Asus MAXIMUS IV GENE-Z User manual

Motherboard
Maximus IV
GENE-Z

ii
E6731
Second Edition
July 2011
Copyright © 2011 ASUSTeK COMPUTER INC. All Rights Reserved.
No part of this manual, including the products and software described in it, may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any
means, except documentation kept by the purchaser for backup purposes, without the express written
permission of ASUSTeK COMPUTER INC. (“ASUS”).
Product warranty or service will not be extended if: (1) the product is repaired, modied or altered, unless
such repair, modication of alteration is authorized in writing by ASUS; or (2) the serial number of the
product is defaced or missing.
ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS
OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF
MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS
DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS,
LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSINESS AND THE LIKE),
EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY
DEFECT OR ERROR IN THIS MANUAL OR PRODUCT.
SPECIFICATIONS AND INFORMATION CONTAINED IN THIS MANUAL ARE FURNISHED FOR
INFORMATIONAL USE ONLY, AND ARE SUBJECT TO CHANGE AT ANY TIME WITHOUT NOTICE,
AND SHOULD NOT BE CONSTRUED AS A COMMITMENT BY ASUS. ASUS ASSUMES NO
RESPONSIBILITY OR LIABILITY FOR ANY ERRORS OR INACCURACIES THAT MAY APPEAR IN THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT.
Products and corporate names appearing in this manual may or may not be registered trademarks or
copyrights of their respective companies, and are used only for identication or explanation and to the
owners’ benet, without intent to infringe.

iii
Contents
Contents ...................................................................................................... iii
Notices........................................................................................................ vii
FCC Radio Frequency (RF) Exposure Caution Statement .............. vii
Declaration of Conformity (R&TTE directive 1999/5/EC)................ viii
CE Marking ..................................................................................... viii
Wireless Operation Channel for Different Domains ..........................ix
France Restricted Wireless Frequency Bands..................................ix
IC Radiation Exposure Statement for Canada...................................x
Safety information ...................................................................................... xi
About this guide ....................................................................................... xiii
 ........................................ xv
Chapter 1: Product introduction
1.1 Welcome! ...................................................................................... 1-1
1.2 Package contents......................................................................... 1-1
1.3 Special features............................................................................ 1-2
1.3.1 Product highlights ........................................................... 1-2
1.3.2 ROG Intelligent Performance & Overclocking features... 1-4
1.3.3 ROG unique features ...................................................... 1-5
1.3.4 ASUS special features .................................................... 1-7
Chapter 2: Hardware information
2.1 Before you proceed ..................................................................... 2-1
2.2 Motherboard overview................................................................. 2-2
2.2.1 Motherboard layout ......................................................... 2-2
2.2.2 Layout contents............................................................... 2-3
2.2.3 Central Processing Unit (CPU) ....................................... 2-4
2.2.4 System memory .............................................................. 2-5
2.2.5 Expansion slots............................................................. 2-16
2.2.6 Onboard switches ......................................................... 2-18
2.2.7 Onboard LEDs .............................................................. 2-20
2.2.8 Jumper .......................................................................... 2-27
2.2.9 Internal connectors ....................................................... 2-28
2.3 Building your computer system ............................................... 2-36

iv
Contents
2.3.1 Additional tools and components to build a PC system 2-36
2.3.2 CPU installation ............................................................ 2-37
2.3.3 CPU heatsink and fan assembly installation................. 2-39
2.3.4 DIMM installation .......................................................... 2-41
2.3.5 Motherboard installation................................................ 2-42
2.3.6 ATX Power connection.................................................. 2-44
2.3.7 SATA device connection................................................ 2-45
2.3.8 Front I/O Connector ...................................................... 2-46
2.3.9 Expension Card installation .......................................... 2-47
2.3.10 Rear panel connection .................................................. 2-48
2.3.11 Audio I/O connections................................................... 2-49
 ...................................................... 2-52
2.5 Turning off the computer........................................................... 2-53
Chapter 3: BIOS setup
3.1 Knowing BIOS .............................................................................. 3-1
3.2 BIOS setup program .................................................................... 3-1
3.2.1 Advanced Mode .............................................................. 3-2
3.2.2 EZ Mode ......................................................................... 3-4
3.3 Extreme Tweaker menu ............................................................... 3-5
3.4 Main menu .................................................................................. 3-14
3.4.1 System Language [English] .......................................... 3-14
3.4.2 System Date [Day xx/xx/xxxx]....................................... 3-14
3.4.3 System Time [xx:xx:xx] ................................................. 3-14
3.4.4 Security ......................................................................... 3-15
3.5 Advanced menu ......................................................................... 3-17
3.5.1 CPU Conguration ........................................................ 3-18
3.5.2 System Agent Conguration ......................................... 3-20
3.5.3 PCH Conguration ........................................................ 3-21
3.5.4 SATA Conguration ....................................................... 3-22
3.5.5 USB Conguration ........................................................ 3-24
3.5.6 Onboard Devices Conguration.................................... 3-25
3.5.7 APM .............................................................................. 3-27
3.5.8 iROG Conguration....................................................... 3-28
3.5.9 ROG Connect ............................................................... 3-29

v
Contents
3.6 Monitor menu ............................................................................. 3-30
3.7 Boot menu .................................................................................. 3-34
3.8 Tool menu ................................................................................... 3-36
3.8.1 ASUS EZ Flash 2 Utility ................................................ 3-36
3.8.2 Asus SPD Information................................................... 3-37
3.8.3 ASUS O.C. Prole......................................................... 3-38
3.8.4 GO Button File .............................................................. 3-39
3.9 Exit menu.................................................................................... 3-40
3.10 Updating BIOS............................................................................ 3-41
3.10.1 ASUS Update utility ...................................................... 3-42
3.10.2 ASUS EZ Flash 2 Utility ................................................ 3-45
3.10.3 ASUS CrashFree BIOS 3 utility .................................... 3-46
3.10.4 ASUS BIOS Updater..................................................... 3-47
Chapter 4: Software support
4.1 Installing an operating system ................................................... 4-1
4.2 Support DVD information ............................................................ 4-1
4.2.1 Running the support DVD ............................................... 4-1
4.2.2 Obtaining the software manuals ..................................... 4-2
4.3 Software information ................................................................... 4-3
4.3.1 AI Suite II ........................................................................ 4-3
4.3.2 DIGI+ VRM...................................................................... 4-4
4.3.3 TurboV EVO.................................................................... 4-7
4.3.4 EPU............................................................................... 4-10
4.3.5 FAN Xpert ......................................................................4-11
4.3.6 Probe II ......................................................................... 4-12
4.3.7 Sensor Recorder........................................................... 4-13
4.3.8 Ai Charger+................................................................... 4-16
4.3.9 ROG CPU-Z.................................................................. 4-17
4.3.10 MemTweakIt.................................................................. 4-18
4.3.11 ROG Connect ............................................................... 4-19
4.3.12 Audio congurations ..................................................... 4-22
  .................................................................. 4-24
4.4.1 RAID denitions ............................................................ 4-24
4.4.2 Installing Serial ATA hard disks ..................................... 4-25

vi
Contents
4.4.3 Setting the RAID item in BIOS ...................................... 4-25
4.4.4 Intel®Rapid Storage Technology Option ROM utility .... 4-26
4.5 Creating a RAID driver disk....................................................... 4-32
4.5.1 Creating a RAID driver disk without entering the OS.... 4-32
4.5.2 Creating a RAID driver disk in Windows®...................... 4-32
4.5.3 Installing the RAID driver during
Windows®OS installation.............................................. 4-33
4.5.4 Using a USB oppy disk drive....................................... 4-34
Chapter 5: Multiple GPU technology support
5.1 ATI®CrossFireX™ technology .................................................... 5-1
5.1.1 Requirements.................................................................. 5-1
5.1.2 Before you begin............................................................. 5-1
5.1.3 Installing CrossFireX graphics cards .............................. 5-2
5.1.4 Installing the device drivers............................................. 5-3
5.1.5 Enabling the ATI®CrossFireX™ technology ................... 5-3
5.2 NVIDIA®SLI™ technology ........................................................... 5-5
5.2.1 Requirements.................................................................. 5-5
5.2.2 Installing two SLI-ready graphics cards .......................... 5-5
5.2.3 Installing the device drivers............................................. 5-6
5.2.4 Enabling the NVIDIA®SLI™ technology ......................... 5-6
5.3 LucidLogix®Virtu™ solution....................................................... 5-9
5.3.1 Hardware installation ...................................................... 5-9
5.3.2 Software conguration ...................................................5-11

vii
Notices
Federal Communications Commission Statement
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions:
• This device may not cause harmful interference, and
• This device must accept any interference received including interference that
may cause undesired operation.
This equipment has been tested and found to comply with the limits for a
Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference in a
residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with manufacturer’s
instructions, may cause harmful interference to radio communications. However,
there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception,
which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment to an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
The use of shielded cables for connection of the monitor to the graphics card is
required to assure compliance with FCC regulations. Changes or modications
to this unit not expressly approved by the party responsible for compliance
could void the user’s authority to operate this equipment.
FCC Radio Frequency (RF) Exposure Caution Statement
Any changes or modications not expressly approved by the party responsible
for compliance could void the user’s authority to operate this equipment. “The
manufacture declares that this device is limited to Channels 1 through 11 in the
2.4GHz frequency by specied rmware controlled in the USA.”
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. To maintain compliance with FCC RF exposure
compliance requirements, please avoid direct contact to the transmitting antenna
during transmitting. End users must follow the specic operating instructions for
satisfying RF exposure compliance.

viii
RF exposure warning
This equipment must be installed and operated in accordance with provided
instructions and the antenna(s) used for this transmitter must be installed to
provide a separation distance of at least 20 cm from all persons and must not
be co-located or operating in conjunction with any other antenna or transmitter.
End-users and installers must be provide with antenna installation instructions and
transmitter operating conditions for satisfying RF exposure compliance.
Declaration of Conformity (R&TTE directive 1999/5/EC)
The following items were completed and are considered relevant and sufcient:
• Essential requirements as in [Article 3]
• Protection requirements for health and safety as in [Article 3.1a]
• Testing for electric safety according to [EN 60950]
• Protection requirements for electromagnetic compatibility in [Article 3.1b]
• Testing for electromagnetic compatibility in [EN 301 489-1] & [EN 301 489-17]
• Effective use of the radio spectrum as in [Article 3.2]
• Radio test suites according to [EN 300 328-2]
CE Marking
CE marking for devices without wireless LAN/Bluetooth
The shipped version of this device complies with the requirements of the EEC
directives 2004/108/EC “Electromagnetic compatibility” and 2006/95/EC “Low
voltage directive”.
CE marking for devices with wireless LAN/ Bluetooth
This equipment complies with the requirements of Directive 1999/5/EC of the
European Parliament and Commission from 9 March, 1999 governing Radio and
Telecommunications Equipment and mutual recognition of conformity.

ix
Wireless Operation Channel for Different Domains
N. America 2.412-2.462 GHz Ch01 through CH11
Japan 2.412-2.484 GHz Ch01 through Ch14
Europe ETSI 2.412-2.472 GHz Ch01 through Ch13
France Restricted Wireless Frequency Bands
Some areas of France have a restricted frequency band. The worst case maximum
authorized power indoors are:
• 10mW for the entire 2.4 GHz band (2400 MHz–2483.5 MHz)
• 100mW for frequencies between 2446.5 MHz and 2483.5 MHz
Channels 10 through 13 inclusive operate in the band 2446.6 MHz to 2483.5
MHz.
There are few possibilities for outdoor use: On private property or on the private
property of public persons, use is subject to a preliminary authorization procedure
by the Ministry of Defense, with maximum authorized power of 100mW in the
2446.5–2483.5 MHz band. Use outdoors on public property is not permitted.
In the departments listed below, for the entire 2.4 GHz band:
• Maximum authorized power indoors is 100mW
• Maximum authorized power outdoors is 10mW
Departments in which the use of the 2400–2483.5 MHz band is permitted with an
EIRP of less than 100mW indoors and less than 10mW outdoors:
01 Ain 02 Aisne 03 Allier 05 Hautes Alpes
08 Ardennes 09 Ariège 11 Aude 12 Aveyron
16 Charente 24 Dordogne 25 Doubs 26 Drôme
32 Gers 36 Indre 37 Indre et Loire 41 Loir et Cher
45 Loiret 50 Manche 55 Meuse 58 Nièvre
59 Nord 60 Oise 61 Orne 63 Puy du Dôme
64 Pyrénées Atlantique 66 Pyrénées Orientales
67 Bas Rhin 68 Haut Rhin 70 Haute Saône 71 Saône et Loire
75 Paris 82 Tarn et Garonne 84 Vaucluse
88 Vosges 89 Yonne 90 Territoire de Belfort
94 Val de Marne
This requirement is likely to change over time, allowing you to use your wireless
LAN card in more areas within France. Please check with ART for the latest
information (www.arcep.fr)
Your WLAN Card transmits less than 100mW, but more than 10mW.

x
Canadian Department of Communications Statement
This digital apparatus does not exceed the Class B limits for radio noise emissions
from digital apparatus set out in the Radio Interference Regulations of the
Canadian Department of Communications.
This class B digital apparatus complies with Canadian ICES-003.
Cet appareil numérique de la classe [B] est conforme à la norme NMB-003 du
Canada.
IC Radiation Exposure Statement for Canada
This equipment complies with IC radiation exposure limits set forth for an
uncontrolled environment. To maintain compliance with IC RF exposure
compliance requirements, please avoid direct contact to the transmitting antenna
during transmitting. End users must follow the specic operating instructions for
satisfying RF exposure compliance.
Operation is subject to the following two conditions:
• This device may not cause interference and
• This device must accept any interference, including interference that may
cause undesired operation of the device.
To prevent radio interference to the licensed service (i.e. co-channel Mobile
Satellite systems) this device is intended to be operated indoors and away from
windows to provide maximum shielding. Equipment (or its transmit antenna) that is
installed outdoors is subject to licensing.
The user is cautioned that this device should be used only as specied within
this manual to meet RF exposure requirements. Use of this device in a manner
inconsistent with this manual could lead to excessive RF exposure conditions.
This device and its antenna(s) must not be co-located or operating in conjunction
with any other antenna or transmitter.
Country Code selection feature to be disabled for products marketed to the US/
CANADA.

xi
Safety information
Electrical safety
• To prevent electrical shock hazard, disconnect the power cable from the
electrical outlet before relocating the system.
• When adding or removing devices to or from the system, ensure that the power
cables for the devices are unplugged before the signal cables are connected. If
possible, disconnect all power cables from the existing system before you add
a device.
• Before connecting or removing signal cables from the motherboard, ensure
that all power cables are unplugged.
• Seek professional assistance before using an adapter or extension cord.
These devices could interrupt the grounding circuit.
• Ensure that your power supply is set to the correct voltage in your area. If you
are not sure about the voltage of the electrical outlet you are using, contact
your local power company.
• If the power supply is broken, do not try to x it by yourself. Contact a qualied
service technician or your retailer.
• The optical S/PDIF is an optional component (may or may not be included in
your motherboard) and is dened as a CLASS 1 LASER PRODUCT.
INVISIBLE LASER RADIATION, AVOID EXPOSURE TO BEAM.
• Never dispose of the battery in re. It could explode and release harmful
substances into the environment.
• Never dispose of the battery with your regular household waste. Take it to a
hazardous material collection point.
• Never replace the battery with an incorrect battery type.
• RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT
TYPE.
• DISPOSE OF USED BATTERIES ACCORDING TO THE ABOVE
BATTERY-RELATED INSTRUCTIONS.

xii
Operation safety
• Before installing the motherboard and adding devices on it, carefully read all
the manuals that came with the package.
• Before using the product, ensure all cables are correctly connected and the
power cables are not damaged. If you detect any damage, contact your dealer
immediately.
• To avoid short circuits, keep paper clips, screws, and staples away from
connectors, slots, sockets and circuitry.
• Avoid dust, humidity, and temperature extremes. Do not place the product in
any area where it may become wet.
This motherboard should only be used in environments with ambient
temperatures between 5ºC (41ºF) and 40ºC (104ºF).
• Place the product on a stable surface.
• If you encounter technical problems with the product, contact a qualied
service technician or your retailer.
DO NOT throw the motherboard in municipal waste. This product has been
designed to enable proper reuse of parts and recycling. This symbol of the
crossed out wheeled bin indicates that the product (electrical and electronic
equipment) should not be placed in municipal waste. Check local regulations for
disposal of electronic products.
DO NOT throw the mercury-containing button cell battery in municipal waste.
This symbol of the crossed out wheeled bin indicates that the battery should not
be placed in municipal waste.
REACH
Complying with the REACH (Registration, Evaluation, Authorisation, and
Restriction of Chemicals) regulatory framework, we published the chemical
substances in our products at ASUS REACH website at http://csr.asus.com/
english/REACH.htm.
ASUS Recycling/Takeback Services
ASUS recycling and takeback programs come from our commitment to the highest
standards for protecting our environment. We believe in providing solutions for you
to be able to responsibly recycle our products, batteries, other components as well
as the packaging materials. Please go to http://csr.asus.com/english/Takeback.htm
for detailed recycling information in different regions.

xiii

Refer to the following sources for additional information and for product and
software updates.
1. ASUS websites
The ASUS website provides updated information on ASUS hardware and
software products. Refer to the ASUS contact information.
2. Optional documentation
Your product package may include optional documentation, such as warranty
yers, that may have been added by your dealer. These documents are not
part of the standard package.
About this guide
This user guide contains the information you need when installing and conguring
the motherboard.
How this guide is organized
This guide contains the following parts:
• Chapter 1: Product introduction
This chapter describes the features of the motherboard and the new
technology it supports.
• Chapter 2: Hardware information
This chapter lists the hardware setup procedures that you have to perform
when installing system components. It includes description of the switches,
jumpers, and connectors on the motherboard.
• Chapter 3: BIOS setup
This chapter tells how to change system settings through the BIOS Setup
menus. Detailed descriptions of the BIOS parameters are also provided.
• Chapter 4: Software support
This chapter describes the contents of the support DVD that comes with the
motherboard package and the software.
• Chapter 5: Multiple GPU technology support
This chapter describes how to install and congure multiple ATI®
CrossFireX™ and NVIDIA®SLI™ graphics cards.

xiv
DANGER/WARNING: Information to prevent injury to yourself
when trying to complete a task.
CAUTION: Information to prevent damage to the components
when trying to complete a task.
NOTE: Tips and additional information to help you complete a
task.
IMPORTANT: Instructions that you MUST follow to complete a
task.
Conventions used in this guide
To ensure that you perform certain tasks properly, take note of the following
symbols used throughout this manual.
Typography
Bold text Indicates a menu or an item to select.
Italics Used to emphasize a word or a phrase.
<Key> Keys enclosed in the less-than and greater-than sign
means that you must press the enclosed key.
Example: <Enter> means that you must press the
Enter or Return key.
<Key1+Key2+Key3> If you must press two or more keys simultaneously, the
key names are linked with a plus sign (+).
Example: <Ctrl+Alt+D>
Command Means that you must type the command exactly as
shown, then supply the required item or value enclosed
in brackets.
Example: At the DOS prompt, type the command line:
afudos /iM4GZ.ROM

xv
Maximus IV GENE-Z specications summary
CPU LGA1155 socket for 2nd Generation Intel®Core™ i7/
Core™ i5/Core™ i3 ProcessorsCore™ i5/Core™ i3 Processors
Supports 32nm CPU
Supports Intel®Turbo Boost Technology 2.0
*The Intel®Turbo Boost Technology 2.0 support depends
on the CPU types.on the CPU types.
**Refer to www.asus.com for Intel CPU support list
Chipset Intel®Z68 Express Chipset
Memory Dual channel memory architecture
4 x DIMM, max. 32GB, DDR3 2200(O.C.)/2133(O.C.)/
1866(O.C.)/1600/1333MHz, non-ECC, un-buffered
memory
* Supports Intel® Extreme Memory Prole (XMP)
**Hyper DIMM support is subject to the physical
characteristics of individual CPUs. Some hyper DIMMs
only support one DIMM per channel.
*** Due to CPU behavior, DDR3 2200/2000/1800 MHz
memory module will run at DDR3 2133/1866/1600
MHz frequency as default.
**** Refer to www.asus.com or this user manual for the
Memory QVL (Qualied Vendors Lidts).
Expansion Slots 2 x PCIe2.0 x16 slots (@singlex16, dual x8)
1 x PCIe2.0 x4 slot
Multi-GPU Technology Support NVIDIA®SLI™ / ATI CrossFireX™ TechnologyTechnologyTechnology
Supports LucidLogix®Virtu™ Technology*Technology*Technology*
* LucidLogixLucidLogix®Virtu™ supports Windows®7 operating
systems.
Storage Intel®Z68 Express Chipset built-in:
- 2 x SATA 6Gb/s ports (Red)
- 4 x SATA 3Gb/s ports (Gray)
- Intel®Rapid Storage Technology supports RAID 0,
1, 5 and 10
- Supports Intel®Smart Response Technology* on
2nd generation Intel®Core™ processor family
* Intel®Smart Response Technology supports
Windows®7/ Vista operating systems.
JMicron®362 controller:
- 2 x External SATA 3Gb/s ports at rear (SATA On-
the-Go)
* These SATA ports are for data hard drives only. ATAPI
devices are not supported.
LAN 1 x Intel®Gigabit LAN
(continued on the next page)

xvi
 SupremeFX X-Fi 2 built-in 8-channel High Denition
Audio CODEC
- EAX®Advanced™ HD 5.0
- THX®TruStudio PRO™
- X-Fi®Xtreme Fidelity™
- Creative ALchemy
- Supports Blu-ray audio layer content protection
- Supports Jack-detection, Multi-streaming, Front
Panel Jack-retasking
- Supports 1 x Optical S/PDIF out port at back panel
USB 2 x USB3.0 Controllers:
- 4 x USB 3.0/2.0 ports (2 ports at mid-board for front
panel, 2 ports at back panel)
Intel®Z68 Express Chipset:
12 USB 2.0 ports (4 ports at mid-board, 8* ports at back
panel)
*One is also for ROG Connect (white)
ROG Exclusive
Overclocking Features
ROG Connect
MemTweakIt
GameFirst
CPU Level Up
MemOK!
Extreme Engine Digi+ Pwer Design
- 8-phase CPU power + 4-phase iGPU power
- 2-phase Memory power
ProbeIt
Extreme Tweaker
iROG
Loadline Calibration
EFI BIOS features
- ROG BIOS Print
- GPU.DIMM Post
Intelligent overclocking tools:
- ASUS TurboV Evo
- O.C Prole
Overclocking Protection:
- COP EX (Component Overheat Protection - EX)
- ASUS C.P.R.(CPU Parameter Recall)
Other Special Features Onboard Switches: Power / Reset / Clr CMOS (at rear)
ASUS Fan Xpert
ASUS Q-LED (CPU, DRAM, VGA, Boot Device LED)
ASUS Q-Connector
ASUS Q-Shield
ASUS Q-Slot
ASUS Q-DIMM
ASUS EZ Flash 2
ASUS CrashFree BIOS 3
ASUS MyLogo 2
Maximus IV GENE-Z specications summary

xvii
Back Panel I/O Ports 1 x PS/2 Keyboard/Mouse port
2 x External SATA ports
1 x LAN (RJ45) port
2 x USB 3.0/2.0 ports
8 x USB 2.0/1.1 ports (one is also for ROG Connect)
1 x S/PDIF Out (Optical)
1 x HDMI port
1 x Clr CMOS switch
8-channel Audio I/O
Internal Connectors 1 x USB 3.0 connector (Red) supports additional 2 USB
3.0 ports
2 x USB 2.0 connectors support additional 4 USB 2.0
ports
6 x SATA connectors: 2 x SATA 6Gb/s connectors (Red)
& 4 x SATA 3Gb/s connectors (Gray)
5 x Fan connectors: 2 x CPU / 3 x Chassis
6 x ProbeIt measurement points
1 x SPDIF_out connector
1 x En/Dis-able Clr CMOS header
1 x 24-pin ATX power connector
1 x 8-pin ATX 12V power connector
1 x ROG Connect switch
1 x Power on switch
1 x Reset switch
1 x Go Button
1 x Audio front panel connector
System panel connector
Manageability WfM2.0, DMI2.0, WOL by PME, WOR by PME, PXE
BIOS Features 64Mb Flash ROM, EFI AMI BIOS, PnP, DMI2.0, WfM2.0,
SM BIOS 2.5, ACPI2.0a Multi-Language BIOS
Software Support DVD:
- Drivers and applications
ASUS AI Suite II
ROG CPU-Z
ROG GameFirst Utility
Sound Blaster X-Fi MB2 Utility
ROG Mem TweakIt Utility
ASUS AI Charger+
DAEMON Tools Pro Standard
Kaspersky®Anti-Virus 1-year license
Form Factor mATX Form Factor, 9.6”x 9.6” (24.4cm x 24.4cm)
Maximus IV GENE-Z specications summary
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1
Chapter 1: Product
introduction
This chapter describes the motherboard
features and the new technologies
it supports.

ROG Maximus IV GENE-Z
Chapter summary 1
1.1 Welcome! ...................................................................................... 1-1
1.2 Package contents......................................................................... 1-1
1.3 Special features............................................................................ 1-2