5. Exit ................................................................................................. 34

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Preface
Copyright Notice
All Rights Reserved.
The information in this document is subject to change without prior notice in
order to improve the reliability, design and function. It does not represent a
commitment on the part of the manufacturer.
Under no circumstances will the manufacturer be liable for any direct, indirect,
special, incidental, or consequential damages arising from the use or inability
to use the product or documentation, even if advised of the possibility of such
damages.
This document contains proprietary information protected by copyright. All rights
are reserved. No part of this manual may be reproduced by any mechanical,
electronic, or other means in any form without prior written permission of the
manufacturer.
Declaration of Conformity
CE
The CE symbol on your product indicates that it is in compliance with the
directives of the Union European (EU). A Certicate of Compliance is available
by contacting Technical Support.
This product has passed the CE test for environmental specications when
shielded cables are used for external wiring. We recommend the use of shielded
cables. This kind of cable is available from ARBOR. Please contact your local
supplier for ordering information.
This product has passed the CE test for environmental specications. Test
conditions for passing included the equipment being operated within an
industrial enclosure. In order to protect the product from being damaged by ESD
(Electrostatic Discharge) and EMI leakage, we strongly recommend the use of
CE-compliant industrial enclosure products.
Warning
This is a class A product. In a domestic environment this product may cause
radio interference in which case the user may be required to take adequate
measures.
Preface

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Preface
FCC Class A
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions:
(1)This device may not cause harmful interference, and
(2)This device must accept any interference received, including interference that
may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference when the
equipment is operated in a commercial environment. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instruction manual, may cause harmful interference to radio
communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the
interference at his own expense.
RoHS
ARBOR Technology Corp. certies that all components in its products are in
compliance and conform to the European Union’s Restriction of Use of Haz-
ardous Substances in Electrical and Electronic Equipment (RoHS) Directive
2002/95/EC.
The above mentioned directive was published on 2/13/2003. The main pur-
pose of the directive is to prohibit the use of lead, mercury, cadmium, hexava-
lent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl
ethers (PBDE) in electrical and electronic products. Member states of the EU
are to enforce by 7/1/2006.
ARBOR Technology Corp. hereby states that the listed products do not contain
unintentional additions of lead, mercury, hex chrome, PBB or PBDB that ex-
ceed a maximum concentration value of 0.1% by weight or for cadmium exceed
0.01% by weight, per homogenous material. Homogenous material is dened
as a substance or mixture of substances with uniform composition (such as sol-
ders, resins, plating, etc.). Lead-free solder is used for all terminations (Sn(96-
96.5%), Ag(3.0-3.5%) and Cu(0.5%)).

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Preface
SVHC / REACH
To minimize the environmental impact and take more responsibility to the earth
we live, Arbor hereby conrms all products comply with the restriction of SVHC
(Substances of Very High Concern) in (EC) 1907/2006 (REACH --Registration,
Evaluation, Authorization, and Restriction of Chemicals) regulated by the
European Union.
All substances listed in SVHC < 0.1 % by weight (1000 ppm)
Warning
Single Board Computers and their components contain very delicate
Integrated Circuits (IC). To protect the Single Board Computer and its
components against damage from static electricity, you should always follow the
following precautions when handling it:
1. Disconnect your Single Board Computer from the power source when you
want to work on the inside.
2. Hold the board by the edges and try not to touch the IC chips, leads or
circuitry.
3. Use a grounded wrist strap when handling computer components.
4. Place components on a grounded antistatic pad or on the bag that comes
with the Single Board Computer, whenever components are separated from
the system.
Replacing the Lithium Battery
Incorrect replacement of the lithium battery may lead to a risk of explosion.
The lithium battery must be replaced with an identical battery or a battery type
recommended by the manufacturer.
Do not throw lithium batteries into the trash-can. It must be disposed of in
accordance with local regulations concerning special waste.
Technical Support
If you have any technical difculties, please do not hesitate to call or e-mail our
customer service.
http://www.arbor.com.tw
E-mail:[e-mail]

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Preface
Warranty
This product is warranted to be in good working order for a period of two years
from the date of purchase. Should this product fail to be in good working order
at any time during this period, we will, at our option, replace or repair it at no
additional charge except as set forth in the following terms. This warranty does
not apply to products damaged by misuse, modications, accident or disaster.
Vendor assumes no liability for any damages, lost prots, lost savings or any other
incidental or consequential damage resulting from the use, misuse of, or inability to
usethisproduct.Vendorwillnotbeliableforanyclaimmadebyanyotherrelatedparty.
Vendors disclaim all other warranties, either expressed or implied, including but
not limited to implied warranties of merchantability and tness for a
particular purpose, with respect to the hardware, the accompanying product’s
manual(s) and written materials, and any accompanying hardware. This limited
warranty gives you specic legal rights.
Return authorization must be obtained from the vendor before returned
merchandise will be accepted. Authorization can be obtained by calling or faxing
the vendor and requesting a Return Merchandise Authorization (RMA) number.
Returned goods should always be accompanied by a clear problem description.

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1Chapter 1
Introduction
Chapter 1 - Introduction

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Introduction
1.1. The Product
• Fanless Design
• Soldered Onboard Intel®Atom™ Processor E3800 family
• Intel®i210IT PCIe GbE controller
• Dual Channels 24-bit LVDS, DDI Port
• Extended Operating Temp.: -20 ~ 70ºC
1.2. About this Manual
This manual is intended for experienced users and integrators with hardware
knowledge of computers. If you are not sure about the description in this manual,
consult your vendor before further handling.
We recommend that you keep one copy of this manual for the quick reference
for any necessary maintenance in the future. Thank you for choosing ARBOR
products.

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Introduction
1.3. Specications
Form Factor Qseven®CPU Module
CPU Soldered onboard Intel®Atom™ Processor E3825
dual-core 1.33GHz or E3845 quadcore 1.91GHz
System Memory Soldered onboard 2GB / 4GB DDR3L SDRAM
VGA/ LCD Controller SoC Integrated Intel®Gen7 graphic
Ethernet controller 1 x Intel®i210IT PCIe GbE controller
Audio HD Audio Link
BIOS Insyde UEFI BIOS
Serial ATA 2 x Serial ATA ports w/ 300MB/s HDD transfer rate
Universal Serial Bus 8 x USB 2.0 ports (Port 0~3 support USB2.0 only)*
Storage Soldered onboard 16GB eMMC (Optional)**
Graphics Interface
LCD: Dual Channels 24-bit LVDS, resolution up to
1920x1200
Analog RGB signals (via Qseven®GF reserved pin)
1 x DDI port
Expansion Bus 3 x PCIe x1 lanes, I2C
Operating Temp. -20ºC ~ 70ºC (-4ºF ~ 158ºF) for EmQ-i2301
Watchdog Timer 1~ 255 levels Reset
Dimension (L x W) 70 x 70 mm (2.76” x 2.76”)
*Please don’t hot plug USB device with USB port0 to avoid that OS can’t
recognize the device (refer to Pin-94&96 in “2.3. Connector Pin Denition” on
page12) . And USB port 0~3 support USB2.0 only (refer to “2.3. Connector Pin
Denition” on page12).
**Windows 7 does not include any driver support for eMMC devices. If you select
Windows 7 as your OS selection in BIOS, the eMMC device is disabled and
grayed out.

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Introduction
1.4. Inside the Package
Before starting with the installation, make sure the following items are shipped.
If any of the items is missing or appears damaged, contact your local dealer or
distributor.
1 x EmQ-i2301 Qseven®CPU Module
1 x Driver CD
1 x Quick Installation Guide

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Introduction
1.5. Ordering Information
EmQ-i2301-E3825-2G Intel®Atom™ Processor E3825 Qseven®CPU module with
2GB memory soldered on module
EmQ-i2301-E3845-2G Intel®Atom™ Processor E3845 Qseven®CPU module with
2GB memory soldered on module
EmQ-i2301-E3825-4G* Intel®Atom™ Processor E3825 Qseven®CPU module with
4GB memory soldered on module
EmQ-i2301-E3845-4G* Intel®Atom™ Processor E3845 Qseven®CPU module with
4GB memory soldered on module
EmQ-i2301D-E3825-2G* Intel®Atom™ Processor E3825 Qseven®CPU module with
2GB memory & 16GB eMMC soldered on CPU module
EmQ-i2301D-E3845-2G* Intel®Atom™ Processor E3845 Qseven®CPU module with
2GB memory & 16GB eMMC soldered on CPU module
HS-0662-F1 Heat spreader
HS-0000-W3 Universal evaluation Heatsink for Qseven®CPU module
PBQ-3000 Qseven®EPIC evaluation board
CBK-06-3000-00
Cable kit
1 x USB cable
1 x USB2 cable
2 x Serial port cables
1 x SATA cable
1 x SATA power cable
*OEM request.

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Introduction
1.6. Driver Installation Note
The CPU board supports Windows 7 and Windows 8.1. Find the necessary
drivers on the CD that comes with your purchase. For different OS, the driver/
utility installation may vary slightly, but generally they are similar.
Find the drivers on CD by the following paths:
Windows 8.1
Driver Path
Audio \Audio\32 bit
\Audio\64 bit
Chipset \Chipset\32bit\Chipset Kit 57833 _32
\Chipset\64bit\Chipset Kit 57833 _64
Ethernet \Ethernet\Intel\32bit\LAN 18.8.1 _32
\Ethernet\Intel\64bit\LAN 18.8.1 _64
GPIO/I2C \GPIO I2C\windows 8 32_64\Intel_Processor_Win8_IO_Drivers_
Gold_MR1
Graphics \Graphic\win32_153339
\Graphic\win64_153339
MBI \MBI\MBI Kit 58443 20140106_windows 8_8.132_64
TXE \TXE\TXE Kit 100885

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Introduction
Windows 7
Driver Path
Audio \Audio\32 bit
\Audio\64 bit
Chipset \Chipset\32bit\Chipset Kit 57833 _32
\Chipset\64bit\Chipset Kit 57833 _64
Ethernet \Ethernet\Intel\32bit\LAN 18.8.1 _32
\Ethernet\Intel\64bit\LAN 18.8.1 _64
Graphics \Graphic\win32_153339
\Graphic\win64_153339
GPIO/I2C \GPIO I2C\windows 7 32_64\Intel_Atom_E3800_Processor_Win7_
IO_Drivers_MR1_v4_0
TXE \TXE\TXE Kit 100885
USB3.0 \USB3.0\SetupUSB3
WINUSB \USB

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2Chapter 2
Board
Overview
Chapter 2 - Board Overview

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Board Overview
2.1. Board Dimensions
22.86
36.58
35.94
15.77
39.27
1.20
18.00
52.00
70.00
3.00
67.00
2.50
70.00 56.50
Unit:mm