ASROCK H110M-DGS User manual

Version 1.0
Published March 2016
Copyright©2016 ASRock INC. All rights reserved.
Copyright Notice:
No part of this documentation may be reproduced, transcribed, transmitted, or
translated in any language, in any form or by any means, except duplication of
documentation by the purchaser for backup purpose, without written consent of
ASRock Inc.
Products and corporate names appearing in this documentation may or may not
be registered trademarks or copyrights of their respective companies, and are used
only for identication or explanation and to the owners’ benet, without intent to
infringe.
Disclaimer:
Specications and information contained in this documentation are furnished for
informational use only and subject to change without notice, and should not be
constructed as a commitment by ASRock. ASRock assumes no responsibility for
any errors or omissions that may appear in this documentation.
With respect to the contents of this documentation, ASRock does not provide
warranty of any kind, either expressed or implied, including but not limited to
the implied warranties or conditions of merchantability or tness for a particular
purpose.
In no event shall ASRock, its directors, ocers, employees, or agents be liable for
any indirect, special, incidental, or consequential damages (including damages for
loss of prots, loss of business, loss of data, interruption of business and the like),
even if ASRock has been advised of the possibility of such damages arising from any
defect or error in the documentation or product.
is device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions:
(1) this device may not cause harmful interference, and
(2) this device must accept any interference received, including interference that
may cause undesired operation.
CALIFORNIA, USA ONLY
e Lithium battery adopted on this motherboard contains Perchlorate, a toxic substance
controlled in Perchlorate Best Management Practices (BMP) regulations passed by the
California Legislature. When you discard the Lithium battery in California, USA, please
follow the related regulations in advance.
“Perchlorate Material-special handling may apply, see www.dtsc.ca.gov/hazardouswaste/
perchlorate”
ASRock Website: http://www.asrock.com

AUSTRALIA ONLY
Our goods come with guarantees that cannot be excluded under the Australian Consumer
Law. You are entitled to a replacement or refund for a major failure and compensation for
any other reasonably foreseeable loss or damage caused by our goods. You are also entitled
to have the goods repaired or replaced if the goods fail to be of acceptable quality and the
failure does not amount to a major failure. If you require assistance please call ASRock Tel
: [phone] ext.123 (Standard International call charges apply)

1
English
H110M-DGS R2.0
Motherboard Layout
Intel
H110
DDR4_B1 (64 bit, 288-pin module)
DDR4_A1 (64 bit, 288-pin module)
ATXPWR1
PCIE1
Top:
RJ-45
USB 2.0
T: USB5
B: USB6
HDLED RESET
PLED PWRBTN
PANEL1
1
1
SPK_CI1
COM1
1
1
HD_AUDIO1
H110M-DGS
RoHS
USB 3.0
T: USB3
B: USB4
USB_11_12
1
CPU_FAN1
1
TPMS1
PCI Express 3.0
Front USB 3.0
Top:
LINE IN
Center:
FRONT
Bottom:
MIC IN
CHA_FAN1
SATA3_2
USB_9_10
1
SATA3_3
SATA3_0
SATA3_1
1
LPT1
CHA_FAN2
BIOS
ROM
USB_7_8
1
CLRMOS1
ATX12V1
USB 2.0
T: USB1
B: USB2
PS2
Keyboard
/Mouse
CMOS
Battery
PCIE3
PCIE2
DVI1

2
English
No. Description
1 ATX 12V Power Connector (ATX12V1)
2 CPU Fan Connector (CPU_FAN1)
3 2 x 288-pin DDR4 DIMM Slots (DDR4_A1, DDR4_B1)
4 ATX Power Connector (ATXPWR1)
5 USB 3.0 Header (USB_11_12)
6 USB 2.0 Header (USB_9_10)
7 Chassis Fan Connector (CHA_FAN2)
8 SATA3 Connector (SATA3_0)
9 SATA3 Connector (SATA3_1)
10 SATA3 Connector (SATA3_2)
11 SATA3 Connector (SATA3_3)
12 System Panel Header (PANEL1)
13 TPM Header (TPMS1)
14 Chassis Intrusion and Speaker Header (SPK_CI1)
15 USB 2.0 Header (USB_7_8)
16 Print Port Header (LPT1)
17 COM Port Header (COM1)
18 Front Panel Audio Header (HD_AUDIO1)
19 Chassis Fan Connector (CHA_FAN1)

3
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H110M-DGS R2.0
I/O Panel
No. Description No. Description
1 USB 2.0 Ports (USB_12)*** 6 USB 2.0 Ports (USB_56)***
2 LAN RJ-45 Port* 7 USB 3.0 Ports (USB_34)***
3 Line In (Light Blue)** 8 DVI-D Port
4 Front Speaker (Lime)** 9 PS/2 Keyboard/Mouse Port
5 Microphone (Pink)**
* ere are two LEDs on the LAN port. Please refer to the table below for the LAN port LED indications.
Activity / Link LED Speed LED
Status Description Status Description
O No Link O 10Mbps connection
Blinking Data Activity Orange 100Mbps connection
On Link Green 1Gbps connection
ACT/LINK LED
SPEED LED
LAN Port
9 56
8
4
3
1 2
7

4
English
** To congure 7.1 CH HD Audio, it is required to use an HD front panel audio module and enable the multi-
channel audio feature through the audio driver.
Please set Speaker Conguration to “7.1 Speaker”in the Realtek HD Audio Manager.
Function of the Audio Ports in 7.1-channel Conguration:
Port Function
Light Blue (Rear panel) Rear Speaker Out
Lime (Rear panel) Front Speaker Out
Pink (Rear panel) Central /Subwoofer Speaker Out
Lime (Front panel) Side Speaker Out
*** ACPI wake-up function is supported on the rear USB ports only.

5
English
H110M-DGS R2.0
1 Introduction
ank you for purchasing ASRock H110M-DGS R2.0 motherboard, a reliable
motherboard produced under ASRock’s consistently stringent quality control.
It delivers excellent performance with robust design conforming to ASRock’s
commitment to quality and endurance.
1.1 Package Contents
• ASRock H110M-DGS R2.0 Motherboard (Micro ATX Form Factor)
• ASRock H110M-DGS R2.0 Quick Installation Guide
• ASRock H110M-DGS R2.0 Support CD
• 2 x Serial ATA (SATA) Data Cables (Optional)
• 1 x I/O Panel Shield
Because the motherboard specications and the BIOS soware might be updated, the
content of this documentation will be subject to change without notice. In case any
modications of this documentation occur, the updated version will be available on
ASRock’s website without further notice. If you require technical support related to
this motherboard, please visit our website for specic information about the model
you are using. You may nd the latest VGA cards and CPU support list on ASRock’s
website as well. ASRock website http://www.asrock.com.

6
English
1.2 Specications
Platform • Micro ATX Form Factor
• Solid Capacitor design
CPU • Supports 6th Generation Intel® CoreTM i7/i5/i3/Pentium®/
Celeron® Processors (Socket 1151)
• Supports CPU up to 91W
• Digi Power design
• 5 Power Phase design
• Supports Intel® Turbo Boost 2.0 Technology
Chipset • Intel® H110
Memory • Dual Channel DDR4 Memory Technology
• 2 x DDR4 DIMM Slots
• Supports DDR4 2133 non-ECC, un-buered memory
• Supports ECC UDIMM memory modules (operate in non-
ECC mode)
• Max. capacity of system memory: 32GB
• Supports Intel® Extreme Memory Prole (XMP) 2.0
Expansion
Slot
• 1 x PCI Express 3.0 x16 Slot (PCIE1: x16 mode)*
* Supports NVMe SSD as boot disks
• 2 x PCI Express 2.0 x1 Slots
Graphics • Intel® HD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
• Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD
Technology, Intel® InsiderTM, Intel® HD Graphics 510/530
• Pixel Shader 5.0, DirectX 12
• Max. shared memory 1024MB
* e size of maximum shared memory may vary from dierent
operating systems.

7
English
H110M-DGS R2.0
• Supports DVI-D with max. resolution up to 1920x1200 @
60Hz
• Supports Accelerated Media Codecs: HEVC, VP8, VP9
• Supports HDCP with DVI-D Port
• Supports Full HD 1080p Blu-ray (BD) playback with DVI-D
Port
Audio • 7.1 CH HD Audio (Realtek ALC887 Audio Codec)
* To congure 7.1 CH HD Audio, it is required to use an HD
front panel audio module and enable the multi-channel audio
feature through the audio driver.
• Supports Surge Protection (ASRock Full Spike Protection)
• ELNA Audio Caps
LAN • PCIE x1 Gigabit LAN 10/100/1000 Mb/s
• Realtek RTL8111GR/RTL8111C
• Supports Wake-On-LAN
• Supports Lightning/ESD Protection (ASRock Full Spike
Protection)
• Supports LAN Cable Detection
• Supports PXE
Rear Panel
I/O
• 1 x PS/2 Mouse/Keyboard Port
• 1 x DVI-D Port
• 4 x USB 2.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))*
• 2 x USB 3.0 Ports (Supports ESD Protection (ASRock Full
Spike Protection))*
* ACPI wake-up function is supported on the rear USB ports
only.
• 1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED
LED)
• HD Audio Jacks: Line in / Front Speaker / Microphone

8
English
Storage • 4 x SATA3 6.0 Gb/s Connectors, support NCQ, AHCI and
Hot Plug
Connector • 1 x Print Port Header
• 1 x COM Port Header
• 1 x TPM Header
• 1 x Chassis Intrusion and Speaker Header
• 1 x CPU Fan Connector (4-pin)
• 2 x Chassis Fan Connectors (4-pin)
* e CPU Fan Connector supports the CPU fan of maximum
1A (12W) fan power.
• 1 x 24 pin ATX Power Connector
• 1 x 8 pin 12V Power Connector
• 1 x Front Panel Audio Connector
• 2 x USB 2.0 Headers (Support 4 USB 2.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
• 1 x USB 3.0 Header (Supports 2 USB 3.0 ports) (Supports
ESD Protection (ASRock Full Spike Protection))
* USB_11_12 is shared with USB_9_10.
BIOS
Feature
• AMI UEFI Legal BIOS with multilingual GUI support
• ACPI 5.0 Compliant wake up events
• SMBIOS 2.7 Support
• CPU, DRAM, PCH 1.0V, VCCIO Voltage Multi-adjustment
Hardware
Monitor
• CPU/Chassis temperature sensing
• CPU/Chassis Fan Tachometer
• CPU/Chassis Quiet Fan (Auto adjust chassis fan speed by
CPU temperature)
• CPU/Chassis Fan multi-speed control
• CASE OPEN detection
• Voltage monitoring: +12V, +5V, +3.3V, CPU Vcore, DRAM,
VPPM, PCH 1.0V, VCCIO

9
English
H110M-DGS R2.0
Please realize that there is a certain risk involved with overclocking, including
adjusting the setting in the BIOS, applying Untied Overclocking Technology, or using
third-party overclocking tools. Overclocking may aect your system’s stability, or
even cause damage to the components and devices of your system. It should be done
at your own risk and expense. We are not responsible for possible damage caused by
overclocking.
* For detailed product information, please visit our website: http://www.asrock.com
OS • Microso® Windows® 10 64-bit / 8.1 64-bit / 7 32-bit / 7 64-
bit
* To install Windows® 7 OS, a modied installation disk with
xHCI drivers packed into the ISO le is required. Please refer to
page 54 for more detailed instructions.
* For the updated Windows® 10 driver, please visit ASRock’s
website for details: http://www.asrock.com
Certica-
tions
• FCC, CE, WHQL

10
English
1.3 Onboard Headers and Connectors
System Panel Header
(9-pin PANEL1)
(see p.1, No. 12)
Connect the power
switch, reset switch and
system status indicator on
the chassis to this header
according to the pin
assignments below. Note
the positive and negative
pins before connecting
the cables.
GND
RESET#
PWRBTN#
PLED-
PLED+
GND
HDLED-
HDLED+
1
GND
PWRBTN (Power Switch):
Connect to the power switch on the chassis front panel. You may congure the way to
turn o your system using the power switch.
RESET (Reset Switch):
Connect to the reset switch on the chassis front panel. Press the reset switch to restart
the computer if the computer freezes and fails to perform a normal restart.
PLED (System Power LED):
Connect to the power status indicator on the chassis front panel. e LED is on when
the system is operating. e LED keeps blinking when the system is in S1/S3 sleep
state. e LED is o when the system is in S4 sleep state or powered o (S5).
HDLED (Hard Drive Activity LED):
Connect to the hard drive activity LED on the chassis front panel. e LED is on
when the hard drive is reading or writing data.
e front panel design may dier by chassis. A front panel module mainly consists
of power switch, reset switch, power LED, hard drive activity LED, speaker and etc.
When connecting your chassis front panel module to this header, make sure the wire
assignments and the pin assignments are matched correctly.
Onboard headers and connectors are NOT jumpers. Do NOT place jumper caps over
these headers and connectors. Placing jumper caps over the headers and connectors
will cause permanent damage to the motherboard.

11
English
H110M-DGS R2.0
Chassis Intrusion and
Speaker Header
(7-pin SPK_CI1)
(see p.1, No. 14)
Please connect the
chassis intrusion and the
chassis speaker to this
header.
Serial ATA3 Connectors
(SATA3_0:
see p.1, No. 8)
(SATA3_1:
see p.1, No. 9)
(SATA3_2:
see p.1, No. 10)
(SATA3_3:
see p.1, No. 11)
ese four SATA3
connectors support SATA
data cables for internal
storage devices with up to
6.0 Gb/s data transfer rate.
USB 2.0 Headers
(9-pin USB_7_8)
(see p.1, No. 15)
(9-pin USB_9_10)
(see p.1, No. 6)
ere are two headers
on this motherboard.
Each USB 2.0 header can
support two ports.
USB 3.0 Header
(19-pin USB_11_12)
(see p.1, No. 5)
Besides two USB 3.0 ports
on the I/O panel, there
is one header on this
motherboard. Each USB
3.0 header can support
two ports.
* USB_11_12 is shared with
USB_9_10.
DUMMY
GND
GND
P+
P-
USB_PWR
P+
P-
USB_PWR
1
SATA3_2 SATA3_3
SATA3_0 SATA3_1
1
+5V
DUMMY
SIGNAL
GND
DUMMY
SPEAKER
DUMMY
1
IntA_P1_D+
ID
IntA_P1_D-
GND
IntA_P1_SSTX+
GND
IntA_P1_SSTX-
IntA_P1_SSRX+
IntA_P1_SSRX-
VbusVbus
Vbus
IntA_P0_SSRX-
IntA_P0_SSRX+
GND
IntA_P0_SSTX-
IntA_P0_SSTX+
GND
IntA_P0_D-
IntA_P0_D+

12
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Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.1, No. 18)
is header is for
connecting audio devices
to the front audio panel.
Chassis Fan Connectors
(4-pin CHA_FAN1)
(see p.1, No. 19)
(4-pin CHA_FAN2)
(see p.1, No. 7)
Please connect fan cables
to the fan connector and
match the black wire to
the ground pin.
CPU Fan Connector
(4-pin CPU_FAN1)
(see p.1, No. 2)
is motherboard pro-
vides a 4-Pin CPU fan
(Quiet Fan) connector.
If you plan to connect a
3-Pin CPU fan, please
connect it to Pin 1-3.
ATX Power Connector
(24-pin ATXPWR1)
(see p.1, No. 4)
is motherboard pro-
vides a 24-pin ATX power
connector. To use a 20-pin
ATX power supply, please
plug it along Pin 1 and Pin
13.
1. High Denition Audio supports Jack Sensing, but the panel wire on the chassis
must support HDA to function correctly. Please follow the instructions in our
manual and chassis manual to install your system.
2. If you use an AC’97 audio panel, please install it to the front panel audio header by
the steps below:
A. Connect Mic_IN (MIC) to MIC2_L.
B. Connect Audio_R (RIN) to OUT2_R and Audio_L (LIN) to OUT2_L.
C. Connect Ground (GND) to Ground (GND).
D. MIC_RET and OUT_RET are for the HD audio panel only. You don’t need to
connect them for the AC’97 audio panel.
E. To activate the front mic, go to the “FrontMic” Tab in the Realtek Control panel
and adjust “Recording Volume”.
GND
FAN_VOLTAGE_CONTROL
FAN_SPEED
FAN_SPEED_CONTROL
12
1
24
13
J_SENSE
OUT2_L
1
MIC_RET
PRESENCE#
GND
OUT2_R
MIC2_R
MIC2_L
OUT_RET
GND
FAN_VOLTAGE_CONTROL
FAN_SPEED
FAN_SPEED_CONTROL

13
English
H110M-DGS R2.0
ATX 12V Power
Connector
(8-pin ATX12V1)
(see p.1, No. 1)
is motherboard pro-
vides an 8-pin ATX 12V
power connector. To use a
4-pin ATX power supply,
please plug it along Pin 1
and Pin 5.
Serial Port Header
(9-pin COM1)
(see p.1, No. 17)
is COM1 header
supports a serial port
module.
TPM Header
(17-pin TPMS1)
(see p.1, No. 13)
is connector supports Trusted
Platform Module (TPM) system,
which can securely store keys,
digital certicates, passwords,
and data. A TPM system also
helps enhance network security,
protects digital identities, and
ensures platform integrity.
Print Port Header
(25-pin LPT1)
(see p.1, No. 16)
is is an interface
for print port cable
that allows convenient
connection of printer
devices.
CCTS#1
RRTS#1
DDSR#1
DDTR#1
RRXD1
GND
TTXD1
DDCD#1
1
RRI#1
1
GN D
SMB_DATA_MAIN
LAD2
LAD1
GN D
S_PWRDWN #
SERIRQ #
GND
P CICL K
PCIRST #
LAD3
+3 V
LAD0
+3VS B
GN D
FRAM E
SMB_CLK_MAIN
1
AFD#
ERROR#
PINIT# GND
SLIN#
STB#
SPD0
SPD1
SPD2
SPD3
SPD4
SPD5
SPD6
SPD7
ACK#
BUSY
PE
SLCT
5
1
8
4

14
Deutsch
Technische Daten
Plattform • Micro-ATX-Formfaktor
• Feststoondensator-Design
Prozessor • Unterstützt die Prozessoren Intel® CoreTM i7/i5/i3/Pentium®/
Celeron® der 6. Generation (Sockel 1151)
• Unterstützt CPU bis 91W
• Digi Power design
• 5-Leistungsphasendesign
• Unterstützt Intel® Turbo Boost 2.0-Technologie
Chipsatz • Intel® H110
Speicher • Dualkanal-DDR4-Speichertechnologie
• 2 x DDR4-DIMM-Steckplätze
• Unterstützt DDR4 2133 non-ECC, ungepuerter Speicher
• Unterstützt ECC-UDIMM-Speichermodule (Betrieb im Non-
ECC-Modus)
• Systemspeicher, max. Kapazität: 32GB
• Unterstützt Intel® Extreme Memory Prole (XMP) 2.0
Erweiter-
ungssteck-
platz
• 1 x PCI-Express 3.0-x16-Steckplatz (PCIE1: x16-Modus)*
* Unterstützt NVMe-SSD als Bootplatte
• 2 x PCI-Express 2.0-x1-Steckplatz
Grakkarte • Integrierte Intel® HD Graphics-Visualisierung und
VGA-Ausgänge können nur mit Prozessoren unterstützt
werden, die GPU-integriert sind.
• Unterstützt integrierte Intel® HD Graphics-Visualisierung:
Intel® Quick Sync Video mit AVC, MVC (S3D) und MPEG-2
Full HW Encode1, Intel® InTruTM 3D, Intel® Clear Video HD
Technology, Intel® InsiderTM, Intel® HD Graphics 510/530
• Pixel Shader 5.0, DirectX 12
• Max. geteilter Speicher: 1024 MB
* Die Größe des maximalen Freigabespeichers kann je nach
Betriebssystem variieren.

15
Deutsch
H110M-DGS R2.0
• Unterstützt DVI-D mit maximaler Auösung von 1920 x
1200 bei 60 Hz
• Unterstützt beschleunigte Mediencodecs: HEVC, VP8, VP9
• Unterstützt HDCP mit DVI-D-Ports
• Unterstützt Blu-ray- (BD) Wiedergabe (Full HD/1080p) mit
DVI-D-Ports
Audio • 7.1-Kanal-HD-Audio (Realtek ALC887-Audiocodec)
* Zur Konguration von 7.1-Kanal-HD-Audio müssen Sie ein
HD-Frontblenden-Audiomodul nutzen und den Mehrkanalton
über den Audiotreiber aktivieren.
• Unterstützt Überspannungsschutz (ASRock Full Spike
Protection)
• ELNA-Audiokondensatoren
LAN • PCIE x1 Gigabit LAN 10/100/1000 Mb/s
• Realtek RTL8111GR/RTL8111C
• Unterstützt Wake-On-LAN
• Unterstützt Blitzschutz/Schutz gegen elektrostatische Entla-
dung (ASRock Full Spike Protection)
• Unterstützt LAN-Kabelerkennung
• Unterstützt PXE
Rückblende,
E/A
• 1 x PS/2-Maus-/Tastatur-anschluss
• 1 x DVI-D-Port
• 4 x USB 2.0-Ports (unterstützt Schutz gegen elektrostatische
Entladung (ASRock Full Spike Protection))*
• 2 x USB 3.0-Ports (unterstützt Schutz gegen elektrostatische
Entladung (ASRock Full Spike Protection))*
* Die ACPI-Weckfunktion wird nur an rückseitigen USB-Ports
unterstützt.
• 1 x RJ-45-LAN-Port mit LED (Aktivität/Verbindung-LED
und Geschwindigkeit-LED)
• HD-Audioanschlüsse: Line-in / Vorderer Lautsprecher /
Mikrofon
Speicher • 4 x SATA-III-6,0-Gb/s-Anschlüsse, unterstützt NCQ, AHCI
und Hot-Plugging

16
Deutsch
Anschluss • 1 x Druckanschluss-Stileiste
• 1 x COM-Anschluss-Stileiste
• 1 x TPM-Stileiste
• 1 x Gehäuseeingri- und Lautsprecher-Stileiste
• 1 x CPU-Lüeranschluss (4-polig)
• 2 x Gehäuselüeranschluss (4-polig)
* Der CPU-Lüeranschluss unterstützt einen CPU-Lüer mit
maximal 1 A (12 W) Leistung.
• 1 x 24-poliger ATX-Netzanschluss
• 1 x 8-poliger 12-V-Netzanschluss
• 1 x Audioanschluss an Frontblende
• 2 x USB 2.0-Stileisten (unterstützen 4 USB 2.0-Ports)
(unterstützt Schutz gegen elektrostatische Entladung (ASRock
Full Spike Protection))
• 1 x USB 3.0-Stileiste (unterstützt 2 USB 3.0-Ports)
(unterstützt Schutz gegen elektrostatische Entladung (ASRock
Full Spike Protection))
* USB_11_12-Anschluss wird mit USB_9_10-Anschluss geteilt.
BIOS-
Funktion
• AMI-UEFI-Legal-BIOS mit Unterstützung
mehrsprachiger grascher Benutzerschnittstellen
• ACPI 5.0-konforme Aufweckereignisse
• SMBIOS 2.7-Unterstützung
• CPU, DRAM, PCH 1,0V, VCCIO Mehrfachspannungsanpas-
sung
Hard-
wareüber-
wachung
• CPU-/Gehäusetemperaturerkennung
• CPU-/Gehäuselüertachometer
• Lautloser CPU-/Gehäuselüer (automatische Anpassung der
Gehäuselüergeschwindigkeit durch CPU-Temperatur)
• CPU-/Gehäuselüer-Mehrfachgeschwindigkeitssteuerung
• Gehäuse-oen-Erkennung
• Spannungsüberwachung: +12 V, +5 V, +3,3 V, CPU Vcore,
DRAM, VPPM, PCH 1.0V, VCCIO

17
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H110M-DGS R2.0
Betriebssys-
tem
• Microso® Windows® 10, 64 Bit / 8.1, 64 Bit / 7, 32 Bit /
7, 64 Bit
* Zur Installation des Windows® 7-Betriebssystems wird ein
modiziertes Installationslaufwerk mit xHCI-Treibern in der
ISO-Datei benötigt. Detaillierte Anweisungen nden Sie auf
Seite 54.
* Einzelheiten zum aktualisierten Windows® 10-Treiber
entnehmen Sie bitte der ASRock-Webseite:
http://www.asrock.com
Zerti-
zierungen
• FCC, CE, WHQL

18
Français
Spécications
Plateforme • Facteur de forme Micro ATX
• Conception à condensateurs solides
Processeur • Prend en charge les processeurs 6egénération Intel® CoreTM
i7/i5/i3/Pentium®/Celeron® (Socket 1151)
• Supporte les processeurs jusqu’à 91W
• Digi Power design
• Alimentation à 5 phases
• Prend en charge la technologie Intel® Turbo Boost 2.0
Chipset • Intel® H110
Mémoire • Technologie mémoire double canal DDR4
• 2 x fentes DIMM DDR4
• Prend en charge les mémoires sans tampon non ECC
DDR4 2133
• Prend en charge les modules mémoire UDIMM ECC
(fonctionne en mode non-ECC)
• Capacité max. de la mémoire système : 32Go
• Prend en charge Intel® Extreme Memory Prole (XMP) 2.0
Fente
d’expansion
• 1 x fente PCI Express 3.0 x 16 (PCIE1:mode x16)*
* Prend en charge les SSD NVMe comme disques de démarrage
• 2 x fente PCI Express 2.0 x 1
Graphiques • La technologie Intel® HD Graphics Built-in Visuals et les
sorties VGA sont uniquement prises en charge par les
processeurs intégrant un contrôleur graphique.
• Prend en charge la technologie Intel® HD Graphics Built-in
Visuals : Intel® Quick Sync Video avec AVC, MVC (S3D) et
MPEG-2 Full HW Encode1, Intel® InTruTM 3D, Intel® Clear
Video HD Technology, Intel® InsiderTM, Intel® HD Graphics
510/530
• Pixel Shader 5.0, DirectX 12
• Mémoire partagée max. 1024Mo
* La taille maximale de mémoire partagée peut varier en fonction
du système d’exploitation.